Electroplating experiment device

Abstract

The utility model relates to an electroplating experiment device which comprises an electroplating bath, a first electrode and a jet flow assembly, the first electrode is arranged in the electroplating bath, the jet flow assembly is arranged in the electroplating bath, the jet flow assembly comprises a plurality of jet flow pieces, and second electrodes are arranged on the jet flow pieces; the multiple jet-flow pieces are arranged on at least one side of the first electrode in the first direction, and the multiple jet-flow pieces are sequentially arranged in the first direction and in the direction away from the first electrode. Wherein each jet flow piece is provided with at least one jet flow opening communicated with the electroplating bath, and at least one of the jet flow pieces is arranged to be capable of jetting electroplating liquid into the electroplating bath through the corresponding jet flow opening. The electroplating experiment device is rich in function, high in practicability and capable of meeting different electroplating requirements.

Description

Technical Field

[0001] This application relates to the field of electroplating process experimental technology, and in particular to an electroplating experimental apparatus. Background Technology

[0002] Experimental equipment for electroplating processes is essential in the research and application of electroplating technology. It forms the basis for developing new processes and helps researchers explore and implement new electroplating technologies.

[0003] In related technologies, electroplating process experimental equipment is usually matched by replacing the corresponding electroplating process experimental equipment for different processes, or by adjusting the internal structure of the electroplating process experimental equipment to meet different electroplating requirements. However, replacing the electroplating process experimental equipment has the disadvantage of high cost, and adjusting the internal structure of the electroplating process experimental equipment is prone to inaccurate internal structure adjustment, which affects the uniformity of the coating and thus leads to inaccurate experiments.

[0004] In other words, the experimental equipment for electroplating processes in related technologies has relatively limited functionality and applicability. Utility Model Content

[0005] Therefore, it is necessary to provide an electroplating experimental device to address the problem that the experimental equipment for electroplating processes in related technologies has relatively limited functionality and low applicability.

[0006] According to one aspect of this application, an electroplating experimental apparatus is provided, the electroplating experimental apparatus comprising:

[0007] Electroplating tank;

[0008] The first electrode is disposed within the electroplating tank; and

[0009] A jetting assembly is disposed in the electroplating tank. The jetting assembly includes multiple jetting elements, each jetting element having a second electrode. The multiple jetting elements are respectively disposed on at least one side of the first electrode along a first direction, and along the first direction away from the first electrode. The multiple jetting elements are arranged sequentially.

[0010] The jetting component is provided with at least one jetting port that communicates with the electroplating tank;

[0011] At least one of the jetting elements is configured to jet electroplating solution into the electroplating tank through the corresponding jetting orifice.

[0012] In one embodiment, the jetting element includes a tube extending along a second direction, the tube having a plurality of jetting ports, the plurality of jetting ports being spaced apart along the second direction, and a second electrode being provided between two adjacent jetting ports;

[0013] The first direction and the second direction intersect each other.

[0014] In one embodiment, the jetting element further includes a plurality of jetting sub-tubes, which are connected to the jetting nozzles one by one;

[0015] The distance L between two adjacent jet tubes satisfies: 14.24cm≤L≤21cm.

[0016] In one embodiment, the diameter D of the jet tube satisfies: 2cm≤D≤3cm.

[0017] In one embodiment, the size W of the second electrode along the circumference of the tube body satisfies: 10cm ≤ W ≤ 15cm.

[0018] In one embodiment, the electroplating experimental apparatus further includes multiple control valves;

[0019] The control valve is provided corresponding to the jet component, and the control valve is located on the corresponding jet component.

[0020] In one embodiment, the electroplating experimental apparatus further includes two filters, one of which is connected to one end of the tube of the electroplating tank and the jetting component, and the other of which is connected to the other end of the tube of the electroplating tank and the jetting component.

[0021] In one embodiment, a plurality of the jetting elements are symmetrically arranged relative to the first electrode along the first direction.

[0022] In one embodiment, the plurality of jet elements includes two first jet elements symmetrically arranged relative to the first electrode along the first direction, wherein the distance X1 between the first jet element and the first electrode along the first direction satisfies: 20cm ≤ X1 ≤ 24cm; and / or

[0023] The plurality of jet elements includes two second jet elements symmetrically arranged relative to the first electrode along the first direction, wherein the distance X2 between the second jet element and the first electrode along the first direction satisfies: 14cm ≤ X2 ≤ 18cm; and / or

[0024] The plurality of jet elements includes two third jet elements symmetrically arranged relative to the first electrode along the first direction, wherein the distance X3 between the third jet element and the first electrode along the first direction satisfies: 8cm ≤ X1 ≤ 12cm; and / or

[0025] The plurality of jetting elements includes two fourth jetting elements symmetrically arranged relative to the first electrode along the first direction. Along the first direction, the distance X4 between the fourth jetting element and the first electrode satisfies: 2cm≤X1≤6cm.

[0026] In one embodiment, the first electrode includes a first end and a second end opposite to each other along a second direction. The electroplating experimental apparatus further includes a first rectifier and a second rectifier. The negative electrode of the first rectifier is electrically connected to the first end of the first electrode, the positive electrode of the first rectifier is electrically connected to the second electrode on one side of the first electrode along the first direction, the negative electrode of the second rectifier is electrically connected to the second end of the first electrode, and the positive electrode of the second rectifier is electrically connected to the second electrode on the other side of the first electrode along the first direction.

[0027] The first direction and the second direction intersect each other.

[0028] In the aforementioned electroplating experimental apparatus, the workpiece to be plated is placed at the first electrode within the electroplating tank. Electricity is supplied to the electroplating solution through the first and second electrodes, and a jet assembly sprays water to agitate and accelerate solution convection. This current reduces metal ions from the electroplating solution into metal atoms, which are then deposited on the surface of the workpiece to form a metal coating. Simultaneously, when jets are positioned at different distances from the first electrode, the agitation velocity of the electroplating solution and the concentration of metal ions within the solution around the workpiece vary. Therefore, by controlling the jets at different distances from the first electrode, different electroplating environments can be created to meet diverse electroplating requirements. In short, the electroplating experimental apparatus of this application is feature-rich, highly practical, and adaptable to meet various electroplating needs. Attached Figure Description

[0029] Figure 1 This is a top view of an electroplating experimental apparatus according to one embodiment of this application.

[0030] Figure 2 for Figure 1 A top view of the jet component in the illustrated embodiment.

[0031] Figure 3 for Figure 1 Side view of the jet component in the illustrated embodiment.

[0032] Explanation of icon numbers:

[0033] 10. Electroplating experimental apparatus;

[0034] 100. First electrode;

[0035] 210. Jet component; 211. Tube body; 212. Second electrode; 213. Jet sub-tube; 210A. First jet component; 210B. Second jet component; 210C. Third jet component; 210D. Fourth jet component;

[0036] 300. Electroplating tank; 400. Filter; 500. Control valve; 610. First rectifier; 620. Second rectifier;

[0037] F1, first direction; F2, second direction. Detailed Implementation

[0038] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0039] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0040] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0041] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0042] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0043] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0044] Electroplating involves various parameters, such as current density, plating solution composition, and temperature. As demands evolve, new electroplating processes need to be developed, or existing processes optimized, to meet specific functional requirements. Electroplating experimental equipment provides a controlled environment that allows researchers to experimentally verify the impact of different parameter combinations on electroplating results, thereby optimizing or developing new processes.

[0045] The experimental equipment for electroplating processes in related technologies has relatively limited functionality. Different processes require specialized electroplating lines to match, and it cannot meet high-quality requirements in terms of jet intensity and coverage. Even if modifications are made, the entire equipment needs to be significantly altered to meet the requirements of a specific function, which can negatively impact testing of other products. For example, adjusting the distance can cause uniformity issues with anode placement, reduce the ability of large jets to fill holes, and result in low applicability. There are also problems such as electric field line obstruction when the nozzle is close to the board surface.

[0046] It is evident that the experimental equipment for electroplating processes in related technologies has relatively limited functionality and applicability.

[0047] Based on this, this application provides an electroplating experimental apparatus that integrates multiple functions to achieve full-surface electroplating of back panels and through-hole filling electroplating. It is also suitable for processes such as modified semi-additive plating (MSAP) and semi-additive plating (SAP). It meets the requirements of high uniformity and high fluidity of the plating solution for different types of substrates. It is easy to operate, has excellent production performance, and can meet different electroplating needs, significantly saving space and investment costs.

[0048] See Figure 1 As shown, Figure 1 This is a top view of the electroplating experimental apparatus 10 in one embodiment of this application.

[0049] The electroplating experimental apparatus 10 provided in this application includes an electroplating tank 300, a first electrode 100, and a jet assembly. Both the first electrode 100 and the jet assembly are disposed within the electroplating tank 300. The jet assembly includes multiple jet elements 210, each with a second electrode 212. When using the electroplating experimental apparatus 10 to electroplat a workpiece, the workpiece is placed at the first electrode 100 within the electroplating tank 300. Electricity is passed through the first electrode 100 and the second electrode 212 to the electroplating solution within the electroplating tank 300. The current reduces metal ions from the electroplating solution into metal atoms, which are then deposited on the surface of the workpiece to form a metal coating.

[0050] Multiple jetting elements 210 are respectively disposed on at least one side of the first electrode 100 along the first direction F1, and arranged sequentially along the first direction F1 away from the first electrode 100. Each jetting element 210 has at least one jet nozzle communicating with the electroplating tank 300. During electroplating, jets are sprayed into the electroplating tank 300 through the jet nozzles of the jetting assembly to stir and accelerate solution convection, thereby promoting uniform mixing of metal ions in the electroplating solution within the electroplating tank 300 and improving the uniformity of the deposited film.

[0051] At least one of the spray nozzles 210 is configured to spray electroplating solution into the electroplating tank 300 through a corresponding spray nozzle. Alternatively, at least one spray nozzle 210 at a different distance from the first electrode 100 can be controlled to spray electroplating solution into the electroplating tank 300 through its spray nozzle. It is understood that when the spray nozzles 210 at different distances from the first electrode 100 spray, the agitation flow rate of the electroplating solution around the workpiece to be plated and the concentration of metal ions in the electroplating solution are also different. Different types of workpieces require different flow rates and metal ion concentrations of the electroplating solution around them. This application can control the spraying of at least one spray nozzle 210 at different distances from the first electrode 100, creating different electroplating environments to adapt to different electroplating needs.

[0052] The electroplating experimental apparatus 10 of this application is feature-rich, highly practical, and can adapt to meet different electroplating needs.

[0053] In this embodiment, the workpiece to be plated may have two surfaces to be plated located on opposite sides, or it may have only one surface to be plated, or it may have multiple through holes to be plated, etc. When the workpiece to be plated is located at the first electrode 100, the first direction F1 can be perpendicular to the surface to be plated. Alternatively, the extension direction of the through holes to be plated can be parallel to the first direction F1. The arrangement can be made according to the specific workpiece to be plated, and no further restrictions are imposed here.

[0054] In some embodiments, the jetting assembly is located at the bottom of the electroplating tank 300, that is, multiple jetting elements 210 jet the electroplating liquid in a direction away from the bottom of the electroplating tank 300, thereby uniformly stirring the electroplating liquid in the electroplating tank 300.

[0055] In some embodiments, see Figure 1 Combined with reference Figure 2 and Figure 3 As shown, Figure 2 for Figure 1 Top view of the jet component 210 in the illustrated embodiment. Figure 3 for Figure 1 Side view of the jet component 210 in the illustrated embodiment.

[0056] The jetting component 210 includes a tube body 211 extending along a second direction F2. The tube body 211 has multiple jet nozzles, which are spaced apart along the second direction F2. A second electrode 212 is provided between two adjacent jet nozzles. The first direction F1 and the second direction F2 intersect each other. That is, the tube body 211 of the jetting component 210 extends along the second direction F2, and the multiple tube bodies 211 of the multiple jetting components 210 are arranged sequentially along the first direction F1. The multiple jetting components 210 can be spaced apart or arranged adjacent to each other; no further restrictions are imposed here.

[0057] Furthermore, the second electrode 212 and the jet nozzle are alternately arranged on the tube body 211 along the second direction F2, so that each jet element 210 can uniformly jet the electroplating solution at all points along the extension direction of the tube body 211. The uniform arrangement of the second electrode 212 at each point along the extension direction of the corresponding tube body 211 helps to increase the uniformity of the reduction of metal ions into metal atoms in the electroplating solution, thereby improving the coating uniformity of the electroplating experimental apparatus 10 and enhancing experimental stability.

[0058] In some embodiments, such as Figure 1 The first electrode 100 is a copper busbar structure extending along the second direction F2, that is, the first electrode 100 is a cathode copper busbar extending along the second direction F2. Thus, the first electrode 100 and the second electrode 212 can cooperate to form a uniform electric field extending along the second direction F2, with the direction of the electric field pointing from one of the first electrode 100 and the second electrode 212 to the other. It can be understood that the uniform cooperation of the first electrode 100 and the second electrode 212 along the second direction F2 is beneficial to improving the uniformity of the coating on the surface of the workpiece to be plated.

[0059] In some embodiments, the second electrode 212 is configured as a titanium mesh as an anode to have better dimensional stability and electrocatalytic performance, which is beneficial to improving electrolysis efficiency.

[0060] In some embodiments, see Figure 2 and Figure 3 As shown, the jetting component 210 also includes multiple jetting sub-tubes 213, which are connected to the jetting nozzles one by one. The design of the jetting sub-tubes 213 facilitates the guidance of the electroplating solution jetting out of the jetting nozzles, which helps to improve the jetting stability and thus improves the accuracy of the electroplating experiment.

[0061] In this embodiment, the spacing L between two adjacent jet tubes 213 satisfies: 14.24cm ≤ L ≤ 21cm, and the spacing L can be 17.5cm. This ensures that the two adjacent jet tubes 213 have a better spacing, which improves the uniformity of the jet flow, reduces manufacturing difficulty, and saves costs.

[0062] In some embodiments, the diameter D of the jet sub-tube 213 satisfies: 2cm ≤ D ≤ 3cm. This facilitates a more uniform and appropriately velocity flow of electroplating solution from the jet sub-tube 213, reduces the jet coverage rate during the coating process, further improves jet stability, and enhances the accuracy of the electroplating experiment. The diameter D of the jet sub-tube 213 can be 2.5cm, and the distance L between two adjacent jet sub-tubes 213 can be 17.5cm, meaning the distance between the centers of two adjacent jet sub-tubes 213 can be 20cm.

[0063] In some embodiments, the size W of the second electrode 212 along the circumference of the tube 211 satisfies: 10cm ≤ W ≤ 15cm. This gives the second electrode 212 a better surface area, providing more active sites for electrochemical reactions, which is beneficial to improving electrolysis efficiency. It also makes the current density distribution more uniform, which helps to reduce local overload phenomena and improves the stability of the electrolysis process and the coating quality.

[0064] In this embodiment, the second electrode 212 is not limited to being arranged circumferentially around the tube body 211. Alternatively, a portion of the second electrode 212 can be located on the outer wall of the tube body 211, with its width along the first direction F1. Correspondingly, the dimension W1 of the second electrode 212 along the first direction F1 satisfies 10cm ≤ W1 ≤ 15cm. This facilitates a better surface area for the second electrode 212, which is beneficial for improving electrolysis efficiency and the stability of the electrolysis process.

[0065] In some embodiments, the outlet of the jet tube 213 and the side of the second electrode 212 facing the electroplating tank 300 are at the same level, thereby achieving multiple uses of one tank while significantly reducing the problems of poor uniformity of fine lines and insufficient exchange of additives in high aspect ratio holes, and greatly improving the uniformity of coating.

[0066] In some embodiments, such as Figure 1 The electroplating experimental apparatus 10 also includes multiple control valves 500. Each control valve 500 is correspondingly positioned on a spray element 210. It can be understood that each spray element 210 can be independently controlled by its corresponding control valve 500 to determine whether it is conducting, or in other words, to independently control whether it sprays electrolyte into the electrolytic tank. This allows control of at least one of the multiple spray elements 210 located at different distances from the first electrode 100, enabling it to spray electroplating solution into the electroplating tank 300 through its corresponding nozzle, creating different electroplating environments to meet various electroplating requirements.

[0067] In some embodiments, continue reading Figure 1As shown, the electroplating experimental apparatus 10 also includes two filters 400. One filter 400 is connected to one end of the tube 211 of the electroplating tank 300 and the jetting component 210, while the other filter 400 is connected to the other end of the tube 211 of the jetting component 210. The electroplating solution in the electroplating tank 300 can flow through the filter 400 into the tube 211 of the jetting component 210, and then be sprayed into the electroplating tank 300 through the jetting sub-tubes 213 of the jetting component 210, thus circulating. The two filters 400 allow the electroplating solution to flow into both ends of the tube 211, which helps to make the jetting rate of the jetting sub-tubes 213 on both sides of the tube 211 the same, which helps to improve the uniformity and stability of the jetting at all points of the jetting component 210, thereby improving the coating uniformity of the electroplating experimental apparatus 10 and improving the experimental accuracy.

[0068] In this embodiment, the tube 211 may be equipped with control valves 500 at its opposite ends, thereby improving the flexibility of introducing electroplating solution into the tube 211. Depending on the requirements, the control valve 500 at one end of the tube 211 can be opened while the control valve 500 at the other end is closed, allowing electroplating solution to be introduced into the tube 211 only from one end. Alternatively, both control valves 500 at both ends of the tube 211 can be opened, allowing electroplating solution to be introduced into the tube 211 from both ends. Specifically, the corresponding control valves 500 can be switched on and off according to the actual situation, without imposing too many restrictions here.

[0069] In some embodiments, a main valve structure can be provided in the passage between the filter 400 and the electroplating tank 300, and another main valve structure can be provided in the passage between the filter 400 and the multiple spray nozzles 210. This main valve structure allows simultaneous control of whether electroplating solution is introduced into the multiple spray nozzles 210, and each spray nozzle 210 can be controlled by its own independent control valve 500 to spray electroplating solution into the electroplating tank 300. The main valve structure improves operational convenience. For example, the control valves 500 on the multiple spray nozzles 210 can all be in the open state, allowing control of whether electroplating solution is sprayed into the electroplating tank 300 through the multiple spray nozzles 210 via the main valve structure. This enhances operational ease.

[0070] In some embodiments, in conjunction with reference Figure 1Multiple jetting elements 210 are symmetrically arranged relative to the first electrode 100 along the first direction F1. That is, the multiple jetting elements 210 in this application can be evenly arranged on the same side or both sides of the first electrode 100 along the first direction F1, while in this embodiment, the multiple jetting elements 210 are symmetrically arranged relative to the first electrode 100. Especially for workpieces requiring simultaneous coating on two surfaces, the symmetrically arranged multiple jetting elements 210 can provide similar or nearly identical coating environments on both sides, which helps improve the uniformity of the coated layer. Furthermore, when controlling the jetting flow of different jetting elements 210, two or an even number of symmetrical jetting elements 210 can be controlled to jet simultaneously, thereby creating different electroplating environments to adapt to different electroplating requirements while achieving simultaneous coating on both sides.

[0071] In some embodiments, such as Figure 1 The plurality of jetting elements 210 includes two first jetting elements 210A symmetrically arranged relative to the first electrode 100 along the first direction F1. Along the first direction F1, the distance X1 between the first jetting element 210A and the first electrode 100 satisfies: 20cm ≤ X1 ≤ 24cm. Thus, the first jetting element 210A is relatively far from the first electrode 100, and when the first jetting element 210A sprays, the flow rate of the electroplating solution around the workpiece is relatively slow, resulting in gentle stirring of the metal ion concentration. Furthermore, the symmetrical arrangement of the two first jetting elements 210A provides a stable and consistent coating environment for the two surfaces to be coated, which is beneficial for improving the coating uniformity of the two surfaces.

[0072] In some embodiments, such as Figure 1 The plurality of jetting elements 210 includes two second jetting elements 210B symmetrically arranged relative to the first electrode 100 along the first direction F1. Along the first direction F1, the distance X2 between the second jetting element 210B and the first electrode 100 satisfies: 14cm ≤ X2 ≤ 18cm. Compared to the first jetting element 210A, the second jetting element 210B is relatively closer to the first electrode 100. When the second jetting element 210B is spraying, the flow rate of the electroplating solution around the workpiece increases relatively, and the stirring speed of the metal ion concentration also increases relatively. Furthermore, the symmetrical arrangement of the two second jetting elements 210B provides a stable and consistent coating environment for the two surfaces to be coated, which is beneficial for improving the coating uniformity of the two surfaces.

[0073] In some embodiments, such as Figure 1The plurality of jetting elements 210 includes two third jetting elements 210C symmetrically arranged relative to the first electrode 100 along the first direction F1. Along the first direction F1, the distance X3 between the third jetting element 210C and the first electrode 100 satisfies: 8cm ≤ X1 ≤ 12cm. Similarly, compared to the second jetting element 210B, the third jetting element 210C is closer to the first electrode 100. When the third jetting element 210C is spraying, the flow rate of the electroplating solution around the workpiece increases relatively, and the stirring speed of the metal ion concentration also increases relatively. Furthermore, the symmetrical arrangement of the two third jetting elements 210C provides a stable and consistent coating environment for the two surfaces to be coated, which is beneficial for improving the coating uniformity of the two surfaces.

[0074] In some embodiments, such as Figure 1 The plurality of jetting elements 210 includes two fourth jetting elements 210D symmetrically arranged relative to the first electrode 100 along the first direction F1. Along the first direction F1, the distance X4 between the fourth jetting element 210D and the first electrode 100 satisfies: 2cm ≤ X1 ≤ 6cm. It is evident that the fourth jetting element 210D is relatively closer to the first electrode 100. When the fourth jetting element 210D is spraying, the flow rate of the electroplating solution around the workpiece increases relatively, and the stirring speed of the metal ion concentration also increases relatively. Furthermore, the symmetrical arrangement of the two fourth jetting elements 210D can provide a stable and consistent coating environment for the two surfaces to be coated on both sides of the workpiece, which is beneficial for improving the coating uniformity of the two surfaces.

[0075] This application uses multiple jetting elements 210 with different spacing from the first electrode 100 to create different coating environments or electroplating environments, thus making it suitable for different electroplating needs and having a wide range of applications.

[0076] In some embodiments, continue reading Figure 1 As shown, the first electrode 100 includes a first end and a second end opposite to each other along the second direction F2. The electroplating experimental apparatus 10 also includes a first rectifier 610 and a second rectifier 620. The negative electrode of the first rectifier 610 is electrically connected to the first end of the first electrode 100, and the positive electrode of the first rectifier 610 is electrically connected to the second electrode 212 on one side of the first electrode 100 along the first direction F1. It can be understood that the first electrode 100 has multiple spray elements on one side of the first direction F1, and each spray element is provided with multiple second electrodes 212. The multiple second electrodes 212 on each spray element can be connected in series with each other, and the positive electrode of the first rectifier 610 is electrically connected to the second electrodes 212 on the multiple spray elements respectively.

[0077] Similarly, the negative terminal of the second rectifier 620 is electrically connected to the second end of the first electrode 100, and the positive terminal of the second rectifier 620 is electrically connected to the second electrode 212 on the other side of the first electrode 100 along the first direction F1. The first electrode 100 has multiple spray elements on the other side of the first direction F1, and each spray element has multiple second electrodes 212. The multiple second electrodes 212 on each spray element can be connected in series, and the positive terminal of the second rectifier 620 is electrically connected to the second electrodes 212 on the multiple spray elements respectively.

[0078] By using two rectifiers to control the second electrodes 212 on the jetting elements 210 on both sides of the first electrode 100, it is possible to control the plating of one of the two surfaces to be plated on the workpiece, or to plate both surfaces. For example, controlling one of the first rectifier 610 and the second rectifier 620 to be turned on allows plating of the surface facing the second electrode 212 connected to the turned-on rectifier. Conversely, controlling both rectifiers 610 and 620 to be turned on allows plating of both surfaces. This provides high flexibility and is beneficial for meeting different electroplating requirements.

[0079] In some embodiments, the first rectifier 610 and the second rectifier 620 are both pulse rectifiers, which can switch between DC and pulse to enable the use of both DC and pulse.

[0080] In some embodiments, a switch is provided between the corresponding rectifier and the second electrode 212 on the corresponding jet element 210 to achieve the conductivity requirements of the second electrode 212 at different positions or on different jet elements 210. This switch may employ a titanium rod conductive interface.

[0081] The electroplating experimental apparatus 10 of this application is used for electroplating through holes, thick back plates, blind holes, filled holes, and carrier plates. It effectively solves the problem of limited functionality in electroplating process experimental equipment in related technologies. It also addresses the issue that a single electroplating solution cannot effectively demonstrate process capabilities under different designs in the early stages of development, and the potential inapplicability of the electroplating solution itself under certain conditions. This effectively reduces the risk level of product application. This application can control the jetting flow of the jetting elements 210 at different distances from the first electrode 100, resulting in different stirring flow rates and metal ion concentrations in the electroplating solution around the workpiece. By controlling the jetting flow of the jetting elements 210 at different distances from the first electrode 100, different electroplating environments can be created to adapt to different electroplating needs, expanding the application scenarios of the final product in different processes. Furthermore, it enhances the verification of the entire electroplating experimental apparatus 10, broadening its application scenarios. In short, the electroplating experimental apparatus 10 of this application is feature-rich, highly practical, and highly compatible, capable of meeting diverse electroplating requirements. Furthermore, this application offers advantages such as ease of use, reduced operational processes, and fewer steps requiring switching between plating baths in related technologies. Additionally, the electroplating solution is recycled, minimizing waste liquid generation and reducing environmental pollution.

[0082] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0083] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An electroplating experiment apparatus characterized by comprising: The electroplating experimental device comprises: an electroplating tank; a first electrode arranged in the electroplating tank; and a jet assembly arranged in the electroplating tank, the jet assembly comprising a plurality of jet members, each of the jet members being provided with a second electrode, the plurality of jet members being arranged on at least one side of the first electrode along a first direction, and the plurality of jet members being arranged in sequence along the first direction and away from the first electrode. At least one of the jet members is provided with at least one jet port in communication with the electroplating tank. At least one of the jet members is configured to jet electroplating solution into the electroplating tank through the corresponding jet port.

2. The electroplating experiment apparatus according to claim 1, wherein The jet member comprises a pipe body extending along a second direction, the pipe body being provided with a plurality of jet ports, the plurality of jet ports being arranged in sequence along the second direction, and the second electrode being arranged between any two adjacent jet ports. The first direction and the second direction intersect each other.

3. The electroplating experiment apparatus according to claim 2, wherein The jet member further comprises a plurality of jet sub-pipes, each of the jet sub-pipes being in communication with one of the jet ports. The distance L between any two adjacent jet sub-pipes satisfies 14.24 cm≤L≤21 cm.

4. The electroplating apparatus according to claim 3, wherein The diameter D of the jet sub-pipe satisfies 2 cm≤D≤3 cm.

5. The electroplating apparatus of claim 2, wherein The size W of the second electrode along the circumferential direction of the pipe body satisfies 10 cm≤W≤15 cm.

6. The electroplating apparatus of claim 2, wherein The electroplating experimental device further comprises a plurality of control valves. The control valves are arranged corresponding to the jet members, and each of the control valves is arranged on the corresponding jet member.

7. The electroplating apparatus of claim 6, wherein the electroplating apparatus further comprises a temperature control unit configured to control a temperature of the electroplating solution. The electroplating experimental device further comprises two filters, one of the filters being in communication with the electroplating tank and one end of the pipe body of the jet member, and the other filter being in communication with the electroplating tank and the other end of the pipe body of the jet member.

8. The electroplating apparatus of claim 1, wherein The plurality of jet members are symmetrically arranged relative to the first electrode along the first direction.

9. The electroplating experiment apparatus according to claim 8, wherein The plurality of jet members comprise two first jet members symmetrically arranged relative to the first electrode along the first direction, and the distance X1 between the first jet members and the first electrode along the first direction satisfies 20 cm≤X1≤24 cm; and / or The plurality of jet members comprise two second jet members symmetrically arranged relative to the first electrode along the first direction, and the distance X2 between the second jet members and the first electrode along the first direction satisfies 14 cm≤X2≤18 cm; and / or The plurality of jet members comprise two third jet members symmetrically arranged relative to the first electrode along the first direction, and the distance X3 between the third jet members and the first electrode along the first direction satisfies 8 cm≤X1≤12 cm; and / or The plurality of jet members comprise two fourth jet members symmetrically arranged relative to the first electrode along the first direction, and the distance X4 between the fourth jet members and the first electrode along the first direction satisfies 2 cm≤X1≤6 cm.

10. The electroplating apparatus of claim 1, wherein The first electrode comprises a first end and a second end opposite to each other along a second direction, and the electroplating experiment device further comprises a first rectifier and a second rectifier, a negative electrode of the first rectifier is electrically connected to the first end of the first electrode, a positive electrode of the first rectifier is electrically connected to the second electrode on one side of the first electrode along the first direction, a negative electrode of the second rectifier is electrically connected to the second end of the first electrode, and a positive electrode of the second rectifier is electrically connected to the second electrode on the other side of the first electrode along the first direction. The first direction and the second direction intersect with each other.

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