Partition paper for PCB electroplating

Abstract

The utility model discloses clapboard paper for PCB (printed circuit board) electroplating, which relates to the technical field of PCB electroplating and comprises a dust-free paper body, one side of the dust-free paper body is provided with an OCA (optical clear adhesive) layer used for contacting with a softer conductive surface on a PCB, one side of the OCA layer far away from the dust-free paper body is provided with a first release protective film, and the other side of the OCA layer far away from the dust-free paper body is provided with a second release protective film. A second release protective film is arranged on one side, far away from the OCA adhesive layer, of the dust-free paper body, the second release protective film is a single-sided release protective film, one side, provided with a release layer, of the second release protective film is in contact with the dust-free paper body, and a second OCA adhesive layer is arranged on one side, far away from the dust-free paper body, of the second release protective film. According to the dust-free paper, the OCA glue layer is arranged on one side of the dust-free paper body, and the OCA glue layer has softness and is used for being in contact with a soft conductive surface (a silver-plated surface or an easily-plated surface) on the PCB and protecting the soft conductive surface, so that the PCB can be prevented from being scratched, and the practicability of the dust-free paper is enhanced.

Description

Technical Field

[0001] This utility model relates to the field of PCB electroplating technology, specifically a separator paper used in PCB electroplating. Background Technology

[0002] In the printed circuit board (PCB) industry, to ensure the provision of high-quality boards to customers, in addition to strictly adhering to the production process at every stage of production and processing, partition paper is placed between each PCB board as it enters the receiving machine to prevent surface scratches during intermediate stages such as board movement between different sections and temporary stacking after each processing step. This is done to enhance the protection of the board surface from adverse external factors such as handling and friction between boards. Therefore, this utility model proposes a partition paper for use in PCB electroplating. Utility Model Content

[0003] Technical problems to be solved

[0004] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a separator paper for use in PCB electroplating.

[0005] Technical solution

[0006] To achieve the above objectives, this utility model provides the following technical solution: a separator paper for PCB electroplating, comprising a dust-free paper body, an OCA adhesive layer for contacting a softer conductive surface on the PCB board on one side of the dust-free paper body, a first release protective film on the side of the OCA adhesive layer away from the dust-free paper body, and a second release protective film on the side of the dust-free paper body away from the OCA adhesive layer. By providing an OCA adhesive layer on one side of the dust-free paper body, the OCA adhesive layer has softness and is used to contact and protect the softer conductive surface (silver-plated or easily plated surface) on the PCB board, thereby preventing scratches on the PCB board and affecting subsequent processing, effectively improving the performance of the device and enhancing its practicality.

[0007] Preferably, the second release protective film is a single-sided release protective film, with the side having the release layer in contact with the dust-free paper body.

[0008] Preferably, a second OCA adhesive layer is provided on the side of the second release protective film away from the dust-free paper body.

[0009] Preferably, a third release film is provided on one side of the second OCA adhesive layer.

[0010] Preferably, the OCA adhesive layer is a soft OCA adhesive.

[0011] Preferably, the first release protective film is a unidirectional release protective film, with the side having the release layer in contact with the OCA adhesive layer.

[0012] Preferably, a third OCA adhesive layer is provided on the side of the first release protective film away from the OCA adhesive layer.

[0013] Preferably, a fourth release film is provided on one side of the third OCA adhesive layer.

[0014] Beneficial effects:

[0015] Compared with existing technologies, this separator paper used in PCB electroplating has the following advantages:

[0016] This invention provides an OCA adhesive layer on one side of the lint-free paper body. The OCA adhesive layer is soft and is used to contact and protect the softer conductive surface (silver-plated or easy-to-surface) on the PCB board. This prevents scratches on the PCB board and avoids affecting subsequent processing, effectively improving the performance and practicality of the device. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the structure of the second OCA adhesive layer and the third release protective film of this utility model;

[0020] Figure 3 This is a schematic diagram of the structure of the third OCA adhesive layer and the fourth release protective film of this utility model.

[0021] In the picture:

[0022] 1. Cleanroom paper body; 2. OCA adhesive layer; 3. First release protective film; 4. Second release protective film; 5. Second OCA adhesive layer; 6. Third release protective film; 7. Third OCA adhesive layer; 8. Fourth release protective film. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figures 1-3 As shown, this utility model provides a technical solution: a separator paper for PCB electroplating, comprising a dust-free paper body 1, an OCA adhesive layer 2 for contacting a softer conductive surface on the PCB board on one side of the dust-free paper body 1, a first release protective film 3 on the side of the OCA adhesive layer 2 away from the dust-free paper body 1, and a second release protective film 4 on the side of the dust-free paper body 1 away from the OCA adhesive layer 2. By setting the OCA adhesive layer 2 on one side of the dust-free paper body 1, the OCA adhesive layer 2 has softness and is used to contact and protect the softer conductive surface (silver-plated or easily plated surface) on the PCB board, thereby preventing scratches on the PCB board and affecting subsequent processing, effectively improving the performance of the device and enhancing its practicality.

[0025] Please refer to the following carefully. Figure 2 The second release protective film 4 is a single-sided release protective film. The side with the release layer is in contact with the dust-free paper body 1. The side of the second release protective film 4 away from the dust-free paper body 1 is provided with a second OCA adhesive layer 5, and the side of the second OCA adhesive layer 5 is provided with a third release protective film 6.

[0026] Please refer to the following carefully. Figure 3 The first release protective film 3 is a unidirectional release protective film, with the side having the release layer in contact with the OCA adhesive layer 2. A third OCA adhesive layer 7 is provided on the side of the first release protective film 3 away from the OCA adhesive layer 2, and a fourth release protective film 8 is provided on the side of the third OCA adhesive layer 7.

[0027] In this application, the OCA adhesive layer 2 is a soft OCA adhesive.

[0028] Working principle: An OCA adhesive layer 2 is set on one side of the lint-free paper body 1. The OCA adhesive layer 2 is soft and is used to contact and protect the softer conductive surface (silver-plated or easy-to-plate surface) on the PCB board. This prevents the PCB board from being scratched, which would affect subsequent processing. This effectively improves the performance of the device and enhances its practicality.

[0029] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A separator paper for use in PCB plating, characterized by: The application relates to a dust-free paper body (1), one side of the dust-free paper body (1) is provided with an OCA adhesive layer (2) for contacting a softer conductive surface on a PCB board, the side, away from the dust-free paper body (1), of the OCA adhesive layer (2) is provided with a first release protection film (3), and the side, away from the OCA adhesive layer (2), of the dust-free paper body (1) is provided with a second release protection film (4).

2. The separator paper for PCB plating according to claim 1, wherein: The second release protection film (4) is a single-side release protection film, one side of the release layer of which is in contact with the dust-free paper body (1).

3. A separator paper for PCB plating according to claim 2, wherein: The side, away from the dust-free paper body (1), of the second release protection film (4) is provided with a second OCA adhesive layer (5).

4. The separator paper for PCB plating according to claim 3, wherein: One side of the second OCA adhesive layer (5) is provided with a third release protection film (6).

5. The separator paper for PCB plating according to claim 1, wherein: The OCA adhesive layer (2) is an OCA adhesive layer with softness.

6. A separator paper for PCB plating according to claim 1, wherein: The first release protection film (3) is a single-side release protection film, one side of the release layer of which is in contact with the OCA adhesive layer (2).

7. A separator paper for PCB plating according to claim 6, wherein: The side, away from the OCA adhesive layer (2), of the first release protection film (3) is provided with a third OCA adhesive layer (7).

8. A separator paper for PCB plating according to claim 7, wherein: One side of the third OCA adhesive layer (7) is provided with a fourth release protection film (8).

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