Vapor chamber and jig for manufacturing vapor chamber

Abstract

The utility model discloses a vapor chamber and a jig for manufacturing the vapor chamber. The vapor chamber comprises a cover body and a heat pipe, the cover body comprises a bottom plate, a connecting port is formed in the bottom plate, the first end of the heat pipe is open and communicated with the connecting port, and the second end, opposite to the first end, of the heat pipe is sealed. The jig comprises a lower jig and an upper jig which are oppositely arranged; at least one mounting groove matched with the heat pipe is formed in the lower jig, and the mounting groove is used for accommodating the heat pipe; the upper jig is provided with a containing groove and a limiting groove which communicate with each other, the first side of the limiting groove faces the containing groove, the second side, opposite to the first side, of the limiting groove communicates with the mounting groove, and the limiting groove is used for containing the bottom plate. The jig for manufacturing the vapor chamber ensures that the positions of the heat pipe and the bottom plate in the jig are stable and accurate, and capillary structures sintered on the upper surface of the bottom plate and the inner surface of the heat pipe are conveniently manufactured at the same time subsequently, so that the manufacturing precision of the vapor chamber is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of temperature equalizing plate especially relates to a temperature equalizing plate and a jig for making temperature equalizing plate. BACKGROUND

[0002] With the rapid development of modern electronic technology, the power density of high-performance electronic devices is constantly improving, and the requirement for heat dissipation technology is also getting higher and higher. As a kind of high-efficiency heat dissipation component, vapor chamber (VC) is widely used in the heat dissipation of CPU, GPU and other high-performance chips. VC vapor chamber is a vacuum cavity with microstructure on the inner wall, usually made of copper and other high thermal conductivity materials. Its working principle is based on phase change heat transfer: when heat is conducted from the heat source to the VC cavity, the cooling liquid in the cavity begins to vaporize after being heated, and the volume expands rapidly and fills the entire cavity; when the gas phase working medium contacts a cooler area, condensation occurs, releasing the heat absorbed previously; the condensed cooling liquid returns to the evaporation heat source through the microstructure capillary channel, and the process is repeated in the cavity, thereby realizing efficient heat conduction and dissipation.

[0003] Reference Figure 1 Traditional planar vapor chamber is relatively simple in structure, but its heat conduction is mainly limited to two-dimensional plane. The liquid at the bottom of the vacuum cavity evaporates and diffuses into the vacuum cavity after absorbing the heat of the chip, and then conducts the heat to the heat dissipation fins, and then removes the heat through air flow. The advantage of this scheme is low cost, but its disadvantage is also obvious: the transmission efficiency of heat in the Z direction (i.e. the direction perpendicular to the plane of the vapor chamber) is limited, and it is difficult to meet the higher requirements of high heat flux density area on heat dissipation performance.

[0004] In order to solve the problem of insufficient heat conduction of traditional planar vapor chamber in Z direction, the industry has proposed 3D vapor chamber VC technology. The internal cavity of 3D vapor chamber VC is open in all directions, and the capillary structure in each direction is also connected. This structure makes 3DVC work like multiple vertical heat pipes, while being integrated with planar vapor chamber to form an internally connected solid unit. Not only does it maintain the high-efficiency heat conduction of traditional vapor chamber in two-dimensional direction, but also significantly enhances the heat conduction capacity in Z direction.

[0005] However, 3D vapor chamber VC technology also has certain disadvantages, mainly in the aspects of difficult manufacturing process and high cost. In order to accurately process the internal microstructure and capillary channel, advanced processing technology and equipment are needed, which undoubtedly increases the production cost and manufacturing difficulty.

[0006] Therefore, the utility model provides a temperature equalizing plate and a jig for making temperature equalizing plate. Utility model content

[0007] The purpose of this invention is to provide a heat spreader and a fixture for manufacturing the heat spreader, which ensures that the heat pipe and the base plate are in a stable and accurate position in the fixture, and facilitates the subsequent simultaneous fabrication of capillary structures sintered on the upper surface of the base plate and the inner surface of the heat pipe, thereby improving the manufacturing precision of the heat spreader.

[0008] The objective of this utility model is achieved through the following technical solution:

[0009] In a first aspect, this utility model provides a fixture for manufacturing a heat spreader plate, the heat spreader plate including a cover and a heat pipe, the cover including a bottom plate, the bottom plate having a connection port, the first end of the heat pipe being open and communicating with the connection port, and the second end of the heat pipe opposite to the first end being sealed.

[0010] The fixture includes: a lower fixture and an upper fixture arranged opposite to each other;

[0011] The lower fixture has at least one mounting groove that matches the heat pipe, and the mounting groove is used to accommodate the heat pipe.

[0012] The upper fixture has a connected receiving groove and a limiting groove. The first side of the limiting groove faces the receiving groove, and the second side of the limiting groove opposite to the first side is connected to the mounting groove. The limiting groove is used to receive the base plate.

[0013] Furthermore, the upper fixture includes a first upper fixture;

[0014] The first upper fixture has at least one powder blowing hole, which communicates with the receiving groove, and the receiving groove is used to receive copper powder injected from the powder blowing hole; and / or,

[0015] The first upper fixture has at least one mounting hole, which is connected to the receiving groove and the mounting groove.

[0016] Furthermore, the fixture also includes a mold core, the mold core comprising:

[0017] The mandrel passes through the mounting hole, the receiving groove, and the limiting groove. The free end of the mandrel is suspended in the mounting groove. The gap between the outer surface of the free end of the mandrel and the inner wall of the heat pipe forms a powder injection chamber.

[0018] A limiting block is connected to the fixed end of the mandrel opposite to the free end.

[0019] Furthermore, the upper fixture includes a second upper fixture;

[0020] The second upper fixture is provided with at least one protruding structure, which is inserted into the mounting groove.

[0021] Furthermore, the heat spreader also includes a first capillary structure and a second capillary structure. The first capillary structure is disposed on the inner wall of the heat pipe, the second capillary structure is partially disposed on the base plate, and the second capillary structure is partially disposed on the first capillary structure.

[0022] The outer diameter of the protrusion structure = the diameter of the mounting groove - 2 × the thickness of the heat pipe - 2 × the thickness of the first capillary structure - 2 × the thickness of the second capillary structure.

[0023] Secondly, this utility model provides a temperature distribution plate, the temperature distribution plate comprising:

[0024] A cover body, the cover body including a top plate and a bottom plate, the top plate and the bottom plate forming a vacuum chamber, and a connection port being provided on the bottom plate;

[0025] A heat pipe, wherein the first end of the heat pipe is open and communicates with the connection port, and the second end of the heat pipe opposite to the first end is sealed;

[0026] The capillary assembly includes a first capillary structure and a second capillary structure connected to each other. The first capillary structure is disposed on the inner wall of the heat pipe, and the second capillary structure is partially disposed on the base plate. The first capillary structure and the second capillary structure are made using the aforementioned fixture.

[0027] The heat dissipation structure includes multiple heat dissipation fins, each of which is disposed through the second end of the heat pipe.

[0028] Furthermore, the capillary assembly includes:

[0029] A third capillary structure, wherein the third capillary structure is disposed on the top plate; and / or,

[0030] A fourth capillary structure is disposed on the second capillary structure.

[0031] Furthermore, the temperature distribution plate also includes a support structure, the support structure comprising:

[0032] At least one first support post, a first surface of the first support post being connected to the second capillary structure, and a second surface of the first support post opposite to the first surface being connected to the third capillary structure.

[0033] Furthermore, the temperature distribution plate also includes a support structure, the support structure comprising:

[0034] At least one second support column, the top surface of the second support column being connected to the second capillary structure, and the bottom surface of the second support column opposite to the top surface being connected to the third capillary structure;

[0035] The first support column is a copper powder column, and the second support column is a copper column.

[0036] Furthermore, both the third capillary structure and the fourth capillary structure are configured as copper mesh structures;

[0037] The first capillary structure was made using a copper powder sintering process;

[0038] The second capillary structure is made using a copper powder sintering process or is configured as a copper mesh structure.

[0039] Compared with the prior art, the beneficial effects of this utility model include at least the following:

[0040] This invention uses the mounting groove on the lower fixture to accommodate the heat pipe, ensuring that the heat pipe is stably and accurately positioned in the fixture. The design of the accommodating groove and the limiting groove on the upper fixture allows the bottom plate of the cover to be precisely positioned and fixed, which facilitates the subsequent simultaneous fabrication of capillary structures sintered on the upper surface of the bottom plate and the inner surface of the heat pipe, thereby improving the manufacturing accuracy of the heat spreader. Attached Figure Description

[0041] Figure 1 This is a schematic diagram of a heat spreader in the prior art.

[0042] Figure 2 This is a schematic diagram of the vacuum chamber of the temperature distribution plate according to an embodiment of the present invention.

[0043] Figure 3 This is a schematic diagram of the structure of a heat spreader according to an embodiment of the present utility model.

[0044] Figure 4 This is an exploded view of the cover body according to an embodiment of the present utility model.

[0045] Figure 5 This is a schematic diagram of a support structure according to an embodiment of the present utility model.

[0046] Figure 6 This is a schematic diagram of the structure of a fixture according to an embodiment of the present utility model.

[0047] Figure 7 yes Figure 6 A magnified view of A in the middle.

[0048] Figure 8 This is another structural schematic diagram of the fixture according to an embodiment of the present utility model.

[0049] Figure 9 yesFigure 8 A magnified view of B in the middle.

[0050] In the diagram: 11. Cover; 111. Top plate; 112. Third capillary structure; 113. Support structure; 1131. Second support column; 1132. First support column; 114. Fourth capillary structure; 115. Second capillary structure; 116. Bottom plate; 12. Heat dissipation structure; 121. Heat dissipation fins; 122. Spacing; 13. Heat conduction structure; 131. Heat pipe; 132. First capillary structure; 14. Vacuum chamber; 21. First upper fixture; 203. Receiving groove; 204. Limiting groove; 211. Powder blowing hole; 212. Mounting hole; 22. Second upper fixture; 221. Protruding structure; 23. Lower fixture; 231. Mounting groove; 232. Powder injection chamber; 24. Mold core; 241. Limiting block; 242. Core rod. Detailed Implementation

[0051] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to make the present invention more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore repeated descriptions of them will be omitted.

[0052] The terms used to describe position and direction in this utility model are illustrated with the accompanying drawings, but changes can be made as needed, and all such changes are included within the scope of protection of this utility model.

[0053] Example 1

[0054] This embodiment describes a fixture for manufacturing a heat spreader.

[0055] In application, the heat spreader includes a cover 11 and a heat-conducting structure 13. Specifically, the cover 11 includes a top plate 111 and a bottom plate 116, with at least one connection port on the bottom plate 116 for connection to the heat-conducting structure 13. The heat-conducting structure 13 includes at least one heat pipe 131. Each heat pipe 131 has a first end and a second end disposed opposite to each other. The first end is open and communicates with the connection port, while the second end is sealed to prevent leakage of the internal working medium.

[0056] refer to Figures 6-9 The fixture in this embodiment includes a lower fixture 23 and an upper fixture arranged opposite to each other.

[0057] In this embodiment, the lower fixture 23 is the bottom component of the fixture. The lower fixture 23 has at least one mounting groove 231 that matches the shape and size of the heat pipe 131. The mounting groove 231 is used to accommodate the heat pipe 131. When the heat pipe 131 is placed into the mounting groove 231, it can ensure that the position of the heat pipe 131 in the lower fixture 23 is stable and accurate.

[0058] In this embodiment, the upper fixture is the top component of the fixture. The upper fixture has a communicating receiving groove 203 and a limiting groove 204. The limiting groove 204 is used to receive the base plate 116; the receiving groove 203 is used to receive the material forming the first capillary structure 132, such as copper powder or copper mesh. Further, the limiting groove 204 includes a first side and a second side disposed opposite to each other. The first side faces the receiving groove 203, and the second side communicates with the mounting groove 231 on the lower fixture 23.

[0059] This invention uses the mounting groove 231 on the lower fixture 23 to accommodate the heat pipe 131, ensuring that the heat pipe 131 is stably and accurately positioned in the fixture. The accommodating groove 203 and the limiting groove 204 of the upper fixture enable the bottom plate 116 of the cover 11 to be precisely positioned and fixed, which facilitates the subsequent simultaneous fabrication of capillary structures sintered on the upper surface of the bottom plate 116 and the inner surface of the heat pipe 131, thereby improving the manufacturing accuracy of the heat spreader.

[0060] Example 2

[0061] Based on Example 1, this example introduces a fixture for making a temperature equalization plate.

[0062] refer to Figure 6 and Figure 7 In this embodiment, the fixture for fabricating the heat spreader may further include a mold core 24. Specifically, the mold core 24 in this embodiment includes a core rod 242 and a limiting block 241. Further, the upper fixture in this embodiment includes a first upper fixture 21. Specifically, to allow the mold core 24 to be smoothly inserted into the fixture, the first upper fixture 21 in this embodiment has at least one mounting hole 212. To allow copper powder to be added to the fixture, the first upper fixture 21 in this embodiment has at least one powder blowing hole 211.

[0063] In this embodiment, the mandrel 242 passes through the mounting hole 212, the receiving groove 203, and the limiting groove 204, with its free end suspended within the mounting groove 231. The gap between the outer surface of the free end of the mandrel 242 and the inner wall of the heat pipe 131 forms the powder injection chamber 232. The limiting block 241 connects to the fixed end of the mandrel 242 opposite to its free end, serving to fix and support the mandrel 242. In application, the limiting block 241 ensures that the mandrel 242 maintains a stable position within the fixture, preventing it from moving or deforming due to external forces.

[0064] In this embodiment, the powder blowing hole 211 is connected to the receiving groove 203, which is used to receive copper powder injected from the powder blowing hole 211. In application, in order to make the copper powder relatively uniformly distributed, the distance between adjacent powder blowing holes 211 is 60mm.

[0065] During the manufacturing process, copper powder can be injected into the receiving groove 203 through the powder blowing hole 211 to fill the space between the first upper fixture 21 and the base plate 116. Furthermore, the copper powder will also enter the powder injection chamber 232 along the receiving groove 203 and the mounting hole 212 to fill the gap between the heat pipe 131 and the mandrel 242. In practical applications, after the copper powder injection is completed, a first capillary structure 132 is formed on the inner wall of the heat pipe 131 and a second capillary structure 115 is formed on the base plate 116 through sintering. The first capillary structure 132 and the second capillary structure 115 are interconnected to increase the heat conduction performance of the heat spreader.

[0066] Example 3

[0067] Based on Example 1, this example introduces a fixture for making a temperature equalization plate.

[0068] refer to Figure 8 and Figure 9 The heat spreader in this embodiment further includes a first capillary structure 132 and a second capillary structure 115. The first capillary structure 132 is disposed on the inner wall of the heat pipe 131, and the second capillary structure 115 is partially disposed on the base plate 116 and partially disposed on the first capillary structure 132. The second capillary structure 115 is configured as a copper mesh structure. Furthermore, the upper fixture in this embodiment includes a second upper fixture 22.

[0069] In this embodiment, the second upper fixture 22 is provided with at least one protrusion 221, which is inserted into the mounting groove 231. Specifically, in order to ensure that the protrusion 221 can be inserted into the mounting groove 231 precisely without compressing or damaging the heat pipe 131 and its capillary structure, the outer diameter of the protrusion 221 is equal to the diameter of the mounting groove 231 - 2 × the thickness of the heat pipe 131 - 2 × the thickness of the first capillary structure 132 - 2 × the thickness of the second capillary structure 115.

[0070] During the manufacturing process, firstly, the first capillary structure 132 is sintered onto the inner wall of the heat pipe 131. Next, a portion of the second capillary structure 115 is sintered onto the base plate 116, and the remaining second capillary structure 115 is bent so that it abuts against the first capillary structure 132. Then, the heat pipe 131 is inserted into the mounting groove 231, the base plate 116 is placed in the limiting groove 204, and the protrusion 221 of the upper fixture is inserted into the heat pipe 131, with the outer surface of the protrusion 221 abutting against the bent second capillary structure 115, thereby compressing the bent second capillary structure 115 and the first capillary structure 132 abutting against it. In practical applications, through sintering, the first capillary structure 132 and the second capillary structure 115 are interconnected to increase the heat conduction performance of the heat spreader.

[0071] Example 4

[0072] Based on any one of the embodiments 1-3, this embodiment introduces a heat spreader.

[0073] The heat spreader in this embodiment includes: a cover 11, a heat pipe 131, a capillary assembly, and a heat dissipation structure 12. The capillary assembly is made using the fixture described in any of embodiments 1-3.

[0074] refer to Figure 3 In this embodiment, the cover 11 includes a top plate 111 and a bottom plate 116. (See reference...) Figure 2 The top plate 111 and the bottom plate 116 are connected by a sealing process to form a vacuum chamber 14.

[0075] In this embodiment, a connection port is provided on the base plate 116. The first end of the heat pipe 131 is open and communicates with the connection port. The heat pipe 131 serves as the main channel for heat transfer, ensuring that heat can be smoothly introduced from the heat source into the interior of the heat spreader. Furthermore, the heat pipe 131 is filled with a phase change material, which can evaporate in the heat absorption section and condense in the heat release section, achieving efficient heat transfer through the phase change process. The second end of the heat pipe 131, opposite the first end, is sealed to prevent leakage of the internal phase change material.

[0076] refer to Figure 4 The capillary assembly in this embodiment includes a first capillary structure 132 and a second capillary structure 115 interconnected. The first capillary structure 132 is disposed on the inner wall of the heat pipe 131, and its fine channel structure effectively promotes the reflux and distribution of the working medium, ensuring uniform heat distribution within the heat pipe 131. The second capillary structure 115 is partially disposed on the base plate 116, forming good thermal contact with the base plate 116, further enhancing the heat absorption and diffusion capabilities. In application, the first capillary structure 132 is manufactured using a copper powder sintering process; the second capillary structure 115 is manufactured using a copper powder sintering process or configured as a copper mesh structure.

[0077] refer to Figure 3 The heat dissipation structure 12 includes multiple heat dissipation fins 121, each fin 121 extending through the second end of the heat pipe 131. The heat dissipation fins 121 not only increase the heat dissipation area but also effectively dissipate heat conducted from the heat pipe 131 into the environment through air convection. In application, the heat dissipation fins 121 are made of metallic or non-metallic thermally conductive materials, such as aluminum, copper, or copper-aluminum composite materials. Preferably, the heat dissipation fins 121 are aluminum and are arranged parallel to the cover 11. In practical applications, the arrangement, size, and shape of the heat dissipation fins 121 are optimized to maximize heat dissipation efficiency while maintaining low flow resistance and noise levels. Preferably, the multiple heat dissipation fins 121 are arranged at equal intervals 122, with a spacing 122 of 3mm between adjacent fins 121, enabling uniform and rapid heat dissipation.

[0078] In practical applications, the length of heat pipe 131 can be set according to actual needs, such as 100mm, to enhance the heat conduction capability of the heat spreader in the Z direction.

[0079] Example 5

[0080] Based on Example 4, this example introduces a heat spreader.

[0081] refer to Figure 4 To further improve the heat dissipation efficiency of the heat exchanger, the capillary assembly in this embodiment also includes a third capillary structure 112 and a fourth capillary structure 114. Specifically, the third capillary structure 112 is disposed on the top plate 111, and the fourth capillary structure 114 is disposed on the second capillary structure 115, which not only increases the heat conduction area but also realizes multi-level heat dispersion and transfer. In application, both the third capillary structure 112 and the fourth capillary structure 114 are configured as copper mesh structures.

[0082] refer to Figure 4 and Figure 5 The heat spreader in this embodiment also includes a support structure 113. Specifically, the support structure 113 includes at least one first support column 1132 and at least one second support column 1131.

[0083] refer to Figure 5 The first support column 1132 has its first surface connected to the second capillary structure 115, and its second surface, opposite to the first surface, is connected to the third capillary structure 112. This ensures smooth heat transfer between the second capillary structure 115 and the third capillary structure 112, while also enhancing the structural stability between them. In application, the first support column 1132 is made of copper powder. Due to its excellent thermal conductivity and plasticity, copper powder can adapt well to the complex shape of the capillary structure, achieving a tight fit.

[0084] refer to Figure 5 The top surface of the second support column 1131 is connected to the second capillary structure 115, and the bottom surface of the second support column 1131, opposite to the top surface, is connected to the third capillary structure 112. In application, the second support column 1131 is a copper column, which has higher strength and rigidity, and can provide additional support for the capillary assembly to prevent structural deformation caused by thermal or mechanical stress.

[0085] In practical applications, the first support column 1132 and the second support column 1131 can be used to guide condensate. When the phase-changing material (working medium) is heated and evaporates inside the heat spreader, it condenses into liquid water (condensate) near the top plate 111. When the condensate accumulation is insufficient, the first support column 1132 and the second support column 1131 can prevent the condensate from dripping directly onto the bottom plate 116, thereby avoiding local overheating or affecting the performance of the heat spreader. In addition, the flow of condensate on the support columns can carry away some heat, which helps to further reduce the temperature near the top plate 111.

[0086] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and alterations to the above embodiments within the scope of the present invention without departing from the principles and spirit of the present invention, and all such changes should fall within the protection scope of the claims of the present invention.

Claims

1. A fixture for manufacturing a heat spreader, characterized in that, The heat spreader includes a cover (11) and a heat pipe (131). The cover (11) includes a base plate (116). A connection port is provided on the base plate (116). The first end of the heat pipe (131) is open and communicates with the connection port. The second end of the heat pipe (131) opposite to the first end is sealed. The fixture includes: a lower fixture (23) and an upper fixture arranged opposite to each other; The lower fixture (23) has at least one mounting groove (231) that matches the heat pipe (131), and the mounting groove (231) is used to accommodate the heat pipe (131). The upper fixture is provided with a connecting receiving groove (203) and a limiting groove (204). The first side of the limiting groove (204) faces the receiving groove (203), and the second side of the limiting groove (204) opposite to the first side is connected to the mounting groove (231). The limiting groove (204) is used to receive the base plate (116).

2. The fixture for manufacturing a heat spreader according to claim 1, characterized in that, The upper fixture includes a first upper fixture (21); The first upper fixture (21) has at least one powder blowing hole (211), which communicates with the receiving groove (203), and the receiving groove (203) is used to receive copper powder injected from the powder blowing hole (211); and / or, The first upper fixture (21) has at least one mounting hole (212) which is connected to the receiving groove (203) and the mounting groove (231).

3. The fixture for manufacturing a heat spreader according to claim 2, characterized in that, The fixture further includes a mold core (24), the mold core (24) comprising: The core rod (242) passes through the mounting hole (212), the receiving groove (203) and the limiting groove (204). The free end of the core rod (242) is suspended in the mounting groove (231). The gap between the outer surface of the free end of the core rod (242) and the inner wall of the heat pipe (131) forms a powder injection chamber (232). A limiting block (241) is connected to the fixed end of the mandrel (242) opposite to the free end.

4. The fixture for manufacturing a heat spreader according to claim 1, characterized in that, The upper fixture includes a second upper fixture (22); The second upper fixture (22) is provided with at least one protrusion (221), which is inserted into the mounting groove (231).

5. The fixture for manufacturing a heat spreader according to claim 4, characterized in that, The heat spreader also includes a first capillary structure (132) and a second capillary structure (115). The first capillary structure (132) is disposed on the inner wall of the heat pipe (131), and the second capillary structure (115) is partially disposed on the base plate (116). The second capillary structure (115) is partially disposed on the first capillary structure (132). The outer diameter of the protrusion structure (221) = the diameter of the mounting groove (231) - 2 × the thickness of the heat pipe (131) - 2 × the thickness of the first capillary structure (132) - 2 × the thickness of the second capillary structure (115).

6. A heat spreader, characterized in that, The temperature distribution plate includes: The cover (11) includes a top plate (111) and a bottom plate (116), the top plate (111) and the bottom plate (116) forming a vacuum chamber (14), and the bottom plate (116) has a connection port. A heat pipe (131) is provided with an open first end and communicates with the connection port, and the second end of the heat pipe (131) opposite to the first end is sealed. A capillary assembly comprising a first capillary structure (132) and a second capillary structure (115) interconnected thereto, the first capillary structure (132) being disposed on the inner wall of the heat pipe (131), and the second capillary structure (115) being partially disposed on the base plate (116), the first capillary structure (132) and the second capillary structure (115) being made using a fixture as described in any one of claims 1-5; The heat dissipation structure (12) includes a plurality of heat dissipation fins (121), each of which is disposed through the second end of the heat pipe (131).

7. The temperature distribution plate according to claim 6, characterized in that, The capillary assembly includes: A third capillary structure (112) is disposed on the top plate (111); and / or, A fourth capillary structure (114) is disposed on the second capillary structure (115).

8. The temperature distribution plate according to claim 7, characterized in that, The temperature distribution plate also includes a support structure (113), which includes: At least one first support post (1132), a first surface of the first support post (1132) is connected to the second capillary structure (115), and a second surface of the first support post (1132) opposite to the first surface is connected to the third capillary structure (112).

9. The temperature distribution plate according to claim 8, characterized in that, The supporting structure (113) includes: At least one second support column (1131), the top surface of the second support column (1131) is connected to the second capillary structure (115), and the bottom surface of the second support column (1131) opposite to the top surface is connected to the third capillary structure (112). The first support column (1132) is a copper powder column, and the second support column (1131) is a copper column.

10. The temperature distribution plate according to claim 7, characterized in that, Both the third capillary structure (112) and the fourth capillary structure (114) are configured as copper mesh structures; The first capillary structure (132) is made by copper powder sintering process; The second capillary structure (115) is made by copper powder sintering process or is set as a copper mesh structure.

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