Semiconductor finished product deformation detection device

Abstract

The utility model discloses a semiconductor finished product deformation detection device, which relates to the technical field of semiconductor finished product detection and comprises a bottom plate, and the top end of the bottom plate is provided with a placement groove. The detection assembly is used for detecting a semiconductor finished product; the adjusting assembly is used for adjusting the height of the detection assembly; the placing assembly is used for supporting and placing the semiconductor; the clamping assembly is used for fixedly clamping the semiconductor; the placing assembly comprises a placing plate, the placing plate is slidably connected to the inner side of the placing groove, and a first rubber pad is arranged on one side of the placing plate; the clamping assembly comprises a pressing plate. The placing plate is arranged at the top end of the bottom plate, the clamping assemblies are arranged on the inner side of the placing plate, semiconductor finished products needing to be detected can be effectively fixed and clamped, meanwhile, the clamping assemblies are arranged at the top end of the placing plate, a plurality of semiconductor finished products can be fixed at the same time, and therefore detection work can be rapidly carried out; and the detection efficiency is effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor finished product testing technology, and in particular to a semiconductor finished product deformation detection device. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature falls between that of conductors and insulators. In traditional technologies, the lack of a connecting rib frame at the top makes them prone to warping and deformation at various stages of the production process, a situation that cannot be completely eliminated. This warping and deformation results in visual defects in the finished product, necessitating screening of semiconductor devices before shipment to prevent defective products from leaving the factory.

[0003] Utility model patent application publication number 202421707818.2 discloses a semiconductor finished product deformation detection device, which includes a measuring tool. One side of the measuring tool is recessed to form a limiting groove for embedding a semiconductor device under test. The measuring tool has an observation circular window and an observation heat sink window extending through the front and back of the measuring tool. The observation circular window and the observation heat sink window are centrally located in the limiting groove, with the observation circular window directly above the observation heat sink window. This utility model uses the external dimensions of the semiconductor device as a reference and the semiconductor device's factory specifications as the inspection standard dimensions. The measuring tool can detect the semiconductor device under test through the observation circular window and the observation heat sink window to determine whether it meets the factory standards. It is simple to operate and can achieve rapid and efficient inspection.

[0004] However, the above-mentioned devices still have some drawbacks in actual use. The most obvious one is that the existing semiconductor product testing devices can only test the deformation of a semiconductor in one test process. The semiconductor needs to be disassembled and re-clamped and fixed repeatedly to complete the test, resulting in low testing efficiency.

[0005] Therefore, it is necessary to invent a semiconductor finished product deformation detection device to solve the above problems. Utility Model Content

[0006] The purpose of this invention is to provide a semiconductor product deformation detection device. By providing a placement plate at the top of a base plate, and multiple sets of clamping components on the inner side of the placement plate, the device can effectively fix and clamp the semiconductor product to be tested. Simultaneously, the multiple clamping components at the top of the placement plate can fix multiple semiconductor products at the same time, thereby enabling rapid testing and significantly improving testing efficiency. This addresses the problem mentioned in the background art where existing semiconductor product testing devices can only detect the deformation of one semiconductor at a time, requiring repeated disassembly and re-clamping of the semiconductor before completing the testing, resulting in low testing efficiency.

[0007] According to one aspect of this disclosure, the following technical solution is provided: a semiconductor finished product deformation detection device, comprising:

[0008] A base plate, the top of which is provided with a placement groove;

[0009] Inspection components are used for inspecting finished semiconductor products;

[0010] An adjustment component is used to adjust the height of the detection component;

[0011] Placement components for supporting and placing semiconductors; and

[0012] Clamping components are used to hold semiconductors in place.

[0013] The placement assembly includes a placement plate, which is slidably connected to the inner side of the placement groove, and a first rubber pad is provided on one side of the placement plate;

[0014] The clamping assembly includes a pressure plate, a second rubber pad is provided on one side of the pressure plate, a connecting block is fixedly connected to the other end of the pressure plate, and an adjusting bolt is rotatably provided on the inner side of the connecting block, the adjusting bolt being threadedly connected to the inner side of the placement plate.

[0015] According to at least one embodiment of the present disclosure, a semiconductor finished product deformation detection device is provided, wherein a first limiting plate is fixedly connected to one side of the placement plate, a second limiting plate is fixedly connected to the other side of the placement plate, a first limiting groove is provided on one side of the placement groove, and the first limiting plate is slidably connected to the inner side of the first limiting groove.

[0016] According to at least one embodiment of the present disclosure, a semiconductor finished product deformation detection device is provided on the other side of the placement groove, a second limiting groove is provided, a second limiting plate is slidably connected to the inner side of the second limiting groove, an insertion hole is provided on the inner side of the second limiting plate, and a pin is provided on the outer side of the base plate, the pin passing through the inner side of the base plate and being disposed on the inner side of the insertion hole.

[0017] According to at least one embodiment of the present disclosure, a semiconductor finished product deformation detection device is provided, wherein a slider is fixedly connected to the bottom end of the pressure plate, and the slider is slidably connected to the inner side of the placement plate.

[0018] According to at least one embodiment of the present disclosure, a semiconductor finished product deformation detection device includes an observation microscope, an adjustment component includes a mounting rod and a mounting block, a fixing block is fixedly connected to the top of the base plate, the mounting rod is fixedly connected to the top of the fixing block, the mounting block is slidably connected to the outside of the mounting rod, a fastening bolt is provided on one side of the mounting block, the fastening bolt is threadedly connected to the inside of the mounting block, a connecting rod is fixedly connected to the other end of the mounting block, and the observation microscope is disposed inside the connecting rod.

[0019] The technical effects and advantages of this utility model are as follows:

[0020] (1) This utility model has a placement plate at the top of the base plate and multiple sets of clamping components on the inner side of the placement plate, which can effectively fix and clamp the semiconductor finished products that need to be tested. At the same time, multiple sets of clamping components at the top of the placement plate can fix multiple semiconductor finished products at the same time, thereby enabling rapid testing and effectively improving the testing efficiency. Attached Figure Description

[0021] The accompanying drawings illustrate exemplary embodiments of the present disclosure and, together with the description thereof, serve to explain the principles of the present disclosure. These drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification.

[0022] Figure 1 This is a schematic diagram of the overall structure of a semiconductor product deformation detection device according to one embodiment of the present disclosure.

[0023] Figure 2 This is a schematic diagram of the main structure of the placement plate in a semiconductor finished product deformation detection device according to one embodiment of the present disclosure.

[0024] Figure 3 This is a schematic diagram of the main structure of the pressure plate in a semiconductor finished product deformation detection device according to one embodiment of the present disclosure.

[0025] The specific labels in the attached figures are as follows:

[0026] 1. Base plate; 11. Fixing block; 12. Mounting rod; 13. Placement groove; 14. First limiting groove; 15. Second limiting groove;

[0027] 2. Mounting block; 21. Fastening bolt; 22. Connecting rod;

[0028] 3. Observe under a microscope;

[0029] 4. Placement plate; 41. First rubber pad; 42. First limiting plate; 43. Second limiting plate; 431. Insertion hole;

[0030] 5. Bolt;

[0031] 6. Pressure plate; 61. Adjusting bolt; 62. Second rubber pad; 63. Connecting block; 64. Sliding block. Detailed Implementation

[0032] like Figures 1-3 As shown, a semiconductor finished product deformation detection device disclosed herein may include: a base plate 1, the top of which is provided with a placement groove 13; a detection component for detecting semiconductor finished products; an adjustment component for adjusting the height of the detection component; a placement component for supporting and placing the semiconductor; and a clamping component for fixing and clamping the semiconductor.

[0033] like Figure 1 and Figure 2 and Figure 3 As shown, in this disclosure, the placement assembly includes a placement plate 4, which is slidably connected to the inner side of the placement groove 13, and a first adhesive pad 41 is provided on one side of the placement plate 4.

[0034] The clamping assembly includes a pressure plate 6, a second rubber pad 62 is provided on one side of the pressure plate 6, and a connecting block 63 is fixedly connected to the other end of the pressure plate 6. An adjusting bolt 61 is rotatably provided on the inner side of the connecting block 63, and the adjusting bolt 61 is threadedly connected to the inner side of the placement plate 4.

[0035] Therefore, by setting a placement plate 4 at the top of the base plate 1, and setting multiple sets of clamping components on the inner side of the placement plate 4, the semiconductor finished products to be tested can be effectively fixed and clamped. At the same time, the multiple sets of clamping components at the top of the placement plate 4 can fix multiple semiconductor finished products at the same time, thereby enabling rapid testing and effectively improving testing efficiency. By setting an adjusting bolt 61, which is threadedly connected to the inner side of the placement plate 4, rotating the adjusting bolt 61 can effectively move it within the inner side of the placement plate 4. By setting a connecting block 63, the adjusting bolt 61 is rotatably set within the connecting block 63, so that the movement of the adjusting bolt 61 can effectively drive the connecting block 63 to move, thereby driving the pressure plate 6 to move and clamp and fix the semiconductors set within the inner side of the placement plate 4.

[0036] like Figure 1 and Figure 2 As shown, in a preferred embodiment, a first limiting plate 42 is fixedly connected to one side of the placement plate 4, a second limiting plate 43 is fixedly connected to the other side of the placement plate 4, a first limiting groove 14 is provided on one side of the placement groove 13, and the first limiting plate 42 is slidably connected to the inner side of the first limiting groove 14.

[0037] Therefore, by setting the first limiting plate 42, the first limiting plate 42 is limited to sliding inside the first limiting groove 14, thereby effectively improving the stability of the movement of the placement plate 4.

[0038] like Figure 1 and Figure 2 As shown in this disclosure, a second limiting groove 15 is provided on the other side of the placement groove 13, and a second limiting plate 43 is slidably connected to the inner side of the second limiting groove 15. An insertion hole 431 is provided on the inner side of the second limiting plate 43, and a pin 5 is provided on the outer side of the base plate 1. The pin 5 passes through the inner side of the base plate 1 and is located on the inner side of the insertion hole 431.

[0039] Therefore, by setting the second limiting groove 15, it is convenient to slide the second limiting plate 43 inside the second limiting groove 15. At the same time, the inner side of the second limiting plate 43 is provided with a socket 431. The pin 5 can be inserted into the inner side of the socket 431 to limit the position of the second limiting plate 43. In specific use, after the placement plate 4 is slidably connected to the inner side of the placement groove 13, the second limiting plate 43 slides inside the second limiting groove 15. After the rightmost socket 431 reaches the position of the pin 5, the pin 5 is inserted into the inner side of the socket 431 to limit the position of the placement plate 4. At this time, the rightmost semiconductor fixed on the placement plate 4 is tested. After the first semiconductor is tested, the pin 5 is pulled out from the inner side of the socket 431, the placement plate 4 is moved to the second one on the right, and the second limiting plate 43 is limited by the pin 5 to test the second semiconductor fixed on the right. Thus, multiple semiconductors set on the placement plate 4 are tested in sequence.

[0040] like Figure 3 As shown, in a preferred embodiment, a slider 64 is fixedly connected to the bottom end of the pressure plate 6, and the slider 64 is slidably connected to the inner side of the placement plate 4.

[0041] Therefore, by setting up slider 64, which can be slidably connected to the inner side of the placement plate 4, the stability of the pressure plate 6 movement is effectively improved.

[0042] like Figure 1 As shown in this disclosure, the detection component includes an observation microscope 3, and the adjustment component includes a mounting rod 12 and a mounting block 2. A fixing block 11 is fixedly connected to the top of the base plate 1, the mounting rod 12 is fixedly connected to the top of the fixing block 11, the mounting block 2 is slidably connected to the outside of the mounting rod 12, a fastening bolt 21 is provided on one side of the mounting block 2, the fastening bolt 21 is threadedly connected to the inside of the mounting block 2, and a connecting rod 22 is fixedly connected to the other end of the mounting block 2. The observation microscope 3 is located inside the connecting rod 22.

[0043] Therefore, by setting the mounting block 2, which can be slidably connected to the outside of the mounting rod 12, it is easy to adjust the height of the mounting block 2. By setting the fastening bolt 21, which is threadedly connected to the inside of the mounting block 2, it is easy to fix the mounting block 2 to the outside of the mounting rod 12. By setting the connecting rod 22, it is easy to set the observation microscope 3 on the inside of the connecting rod 22, which is easy to adjust the height of the observation microscope 3. At the same time, the observation microscope 3 is used to observe and detect the semiconductor below.

[0044] Those skilled in the art should understand that the above embodiments are merely for illustrating the present disclosure and are not intended to limit the scope of the disclosure. Those skilled in the art can make other changes or modifications based on the above disclosure, and these changes or modifications still fall within the scope of the present disclosure.

Claims

1. A semiconductor finished product deformation detection device, characterized in that, The utility model relates to a semiconductor detection device, including: The bottom plate (1) top is provided with the placement groove (13); Detection assembly for semiconductor finished product detection; Adjustment assembly for the height of detection assembly adjustment; Placement assembly for supporting semiconductor placement; And Clamping assembly for semiconductor fixed clamping; The placement assembly includes placement board (4), and the placement board (4) sliding connection is in the inside of placement groove (13), and one side of the placement board (4) is provided with first rubber pad (41); The clamping assembly includes pressing plate (6), and one side of the pressing plate (6) is provided with second rubber pad (62), and the other end of the pressing plate (6) is fixedly connected with connecting block (63), and the inside of the connecting block (63) is rotationally provided with adjusting bolt (61), and the adjusting bolt (61) is threadedly connected to the inside of placement board (4).

2. The apparatus for detecting deformation of a semiconductor product according to claim 1, wherein: One side of the placement board (4) is fixedly connected with first limit board (42), and the other side of the placement board (4) is fixedly connected with second limit board (43), and one side of the placement groove (13) is provided with first limit slot (14), and the first limit board (42) is slidingly connected to the inside of first limit slot (14).

3. The apparatus of claim 2, wherein: The other side of the placement groove (13) is provided with second limit slot (15), and the second limit board (43) is slidingly connected to the inside of second limit slot (15), and the inside of the second limit board (43) is provided with jack (431), and the outside of the bottom plate (1) is provided with plug pin (5), and the plug pin (5) penetrates the inside of the bottom plate (1) and is arranged in the inside of jack (431).

4. The apparatus of claim 3, wherein: The bottom end of the pressing plate (6) is fixedly connected with sliding block (64), and the sliding block (64) is slidingly connected to the inside of placement board (4).

5. A device for detecting deformation of a semiconductor product according to claim 4, characterized in that: The detection assembly includes observation microscope (3), the adjustment assembly includes mounting rod (12) and mounting block (2), the top of the bottom plate (1) is fixedly connected with fixed block (11), the mounting rod (12) is fixedly connected to the top of fixed block (11), the mounting block (2) is slidingly connected to the outside of mounting rod (12), one side of the mounting block (2) is provided with fastening bolt (21), the fastening bolt (21) is threadedly connected to the inside of mounting block (2), the other end of the mounting block (2) is fixedly connected with connecting rod (22), and the observation microscope (3) is arranged in the inside of connecting rod (22).

Images