High-temperature piezoelectric integrated vibration sensor

Abstract

The utility model discloses a high temperature type piezoelectric integrated vibration sensor, which comprises a device box body, a sealing cover assembly and a heat dissipation assembly, the upper end and the lower end of the device box body are respectively provided with one part of the sealing cover assembly, the right side wall of the device box body is provided with a connecting end, the connecting end is internally provided with a piezoelectric sensor, and the piezoelectric sensor is connected with the heat dissipation assembly. Mounting threads are arranged on the outer wall of the connecting end, and one part of a heat dissipation assembly is mounted on the outer wall of the left side of the device box body; the problems that in the prior art, although a sensor in use can save production cost, is flexible to use and can better guarantee stable and reliable work of the sensor, the sensor is usually in a severe working environment, and the sensor is not provided with a heat dissipation device, so that the sensor cannot work stably and reliably in some high-temperature working environments, and the service life of the sensor is prolonged are solved. And the reliability of the sensor is reduced due to faults caused by high temperature.

Description

TECHNICAL FIELD

[0001] The utility model relates to vibration sensor technical field, concretely related to a high temperature piezoelectric integrated vibration sensor. BACKGROUND

[0002] The vibration sensor is one of the key components in the test technology, and its main role is to receive mechanical quantity and convert it into proportional electric quantity, and since it is also an electromechanical conversion device, it is sometimes also called transducer, vibration pickup and the like.

[0003] According to the check public (announcement) number: CN212539400U discloses a piezoelectric vibration sensor, and this technology discloses that "the shell is fixedly connected with the base, the lower part of the base is fixedly connected with the screw rod, the upper part of the base is provided with the center threaded column, the outer surface of the center threaded column is sleeved with the piezoelectric ceramic sheet, the lower surface of the piezoelectric ceramic sheet is provided with the first electrode sheet, the upper surface of the piezoelectric ceramic sheet is provided with the second electrode sheet, the lower surface of the first electrode sheet is provided with the first insulating sheet, and the upper surface of the second electrode sheet is provided with the second insulating sheet.

[0004] However, the piezoelectric vibration sensor has the following shortcomings:

[0005] 1、Although the sensor in the patent can save production cost, be flexible to use and better guarantee the stable and reliable work of the sensor, the sensor is usually in a severe working environment, and the sensor is not provided with a heat dissipation device, so that the sensor is prone to failure in some high-temperature working environment, thereby reducing the reliability of the sensor.

[0006] To solve the above problems, the high-temperature piezoelectric integrated vibration sensor is provided in the application. Utility model content

[0007] In view of the problems in the related art, the utility model provides a high-temperature piezoelectric integrated vibration sensor, which can ensure that the sensor has stronger heat dissipation capacity in a high-temperature working environment, thereby further improving the reliability of the sensor.

[0008] Therefore, the utility model adopts the specific technical scheme as follows:

[0009] The utility model provides a high temperature type piezoelectric integrated vibration sensor, including device box body, cover assembly and heat dissipation subassembly, one part of cover assembly is installed respectively on the upper and lower both ends of device box body, is installed with the connecting end on the right side wall of device box body, is installed with piezoelectric sensor in the connecting end, is provided with the mounting thread on the outer wall of connecting end, one part of heat dissipation subassembly is installed on the left side outer wall of device box body,

[0010] The heat dissipation subassembly includes an upper heat conduction plate, the upper heat conduction plate is installed on one end of the cover assembly by mounting bolts, the outer wall of the upper heat conduction plate is installed with heat dissipation fins, the bottom wall of the other part of the cover assembly is installed with a lower heat conduction plate by mounting bolts, the outer wall of the lower heat conduction plate is also installed with heat dissipation fins, and the left side outer wall of the device box body is installed with an auxiliary heat conduction plate by mounting bolts, and the outer wall of the auxiliary heat conduction plate is also installed with heat dissipation fins.

[0011] As a further scheme of the utility model, the cover assembly includes an upper cover, the upper cover is installed on the upper end of the device box body by four corner fixing bolts, and a lower cover is installed on the bottom end of the device box body by four corner fixing bolts.

[0012] As a further scheme of the utility model, the outer walls of the upper cover and the lower cover are both provided with limiting holes and mounting holes, the upper heat conduction plate is installed on the upper end of the upper cover by cooperating with the mounting holes of the upper cover through mounting bolts, and the lower heat conduction plate is installed on the bottom end of the lower cover by cooperating with the mounting holes of the lower cover through mounting bolts.

[0013] As a further scheme of the utility model, the upper heat conduction plate and the lower heat conduction plate are both provided with limiting columns matched with the limiting holes.

[0014] As a further scheme of the utility model, the connecting parts of the upper heat conduction plate and the lower heat conduction plate with the upper cover and the lower cover are coated with heat-conducting grease, and the connecting part of the auxiliary heat conduction plate with the left side wall of the device box body is also coated with heat-conducting grease.

[0015] As a further scheme of the utility model, the limiting holes on the left side wall of the device box body are matched with the limiting columns on the auxiliary heat conduction plate.

[0016] As a further scheme of the utility model, the front and rear walls of the device box body are both provided with anti-skid lines.

[0017] The utility model has the advantages of:

[0018] The device box body, the cover assembly and the heat dissipation assembly are matched to work, in use, first, the upper heat conduction plate, the lower heat conduction plate and the auxiliary heat conduction plate are respectively installed to the predetermined position through the mounting bolt, in the process, the heat conduction grease needs to be daubed at the connecting place of each heat conduction plate, then the connecting end is screw-connected with the mounting position, installation can be completed, when working, the heat dissipation fins on each heat conduction plate can assist the device box body to dissipate heat, so that the temperature in the device box body can be reduced in the high-temperature environment, and failure can be avoided, so that the device can guarantee that the sensor has stronger heat dissipation capacity in the high-temperature working environment, and the reliability of the sensor can be further improved. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0020] Figure 1 It is a whole structure schematic diagram of a high-temperature piezoelectric integrated vibration sensor according to the embodiment of the present application.

[0021] Figure 2 It is a partial heat dissipation assembly structure schematic diagram of a high-temperature piezoelectric integrated vibration sensor according to the embodiment of the present application.

[0022] Figure 3 It is an auxiliary heat conduction plate schematic diagram of a high-temperature piezoelectric integrated vibration sensor according to the embodiment of the present application.

[0023] Figure 4 It is a cover assembly structure schematic diagram of a high-temperature piezoelectric integrated vibration sensor according to the embodiment of the present application.

[0024] Figure 5 It is an auxiliary heat conduction plate use state schematic diagram of a high-temperature piezoelectric integrated vibration sensor according to the embodiment of the present application.

[0025] In the drawings:

[0026] 1, device box body; 2, cover assembly; 21, upper cover; 22, fixing bolt; 23, lower cover; 24, limiting hole; 25, mounting hole; 26, limiting column; 3, heat dissipation assembly; 4, connecting end; 5, piezoelectric sensor; 6, mounting thread; 7, upper heat conduction plate; 8, mounting bolt; 9, heat dissipation fin; 10, lower heat conduction plate; 11, auxiliary heat conduction plate; 12, anti-skid line. DETAILED DESCRIPTION

[0027] To further illustrate the embodiments, the utility model provides with the drawings, these drawings are part of the utility model disclosure, it mainly used to illustrate the embodiment, and can cooperate the related description of the specification to explain the operation principle of the embodiment, cooperate with reference to these contents, the person skilled in the art should be able to understand other possible implementation ways and the advantages of the utility model, the components in the drawing are not drawn according to the proportion, and similar component symbols are usually used to represent similar components.

[0028] According to the embodiment of the utility model, a high-temperature piezoelectric integrated vibration sensor is provided.

[0029] Please refer to the drawings of the specification Figures 1-5, according to the utility model discloses a high temperature type piezoelectric integrated vibration sensor, including device box body 1, cover assembly 2 and heat dissipation subassembly 3, the upper and lower ends of device box body 1 are installed with the one part of cover assembly 2 respectively, cover assembly 2 includes upper cover 21, upper cover 21 is installed through the fixed bolt 22 of four corners on the upper end of device box body 1, the bottom of device box body 1 is installed with lower cover 23 through the fixed bolt 22 of four corners, the right side wall of device box body 1 is installed with connecting end 4, piezoelectric sensor 5 is installed in connecting end 4, the outer wall of connecting end 4 is provided with mounting thread 6, the left side outer wall of device box body 1 is installed with the one part of heat dissipation subassembly 3, heat dissipation subassembly 3 includes upper heat conduction plate 7, upper heat conduction plate 7 is installed through mounting bolt 8 on the one part upper end of cover assembly 2, the outer wall of upper heat conduction plate 7 is installed with heat dissipation fin 9, the bottom wall of the other part of cover assembly 2 is installed with lower heat conduction plate 10 through mounting bolt 8, the outer wall of lower heat conduction plate 10 is also installed with heat dissipation fin 9, the left side outer wall of device box body 1 is installed with auxiliary heat conduction plate 11 through mounting bolt 8, the outer wall of auxiliary heat conduction plate 11 is also installed with heat dissipation fin 9, the outer wall of upper cover 21 and lower cover 23 is all set with limiting hole 24 and mounting hole 25, upper heat conduction plate 7 is installed on the upper end of upper cover 21 through the cooperation of mounting bolt 8 and the mounting hole 25 of upper cover 21, lower heat conduction plate 10 is installed on the bottom end of lower cover 23 through the cooperation of mounting bolt 8 and the mounting hole 25 of lower cover 23, the limiting hole 24 of upper heat conduction plate 7 and lower heat conduction plate 10 are all installed with the limiting post 26 that cooperates with, the connecting place of upper heat conduction plate 7 and lower heat conduction plate 10 and upper cover 21 and lower cover 23 is daubed with heat-conducting grease respectively, the connecting place of auxiliary heat conduction plate 11 and the left side wall of device box body 1 is also daubed with heat-conducting grease, the limiting hole 24 on the left side wall of device box body 1 cooperates with the limiting post 26 on auxiliary heat conduction plate 11. Through the cooperation of the device box body 1 of setting, cover assembly 2 and heat dissipation subassembly 3 work, when using, first through mounting bolt 8 installs upper heat conduction plate 7, lower heat conduction plate 10 and auxiliary heat conduction plate 11 to the predetermined position respectively, in this process, heat-conducting grease needs to be daubed at the connecting place of each heat conduction plate, then connecting end 4 is connected with the installation position thread, can complete installation, when working, the heat dissipation fin 9 on each heat conduction plate, can assist device box body 1 heat dissipation, make it high temperature environment, can reduce the temperature in device box body 1, avoid malfunction, thereby make the device can guarantee sensor in high temperature working environment, has stronger heat dissipation capacity, and then can further improve the reliability of sensor.

[0030] In an embodiment, please refer to the description attached Figures 1-5 , as the further scheme of the utility model, the front and rear walls of device box body 1 are all provided with anti-skid line 12. The anti-skid line 12 that sets up can facilitate the installation and dismounting of device box body 1.

[0031] Work flow: in use, first by installing bolt 8 respectively installed on the upper heat plate 7, lower heat plate 10 and auxiliary heat plate 11 to the predetermined position, in the process, in the connection of each heat plate need to smear the heat conduction fat, then the connection end 4 and installation position threaded connection, namely the installation can be completed, work, each heat plate on the heat dissipation fin 9, can assist device box 1 heat dissipation, make it high temperature environment, can reduce the temperature in the device box 1, avoid malfunction.

[0032] The above is only the preferred embodiment of the present application, and is not intended to limit the present application, any modification, equivalent replacement, improvement, etc. within the spirit and principles of the present application, should be included in the protection scope of the present application.

Claims

1. A high-temperature piezoelectric integrated vibration sensor, comprising a device housing (1), a cover assembly (2), and a heat dissipation assembly (3), characterized in that: A portion of a sealing assembly (2) is installed at the upper and lower ends of the device housing (1). A connecting end (4) is installed on the right side wall of the device housing (1). A piezoelectric sensor (5) is installed inside the connecting end (4). An installation thread (6) is provided on the outer wall of the connecting end (4). A portion of a heat dissipation assembly (3) is installed on the left outer wall of the device housing (1). The heat dissipation assembly (3) includes an upper heat-conducting plate (7), which is mounted on the upper part of a cover assembly (2) by mounting bolts (8). Heat dissipation fins (9) are installed on the outer wall of the upper heat-conducting plate (7). A lower heat-conducting plate (10) is mounted on the bottom wall of the other part of the cover assembly (2) by mounting bolts (8). Heat dissipation fins (9) are also installed on the outer wall of the lower heat-conducting plate (10). A heat-dissipating auxiliary heat-conducting plate (11) is mounted on the left outer wall of the device housing (1) by mounting bolts (8). Heat dissipation fins (9) are also installed on the outer wall of the heat-dissipating auxiliary heat-conducting plate (11).

2. The high-temperature piezoelectric integrated vibration sensor according to claim 1, characterized in that: The sealing assembly (2) includes an upper cover (21), which is installed on the upper end of the device box (1) by fixing bolts (22) at the four corners, and a lower cover (23) is installed on the bottom end of the device box (1) by fixing bolts (22) at the four corners.

3. The high-temperature piezoelectric integrated vibration sensor according to claim 2, characterized in that: Limiting holes (24) and mounting holes (25) are provided on the outer walls of the upper cover (21) and the lower cover (23). The upper heat-conducting plate (7) is installed on the upper end of the upper cover (21) by means of mounting bolts (8) and mounting holes (25) of the upper cover (21). The lower heat-conducting plate (10) is installed on the bottom end of the lower cover (23) by means of mounting bolts (8) and mounting holes (25) of the lower cover (23).

4. A high-temperature piezoelectric integrated vibration sensor according to claim 3, characterized in that: Both the upper heat-conducting plate (7) and the lower heat-conducting plate (10) are equipped with limiting posts (26) that cooperate with the limiting holes (24).

5. A high-temperature piezoelectric integrated vibration sensor according to claim 4, characterized in that: Thermal grease is applied to the connection points of the upper heat-conducting plate (7) and the lower heat-conducting plate (10) with the upper cover (21) and the lower cover (23), respectively. Thermal grease is also applied to the connection point of the auxiliary heat-conducting plate (11) with the left side wall of the device housing (1).

6. A high-temperature piezoelectric integrated vibration sensor according to claim 4, characterized in that: The limiting hole (24) on the left side wall of the device housing (1) is used in conjunction with the limiting post (26) on the heat-conducting plate (11).

7. A high-temperature piezoelectric integrated vibration sensor according to claim 1, characterized in that: The device housing (1) has anti-slip textures (12) on both the front and back walls.

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