Pressure sensor

Abstract

The utility model discloses a pressure sensor, comprising a pressure sensing structure comprising a first structure and a second structure which are in butt joint, an integrated circuit structure having a first end and a second end arranged opposite to the first end, the first end being connected with the first structure of the pressure sensing structure; the first supporting piece is arranged at the second end; the signal transmission structure is connected with the second end through the first supporting piece; the signal transmission structure comprises a top cover, the top cover is provided with a plurality of limiting holes, and a spring is arranged in each limiting hole. According to the utility model, the pressure sensor comprises the first support member, the connection between the integrated circuit structure and the signal transmission structure is realized through the arrangement of the first support member, and the output precision of the pressure sensor can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor devices, specifically to a pressure sensor. BACKGROUND

[0002] The pressure sensor realized by the glass micro-melting technology is widely applied in the vehicle industry, such as fuel system, braking system and vehicle stability system, and is usually used for realizing the pressure detection of various gases or liquids such as braking and transmission.

[0003] In the related art, the pressure sensor realized by the glass micro-melting technology usually includes a pressure source, a fluid channel and a spring for realizing signal transmission. However, due to the structure, fixing mode and inherent characteristics of the spring, the spring may be broken or abnormally stressed, thereby affecting the service life and output accuracy of the pressure sensor. SUMMARY

[0004] In view of the above defects of the prior art, the technical problem to be solved by the utility model is how to improve the output accuracy of the pressure sensor.

[0005] In order to solve at least one of the above technical problems, the utility model discloses a pressure sensor.

[0006] According to one aspect of the present disclosure, a pressure sensor is provided, comprising:

[0007] A pressure sensing structure includes a first structure and a second structure in opposite connection;

[0008] An integrated circuit structure has a first end and a second end arranged opposite to the first end, and the first end is connected to the first structure of the pressure sensing structure;

[0009] A first support is arranged at the second end;

[0010] A signal transmission structure is connected to the second end through the first support;

[0011] The signal transmission structure includes a top cover having a plurality of limiting holes, a spring is arranged in each limiting hole, and the spring is clamped to the first support.

[0012] In some possible embodiments, the integrated circuit structure includes:

[0013] An integrated circuit board is electrically connected to the first structure of the pressure sensing structure;

[0014] A second support is clamped to the integrated circuit board and connected to the pressure sensing structure.

[0015] In some possible embodiments, the first support comprises:

[0016] a support base connected with an integrated circuit board in the integrated circuit structure;

[0017] a protruding portion clamped in the spring arranged in the limiting hole of the signal transmission structure.

[0018] In some possible embodiments, the number of the springs is the same as the number of the first supports.

[0019] In some possible embodiments, the first structure of the pressure sensing structure comprises:

[0020] a first surrounding side wall, which forms a first cavity inside, and a sensitive area arranged on the outer wall of the first surrounding side wall;

[0021] a sensitive chip fixed to the surface of the sensitive area.

[0022] In some possible embodiments, the second structure of the pressure sensing structure comprises:

[0023] a second surrounding side wall, which forms a through second cavity inside, and a plurality of stepped portions arranged on the outer side;

[0024] the first cavity and the second cavity are in communication.

[0025] In some possible embodiments, the pressure sensing structure further comprises:

[0026] a bonding structure bonded between the sensitive chip and the sensitive area.

[0027] In some possible embodiments, the number of the sensitive chips is a plurality.

[0028] In some possible embodiments, the integrated circuit structure further comprises:

[0029] a conductive wire for realizing wire bonding connection between the integrated circuit board and the pressure sensing structure;

[0030] a protective layer covering the conductive wire, a region where the integrated circuit board is connected with the conductive wire, and a region where the pressure sensing structure is connected with the conductive wire.

[0031] In some possible embodiments, a first end of the integrated circuit structure is configured to acquire a sensing signal output by the pressure sensing structure,

[0032] a second end of the integrated circuit structure is configured to output the processed sensing signal.

[0033] In some possible embodiments, the first support is electrically connected with the integrated circuit structure and is configured to acquire the processed inductive signal.

[0034] In some possible embodiments, the pressure sensor further comprises:

[0035] An outer shell is arranged outside the integrated circuit structure, one end of the outer shell is connected with the pressure sensing structure, and the other end is connected with the top cover of the signal transmission structure.

[0036] The utility model discloses, has following beneficial effect:

[0037] In the utility model, the pressure sensor comprises pressure sensing structure and signal transmission structure arranged at two ends of integrated circuit structure, so that the pressure sensing structure transmits the inductive signal to the signal transmission structure through the integrated circuit structure. The signal transmission structure comprises a top cover, and a limiting hole for accommodating and limiting the spring is arranged on the top cover. The pressure sensor further comprises a first support arranged at one end of the integrated circuit structure. The spring moves along its own axis and is subjected to vertical force by cooperation of the first support and the limiting hole, so that the force change caused by the deviation and skew of the spring can be avoided, the influence of the force deviation of the spring on the output precision of the pressure sensor can be reduced, and the stability of signal transmission between the structures in the pressure sensor can be improved. In addition, the pressure sensing structure comprises a first structure and a second structure in abutment. Compared with the structure in the prior art, the stress can be reduced and the manufacturing process can be simplified. BRIEF DESCRIPTION OF DRAWINGS

[0038] In order to more clearly illustrate the technical scheme of the utility model, the following will be briefly introduced the drawings needed to be used in the description of prior art or, and obviously, the drawings in the following description are some embodiments of the utility model, and for those skilled in the art, under the premise of not paying creative labor, other drawings can also be obtained according to these drawings.

[0039] Figure 1 The cross-sectional view of the pressure sensor provided by the embodiment of the utility model is provided.

[0040] Figure 2 The structure schematic view of the pressure sensing structure provided by the embodiment of the utility model is provided.

[0041] Figure 3 The cross-sectional view of the pressure sensing structure provided by the embodiment of the utility model is provided.

[0042] Figure 4 The first side view of the integrated circuit structure provided by the embodiment of the utility model is provided.

[0043] Figure 5The second side view of the integrated circuit structure is provided for the embodiment of the utility model.

[0044] Corresponding to the above-mentioned reference signs are:

[0045] 100-pressure sensing structure, 110-first structure, 111-first side wall, 112-first cavity, 113-sensitive area, 114-sensitive chip, 120-second structure, 121-second side wall, 122-second cavity, 123-step part, 130-bonding structure;

[0046] 200-integrated circuit structure, 210-integrated circuit board, 211-groove, 212-connection contact, 220-second support, 221-boss, 230-protection layer;

[0047] 300-first support, 310-support base, 320-boss part;

[0048] 400-signal transmission structure, 410-top cover, 411-limiting hole, 420-spring;

[0049] 500-outer shell;

[0050] L1-first end, L2-second end. DETAILED DESCRIPTION

[0051] The technical solutions in the embodiments of the present specification will be described clearly and completely below in combination with the drawings in the embodiments of the present specification. Obviously, the described embodiments are only some of the embodiments of the present specification, not all the embodiments. Based on the embodiments in the present specification, all other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present specification.

[0052] It should be noted that the terms "first", "second" and the like in the specification and claims of the present specification and the above-mentioned drawings are used to distinguish similar objects, and do not have to be used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present specification described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or server including a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0053] Various exemplary embodiments, features, and aspects of the present disclosure will be described in detail below with reference to the accompanying drawings. The same reference numbers in different drawings represent the same or similar elements. Although various aspects of the embodiments are illustrated in the drawings, the drawings are not necessarily drawn to scale unless specifically indicated.

[0054] The term "exemplary" is used herein to mean "serving as an example, instance, or illustration." Any implementation described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other implementations.

[0055] The term "and / or", used herein, is a descriptive correlation, which means that there can be three relationships, for example, A and / or B, which means that there are three cases of A alone, A and B together, and B alone. In addition, the term "at least one" herein means any one of the plurality or any combination of at least two of the plurality, for example, including at least one of A, B, and C, which means including any one or more elements selected from the set consisting of A, B, and C.

[0056] In addition, in order to better illustrate the present disclosure, numerous specific details are given in the specific embodiments below. Those skilled in the art should understand that the present disclosure can also be implemented without certain specific details. In some examples, methods, means, elements and circuits well known to those skilled in the art are not described in detail, in order to highlight the main idea of the present disclosure.

[0057] Figure 1 A cross-sectional view of a pressure sensor provided by an embodiment of the present application is shown in Figure 3 A cross-sectional view of a pressure sensing structure provided by an embodiment of the present application is shown in Figure 4 A first side view of an integrated circuit structure provided by an embodiment of the present application is shown in Figure 1 、 Figure 3 and Figure 4 A pressure sensor includes:

[0058] A pressure sensing structure 100 includes a first structure 110 and a second structure 120 in opposite connection;

[0059] An integrated circuit structure 200 has a first end L1 and a second end L2 opposite the first end L1, and the first end L1 is connected to the first structure 110 of the pressure sensing structure 100; wherein the first end L1 is configured to obtain the sensing signal output by the pressure sensing structure 100, and the second end L2 is configured to provide the processed sensing signal;

[0060] A first support 300 is provided at the second end L2, and the first support 300 is electrically connected to the integrated circuit structure 200 and is used to obtain the processed sensing signal;

[0061] The signal transmission structure 400 is connected with the second end L2 through the first support 300;

[0062] The signal transmission structure 400 comprises a top cover 410, and a plurality of limiting holes 411 are arranged on the top cover 410, and a spring 420 is arranged in each limiting hole 411; the spring 420 is clamped on the first support 300, and the number of the springs 420 is the same as that of the first supports 300;

[0063] The outer shell 500 is arranged outside the integrated circuit structure 200, one end of the outer shell 500 is connected with the pressure sensing structure 100, and the other end is connected with the top cover 410 of the signal transmission structure 400.

[0064] In a specific embodiment, as shown in Figure 1 The pressure sensor comprises the pressure sensing structure 100, the integrated circuit structure 200 connected with the first structure 110 of the pressure sensing structure 100, the first support 300 arranged on the second end L2 of the integrated circuit structure 200, and the signal transmission structure 400 connected with the first support 300 and the integrated circuit structure 200. The signal transmission structure 400 can comprise the top cover 410 and the spring 420, the limiting hole 411 for accommodating the spring 420 and limiting the position of the spring 420 is arranged on the top cover 410, and the number of the springs 420 is the same as that of the limiting holes 411.

[0065] Specifically, the pressure sensing structure 100 comprises the first structure 110 and the second structure 120, and is used for sensing the external pressure and outputting the external pressure as a sensing signal. The integrated circuit structure 200 comprises the first end L1 and the second end L2, the first end L1 is connected with the first structure 110 of the pressure sensing structure 100 and receives the sensing signal provided by the first structure 110; the second end L2 is connected with the signal transmission structure 400 and the first support 300, and provides the processed sensing signal for the signal transmission structure 400. The signal transmission structure 400 is used for receiving the processed sensing signal provided by the integrated circuit structure 200, and providing an output signal corresponding to the external pressure sensed by the pressure sensor. The first support 300 is used for limiting the spring 420 in cooperation with the top cover 410, so as to ensure that the spring 420 can always move along the axis direction of the spring 420 and be subjected to vertical force, and the first support 300 cooperates with the integrated circuit structure 200 to realize the transmission of the signal to the signal transmission structure 400, thereby improving the stability of the signal transmission.

[0066] In addition, an outer shell 500 is arranged outside the integrated circuit structure 200, one end of the outer shell 500 is connected with the pressure sensing structure 100, and the other end is connected with the top cover 410 of the signal transmission structure 400, so that the top cover 410 can be arranged on the outer shell 500, thereby realizing protection of various structures of the pressure sensor. Meanwhile, the top cover 410, the limiting hole 411 and the first support 300 are matched with each other, so that the spring 420 is fixed and can move along the axis, avoiding that the structure of the spring 420 is inclined to cause force deviation, thereby improving the stability of the spring 420 and the accuracy of signal output. The outer shell 500 can be made of metal material and connected with the pressure sensing structure 100 by laser welding, but is not limited to metal material and laser welding.

[0067] The pressure sensing structure 100 comprises a first structure 110, a second structure 120 and a bonding structure 130.

[0068] The first structure 110 comprises a surrounding first side wall 111, a first cavity 112 is formed inside the first side wall 111, and a sensitive area 113 is arranged on the outer wall of the first side wall 111; a sensitive chip 114 is fixed on the surface of the sensitive area 113. The bonding structure 130 is bonded between the sensitive chip 114 and the sensitive area 113.

[0069] The second structure 120 comprises a surrounding second side wall 121, a through second cavity 122 is formed inside the second side wall 121, and a plurality of stepped portions 123 are arranged on the outer side; the first cavity 112 and the second cavity 122 are in communication.

[0070] In one specific embodiment, Figure 2 A side view of the pressure sensing structure 100 provided by the utility model embodiment, Figure 3 As shown in the sectional view of the pressure sensing structure 100 provided by the utility model embodiment, Figure 2-3 The pressure sensing structure 100 can comprise a first structure 110 and a second structure 120, the first structure 110 comprises a surrounding first side wall 111, the second structure 120 comprises a surrounding second side wall 121, a first cavity 112 is formed inside the first side wall 111 and is in communication with a second cavity 122 formed inside the second side wall 121, the second cavity 122 penetrates the second structure 120, and the first structure 110 and the second structure 120 can be connected by laser welding. After the first cavity 112 and the second cavity 122 are in communication, an elliptical cylindrical cavity or a cylindrical cavity can be formed.

[0071] In the first structure 110, the outer wall of the first side wall 111 is formed with a sensitive area 113, and a sensitive chip 114 is arranged on the sensitive area 113, and the second structure 120 is partially or entirely exposed from the outer shell 500, so that the pressure sensing structure 100 can sense the external pressure change and form a sensing signal and transmit the sensing signal to the integrated circuit structure 200. In addition, the outer side of the second side wall 121 is formed with a plurality of stepped portions 123, and the plurality of stepped portions 123 can improve the structural stress; preferably, the outer side of the first side wall 111 can also be formed with one or more stepped portions, which can further improve the stress problem and provide convenience for the combination of the first structure 110 and the second structure 120.

[0072] For the sensitive chip 114, the sensitive chip 114 is fixed to the sensitive area 113 through the bonding structure 130, and the sensitive chip 114 can output different sensing signals with different sizes according to the size of the external pressure. Specifically, the sensitive chip 114 can be adhered to the sensitive area 113 by a sintering process using a micro-fusion glass adhesive. The bonding structure 130 can be a micro-fusion glass adhesive, which can be selected from a specific material combination and be changed into a glass state at high temperature. In addition, the thermal expansion coefficient of the micro-fusion glass adhesive after the change of the form at high temperature can balance the difference between the thermal expansion coefficients of the sensitive area 113 and the sensitive chip 114, thereby improving the reliability and stability of the fixation of the sensitive chip 114 to the sensitive area 113 and reducing the thermal stress.

[0073] The sensitive area 113 can include at least two sensitive chips 114, and each sensitive chip 114 includes two pressure-sensitive resistors, a Wheatstone bridge is formed through the connection between the sensitive chip 114 and the integrated circuit structure 200, and the first cavity and the second cavity connected in communication are matched, so that when the pressure medium acts on the second structure 120 of the pressure sensing structure 100, two resistors in the two sensitive chips 114 increase and two resistors decrease, thereby outputting a differential electrical signal proportional to the pressure, that is, a sensing signal.

[0074] In the utility model, compared with the prior art, the structure and the manufacturing process of the pressure sensing structure 100 can save production cost, simplify the manufacturing process and reduce the structural stress.

[0075] The integrated circuit structure 200 includes:

[0076] The integrated circuit board 210 is electrically connected with the first structure 110 of the pressure sensing structure 100, and specifically, is electrically connected with the sensitive chip 114 on the first structure 110.

[0077] The second support 220 is clamped to the integrated circuit board 210 and connected with the pressure sensing structure 100.

[0078] Conductive wires enable wire bonding between the integrated circuit board 210 and the pressure sensing structure 100;

[0079] The protective layer 230 covers the conductive wires, the area where the integrated circuit board 210 is connected to the conductive wires, and the area where the pressure sensing structure 100 is connected to the conductive wires.

[0080] In one specific embodiment Figure 4 This is a first side view of the integrated circuit structure 200 provided in an embodiment of the present invention. Figure 5 A second side view of the integrated circuit structure 200 provided in an embodiment of the present invention, as shown below. Figure 4 as well as Figure 5 As shown, the integrated circuit structure 200 may include an integrated circuit board 210 and a second support member 220. The integrated circuit board 210 receives and processes the sensed signal, converting it into proportional voltage output, digital signal output, current output, etc., through amplification, compensation, and equalization. This signal is then transmitted to the signal transmission structure 400 via the first support member 300. The second support member 220 supports the integrated circuit board 210 and connects it to the pressure sensing structure 100, thereby improving the structural stability of the integrated circuit board 210 and the stability of the pressure signal output. The second support member 220 can be connected to the pressure sensing structure 100 using methods such as laser welding or adhesive bonding.

[0081] In addition, such as Figure 5 As shown, the integrated circuit board 210 has a groove 211, and the second support member 220 has a protrusion 221 that matches the groove 211, so that the second support member 220 can be snapped onto the integrated circuit board 210. Compared with the existing technology that uses welding, glue, etc. for connection and placement, the groove 211 and the protrusion 221 cooperate to achieve the snap-fit ​​between the integrated circuit board 210 and the second support member 220, so that there is a physical limiting structure between the two, thereby ensuring the accuracy of the position during the connection process, and thus improving the consistency of the manufactured products and the accuracy of position control.

[0082] The integrated circuit structure 200 also includes conductive lines and a protective layer 230, combined with Figure 1 and Figure 5It can be seen that the integrated circuit board 210 is further provided with a connecting contact 212, one end of the conductive wire is connected to the connecting contact 212, and the other end is connected to the sensitive chip 114, so that the connection between the sensitive chip 114 and the integrated circuit board 210 can be realized. At the same time, a protective layer 230 can be provided to protect the area of the wire bonding connection, so as to improve the reliability and stability of the connection between the sensitive chip 114 and the integrated circuit board 210. The protective layer 230 can be glue, and the area of the wire bonding connection can include the conductive wire, the area where the integrated circuit board 210 is connected to the conductive wire, and the area where the pressure sensing structure 100 is connected to the conductive wire. The integrated circuit board 210 can also be electrically connected to the sensitive chip 114 by other means.

[0083] The first support 300 includes:

[0084] The support base 310 is connected to the integrated circuit board 210 in the integrated circuit structure 200.

[0085] The protruding part 320 is clamped with the spring 420 arranged in the limiting hole 411 of the signal transmission structure 400.

[0086] In a specific embodiment, the first support 300 can include a support base 310 connected to the integrated circuit board 210 and a protruding part 320 clamped with the spring 420 in the signal transmission structure 400, so that the signal transmission structure 400 is connected to the integrated circuit structure 200 through the first support 300. The arrangement of the protruding part 320 can fix the position of the spring 420 and prevent the spring 420 from deviating when subjected to force, so that the spring 420 can be subjected to vertical force. In addition, the outer surface of the first support 300 and the surface of the spring 420 are both provided with a plating layer to ensure stable transmission of signals between the integrated circuit structure 200 and the signal transmission structure 400. The first support 300 can be made of metal, and the support base 310 can be fixedly arranged in the board hole of the integrated circuit board 210 by means of tin paste welding, but is not limited to metal material and tin paste welding fixing method.

[0087] According to the above-mentioned embodiments of the utility model provide can see, the utility model discloses, pressure sensor includes pressure sensing structure and signal transmission structure that set apart in integrated circuit structure both ends, to make pressure sensing structure pass through integrated circuit structure and transmit to signal transmission structure with the sensing signal. Among them, signal transmission structure includes the top cap, is provided with the limiting hole for accommodating and limiting spring on the top cap;Pressure sensor still includes the first support that sets up in integrated circuit structure one end, through the first support with limiting hole cooperation, make spring along its own axis movement and perpendicular force, can avoid the stress change that the spring occurs deviation skew etc. cause, reduce the influence of spring stress deviation to pressure sensor output precision, and can improve the stability of signal transmission between each structure in pressure sensor. In addition, pressure sensing structure includes the first structure and the second structure of opposite, compared with the structure setting in prior art, can reduce stress and simplify the manufacturing process.

[0088] It should be noted that: the above has described various embodiments of the present disclosure, the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes are obvious to those skilled in the art without departing from the scope and spirit of the described embodiments. The choice of terms used herein is intended to best explain the principles, practical application or technical improvement in the market of the embodiments, or to enable other ordinary skilled in the art to understand the embodiments disclosed herein.

Claims

1. A pressure sensor, characterized by The pressure sensor comprises: a pressure sensing structure including a first structure and a second structure in opposite connection; an integrated circuit structure having a first end and a second end arranged opposite to the first end, the first end being connected to the first structure of the pressure sensing structure; a first support arranged at the second end; a signal transmission structure connected to the second end through the first support; wherein the signal transmission structure includes a top cover having a plurality of limiting holes, a spring being arranged in each limiting hole and clamped to the first support.

2. A pressure sensor according to claim 1, wherein The integrated circuit structure comprises: an integrated circuit board electrically connected to the first structure of the pressure sensing structure; a second support clamped to the integrated circuit board and connected to the pressure sensing structure.

3. A pressure sensor according to claim 2, wherein The first support comprises: a support base connected to the integrated circuit board in the integrated circuit structure; a protruding portion clamped to the spring arranged in the limiting hole of the signal transmission structure.

4. The pressure sensor of claim 1, wherein, The number of springs is the same as the number of first supports.

5. The pressure sensor of claim 1, wherein, The first structure of the pressure sensing structure comprises: a surrounding first sidewall forming a first cavity inside, and a sensitive area being arranged on the outer wall of the first sidewall; a sensitive chip fixed to the surface of the sensitive area.

6. A pressure sensor according to claim 5, wherein The second structure of the pressure sensing structure comprises: a surrounding second sidewall forming a through second cavity inside, and a plurality of stepped portions being arranged on the outer side; the first cavity and the second cavity being in communication.

7. A pressure sensor according to claim 5, wherein The pressure sensing structure further comprises: a bonding structure bonded between the sensitive chip and the sensitive area.

8. A pressure sensor according to claim 5, wherein, The number of sensitive chips is a plurality.

9. A pressure sensor according to claim 2, wherein, The integrated circuit structure further comprises: a conductive wire enabling wire bonding connection between the integrated circuit board and the pressure sensing structure; a protective layer covering the conductive wire, a region where the integrated circuit board is connected to the conductive wire, and a region where the pressure sensing structure is connected to the conductive wire.

10. The pressure sensor of claim 1, wherein, The first end of the integrated circuit structure is configured to acquire the sensing signal output by the pressure sensing structure, the second end of the integrated circuit structure is configured to output the processed sensing signal.

11. A pressure sensor according to claim 10, wherein, The first support is electrically connected to the integrated circuit structure and is used to acquire the processed sensing signal.

12. The pressure sensor of claim 1, wherein, The pressure sensor further comprises: an outer shell surrounding the outer side of the integrated circuit structure, one end of the outer shell being connected to the pressure sensing structure and the other end being connected to the top cover of the signal transmission structure.

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