Solder ball production intensity detection device

Abstract

The utility model relates to a solder ball production intensity detection device which is used for carrying out compressive strength test on solder balls, the solder balls are welded on a test substrate, the solder ball production intensity detection device comprises a supporting structure, the supporting structure comprises a machine table, a base is arranged below the machine table, and the base and the machine table are connected and fixed through a stand column; a detection table for placing a test substrate is rotatably connected to the center of the machine table, and at least two groups of stations are arranged on the detection table; the driving structure is arranged on the base and is used for driving the detection table to rotate; the detection structure comprises a support, and a detection part is arranged on the support in a lifting mode; and a discharging structure. According to the solder ball production intensity detection device, when the detection structure is used for carrying out compression resistance detection on the solder balls on the test substrate at the detection point positions, an operator can carry out feeding at the feeding point positions, orderly detection is not interfered, discharging is completed through the discharging structure, the working process continuity is high, and semi-automatic continuous detection is achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to solder ball production strength detection technical field, specifically to a kind of solder ball production strength detection device. BACKGROUND

[0002] Solder ball is the new type of welding material developed to adapt to the development of modern microelectronics industry, as the important auxiliary material of BGA, CSP in IC production, it is widely used in modern microelectronics, and it is indispensable process auxiliary material in the functional IC production process of notebook computer, mobile communication equipment, computer mainboard, light emitting diode, liquid crystal display, PDA, digital camera and other products.

[0003] Because the mechanical properties and physical properties of solder ball determine the performance of solder ball in electronic packaging and welding application, so after solder ball processing, solder ball needs to be detected in strength, in strength test, one of tests is compression resistance test, however, after the detection of single material by existing strength detection device, the detection material on detection station needs to be taken down first, then new detection material is placed on this detection station, so that subsequent detection can be carried out, for this purpose, a kind of solder ball production strength detection device is provided. SUMMARY

[0004] Based on the above description, the utility model provides a kind of solder ball production strength detection device to solve the technical problem that existing solder ball strength detection device is inconvenient for continuous strength detection of solder ball.

[0005] The technical scheme that the utility model solves the above technical problem is as follows: a kind of solder ball production strength detection device is used to carry out compression resistance test to solder ball, and the solder ball is welded on test substrate, and it includes:

[0006] Support structure includes machine table, and base is arranged below machine table, and base and machine table are fixed by column connection, and detection table for placing test substrate is rotatably connected at the center of machine table, and at least two groups of stations are arranged on detection table;

[0007] Driving structure is arranged on base and is used to drive detection table to rotate;

[0008] Detection structure includes support, and detection component is arranged on support in a lifting manner;

[0009] Unloading structure includes central shaft column, and the central shaft column is fixed on base, and the top end of the central shaft column penetrates detection table and is fixed with mounting table, and telescopic component one is arranged on mounting table, and the telescopic end of telescopic component one is provided with unloading push plate.

[0010] On the basis of the above technical scheme, the utility model can also be improved as follows.

[0011] Further, the test substrate is a metal substrate, and the machine table is provided with a plurality of grooves at corresponding stations, and a magnet plate for magnetically attracting and limiting the test substrate is arranged in the grooves.

[0012] Further, the machine table is provided with a stepped hole, and the detection table is rotatably connected to the machine table through the stepped hole.

[0013] Further, the driving structure comprises a stepping motor, a gear one and a gear two, wherein the stepping motor is fixed to the base by bolts, the gear one is assembled to the output end of the stepping motor, and the gear two is engaged with the gear one and is assembled to the outer side of the shaft column part of the detection table.

[0014] Further, the bracket is fixed with a telescopic component two by bolts, and the detection component is arranged above the corresponding station in a lifting manner through the telescopic component two.

[0015] Further, the telescopic component two and the telescopic component one are one of a pneumatic cylinder and an electric push rod.

[0016] Further, the detection component comprises a mounting seat, and a mounting opening is formed in the front surface of the mounting seat, and a pressure sensor is arranged in the mounting opening, and a pressure head is arranged at the bottom of the pressure sensor.

[0017] Further, the machine table is provided with a conveyor arranged at the back surface of the machine table and used for conveying and transferring the test substrate after detection.

[0018] Compared with the prior art, the technical scheme has the following beneficial technical effects:

[0019] The solder ball production strength detection device can be loaded at the loading point by the operator when the detection structure is used to detect the solder ball on the test substrate at the detection point, without interfering with the orderly detection, and the unloading is completed by the unloading structure, so that the working process has high continuity and realizes semi-automatic continuous detection. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 A structure schematic view of a solder ball production strength detection device is provided for the embodiments of the present application;

[0021] Figure 2 A structure schematic view of another view of the solder ball production strength detection device is provided for the embodiments of the present application; Figure 1

[0022] A semi-partial structure schematic view of the solder ball production strength detection device is provided for the embodiments of the present application; Figure 3 Figure 1

[0023] Figure 4 ​​The structural schematic view of the embodiment of the utility model is shown when the utility model is provided with a conveyor.

[0024] In the drawings, the component list represented by each sign is as follows:

[0025] 1, support structure; 11, machine table; 12, base; 13, column; 14, detection table; 15, station; 16, magnet disc; 2, driving structure; 21, stepper motor; 22, gear one; 23, gear two; 3, detection structure; 31, bracket; 32, detection component; 321, mounting seat; 322, pressure sensor; 323, pressure head; 33, telescopic component two; 4, unloading structure; 41, central shaft column; 42, mounting table; 43, unloading push plate; 5, test substrate; 6, conveyor. DETAILED DESCRIPTION

[0026] The technical scheme in the embodiments of the utility model will be described clearly and completely in combination with the drawings in the embodiments of the utility model.

[0027] In some application environments, electronic devices can experience mechanical shocks or vibrations, and these dynamic loads can cause the solder balls to be compressed, and the compression strength test helps to evaluate the performance of the solder balls under these conditions.

[0028] As shown in Figure 1 and Figure 2 , a solder ball production strength detection device in the embodiment is used for compression strength test of solder balls, and the solder balls are pre-welded on the test substrate 5, so that a fixed plane can be provided during testing, and the state after the solder balls are welded in actual use is the same. The solder ball production strength detection device comprises a support structure 1, a driving structure 2, a detection structure 3 and an unloading structure 4.

[0029] Among them, the support structure 1 comprises a machine table 11, a base 12, a column 13 and a detection table 14, the base 12 in the support structure 1 is erected on the ground to form a plane support, and the four groups of columns 13 are distributed at the four corners of the upper surface of the base 12, and the four groups of columns 13 are connected and fixed between the machine table 11 and the base 12, at this time, the base 12 is located below the machine table 11, and the machine table 11 and the base 12 have a height difference, which provides a placing space for the installation of the subsequent driving structure 2. As for the detection table 14 used for placing the test substrate 5, the position is rotatably connected at the center of the machine table 11, and the detection table 14 is provided with at least two groups of stations 15.

[0030] The number of the workstations 15 is preferably four, and the four workstations 15 are distributed in a circumferential array on the upper surface of the detection table 14 to form an upper feeding point, a detection point and two transition points. When the detection table 14 is viewed from above, the upper feeding point is located at the six o'clock direction, the detection point is located at the twelve o'clock direction, and the two transition points are located at the three o'clock and nine o'clock directions. It should be noted that, since the detection table 14 is rotatable, the upper feeding point, the detection point and the two transition points are not fixed points. For example, the detection point actually refers to a point located directly below the detection structure 3.

[0031] In addition, it should be noted that the test substrate 5 is a metal substrate, and a plurality of grooves are formed in the machine table 11 at positions corresponding to the workstations 15. A magnet plate 16 for magnetically attracting and limiting the test substrate 5 is arranged in the grooves. In this way, the test substrate 5 can be prevented from sliding randomly.

[0032] To facilitate understanding of how the detection table 14 is rotatably connected to the machine table 11, it is explained here that, as shown in Figure 3 , the machine table 11 is provided with a stepped hole, and the detection table 14 is rotatably connected to the machine table 11 through the stepped hole. The detection table 14 is composed of a disc part and a shaft column part. The disc part is located at the step of the stepped hole, and the bottom of the shaft column part penetrates the stepped hole and extends to the outside of the stepped hole. In this way, the driving structure 2 can drive the detection table 14 to rotate through the shaft column part.

[0033] Since there is a height difference between the machine table 11 and the base 12, an accommodation space is formed, and the driving structure 2 is arranged in the accommodation space. The driving structure 2 is arranged on the base 12, for example, and is used to drive the detection table 14 to rotate.

[0034] For the description of the driving structure 2, as shown in Figure 3 , the driving structure 2 includes a stepping motor 21, a gear one 22 and a gear two 23. The stepping motor 21 is fixed to the base 12 by bolts, the gear one 22 is assembled to the output end of the stepping motor 21, and the gear two 23 is engaged with the gear one 22 and is assembled to the outside of the shaft column part of the detection table 14. In this way, when the stepping motor 21 moves intermittently, it will drive the gear one 22 to rotate, and through the transmission of the gear two 23, the detection table 14 can also rotate intermittently.

[0035] As shown in Figure 2 , the detection structure 3 in the embodiment includes a support 31, and a detection component 32 is arranged on the support 31 in a liftable manner to complete the compression resistance detection of the soldering balls.

[0036] For further description of the detection component 32, as shown in Figure 3As shown, the telescopic component two 33 is fixed on the support 31 by bolts, and the detection component 32 is arranged above the corresponding station 15 in a lifting manner through the telescopic component two 33. The corresponding station 15 refers to a detection point. The detection component 32 comprises a mounting seat 321. An installation opening is formed in the front of the mounting seat 321. A pressure sensor 322 is arranged in the installation opening. The model of the pressure sensor 322 is, for example, FUTEK, and the type is LCM300. A pressure head 323 is arranged at the bottom of the pressure sensor 322. In this way, after the pressure head 323 is moved by the telescopic component two 33, the pressure resistance of the solder ball can be tested by the pressure sensor 322. This is a prior art, and will not be described in detail here.

[0037] In order to realize mechanical unloading after detection, a discharging structure 4 is designed in the embodiment, as shown in the figure. Figure 4 The discharging structure 4 comprises a central shaft column 41. The central shaft column 41 is fixed on the base 12. The top end of the central shaft column 41 penetrates the detection table 14 and is fixed with a mounting table 42. In this way, the detection table 14 is actually rotatably connected to the outside of the central shaft column 41. The rotation of the detection table 14 will not drive the mounting table 42 to rotate. Therefore, a telescopic component one is arranged on the mounting table 42. The telescopic end of the telescopic component one is provided with a discharging push plate 43. In this way, the discharging push plate 43 is moved by the telescopic component one, so that the test substrate 5 after detection at the detection point can be pushed out of the detection point.

[0038] It should be noted that the telescopic component two 33 and the telescopic component one are one of a pneumatic cylinder or an electric push rod.

[0039] Considering that the test substrate 5 after discharging needs to be tested for shear strength or thermal stability, etc., in order to speed up the turnover, as shown in the figure, Figure 4 In an embodiment, the solder ball production strength detection device further comprises a conveyor 6. The conveyor 6 is a prior art, which is composed of a rack, a plurality of conveying rollers, a belt and a motor. The conveying rollers are rotatably connected to the inside of the rack. The motor is connected to any one group of conveying rollers. The belt is drivingly connected between the outside of the plurality of conveying rollers. In this way, when the motor is started, the belt can complete the conveying and transferring work. In the embodiment, the conveyor 6 is arranged on the ground and adjacent to the back of the machine table 11, and is used for conveying and transferring the test substrate 5 after detection.

[0040] Working principle:

[0041] When the solder ball on the test substrate 5 at the detection point is detected for pressure resistance by the detection structure 3, the operator can load at the loading point without interfering with the orderly detection, and the unloading is completed by the discharging structure 4, which can reduce the burden of workers.

[0042] The above merely is the preferred specific implementation manner of the present utility model, but the protection scope of the present utility model is not limited to this, any skilled person in the technical field according to the technical scheme and the utility model concept of the present utility model is equivalent to replace or change within the technical range disclosed by the present utility model, and should be covered in the protection scope of the present utility model.

Claims

1. A solder ball production strength testing device, used for testing the compressive strength of solder balls, wherein the solder balls are soldered onto a test substrate (5), characterized in that, include: The support structure (1) includes a machine base (11), a base (12) is provided below the machine base (11), the base (12) and the machine base (11) are connected and fixed by a column (13), and a test station (14) for placing the test substrate (5) is rotatably connected at the center of the machine base (11), and at least two workstations (15) are provided on the test station (14). The drive structure (2) is mounted on the base (12) and is used to drive the detection stage (14) to rotate; The detection structure (3) includes a bracket (31) on which a detection component (32) is mounted in a height-adjustable manner. The unloading structure (4) includes a central shaft column (41), which is fixed on the base (12). The top of the central shaft column (41) passes through the detection table (14) and is fixed with an installation table (42). A telescopic component is provided on the installation table (42), and an unloading push plate (43) is provided at the telescopic end of the telescopic component.

2. The solder ball production strength testing device according to claim 1, characterized in that: The test substrate (5) is a metal substrate. Several grooves are provided on the machine tool (11) at the corresponding work stations (15). A magnetic disk (16) for magnetically limiting the test substrate (5) is provided in the groove.

3. The solder ball production strength testing device according to claim 2, characterized in that: The machine base (11) has a stepped hole, and the testing table (14) can be rotatably connected to the machine base (11) through this stepped hole. The testing table (14) is composed of a disc part and a shaft part.

4. The solder ball production strength testing device according to claim 3, characterized in that: The drive structure (2) includes a stepper motor (21), a first gear (22) and a second gear (23). The stepper motor (21) is fixed to the base (12) by bolts. The first gear (22) is assembled at the output end of the stepper motor (21). The second gear (23) meshes with the first gear (22) and is assembled on the outside of the shaft column of the detection table (14).

5. The solder ball production strength testing device according to claim 1, characterized in that: The bracket (31) is fixed with a telescopic component two (33) by bolts. The detection component (32) can be raised and lowered directly above the corresponding work station (15) through this telescopic component two (33).

6. The solder ball production strength testing device according to claim 5, characterized in that: The telescopic component two (33) and the telescopic component one are either a cylinder or an electric push rod.

7. The solder ball production strength testing device according to claim 5, characterized in that: The detection component (32) includes a mounting base (321), with an installation port on the front of the mounting base (321), a pressure sensor (322) installed in the installation port, and a pressure head (323) installed at the bottom of the pressure sensor (322).

8. The solder ball production strength testing device according to claim 1, characterized in that: It also includes a conveyor (6), which is located on the back of the machine (11) and is used to transport and transfer the tested substrate (5) after testing.

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