Short-time overload testing device for sheet-shaped semi-finished chip resistor
By designing a short-time overload testing device for chip resistors, and utilizing a base drive mechanism and a vertical drive mechanism, the device enables automatic or semi-automatic testing of the chip resistors. This solves the problems of complex testing, significant safety hazards, and high costs in existing technologies, and achieves rapid and convenient resistance testing.
Patent Information
- Application Number
- CN202423220950.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2025-12-23
- Estimated Expiration
- 2034-12-25
AI Technical Summary
In existing technologies, short-time overload testing of resistors is performed on granular thick-film resistors at the finished product stage, which makes it impossible to detect problems in time during the development stage, increases production cycle and cost, and the test instruments are complex in structure, cumbersome to operate and pose safety hazards.
A short-time overload testing device for chip resistors was designed, including a base, a platform, an industrial camera, and probes. The device enables automatic or semi-automatic testing of chip resistors through a platform drive mechanism and a vertical drive mechanism, avoiding direct contact between operators and the circuit. The industrial camera is used for positioning, and the controller controls the probes for rapid testing.
It enables rapid testing at the semi-finished product stage, reduces testing difficulty and cost, improves testing efficiency and convenience, reduces safety hazards, can detect problems during the development stage, and has a simple structure that is easy to operate.
Smart Images

Figure CN223711734U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a kind of chip resistor production and processing field, especially a kind of sheet-shaped semi-finished product chip resistor short-time overload test device. BACKGROUND
[0002] Resistance short-time overload refers to the resistor in short time withstands the current load exceeding its rated power. This situation can cause the resistor to heat up, resistance changes, and even damage, thereby affecting the stability and safety of the circuit. Therefore, the STOL (short-time overload) performance of the resistor is tested to ensure the pass rate of the resistor.
[0003] In the prior art, the following problems exist when testing:
[0004] 1. It is mainly used for granular thick film resistors and tested at the finished product stage. In this way, problems cannot be found and solved in time during the development stage, increasing the production cycle and cost.
[0005] 2. The existing resistance load tester has a complex structure and is cumbersome to operate, requiring professional technicians to operate, which is not conducive to widespread use.
[0006] 3. The existing resistance load tester requires the operator to directly contact the test circuit during testing, which poses a safety hazard of electric shock. SUMMARY
[0007] The utility model aims to provide a kind of sheet-shaped semi-finished product chip resistor short-time overload test device, by using the structure, improve the convenience and efficiency of testing, reduce the difficulty of testing, reduce cost.
[0008] To achieve the above purpose, the utility model adopts the technical scheme: a kind of sheet-shaped semi-finished product chip resistor short-time overload test device, including base, base, industrial camera and probe, the base is equipped with base drive mechanism, the base drive mechanism drives the base moves on the base, the base is equipped with product limiting assembly;
[0009] A stand is provided on the top rear side of the base, the industrial camera is installed on the stand, and the industrial camera is arranged directly above the base;
[0010] A bracket is vertically slidably arranged on the stand, the detection circuit board is provided on the bracket, the top of the probe is installed on the detection circuit board, the bottom of the probe is arranged below the detection circuit board, and the probe is arranged opposite to the base; A vertical drive mechanism is provided on the stand, and the vertical drive mechanism drives the bracket to vertically slide along the stand.
[0011] The industrial camera, the detection circuit board, the longitudinal driving mechanism and the vertical driving mechanism are connected with a controller.
[0012] In the technical scheme, the detection circuit board is provided with a through slot, the top of the probe is connected with the top of the detection circuit board, and the bottom of the probe passes through the through slot and is arranged directly below the through slot.
[0013] The probe is in an L-shaped structure, including a horizontal rod and a vertical rod, the outer end of the horizontal rod is connected with the top of the detection circuit board, the inner end of the horizontal rod is arranged directly above the through slot, the top of the vertical rod is connected with the inner end of the horizontal rod perpendicularly, and the bottom of the vertical rod passes through the through slot and is arranged directly below the through slot.
[0014] In the technical scheme, the probe is in an L-shaped structure, including a horizontal rod and a vertical rod, the outer end of the horizontal rod is connected with the top of the detection circuit board, the inner end of the horizontal rod is arranged directly above the through slot, the top of the vertical rod is connected with the inner end of the horizontal rod perpendicularly, and the bottom of the vertical rod passes through the through slot and is arranged directly below the through slot.
[0015] In the technical scheme, the product limiting assembly includes a plurality of negative pressure holes, and the negative pressure holes are connected with a negative pressure source.
[0016] In the technical scheme, the product limiting assembly includes a plurality of negative pressure holes, and the negative pressure holes are connected with a negative pressure source.
[0017] In the technical scheme, the base driving mechanism includes a longitudinal driving mechanism, the longitudinal driving mechanism includes a longitudinal motor and a longitudinal screw rod arranged on the base, the base is provided with a longitudinal sliding rail, the bottom of the base is arranged on the longitudinal sliding rail in a sliding mode, the longitudinal screw rod is arranged on the side of the longitudinal sliding rail in parallel, the two ends of the longitudinal screw rod are rotationally connected with the base, the middle part of the longitudinal screw rod is screw-connected with the bottom of the base, and the longitudinal motor drives the longitudinal screw rod to rotate and drives the base to move along the longitudinal sliding rail.
[0018] In the above technical solution, the base driving mechanism further includes a transverse driving mechanism, which includes a transverse motor and a transverse lead screw. The base includes an upper base and a lower base. The product limiting component is installed on the upper base. The bottom of the lower base is slidably disposed on the longitudinal slide rail. The longitudinal lead screw is screwed to the lower base. The lower base is provided with a transverse slide rail. The transverse lead screw is arranged parallel to the side of the transverse slide rail. The transverse motor is installed on the lower base. The bottom of the upper base is slidably disposed on the transverse slide rail. The transverse lead screw is screwed to the lower base. The transverse motor drives the transverse lead screw to rotate and drives the upper base to move laterally along the transverse slide rail.
[0019] In the above technical solution, the vertical drive mechanism includes a vertical cylinder, a vertical slide rail is provided on the upright frame, the rear side of the bracket is slidably disposed on the vertical slide rail, and the rear end of the detection circuit board is mounted on the bracket; the vertical cylinder is mounted on the upright frame, the output shaft of the vertical cylinder is connected to the bracket, and the vertical cylinder and the bracket move vertically along the vertical slide rail.
[0020] In the above technical solution, a slider is also provided, which is slidably disposed on the vertical slide rail. The bracket is connected to the slider via a buffer mechanism. The output shaft of the vertical cylinder is connected to the slider. The vertical cylinder drives the slider to move vertically along the vertical slide rail.
[0021] The buffer mechanism includes two buffer rods. The slider has two through holes. The middle parts of the two buffer rods are respectively movably inserted into one of the through holes. The bottom of the buffer rod is fixedly connected to the top rear side of the bracket. The top of the buffer rod is provided with a limiting nut. The limiting nut is located above the slider.
[0022] And / or, each of the buffer rods is further fitted with a spring, the top of the spring abutting against the bottom surface of the slider, and the bottom of the spring abutting against the top surface of the bracket.
[0023] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art:
[0024] 1. In this utility model, a base is used to support and limit the semi-finished chip resistors. An industrial camera is used to photograph and position the product. A controller is used to control the vertical drive mechanism and the base drive mechanism to move the base so that the semi-finished chip resistors on the substrate are aligned with the probes. The vertical drive mechanism then drives the probes to move down and contact the corresponding semi-finished chip resistors to be tested, and energizes the probes to perform rapid short-time load testing on the semi-finished chip resistors. This achieves rapid testing, improves testing efficiency and convenience, and eliminates the need for operators to come into contact with the test circuits, reducing safety hazards.
[0025] 2. In this utility model, the testing is performed on the semi-finished chip resistor, which allows for testing at the semi-finished stage of the chip resistor, enabling problems to be identified during the development stage and reducing costs;
[0026] 3. The testing device in this utility model has a simple structure, is easy to operate, and has low cost. Attached Figure Description
[0027] Figure 1 This is a schematic diagram of the structure in Embodiment 1 of this utility model;
[0028] Figure 2 yes Figure 1 The left view;
[0029] Figure 3 This is a partial structural diagram of the connection between the probe and the detection circuit board in Embodiment 1 of this utility model;
[0030] Figure 4 This is a partial cross-sectional view of the connection between the product limiting component and the base in Embodiment 1 of this utility model;
[0031] Figure 5 This is a schematic diagram of the connection between the slider and the bracket in Embodiment 1 of this utility model.
[0032] The components include: 1. Base; 2. Platform; 3. Industrial camera; 4. Probe; 5. Stand; 6. Bracket; 7. Detection circuit board; 8. Vertical drive mechanism; 9. Through slot; 10. Horizontal bar; 11. Vertical bar; 12. Nozzle; 13. Mounting hole; 14. Air chamber; 15. Longitudinal motor; 16. Longitudinal lead screw; 17. Longitudinal slide rail; 18. Transverse motor; 19. Transverse lead screw; 20. Upper platform; 21. Lower platform; 22. Transverse slide rail; 23. Vertical slide rail; 24. Slider; 25. Buffer rod; 26. Limit nut; 27. Spring. Detailed Implementation
[0033] The present invention will be further described below with reference to the accompanying drawings and embodiments:
[0034] Example 1: See Figures 1 to 5As shown, a short-time overload testing device for a chip resistor in a semi-finished product includes a base 1, a platform 2, an industrial camera 3, and a probe 4. The base 1 is provided with a platform driving mechanism, which drives the platform 2 to move on the base 1. The platform 2 is provided with a product limiting component.
[0035] A stand 5 is provided on the top rear side of the base 1, the industrial camera 3 is mounted on the stand 5, and the industrial camera 3 is located directly above the base 2;
[0036] A bracket 6 is vertically slidably mounted on the support frame 5. A detection circuit board 7 is mounted on the bracket 6. The top of the probe 4 is mounted on the detection circuit board 7, and the bottom of the probe 4 is located below the detection circuit board 7. The probe 4 is positioned directly opposite the base 2. A vertical drive mechanism 8 is provided on the support frame 5, and the vertical drive mechanism 8 drives the bracket 6 to slide vertically along the support frame 5.
[0037] The industrial camera, detection circuit board, longitudinal drive mechanism, and vertical drive mechanism are connected to a controller.
[0038] In this invention, the controller is a computer, which is used to control the operation of the industrial camera, the longitudinal drive mechanism and the vertical drive mechanism. It also controls the detection circuit board to energize or de-energize the probe. The control circuit board has a detection circuit. By controlling the detection circuit board to energize the probe, the probe contacts the product, and the detection circuit detects the product's short-time load test (short-time overload test).
[0039] In the present utility model, during actual use, the product (a sheet-shaped semi-finished product chip resistor, which is in a whole board shape, not yet strip-divided or pellet-folded, with multiple sheet-shaped semi-finished product chip resistors on the whole board, multiple sheet-shaped semi-finished product chip terminals arranged in an array, multiple rows of sheet-shaped semi-finished product chip resistors arranged at intervals from left to right, and each row having multiple sheet-shaped semi-finished product chip resistors arranged at intervals from front to back) is placed on the base platform, and the product is limited on the base platform through the limiting component. In the present utility model, there are two control methods. The first is full-automatic detection: the controller controls the industrial camera to take pictures of the product on the base platform. Among them, a display is installed on the side of the vertical frame, and the display shows the taken pictures, enabling the operator to directly observe the position of the product. Of course, the display can also not be set, and the pictures can be directly displayed on the computer monitor. The controller can accurately know the position of the product on the base platform according to the pictures taken by the industrial camera. Then, the controller controls the longitudinal driving mechanism to work, so that the longitudinal driving mechanism drives the base platform to move, making a sheet-shaped semi-finished product chip resistor at a required detection position face the probe. Then, the controller controls the vertical driving mechanism to work, driving the detection circuit board and the probe on it to move downward to contact the corresponding sheet-shaped semi-finished product chip resistor. During this process, the detection circuit board supplies power to the probe, so as to conduct a short-time over-load test on the sheet-shaped semi-finished product chip resistor through the probe contacting the sheet-shaped semi-finished product chip resistor. After the test is completed, the detection circuit board cuts off the power supply to the probe. During the detection process, data will be fed back to the controller, and the controller judges whether the detected data conforms to the value preset in the controller and analyzes whether this sheet-shaped semi-finished product chip resistor is qualified. After a sheet-shaped semi-finished product chip resistor is detected, the vertical driving mechanism drives the probe to move upward to separate from the contact with this sheet-shaped semi-finished product chip resistor. Then, the longitudinal driving mechanism drives the base platform to move longitudinally, making another sheet-shaped semi-finished product chip resistor face the probe. Then, the probe continues to move downward to contact the sheet-shaped semi-finished product chip resistor directly below it, and continues to conduct the above test after being powered on. In this way, it circulates. During this process, the corresponding sheet-shaped semi-finished product chip resistors that need to be detected will be detected (there are a relatively large number of sheet-shaped semi-finished product chip resistors on the base platform. It is only necessary to sample and detect a certain number of sheet-shaped semi-finished product chip resistors, and there is no need to test each sheet-shaped semi-finished product chip resistor). In this method, the operator only needs to pick up and place the product on the base platform, and preset the corresponding control program in the controller.
[0040] Of course, the above method is a fully automatic detection method. As another method, the second detection method is a semi-automatic detection method: the operator controls the base drive mechanism to move through the controller, manually inputs data into the controller, takes pictures through an industrial camera to determine the position of the corresponding chip resistor, and displays the corresponding data position of all chip resistors on the controller (computer) (for example, if there are 1000 chip resistors on the base, each chip resistor will be given a data, taking 1-1000 as an example, each chip resistor corresponds to a number). The operator inputs a number, which is the data of the chip resistor position selected by the operator. The base drive mechanism drives the base to move, so that the chip resistor with the corresponding number will move directly below the probe. A separate control switch is also connected to the controller. This controller is a pedal-type control switch. After the base moves, and a corresponding chip resistor is aligned with the probe, the pedal-type control switch can be pressed by foot to control the vertical drive mechanism. This moves the probe downwards, bringing it into contact with the chip resistor. After a predetermined time (the probe is energized for a predetermined time), the vertical drive mechanism moves the probe upwards, completing the detection of one chip resistor. This method enables semi-automatic product detection. The operator can test the selected chip resistors, such as multiple outermost chip resistors, multiple middle chip resistors, or other representative chip resistors.
[0041] The first fully automatic testing method uses pre-installed automated control programs within the controller. The second, semi-automatic testing method is suitable for testing different types of products, eliminating the need for separately developed control programs and thus reducing costs.
[0042] See Figure 3 As shown, a through groove 9 is provided in the center of the detection circuit board 7, the top of the probe 4 is connected to the top of the detection circuit board 7, and the bottom of the probe 4 passes through the through groove 9 and is located directly below the through groove 9.
[0043] The probe 4 has an L-shaped structure, including a horizontal bar 10 and a vertical bar 11. The outer end of the horizontal bar 10 is connected to the top of the detection circuit board 7, the inner end of the horizontal bar 10 is located directly above the through groove 9, the top of the vertical bar 11 is vertically connected to the inner end of the horizontal bar 10, and the bottom of the vertical bar 11 passes through the through groove 9 and is located directly below the through groove 9.
[0044] The probe consists of four probes. The tops of two probes are connected to the top of the detection circuit board on the left side of the through slot, and the tops of the other two probes are connected to the top of the detection circuit board on the right side of the through slot.
[0045] In this embodiment, the two probes on the left are spaced apart at the front, and the two probes on the right are also spaced apart at the front and back. The bottoms of the two probes on the left contact one terminal of the chip resistor, and the bottoms of the two probes on the right contact the other terminal of the chip resistor. By energizing the four probes, a short-time overload test is performed on a chip resistor. The through-slot allows the top of the probe to connect to the top of the testing circuit board, while the bottom of the probe passes through the through-slot to contact the chip resistor. This design allows for quick replacement of damaged probes. Furthermore, the angle and position of the probes can be adjusted or the probes can be replaced according to different sizes and models of products, ensuring that the four probes are aligned with both ends of the chip resistor.
[0046] In this utility model, the product limiting component has two structures: the first type: the product limiting component includes multiple negative pressure holes, and the negative pressure holes are connected to a negative pressure source.
[0047] The second type: Therefore, the product limiting component includes multiple suction nozzles 12. The base 2 has multiple mounting holes 13 on its top. The bottom of each suction nozzle 12 is installed in a mounting hole 13, and the top of the suction nozzle 12 is located above the top surface of the mounting hole 13. The suction nozzle 12 is connected to a negative pressure source.
[0048] Both of these mechanisms include an air chamber 14 inside the base. This air chamber is connected to a negative pressure source via an air pipe. In the first structure, the negative pressure port is connected to the air chamber; in the second structure, the suction nozzle is connected to the air chamber. This allows the air chamber to apply negative pressure to all the negative pressure ports and the suction nozzle when the negative pressure source generates negative pressure, thereby positioning the product. In this embodiment, the second structure is used. The top of the suction nozzle is positioned above the top surface of the base. The product is placed directly on the base, with its bottom surface in contact with the suction nozzle. The negative pressure source generates negative pressure, adsorbing the product onto the base. This ensures that the product moves stably and precisely when the base moves.
[0049] See Figure 1 , 2As shown, the base drive mechanism includes a longitudinal drive mechanism, which includes a longitudinal motor 15 and a longitudinal lead screw 16 mounted on the base 1. The base 1 is provided with a longitudinal slide rail 17. The bottom of the base 2 is slidably disposed on the longitudinal slide rail 17. The longitudinal lead screw 16 is disposed parallel to the side of the longitudinal slide rail 17. The two ends of the longitudinal lead screw 16 are rotatably connected to the base 1, and the middle part of the longitudinal lead screw 16 is screwed to the bottom of the base 2. The longitudinal motor 15 drives the longitudinal lead screw 16 to rotate and drives the base 2 to move along the longitudinal slide rail 17.
[0050] The base moves back and forth on the longitudinal slide rails. The rotation of the longitudinal lead screw drives the base to move back and forth, ensuring that any one of the surface-mount resistors in a column is aligned with the probes for testing. In this method, the product's position on the base can be manually adjusted to ensure that any surface-mount resistor in any column is aligned with the probes for testing. Alternatively, only any one surface-mount resistor in a column can be tested, depending on the specific requirements.
[0051] Furthermore, the base drive mechanism also includes a transverse drive mechanism, which includes a transverse motor 18 and a transverse lead screw 19. The base 2 includes an upper base 20 and a lower base 21. The air chamber is disposed inside the upper machine platform. The product limiting component is installed on the upper base 20. The bottom of the lower base 21 is slidably disposed on the longitudinal slide rail 17. The longitudinal lead screw 16 is screwed to the lower base 21. The lower base 21 is provided with a transverse slide rail 22. The transverse lead screw 19 is arranged parallel to the side of the transverse slide rail 22. Both ends of the transverse lead screw are rotatably connected to the lower base. The transverse motor 18 is installed on the lower base 21. The bottom of the upper base 20 is slidably disposed on the transverse slide rail 22. The transverse lead screw 19 is screwed to the lower base 21. The transverse motor 18 drives the transverse lead screw 19 to rotate and drives the upper base 20 to move laterally along the transverse slide rail 22.
[0052] In this invention, if the base drive mechanism only has a longitudinal drive mechanism, it can only drive the base to move along the Y-axis direction on the base, which has certain limitations. It can only test a single row of chip resistors at a time. Therefore, this embodiment also includes a transverse drive mechanism, which can drive the upper base to move laterally along the transverse slide rail on the lower base, that is, to achieve movement in the X-axis direction. In other words, the lower base drives the product on top of the upper base to move in the Y-axis direction, and the upper base drives the product above it to move in the X-axis direction. Furthermore, the combination of motor and lead screw provides high movement accuracy, ensuring that any chip resistor placed at any position on the base can be accurately moved under the probe and contacted by the probe.
[0053] See Figure 1 , 2 As shown, the vertical drive mechanism 8 includes a vertical cylinder, the upright frame 5 is provided with a vertical slide rail 23, the rear side of the bracket 6 is slidably disposed on the vertical slide rail 23, and the rear end of the detection circuit board 7 is mounted on the bracket 6; the vertical cylinder is mounted on the upright frame 5, the output shaft of the vertical cylinder is connected to the bracket 6, and the vertical cylinder and the bracket 6 move vertically along the vertical slide rail 23.
[0054] The extension and retraction of the vertical cylinder output shaft drives the bracket to move vertically, thereby causing the probe to move up and down to contact or detach from the chip resistor in the semi-finished sheet.
[0055] See Figure 1 , 2 As shown in Figure 5, a slider 24 is also provided. The slider 24 is slidably disposed on the vertical slide rail 23. The bracket 6 is connected to the slider 24 via a buffer mechanism. The output shaft of the vertical cylinder is connected to the slider 24. The vertical cylinder drives the slider 24 to move vertically along the vertical slide rail 23.
[0056] The buffer mechanism includes two buffer rods 25. The slider 24 is provided with two through holes. The middle parts of the two buffer rods 25 are respectively moved and inserted into one through hole. The bottom of the buffer rod 25 is fixedly connected to the top rear side of the bracket 6. The top of the buffer rod 25 is provided with a limiting nut 26. The limiting nut 26 is located above the slider 24.
[0057] To ensure stable contact between the probe and the semi-finished chip resistor after the vertical cylinder output shaft extends, and to prevent the probe from bending, a buffer mechanism is incorporated. During the downward movement of the slider and support, the probe first contacts the chip resistor. After contact, the slider continues to move downwards a short distance, approaching the support, until the vertical cylinder output shaft is fully extended. At this point, the probe is in tight contact with the chip resistor, preventing rigid collisions that could damage the chip resistor or cause the probe to bend. This ensures stable electrical contact between the probe and the chip resistor. After testing, the vertical cylinder output shaft retracts, causing the slider to move upwards until the limit nut contacts the top surface of the slider. The slider then continues to move upwards, and the limit nut and buffer rod move the support upwards, lifting the probe and disengaging it from the product. In this method, the weight of the support and the detection circuit board ensures that the probe presses against the chip resistor, guaranteeing stable electrical contact.
[0058] More preferably, each of the buffer rods is further fitted with a spring 27, the top of the spring abutting against the bottom surface of the slider and the bottom of the spring abutting against the top surface of the bracket. After the probe contacts the chip resistor, the slider continues to move downward, compressing the spring. The restoring force of the spring applies a certain downward pressure to the bracket, making the probe contact the chip resistor more stably, further ensuring the stability of the contact between the probe and the chip resistor, and guaranteeing detection performance and stability.
[0059] When the industrial camera takes a picture of the product on the base, the base will move forward and move to the front and below the detection circuit board, so that it will not be blocked by the detection circuit board, ensuring that the industrial camera can take pictures of the product normally.
[0060] In the description of this utility model, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. In the description of the invention, "a plurality of" means two or more, unless otherwise explicitly specified.
[0061] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. For instance, the two components can be mechanically connected by contact or abutting; they can also be directly hooked or connected by an intermediate medium; or they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
Claims
1. A short-time overload testing device for a chip resistor (semi-finished product), characterized in that: The device includes a base, a platform, an industrial camera, and a probe. The base is equipped with a platform driving mechanism that drives the platform to move on the base. The platform is equipped with a product limiting component. A stand is provided on the rear top side of the base, the industrial camera is mounted on the stand, and the industrial camera is positioned directly above the base. A bracket is vertically slidable on the stand, and a detection circuit board is mounted on the bracket. The top of the probe is mounted on the detection circuit board, and the bottom of the probe is located below the detection circuit board. The probe is positioned directly opposite the base. A vertical drive mechanism is provided on the stand, which drives the bracket to slide vertically along the stand. The industrial camera, detection circuit board, longitudinal drive mechanism, and vertical drive mechanism are connected to a controller.
2. The short-time overload testing device for chip resistors as described in claim 1, characterized in that: The detection circuit board has a through slot at its center, the top of the probe is connected to the top of the detection circuit board, and the bottom of the probe passes through the through slot and is located directly below the through slot. The probe has an L-shaped structure, including a horizontal bar and a vertical bar. The outer end of the horizontal bar is connected to the top of the detection circuit board, the inner end of the horizontal bar is located directly above the through groove, the top of the vertical bar is perpendicularly connected to the inner end of the horizontal bar, and the bottom of the vertical bar passes through the through groove and is located directly below the through groove.
3. The short-time overload testing device for chip resistors as described in claim 2, characterized in that: The probe consists of four probes. The tops of two probes are connected to the top of the detection circuit board on the left side of the through slot, and the tops of the other two probes are connected to the top of the detection circuit board on the right side of the through slot.
4. The short-time overload testing device for chip resistors as described in claim 1, characterized in that: The product limiting component includes multiple negative pressure holes, which are connected to a negative pressure source.
5. The short-time overload testing device for chip resistors as described in claim 1, characterized in that: Therefore, the product limiting component includes multiple suction nozzles. The top of the base is provided with multiple mounting holes. The bottom of each suction nozzle is installed in a mounting hole, and the top of the suction nozzle is positioned above the top surface of the mounting hole. The suction nozzle is connected to a negative pressure source.
6. The short-time overload testing device for chip resistors as described in claim 1, characterized in that: The base drive mechanism includes a longitudinal drive mechanism, which includes a longitudinal motor and a longitudinal lead screw mounted on the base. The base is provided with a longitudinal slide rail, and the bottom of the base is slidably disposed on the longitudinal slide rail. The longitudinal lead screw is disposed parallel to the side of the longitudinal slide rail, and both ends of the longitudinal lead screw are rotatably connected to the base. The middle part of the longitudinal lead screw is screwed to the bottom of the base. The longitudinal motor drives the longitudinal lead screw to rotate and drives the base to move along the longitudinal slide rail.
7. The short-time overload testing device for chip resistors as described in claim 6, characterized in that: The base drive mechanism further includes a transverse drive mechanism, which includes a transverse motor and a transverse lead screw. The base includes an upper base and a lower base. The product limiting component is installed on the upper base. The bottom of the lower base is slidably disposed on the longitudinal slide rail. The longitudinal lead screw is screwed to the lower base. The lower base is provided with a transverse slide rail. The transverse lead screw is arranged parallel to the side of the transverse slide rail. The transverse motor is installed on the lower base. The bottom of the upper base is slidably disposed on the transverse slide rail. The transverse lead screw is screwed to the lower base. The transverse motor drives the transverse lead screw to rotate and drives the upper base to move laterally along the transverse slide rail.
8. The short-time overload testing device for chip resistors as described in claim 1, characterized in that: The vertical drive mechanism includes a vertical cylinder, a vertical slide rail is provided on the upright frame, the rear side of the bracket is slidably disposed on the vertical slide rail, and the rear end of the detection circuit board is mounted on the bracket; the vertical cylinder is mounted on the upright frame, the output shaft of the vertical cylinder is connected to the bracket, and the vertical cylinder and the bracket move vertically along the vertical slide rail.
9. The short-time overload testing device for chip resistors as described in claim 8, characterized in that: A slider is also provided, which is slidably disposed on the vertical slide rail. The bracket is connected to the slider via a buffer mechanism. The output shaft of the vertical cylinder is connected to the slider. The vertical cylinder drives the slider to move vertically along the vertical slide rail. The buffer mechanism includes two buffer rods. The slider has two through holes. The middle parts of the two buffer rods are respectively movably inserted into one of the through holes. The bottom of the buffer rod is fixedly connected to the top rear side of the bracket. The top of the buffer rod is provided with a limiting nut. The limiting nut is located above the slider. And / or, each of the buffer rods is further fitted with a spring, the top of the spring abutting against the bottom surface of the slider, and the bottom of the spring abutting against the top surface of the bracket.