Circuit board and electronic equipment

Abstract

The utility model relates to a circuit board and electronic equipment. The circuit board comprises a board body, and a signal wire, a first bonding pad and a second bonding pad which are arranged on the board body; the first bonding pad comprises a first welding part connected with the signal wire and a second welding part located on one side of the signal wire; the second bonding pad is connected with the signal wire; the first welding part has a width dimension W2, the second welding part has a width dimension W3, the second welding pad has a width dimension W4, and W2 < W3 and W2 < W4 are satisfied. According to the invention, the first bonding pad is divided into the first welding part and the second welding part, and the first welding part with a smaller width size is connected with the signal wire, so that a part of the first bonding pad is connected into a circuit, the influence of the second welding part on a signal can be reduced, and the impedance mutation of the signal when passing through the first bonding pad is effectively reduced. On the basis of ensuring the original design function of the circuit board, the requirement of selective welding of the circuit board can be met, and the signal transmission quality can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronics, and in particular to a circuit board and an electronic device. BACKGROUND

[0002] A circuit board (PCB) is an electronic device with a specific function composed of a printed circuit board as a basic carrier and various electronic devices. The circuit board is one of the core components of an electronic device, and its construction of a circuit path can realize signal transmission and signal interaction between related electronic devices.

[0003] In related technologies, a circuit board mainly includes a board body, a signal trace provided on the board body, a solder pad electrically connected with the signal trace, and an electronic device connected with the solder pad. The signal trace is a copper foil line on the circuit board for transmitting signals. The solder pad is a metal area for connecting the pins of the electronic device and the signal trace. The signal trace is electrically connected with the electronic device through the solder pad, so that signals can be transmitted from one device to another device.

[0004] At present, the signal transmission quality of the circuit board is poor. Utility model content

[0005] The circuit board provided by the embodiments of the present application can improve the signal transmission quality of the circuit board.

[0006] In order to achieve the above-mentioned purpose, according to the first aspect of the present application, a circuit board is provided, which comprises a board body, a signal trace, a first solder pad and a second solder pad. The signal trace is provided on the board body. The first solder pad comprises a first solder part and a second solder part, and the first solder part and the second solder part are arranged on the board body in a spaced manner. The first solder part is connected with the signal trace, and the second solder part is located on one side of the signal trace. The second solder pad is arranged on the board body and connected with the signal trace. In the width direction of the signal trace, the first solder part has a width size W2, the second solder part has a width size W3, and the second solder pad has a width size W4, which satisfy W2W3, and W2W4.

[0007] Optionally, the first solder part is arranged in overlap with the signal trace.

[0008] Optionally, the signal trace has a width size W1, which satisfies 0.5W1≤W2≤1.5W1.

[0009] Optionally, the width size W1 of the signal trace is equal to the width size W2 of the first solder part.

[0010] Optionally, the distance between the first solder part and the second solder part is D, which satisfies 2mil≤D≤6mil.

[0011] Optionally, the width dimension W3 of the second soldering part is smaller than the width dimension W4 of the second pad.

[0012] Optionally, the length dimensions of the first soldering part and the second soldering part are equal along the extension direction of the signal trace; and / or, at least one end of the first soldering part in the extension direction of the signal trace is flush with at least one end of the second soldering part in the extension direction of the signal trace.

[0013] Optionally, the first soldering part and the second soldering part are copper pads or copper pads plated with tin; and / or, the circuit board comprises a plurality of first pads, the first soldering part of each first pad is connected with the signal trace, and the second soldering part of each first pad is located on one side of the signal trace.

[0014] Optionally, the second pad is configured to be connected with a standard electronic device, and the first pad is configured to be connected with an optional electronic device.

[0015] According to a second aspect of the present application, an electronic device is provided, which comprises the circuit board as described above.

[0016] The circuit board provided by the present application adjusts the structure of the first pad for the optional electronic device to split the first pad into the first soldering part and the second soldering part which are separated from each other, and makes the first soldering part with a smaller width dimension connected with the signal trace and the second soldering part with a larger width dimension not connected with the signal trace, so as to connect part of the first pad into the circuit, and further reduce the influence of the second soldering part on the signal, so as to effectively reduce the impedance mutation of the signal when passing through the first pad. In this way, the negative influence of the impedance mutation on the signal caused by the too large width of the first pad and the too thin line width of the signal trace can be reduced. This can not only meet the requirement of the optional soldering of the circuit board, but also improve the signal transmission quality on the basis of ensuring the original design function of the circuit board.

[0017] Other features and advantages of the present application will be described in detail in the following specific embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0019] In order to more completely understand the present application and its beneficial effects, the following will be described in conjunction with the drawings, wherein the same reference numerals in the following description represent the same parts.

[0020] Figure 1 is a partial structure schematic diagram of a circuit board in the related art.

[0021] Figure 2 A partial structure schematic diagram of a circuit board provided by an embodiment of the present application is shown in FIG. 1.

[0022] Figure 3 A position schematic diagram between a first pad and a signal trace provided by an embodiment of the present application is shown in FIG. 2.

[0023] Figure 4 Another position schematic diagram between a first pad and a signal trace provided by an embodiment of the present application is shown in FIG. 3.

[0024] Figure 5 Still another position schematic diagram between a first pad and a signal trace provided by an embodiment of the present application is shown in FIG. 4.

[0025] Figure 6 A circuit board packaging schematic diagram in the related art is shown in FIG. 5.

[0026] Figure 7 A circuit board packaging schematic diagram provided by an embodiment of the present application is shown in FIG. 6.

[0027] Explanation of reference signs:

[0028] 1-circuit board; 11-board body; 12-signal trace; 13-first pad; 131-first pad portion; 132-second pad portion; 14-second pad; 15-pad without component. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative effort belong to the protection scope of the present application.

[0030] Before introducing a circuit board 1 and an electronic device provided by an embodiment of the present application, the related art of the present application is introduced.

[0031] In the related art, as shown in FIG. 5, the circuit board 1 mainly includes a board body 11, a signal trace 12 arranged on the board body 11, a pad electrically connected with the signal trace 12, and an electronic device 2 welded on the pad. Figure 1 Figure 1 ​The signal traces 12 are copper foil lines on the circuit board 1 for transmitting signals. The pads are metal areas for connecting electronic device pins and the signal traces 12. The signal traces 12 are electrically connected to the electronic devices through the pads, enabling signals to be transmitted from one device to another. The board body 11 mainly includes an insulating substrate, a dielectric layer insulating and separating different signal traces 12, and an adhesive layer connecting the signal traces 12 and the insulating substrate and connecting the signal traces 12 and the dielectric layer. The signal traces 12 are mainly formed by forming a metal foil layer on the insulating substrate, and then removing the excess part of the metal foil layer by etching or other processes.

[0032] On the basis of improving the compatibility of the circuit board 1 and meeting the upgrading needs of the circuit board 1, in order to control the production cost of the circuit board 1 and improve the design flexibility of the circuit board 1, many devices will be selected and installed in the form of BOM (Bill of Material) in the circuit signal design process. That is, in order to make the product have multiple functional configurations or adapt to different application scenarios, the designer will reserve some uninstalled pads 15 on the circuit board 1. The electronic devices installed on these uninstalled pads 15 can be selected according to the configuration needs and scene needs in the BOM. For example, different application scenarios of the circuit board 1 have different communication interface needs, and whether to install the corresponding communication module on the uninstalled pad 15 needs to be determined according to the actual application scenario. For another example, some multi-functional chips may not need some functions in the basic version of the product, so there is no need to solder the chips on the uninstalled pad 15, and the corresponding chips are soldered on the basis of the high version according to the needs. In this way, in the finished product of the final circuit board 1, the uninstalled pad 15 may be installed with parts or may not be installed with parts.

[0033] Since the width of the uninstalled pad 15 is greater than the width of the signal trace 12, and the width size difference between the uninstalled pad 15 and the signal trace 12 is large. If there is no part finally installed on the uninstalled pad 15, it will cause the impedance to change greatly when the relatively thin signal trace 12 passes through the relatively large uninstalled pad 15. When the signal is transmitted at the impedance mutation position, reflection, distortion and other problems will occur, thereby causing poor signal transmission quality.

[0034] Therefore, in order to overcome the impact of the uninstalled pad 15 wider than the signal trace on the signal in the case of no installation, the present application provides a circuit board 1 and an electronic device. By designing the structure of the uninstalled pad 15, the impedance mutation between the signal trace 12 and the uninstalled pad 15 can be effectively improved, and the signal transmission quality can be improved. In this way, on the basis of ensuring the original design function of the circuit board 1, the requirements of the circuit board 1 for selective soldering can be met, and the signal transmission quality can be improved.

[0035] The following will be described in combination withFigures 2 to 7 A detailed description of a circuit board 1 and an electronic device provided by embodiments of the present application is provided.

[0036] Please refer to Figure 2 and Figure 3 , Figure 2 A partial structure schematic diagram of the circuit board 1 provided by embodiments of the present application is provided, Figure 3 A position schematic diagram between the first pad 13 and the signal trace 12 provided by embodiments of the present application is provided. Embodiments of the present application provide a circuit board 1. The circuit board 1 includes a board body 11, a signal trace 12, a first pad 13 and a second pad 14. The signal trace 12 is disposed on the board body 11. The first pad 13 includes a first solder part 131 and a second solder part 132. The first solder part 131 and the second solder part 132 are disposed on the board body 11 in a spaced manner. The first solder part 131 is connected with the signal trace 12, and the second solder part 132 is located on one side of the signal trace 12. The second pad 14 is disposed on the board body 11 and connected with the signal trace 12; wherein, in the width direction of the signal trace 12, the first solder part 131 has a width dimension W2, the second solder part 132 has a width dimension W3, and the second pad 14 has a width dimension W4, which satisfy: W2 < W3, and W2 < W4.

[0037] It can be understood that the circuit board 1 further includes a standard electronic device mounted on the second pad 14. The standard electronic device on the second pad 14 ensures the basic function of the circuit board 1. The standard electronic device on the second pad 14 is an essential component of the circuit board 1. The first pad 13 mounts an optional electronic device, and the optional electronic device can expand the function of the circuit board 1 or improve some functions of the circuit board 1.

[0038] It can be understood that the first pad 13 is a pad for selectively mounting an optional electronic device according to the function configuration or application scenario of the circuit board 1. It can not mount any electronic device, or can mount an electronic device. When mounting an electronic device, the first solder part 131 and the second solder part 132 are connected with the same electronic device.

[0039] It can be understood that the first solder part 131 and the second solder part 132 are disposed in a spaced manner along the width direction of the signal trace 12.

[0040] It can be understood that when the electronic device is not mounted on the first pad 13, the second soldering part 132 is not connected to the circuit, that is, the second soldering part 132 is not electrically connected with the signal line 12. Therefore, when the first pad 13 is not mounted, the first soldering part 131 and the second soldering part 132 are kept in a separated state, and the signal transmission of the first soldering part 131 is not affected by the second soldering part 132 beside it. When the electronic device is mounted on the first pad 13, the solder paste of the first soldering part 131 and the solder paste of the second soldering part 132 cover the pin of the electronic device mounted on the first pad 13, so that the second soldering part 132 is connected to the circuit through the electronic device to be electrically connected with the signal line 12.

[0041] In the embodiment, the first pad 13 for mounting the electronic device is adjusted in structure to be split into the first soldering part 131 and the second soldering part 132 which are separated from each other, and the first soldering part 131 with a smaller width size is connected with the signal line 12, and the second soldering part 132 with a larger width size is not connected with the signal line 12, so that the smaller part of the first pad 13 is connected to the circuit, and the influence of the second soldering part 132 on the signal can be reduced to effectively reduce the impedance mutation of the signal when passing through the first pad 13. In this way, the negative influence of the impedance mutation of the signal line 12 caused by the too large width of the first pad 13 and the too small line width of the signal line 12 can be reduced. This can not only meet the requirement of the optional soldering of the circuit board 1, but also improve the signal transmission quality on the basis of ensuring the original design function of the circuit board 1.

[0042] It can be understood that the prerequisite for ensuring that the electronic device can be soldered to the first pad 13 is that the overall width size of the first pad 13 should not be changed. In order to reduce the influence of the first pad 13 on the signal transmission, the width difference between the first pad 13 and the signal line 12 should be reduced to reduce the large impedance mutation caused by the large width of the first pad 13. Therefore, the first pad 13 is split into the first soldering part 131 and the second soldering part 132, and the width size W2 of the first soldering part 131 is smaller than the width size W3 of the second soldering part 132.

[0043] It can be understood that in the related art, the width size of the pad 15 without mounting the electronic device is W0, and the distance between the first soldering part 131 and the second soldering part 132 is D. Wherein, W0=W2+W3+D. That is, the overall width size of the first pad 13 designed in the present application is equal to the width size of the pad 15 without mounting the electronic device in the related art, which is W0. In this way, it can be ensured that the first pad 13 can successfully solder the electronic device.

[0044] Please refer to Figure 3 or Figure 4 or Figure 5 , Figure 4 is another schematic view of the position between the first pad 13 and the signal line 12 provided by the embodiment of the present application,Figure 5 This is a schematic diagram showing the position between the first solder pad 13 and the signal trace 12 provided in another embodiment of this application. In some embodiments, the first solder pad 131 overlaps with the signal trace 12.

[0045] It can be understood that the first solder joint 131 overlaps inside the signal trace 12, and the path segment connecting the signal trace 12 and the first solder joint 131 overlaps within the first solder joint 131, such as... Figure 3 As shown, the path segment connecting signal trace 12 and the first solder joint 131 can also overlap with the first solder joint 131, such as... Figure 4 As shown, the first solder joint 131 can also overlap inside the signal trace 12. Figure 5 As shown.

[0046] Understandable. Figure 3 In the process, the width W1 of the signal trace 12 is equal to the width W2 of the first solder part 131. Figure 4 In the process, the width W1 of the signal trace 12 is greater than the width W2 of the first solder part 131. Figure 5 In the middle, the width dimension W1 of the signal trace 12 is equal to the width dimension W2 of the first solder part 131.

[0047] In this embodiment, the connection area between the signal trace 12 and the first solder joint 131 can be increased through the above-mentioned settings, thereby improving the current carrying capacity between the signal trace 12 and the first solder joint 131, which is conducive to improving the communication reliability between the electronic devices mounted on the first solder pad 13 and the signal trace 12.

[0048] Please see Figure 3 or Figure 4 or Figure 5 In some embodiments, the signal trace 12 has a width dimension W1, satisfying: 0.5W1≤W2≤1.5W1.

[0049] It is understood that the width dimension W2 of the first weld 131 includes, but is not limited to, 0.5W1, 0.6W1, 0.7W1, 0.8W1, 0.9W1, 1.0W1, 1.1W1, 1.2W1, 1.3W1, 1.4W1, 1.42W1, 1.44W1, 1.46W1, 1.48W1, and 1.5W1.

[0050] In this embodiment, the width difference between the width dimension W1 of the signal trace 12 and the width dimension W2 of the first solder part 131 can be effectively controlled by the above-mentioned limitations, thereby effectively reducing the impedance change when the signal passes through the first solder pad 13 and improving the signal transmission quality.

[0051] Please see Figure 3In some embodiments, the width dimension W1 of the signal trace 12 is equal to the width dimension W2 of the first solder portion 131.

[0052] It can be understood that the smaller the difference between the width dimension W1 of the signal trace 12 and the width dimension W2 of the first solder portion 131, the smaller the adverse effect of the first solder pad 13 on the signal. In this way, the higher the improvement of the signal transmission quality.

[0053] Referring to Figure 3 In some embodiments, the distance between the first solder portion 131 and the second solder portion 132 is D, which satisfies: 2mil≤D≤6mil.

[0054] It can be understood that the distance D between the first solder portion 131 and the second solder portion 132 includes but is not limited to 2mil, 2.1mil, 2.3mil, 2.5mil, 2.7mil, 2.9mil, 3.1mil, 3.3mil, 3.5mil, 3.7mil, 3.9mil, 4.1mil, 4.3mil, 4.5mil, 4.7mil, 4.9mil, 5.1mil, 5.3mil, 5.5mil, 5.7mil, 5.9mil, 6mil.

[0055] Further, 3mil≤D≤5mil.

[0056] In the present embodiment, by limiting the distance D between the first solder portion 131 and the second solder portion 132, on the one hand, it can avoid that the distance D is too small to cause the second solder portion 132 to be too close to the first solder portion 131 and be connected to the circuit, so as to effectively ensure that the second solder portion 132 is not connected to the signal trace 12, thereby facilitating the purpose of reducing impedance mutation; on the other hand, it can avoid that the distance D is too large to cause the first solder pad 13 to have a large operation difficulty when soldering with the electronic device, thereby facilitating the operability of the connection between the first solder portion 131 and the second solder portion 132 and the pins of the electronic device.

[0057] Referring to Figure 2 and 3 In some embodiments, the width dimension W3 of the second solder portion 132 is smaller than the width dimension W4 of the second solder pad 14. In this way, the width dimension of the first solder pad 13 as a whole can be left empty, so as to facilitate the difficulty of arranging multiple first solder pads 13 and multiple second solder pads 14, and to improve the arrangement neatness of the first solder pad 13 and the second solder pad 14, thereby facilitating the aesthetic appearance of the circuit board 1.

[0058] Specifically, W2-W2<W3<W4.

[0059] Referring to Figure 3 or Figure 4 or Figure 5In some embodiments, the length of the first soldering part 131 and the second soldering part 132 is equal along the extension direction of the signal trace 12. In this way, the layout regularity of the circuit board 1 can be improved, and the process consistency of the first soldering part 131 and the second soldering part 132 can be improved, so as to improve the production efficiency.

[0060] Referring to Figure 3 or Figure 4 or Figure 5 In some embodiments, at least one end of the first soldering part 131 in the extension direction of the signal trace 12 is flush with at least one end of the second soldering part 132 in the extension direction of the signal trace 12. In this way, the layout regularity of the circuit board 1 can be improved, and the process consistency of the first soldering part 131 and the second soldering part 132 can be improved, so as to improve the production efficiency.

[0061] In some embodiments, the first soldering part 131 and the second soldering part 132 are copper pads or copper-plated tin pads.

[0062] It can be understood that when the first soldering part 131 and the second soldering part 132 are copper pads, the copper material can be used to make the first soldering part 131 and the second soldering part 132 have better electrical conductivity, so as to ensure the efficiency and stability of signal transmission, reduce the loss and distortion in the process of signal transmission, and be suitable for various circuits with high requirements for electrical conductivity.

[0063] At the same time, the copper material has excellent heat conduction performance, which can quickly dissipate the heat generated during the welding process. This not only helps to protect other electronic devices on the circuit board 1 from overheating, but also allows the solder joint to cool and solidify faster, improving the welding quality and efficiency.

[0064] It can be understood that when the first soldering part 131 and the second soldering part 132 are copper-plated tin pads, in addition to the above characteristics, the tin plating layer can also isolate copper from air, moisture, etc., to form a protective film on the surface of copper, preventing copper from being oxidized and corroded, prolonging the service life of the soldering pad, and improving the stability and reliability of the circuit board 1 in various environments.

[0065] Referring to Figure 2 In some embodiments, the circuit board 1 includes a plurality of first soldering pads 13. The first soldering part 131 of each first soldering pad 13 is connected with the signal trace 12. The second soldering part 132 of each first soldering pad 13 is located on one side of the signal trace 12. In this way, not only the installation of the circuit board 1 can be improved, but also the impedance mutation at the connection between the signal trace 12 and each first soldering pad 13 can be effectively reduced, so as to improve the overall signal transmission quality of the circuit board 1.

[0066] It can be understood that there are multiple signal traces 12, and each signal trace 12 is connected with the first soldering part 131 of the corresponding first soldering pad 13 according to design requirements.

[0067] On the basis of the above-mentioned embodiments, the circuit board 1 provided by the embodiments of the present application is summarized as follows.

[0068] Please refer to Figure 2 In some embodiments, the second pad 14 is configured to be connected with a standard electronic device. The first pad 13 is configured to be connected with an optional electronic device.

[0069] It can be understood that the standard electronic device on the second pad 14 ensures the basic function of the circuit board 1. The standard electronic device on the second pad 14 is an essential component of the circuit board 1. The optional electronic device installed on the first pad 13 can expand the function of the circuit board 1 or improve some functions of the circuit board 1.

[0070] As shown in Figure 2 and Figure 3 , the circuit board 1 provided by the embodiments of the present application includes a board body 11, a signal trace 12 and a plurality of first pads 13. The signal trace 12 is arranged on the board body 11. The first pad 13 includes a first soldering portion 131 and a second soldering portion 132. The first soldering portion 131 and the second soldering portion 132 are arranged on the board body 11 in a spaced manner. The first soldering portion 131 is connected with the signal trace 12, and the second soldering portion 132 is located on one side of the signal trace 12. The first soldering portion 131 is arranged in an overlapping manner with the signal trace 12. The width dimension W1 of the signal trace 12 is equal to the width dimension W2 of the first soldering portion 131. The distance D between the first soldering portion 131 and the second soldering portion 132 satisfies: 2mil≤D≤6mil. The length dimensions of the first soldering portion 131 and the second soldering portion 132 are equal along the extension direction of the signal trace 12. The two ends of the first soldering portion 131 in the extension direction of the signal trace 12 are flush with the two ends of the second soldering portion 132 in the extension direction of the signal trace 12, respectively. The first soldering portion 131 and the second soldering portion 132 are copper soldering pads plated with tin.

[0071] Specifically, taking the circuit board 1 provided by the embodiments of the present application as an example, the width dimension W1 of the signal trace 12 is 5mil, the width dimension W0 in the related art is 30mil, and the length dimension L of the un-mounted pad 15 (as shown in Figure 6 , which is a schematic diagram of the circuit board 1 in the related art, Figure 6 ) is 40mil. The un-mounted pad 15 is used to install an optional electronic device, which can expand the function of the circuit board 1 or improve some functions of the circuit board 1. The un-mounted pad 15 can be installed with no electronic device or installed with an electronic device.

[0072] In the embodiment, the width dimension W2 of the first soldering part 131 is consistent with the width dimension W1 of the signal trace 12, which is 5 mil; the length dimension L of the first soldering part 131 is 40 mil, and the interval D between the first soldering part 131 and the second soldering part 132 is 4 mil; correspondingly, the width dimension W3 of the second soldering part 132 = W0-W2-D = 30 mil-5 mil-4 mil = 21 mil; the length dimension L of the second soldering part 132 is 40 mil, as shown in Figure 7 Figure 7 is a schematic diagram of the circuit board 1 provided by the embodiment of the present application.

[0073] Correspondingly, the embodiment of the present application further provides an electronic device, which comprises the circuit board 1 described above.

[0074] The electronic device can be a computer host, a display device, etc. Specifically, the display device includes but is not limited to a smart interactive tablet, a smart interactive blackboard, and a smart interactive whiteboard.

[0075] It can be understood that the electronic device comprises the circuit board 1 described above, and thus the electronic device has all the beneficial effects of the circuit board 1 described above, which will not be described herein again.

[0076] In the description of the present application, the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" can explicitly or implicitly include one or more features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0077] In the above embodiments, the description of each embodiment is focused on, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0078] The embodiments, implementation manners and related technical features of the present application can be combined or replaced with each other without conflict.

[0079] The above is only the preferred embodiment of the present application, and does not limit the present application in any form, but any simple modification, equivalent change and modification made to the above embodiment without departing from the technical solution of the present application and according to the technical essence of the present application, still belongs to the scope of the technical solution of the present application.​

Claims

1. A circuit board (1), characterized in that, include: Plate(11); Signal traces (12) are disposed on the board (11); A first pad (13) includes a first solder part (131) and a second solder part (132), the first solder part (131) and the second solder part (132) being spaced apart on the board body (11); the first solder part (131) is connected to the signal trace (12), and the second solder part (132) is located on one side of the signal trace (12); and The second pad (14) is disposed on the board body (11) and connected to the signal trace (12); In the width direction of the signal trace (12), the first solder part (131) has a width dimension W2, the second solder part (132) has a width dimension W3, and the second solder pad (14) has a width dimension W4, satisfying: W2 < W3 and W2 < W4.

2. The circuit board (1) according to claim 1, characterized in that, The first solder joint (131) overlaps with the signal trace (12).

3. The circuit board (1) according to claim 2, characterized in that, The signal trace (12) has a width dimension W1, which satisfies: 0.5W1≤W2≤1.5W1.

4. The circuit board (1) according to claim 3, characterized in that, The width dimension W1 of the signal trace (12) is equal to the width dimension W2 of the first solder part (131).

5. The circuit board (1) according to any one of claims 1-4, characterized in that, The distance between the first weld (131) and the second weld (132) is D, which satisfies: 2mil≤D≤6mil.

6. The circuit board (1) according to any one of claims 1-4, characterized in that, The width dimension W3 of the second solder part (132) is smaller than the width dimension W4 of the second solder pad (14).

7. The circuit board (1) according to any one of claims 1-4, characterized in that, Along the extension direction of the signal trace (12), the lengths of the first solder joint (131) and the second solder joint (132) are equal; And / or, at least one end of the first solder part (131) in the extension direction of the signal trace (12) is flush with at least one end of the second solder part (132) in the extension direction of the signal trace (12).

8. The circuit board (1) according to any one of claims 1-4, characterized in that, The first solder part (131) and the second solder part (132) are copper solder pads or copper-tin-plated solder pads; And / or, the circuit board (1) includes a plurality of first pads (13), the first solder part (131) of each first pad (13) is connected to the signal trace (12), and the second solder part (132) of each first pad (13) is located on one side of the signal trace (12).

9. The circuit board (1) according to any one of claims 1-4, characterized in that, The second pad (14) is configured to connect to standard electronic devices, and the first pad (13) is configured to connect to optional electronic devices.

10. An electronic device, characterized in that, Includes the circuit board (1) as described in any one of claims 1-9.

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