Radiator of circuit board used in intelligent cooker

Abstract

The utility model discloses a radiator of a circuit board used in an intelligent cooking machine, which comprises a radiating plate with a plurality of fins, the radiating plate is arranged on the back of the intelligent cooking machine, the fins on the radiating plate are exposed in the external environment, the circuit board is arranged in a casing of the cooking machine and contacted with the inner side of the radiating plate, and the radiating plate is arranged in the casing of the cooking machine. By adopting the radiator, heat on the circuit board can be quickly conducted to the external environment, and the radiator can be mounted together with the back of the cooker in a sealed contact manner, so that organisms such as cockroaches, insects and rats are effectively prevented from invading into a shell of the cooker, and the service life of the cooker is prolonged. And the cooking environment in the shell of the automatic cooker is ensured to be clean and sanitary.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of intelligent cooking machine, especially the heat sink of circuit board used in intelligent cooking machine. BACKGROUND

[0002] As intelligent cooking equipment, the cooking machine has multiple functions such as automatic feeding, automatic cooking, automatic seasoning adding and oil fume treatment, and the components for completing the above functions are integrated and packaged in the limited machine shell space, the control circuit board of the cooking machine is also installed in the machine shell, is affected by the high heat generated during cooking of the cooking machine, and is often in a high-temperature environment and is difficult to dissipate heat to the external environment, which can easily cause the control circuit board to be burned out, making the cooking machine unable to work normally and increasing equipment maintenance cost, therefore, how to effectively dissipate heat for the circuit board of the cooking machine is very important.

[0003] Of course, some ways are also adopted in the prior art to dissipate heat for the circuit board, and the commonly used way is to install an electric fan in the machine shell and open a heat dissipation opening on the machine shell, which communicates with the outside, so as to accelerate the exchange of high-temperature airflow around the circuit board and external airflow to achieve the purpose of heat dissipation, but the structure has the following disadvantages:

[0004] After being used for a period of time, oil dirt and dust will accumulate on the electric fan, the wind force is blocked, the heat dissipation efficiency is reduced, cleaning or replacement needs to be performed frequently, the maintenance cost is increased, and due to the existence of the heat dissipation opening, some cockroaches, rats or insects and other organisms in the external environment will enter the cooking machine shell through the heat dissipation opening, on one hand, these organisms may bite or drag the electrical wires in the machine shell, causing unstable circuit connection or even direct damage, on the other hand, polluting the cooking environment in the cooking machine, bringing health hazards, and further affecting people's health. SUMMARY

[0005] The utility model wants to solve the technical problem to provide a kind of heat sink of circuit board used in intelligent cooking machine with good sealing, high heat dissipation efficiency.

[0006] In order to solve the above technical problems, the technical scheme adopted by the utility model is as follows:

[0007] A kind of heat sink of circuit board used in intelligent cooking machine is provided, including the heat dissipation plate with several fins, characterized in that, the heat dissipation plate is installed on the back of intelligent cooking machine, the fins on it are exposed to the external environment, the circuit board is placed in the machine shell of cooking machine and is in contact with the inner side of heat dissipation plate, and several heat pipes are packaged in the heat dissipation plate.

[0008] Preferably, the heat sink is composed of a substrate and the fins, the fins are fixedly mounted on the outer wall of the substrate, the heat pipe is encapsulated inside the substrate, and the inner side of the substrate is in contact with the circuit board.

[0009] Preferably, the substrate is the back plate of the casing of the cooking machine or a part of the back plate.

[0010] Preferably, the substrate is fixedly mounted on the back plate of the cooking machine's casing, and an opening is provided on the back plate at a position opposite to the circuit board.

[0011] Preferably, all the heat pipes are spaced apart from each other, with the heat pipes in the middle being vertically distributed and the heat pipes on the sides of the heat sink being horizontally distributed.

[0012] Preferably, the fin group consists of several parallel and spaced fins, and all fins are fixedly mounted on the outer side wall of the substrate.

[0013] Preferably, a heat sink is provided on the components of the circuit board, and the heat sink is fixedly connected to the substrate.

[0014] This utility model uses a heat sink that can quickly conduct heat from the circuit board to the external environment. The substrate can be installed together with the back panel of the cooking machine in a sealed contact manner or directly as the back panel of the cooking machine and sealed on the frame of the cooking machine. This effectively prevents cockroaches, insects, rodents and other organisms from entering the cooking machine casing and ensures a clean and hygienic cooking environment inside the cooking machine casing. Attached Figure Description

[0015] Figure 1 This is a perspective view of the radiator provided by this utility model.

[0016] In the diagram: substrate 1; heat pipe 2; fins 3; circuit board 4. Detailed Implementation

[0017] like Figure 1 As shown, the heat sink of this utility model is used to dissipate heat from the circuit board 4 in the intelligent cooking machine. The circuit board 4 is installed on the rear side inside the casing of the cooking machine (within the rear). Figure 1The paper surface is a reference direction, the direction to the left lower side is front / inner, the direction to the right upper side is back / back / outer, same below), correspondingly, the heat sink is installed on the back of the cooking machine, the inner side of the heat sink is in contact with the circuit board 4, the fins 3 installed on the outer side of the heat sink are exposed to the external environment, the heat on the circuit board 4 can be conducted to the heat sink and quickly dissipated to the external environment by the heat sink, the heat sink is used to realize the quick conduction and heat dissipation of the circuit board 4, and when the heat sink is installed, the heat sink and the shell are sealed and connected together, so that the dust, foreign matters and biological organisms such as cockroaches, mice, insects and the like in the external environment are effectively isolated outside the cooking machine, the cooking environment in the shell of the cooking machine is ensured to be sanitary, and the damage of the above biological organisms to the electrical wires or hardware devices in the shell after invading the shell is prevented, so that the cooking work of the cooking machine can be steadily carried out.

[0018] The heat sink comprises a heat dissipation plate and a plurality of heat pipes 2.

[0019] 1, the heat dissipation plate

[0020] The heat dissipation plate is a fin 3 type heat dissipation plate, which is divided into an integral base plate 1 and a plurality of fins 3.

[0021] The base plate 1 and the fins 3 are made of materials with good heat conduction characteristics, such as aluminum, copper and the like.

[0022] The outer contour shape of the base plate 1 is a rectangular body, which is used to install the fins 3 and the heat pipes 2, wherein the fins 3 are fixedly installed on the outer side wall of the base plate 1, the heat pipes 2 are built in the base plate 1, and the base plate 1 is integrally installed on the cooking machine by being fixed to the back plate of the shell of the cooking machine or being fixed to the rack as the back plate of the cooking machine (the specific installation mode of the base plate 1 is introduced in the third part), after installation, the fins 3 are exposed to the external environment, the inner side of the base plate 1 is in contact with the circuit board 4, in order to facilitate the connection between the circuit board 4 and the base plate 1, the heat dissipation sheet is fixedly attached on the components on the circuit board 4, the locking hole is arranged on the heat dissipation sheet, and the heat dissipation sheet is attached on the inner side of the base plate and locked on the base plate.

[0023] The size of the base plate 1 is related to the heat dissipation efficiency of the circuit board 4, and the size of the base plate 1 can be designed according to the actual required heat dissipation efficiency, the length x width x height of the base plate 1 of the utility model is preferably (30-50cm) x (5-15cm) x (30-60cm), and the length x width x height is preferably 49cm x 10cm x 53cm.

[0024] The fins 3 are used to dissipate the heat conducted to them from the base plate 1 to the outside air. The shape of the fins 3 is preferably a flat rectangular plate structure, all the fins 3 are parallel to each other and evenly arranged on the outer side of the entire base plate 1, the front end side of each fin 3 is fixedly installed on the outer side wall of the base plate 1 and parallel to the left side or right side plate of the base plate 1, or the fins 3 are integrally injection molded with the base plate 1. The shape of the fins 3 can also be curved or fan-shaped, which is not limited here.

[0025] 2, heat pipe 2

[0026] The structure and working principle of the heat pipe 2 are as follows:

[0027] Generally, the heat pipe 2 is composed of a pipe shell, a wick and an end cover. The inside of the heat pipe 2 is in a negative pressure state and is filled with a suitable liquid. The liquid has a low boiling point and is easy to evaporate. The pipe wall has a wick, which is composed of a capillary porous material. One end of the heat pipe 2 is the evaporation end, and the other end is the condensation end. By utilizing the phase change process of the medium evaporating at the hot end (evaporation end) and condensing at the cold end (condensation end) (i.e. by utilizing the latent heat of evaporation and condensation of the liquid), heat is quickly conducted. When one end of the heat pipe 2 is heated, the liquid in the capillary tube rapidly vaporizes, and the vapor flows to the other end under the action of thermal diffusion, and condenses at the cold end to release heat. The liquid flows back to the evaporation end along the porous material by capillary action, and the cycle continues until the temperatures at both ends of the heat pipe 2 are equal (at this time, the thermal diffusion of the vapor stops). This cycle is carried out quickly, and heat can be continuously conducted away.

[0028] In the utility model, the heat pipe 2 is fixedly packaged in the base plate 1, and the number thereof is multiple. Some of the heat pipes 2 (referred to as first heat pipes, and the heat pipes 2 not in contact with the circuit board 4 are referred to as second heat pipes, and the same below) are used to contact the hot end thereof with the circuit board 4 to quickly conduct the heat on the circuit board 4 to the base plate 1, and then conduct the heat to the fins 3 by the base plate 1, and finally dissipate the heat to the outside air.

[0029] In order to seamlessly fit the first heat pipe with the heat dissipation fins on the circuit board 4, the shape of the first heat pipe is a rectangular body or a flat long tube. When the heat pipe 2 is packaged in the base plate 1, the inner side wall of the first heat pipe is exposed and is in the same vertical plane as the inner side of the base plate 1.

[0030] The second heat pipe can be completely packaged in the base plate 1 or packaged in the base plate 1 in the same shape and installation method as the first heat pipe, so that the inner side of the base plate 1 is a flat surface, so that the base plate 1 can be completely fitted on the back plate of the frying machine and fixedly connected, and the base plate 1 and the back plate are sealed and attached together.

[0031] All the first heat pipes and the second heat pipes are distributed in intervals and located in a space enclosed by the heat pipes 2 at the most side, which is equal to or slightly smaller than the area of the inner side of the substrate 1, so that the heat pipes 2 can be distributed on the whole substrate 1, wherein the heat pipes 2 located at the middle position of the substrate 1 are vertically arranged, and the heat pipes 2 located at the side position of the substrate 1 are horizontally arranged, preferably, the hot end of each heat pipe 2 is close to the mounting position of the circuit board 4, and the cold end of the heat pipe 2 is away from the mounting position of the circuit board 4, the heat pipes 2 are arranged in this way, so that when the heat on the substrate 1 is conducted to the hot end of any second heat pipe, the corresponding second heat pipe will quickly transfer the heat from the hot end to the cold end, and then to the substrate 1, and finally to the fins 3, thereby realizing the rapid conduction of the high heat at the position of the circuit board 4 on the substrate 1 in a "radial" manner away from the circuit board 4, effectively improving the conduction efficiency of the heat on the circuit board 4 on the substrate 1, and thus effectively improving the heat dissipation efficiency of the fins 3.

[0032] 3, Mounting mode of the heat sink

[0033] In the utility model, the frying machine is preferably of a rectangular structure, wherein the casing comprises a base, a top plate, a left side plate, a right side plate, a back plate and a door, the base, the top plate, the left side plate, the right side plate and the back plate are connected to each other and enclosed with the door in a closed state to form the rectangular body, an inner cavity is arranged in the casing, which is a space for completing the work related to cooking (such as material preparation, frying and oil fume treatment), and the circuit board 4 is mounted in the space between the back wall of the inner cavity and the back plate.

[0034] The mounting mode of the heat sink on the frying machine is preferably the following two modes:

[0035] 1) The heat sink is fixedly mounted on the back plate of the frying machine.

[0036] Specifically, the inner side wall of the substrate 1 is attached to the outer side of the back plate and fixedly mounted together, in order to realize the contact of the circuit board 4 with the first heat pipe 2, a through opening is formed in the back plate opposite to the circuit board 4, so that the back surface of the circuit board 4 can directly and closely contact with the first heat pipe 2, and a sealing structure is arranged around the through opening.

[0037] 2) The heat sink is fixedly mounted on the frame of the frying machine as the back plate or part of the back plate of the frying machine.

[0038] Specifically, the size of the substrate 1 is adapted to the size of the back plate, that is, the original back plate of the frying machine is omitted, and the substrate 1 is used as the back plate of the frying machine, which is fixedly connected with the frame and sealingly connected with the top plate, the base, the left side plate and the right side plate, and the circuit board 4 can directly contact with the first heat pipe 2 on the substrate 1.

[0039] Alternatively, a rectangular window is formed on the back plate at a position opposite to the circuit board 4, the size of the substrate 1 is adapted to the size of the window, the substrate 1 is arranged in the window, and a sealing waterproof structure is arranged between the four edges of the window and the substrate 1, that is, the substrate 1 is a component of the back plate, the back plate and the substrate 1 can be integrally formed, and the circuit board 4 is in contact with the first heat pipe 2 on the substrate 1.

Claims

1. A heat sink for a circuit board used in a smart cooking machine, comprising a heat sink plate with several fins, characterized in that, The heat sink is installed on the back of the smart cooking machine, and the fins on it are exposed to the external environment. The circuit board is placed inside the casing of the cooking machine and contacts the inside of the heat sink. Several heat pipes are encapsulated inside the heat sink.

2. The heat sink for the circuit board used in the intelligent cooking machine according to claim 1, characterized in that, The heat sink consists of a substrate and fins. The fins are fixedly mounted on the outer wall of the substrate. The heat pipe is encapsulated inside the substrate. The inner side of the substrate is in contact with the circuit board.

3. The heat sink for the circuit board used in the intelligent cooking machine according to claim 2, characterized in that, The substrate is the back plate of the casing of the cooking machine or a part of the back plate.

4. The heat sink for the circuit board used in the intelligent cooking machine according to claim 2, characterized in that, The substrate is fixedly mounted on the back panel of the cooking machine's casing, and an opening is provided on the back panel at a position opposite to the circuit board.

5. The heat sink for the circuit board used in the intelligent cooking machine according to claim 3 or 4, characterized in that, All the heat pipes are spaced apart from each other, with the heat pipes in the middle arranged vertically and the heat pipes on the sides of the heat sink arranged horizontally.

6. The heat sink for the circuit board used in the intelligent cooking machine according to claim 5, characterized in that, The fin group consists of several parallel and spaced fins, and all fins are fixedly mounted on the outer side wall of the substrate.

7. The heat sink for the circuit board used in the intelligent cooking machine according to claim 6, characterized in that, Heat sinks are provided on the components of the circuit board, and the heat sinks are fixedly connected to the substrate.

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