Module water cooling plate heat dissipation structure adopting DOH heat sink design

The modular water-cooled plate heat dissipation structure designed with DOH heat sinks, combining air cooling and water cooling methods, solves the problem of insufficient heat dissipation in small areas, achieving rapid and effective heat dissipation and improving the stability and lifespan of electrical components.

CN223714421UActive Publication Date: 2025-12-23SHENZHEN CORNERSTONE NEW MATERIAL TECH CO LTD
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Patent Information

Application Number
CN202423156108.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-20
Publication Date
2025-12-23
Estimated Expiration
2034-12-20

AI Technical Summary

Technical Problem

In existing technologies, using a fixed-size heat sink in a small area cannot effectively dissipate heat, which affects the lifespan of electrical components.

Method used

The modular water-cooled plate heat dissipation structure with DOH heat sink design includes a heat sink, cooling device and device mounting components. It utilizes the rapid circulation of coolant and various shapes of heat dissipation fins, combined with air cooling and water cooling methods for heat dissipation.

Benefits of technology

It achieves rapid and effective heat dissipation, improves the stability and lifespan of electrical components, and enhances the adequacy and comprehensiveness of heat dissipation.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a module water cooling plate heat dissipation structure adopting a DOH heat sink design, which comprises a heat dissipation plate, a cooling device is arranged at the upper end of the heat dissipation plate, and a device mounting assembly is arranged at the upper end of the cooling device; the device mounting assembly comprises a second mounting plate and a first mounting plate, and the heat dissipation plate, the cooling box and the second mounting plate are mutually fixed; the cooling device and the heat dissipation plate are used for heat dissipation between the device installation assemblies. According to the utility model, through the combination of air-cooling heat dissipation and water-cooling heat dissipation, not only can the stability and rapidity during heat dissipation be realized, but also the cooling effectiveness during heat dissipation can be realized, the heat dissipation quality is greatly improved, the effective use of electrical components is ensured, and the practicability and stability are enhanced.
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Description

TECHNICAL FIELD

[0001] The utility model relates to water cooling plate heat dissipation structure technical field especially relates to a kind of module water cooling plate heat dissipation structure using DOH heat sink design. BACKGROUND

[0002] At present, when the electric component is cooled, cooling mechanism is arranged on one side of the electric component to cool it, but the conventional way is to directly install the radiator, and the radiator of fixed size cannot achieve sufficient cooling effect in some small space, which affects the rapid cooling and reduces the service life of the electric component, therefore, the module water cooling plate heat dissipation structure using DOH heat sink design is proposed to solve the above problems. SUMMARY

[0003] The utility model discloses a kind of module water cooling plate heat dissipation structure using DOH heat sink design to solve the shortcomings in the prior art.

[0004] To achieve the above object, the utility model adopts the following technical scheme:

[0005] A kind of module water cooling plate heat dissipation structure using DOH heat sink design, including heat dissipation plate, the upper end of the heat dissipation plate is equipped with cooling device, the upper end of the cooling device is equipped with device installation component;

[0006] The device installation component includes second mounting plate and first mounting plate, and heat dissipation plate, cooling box and second mounting plate are fixed to each other;

[0007] The cooling device and heat dissipation plate are used to cool the device installation component.

[0008] Preferably, the cooling device includes cooling liquid output pipe and cooling liquid input pipe connected at both sides of one end of the cooling box, a plurality of partitions are fixed in the cooling box at equal intervals, and the partitions divide the cooling box into a plurality of flow-through cavities of the same size at equal intervals.

[0009] Preferably, a plurality of guide plates are fixed in the flow-through cavities at equal intervals, and the guide plates are in pairs, a plurality of heat dissipation bumps are provided in the flow-through cavities at equal intervals, and the heat dissipation bumps are made of copper.

[0010] Preferably, the cooling box is provided with an opening on one side, the opening is closed by a cover, and the cooling box and the cover are made of stainless steel.

[0011] Preferably, the edges of the heat dissipation plate, the cooling box and the second mounting plate are fixed by a plurality of screws.

[0012] Preferably, a plurality of heat dissipation fins are arranged on the heat dissipation plate at equal intervals, the heat dissipation fins are in a fish scale structure, and the heat dissipation fins are made of one of copper, aluminum alloy and stainless steel.

[0013] Preferably, the heat dissipation fins are in a cylindrical structure.

[0014] Preferably, the heat dissipation fins are composed of a plurality of rectangular heat dissipation blocks of equal size.

[0015] Preferably, the heat dissipation fins are in a rectangular structure.

[0016] Preferably, a graphene coating is coated on a periphery of the heat dissipation fins.

[0017] In the utility model, the mounting plate of upper end adopts DOH heat sink design, when needing heat dissipation, cooling liquid is sent into flow cavity through cooling liquid input pipe, realizes its sequential flow in cooling box through the flow guide of flow guide plate, and simultaneously, the flow speed can be greatly improved during flow guide, realizes rapid circulation, improves cooling effect, the heat dissipation bump can quickly absorb temperature and keep in low temperature state, and then is cooled sufficiently in combination with the rapid flow of cooling liquid, and then flows out from cooling liquid output pipe, the heat dissipation fin of one side of heat dissipation plate in fish scale shape can improve anti-collision effect and heat dissipation effect, and in combination with rapid water cooling, the cooling effect is greatly improved.

[0018] The utility model has the following advantages:

[0019] 1. Through the setting of flow guide block and baffle, the flow speed of cooling liquid is greatly improved, so that rapid circulation is realized, and the cooling effect is improved.

[0020] 2. Through the setting of heat dissipation fin and a plurality of heat dissipation bumps, the temperature cooling property is greatly improved, and the effectiveness of heat dissipation is ensured.

[0021] 3. Through the combination of rectangular block, rectangular, fish scale and cylindrical heat dissipation fin structures, air cooling heat dissipation is realized, and through the combination of air cooling and water cooling, the sufficiency and comprehensiveness of heat dissipation can be further improved.

[0022] In summary, the utility model realizes stability and rapidity during heat dissipation through the combination of air cooling heat dissipation and water cooling heat dissipation, realizes the effectiveness of cooling during heat dissipation, greatly improves the quality of heat dissipation, ensures the effective use of electrical components, and enhances practicality and stability. ACCURACY

[0023] Figure 1 It is a structural diagram of the utility model;

[0024] Figure 2 It is an internal structure diagram of the cooling box of the utility model;

[0025] Figure 3 It is the inside flow guide structure diagram of the cooling box of the utility model;

[0026] Figure 4 It is the installation structure diagram of the cover of the utility model;

[0027] Figure 5 It is the structure diagram of the heat dissipation fin of the utility model in multiple rectangular blocks;

[0028] Figure 6 It is the structure diagram of the heat dissipation fin of the utility model in multiple rectangles;

[0029] Figure 7 It is the structure diagram of the heat dissipation fin of the utility model in multiple cylinders.

[0030] In the drawing: 1 flow guide plate, 2 partition, 3 cooling box, 4 cooling liquid output pipe, 5 cooling liquid input pipe, 6 heat dissipation bump, 7 cover, 8 first mounting plate, 9 second mounting plate, 10 heat dissipation plate, 11 screw, 12 heat dissipation fin. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only a part of the embodiments of the utility model, rather than all the embodiments.

[0032] Referring to Figures 1-7 A module water-cooling plate heat dissipation structure adopting DOH heat sink design, comprising a heat dissipation plate 10, the upper end of the heat dissipation plate 10 is provided with a cooling device, the cooling device comprises a cooling liquid output pipe 4 and a cooling liquid input pipe 5 connected on both sides of one end of a cooling box 3, a plurality of partition plates 2 are fixed in the cooling box 3 at equal intervals, and the partition plates 2 divide the cooling box 3 into a plurality of flow-through cavities of the same size at equal intervals, the partition plates 2 are used for separation and guidance, so that flow-through cavities are formed, thereby diffusing the area subjected to heat dissipation and improving the range of heat dissipation;

[0033] The upper end of the cooling device is provided with a device mounting assembly, the device mounting assembly comprises a second mounting plate 9 and a first mounting plate 8, and the heat dissipation plate 10, the cooling box 3 and the second mounting plate 9 are fixed to each other, an electric element is mounted between the second mounting plate 9 and the first mounting plate 8, and the cooling device and the heat dissipation plate 10 are used for heat dissipation between the device mounting assembly;

[0034] A plurality of flow guide plates 1 are fixed in the flow-through cavities at equal intervals, and the flow guide plates 1 are in pairs, a plurality of heat dissipation bumps 6 are arranged in the flow-through cavities at equal intervals, and the heat dissipation bumps 6 are made of copper material, the arrangement of the flow guide plates 1 and the heat dissipation bumps 6 improves the flow speed of the cooling liquid and reduces the temperature of the cooling liquid, thereby ensuring the effectiveness of heat dissipation;

[0035] The cooling box 3 is provided with an opening on one side, which is closed by a cover 7. Both the cooling box 3 and the cover 7 are made of stainless steel, which can absorb heat and ensure rapid heat dissipation at low temperature, thereby ensuring stable heat dissipation.

[0036] The edges of the heat dissipation plate 10, the cooling box 3, and the second mounting plate 9 are fixed by a plurality of screws 11. The heat dissipation plate 10 is provided with a plurality of heat dissipation fins 12 at equal intervals. The heat dissipation fins 12 have a fish scale structure and are made of iron-based galvanized material. The heat dissipation fins 12 have stable heat dissipation effect and are suitable for long-term rapid heat dissipation. The heat dissipation fins 12 achieve rapid air cooling heat dissipation.

[0037] The heat dissipation fins 12 are made of one of copper, aluminum alloy, and stainless steel. The heat dissipation fins 12 have a cylindrical structure and are composed of a plurality of rectangular heat dissipation blocks of equal size. The heat dissipation fins 12 have a rectangular structure and are coated with a graphene coating around the circumference. The combination of the rectangular block, rectangular, fish scale, and cylindrical heat dissipation fin structures further improves the comprehensiveness and comprehensiveness of heat dissipation.

[0038] When the heat dissipation fins 12 are made of copper, the advantages are excellent thermal conductivity, good ductility, and corrosion resistance. The disadvantage is high cost and heavy weight.

[0039] When the heat dissipation fins 12 are made of copper aluminum and aluminum alloy (such as 6061, 3003, 5052, and 5083), the advantages are good thermal conductivity, light weight, and relatively low cost. The disadvantage is that corrosion may occur when in contact with certain cooling liquids.

[0040] When the heat dissipation fins 12 are made of copper aluminum composite material, they combine the advantages of copper and aluminum, such as good welding performance of copper and high thermal conductivity and processability of aluminum, which can meet the heat dissipation needs of high-power modules while maintaining compact structure and light weight.

[0041] When the heat dissipation fins 12 are made of stainless steel, the advantages are high strength and strong corrosion resistance. The disadvantage is that the thermal conductivity is not as good as copper and aluminum, and the cost is also high.

[0042] When the heat dissipation fins 12 are made of graphite, the advantages are lightweight and non-corrosive. The disadvantage is that it is not widely used and is prone to cracking.

[0043] When the heat dissipation fins 12 are made of other materials, silver (due to its excellent thermal conductivity), acrylic or POM, etc. may be used in certain special cases, but these materials are usually not the main heat conduction part but are used to manufacture other components of the water cooling system.

[0044] In selecting the appropriate water-cooled plate material, consider the actual working environment, expected service life, maintenance requirements, and cost-effectiveness factors, such as in environments requiring high strength and good corrosion resistance, copper-aluminum composite materials may be preferred; while in weight-sensitive applications, aluminum alloys are more likely to be used, and for some high-end applications, special alloys or coatings may be used to enhance performance.

[0045] In the utility model, the mounting plate of upper end adopts DOH heat sink design, when needing to radiate heat, cooling liquid is sent into flow cavity through cooling liquid input pipe 5, realizes its sequential flow in cooling box 3 through the flow guide of flow guide plate 1, can greatly improve the flow speed when guiding, realizes rapid circulation, improves cooling effect, heat dissipation bump 6 can quickly absorb temperature, keeps in low temperature state, combines with the sufficient cooling of quick flow cooling liquid, then flows out from cooling liquid output pipe 4, the one side of heat dissipation plate 10 is the heat dissipation fin 12 of scale-like heat dissipation fin 12 and can improve the anti-collision effect and heat dissipation effect, combines with quick water cooling and greatly improves the cooling effect.

[0046] The above is only the preferred embodiment of the utility model, but the protection scope of the utility model is not limited to this, any skilled person in the art in the technical range disclosed by the utility model, according to the technical scheme and utility model concept of the utility model, equivalent replacement or change, should be covered in the protection scope of the utility model.

Claims

1. A module water-cooling plate heat dissipation structure using a DOH heat sink design, characterized in that, The application relates to a heat dissipation device, which comprises a heat dissipation plate (10), wherein the upper end of the heat dissipation plate (10) is provided with a cooling device, the upper end of the cooling device is provided with a device mounting assembly, the device mounting assembly comprises a second mounting plate (9) and a first mounting plate (8), the heat dissipation plate (10), the cooling box (3) and the second mounting plate (9) are fixed with each other, the cooling device and the heat dissipation plate (10) are used for dissipating heat between the device mounting assembly. The cooling device comprises cooling liquid output pipes (4) and cooling liquid input pipes (5) connected to the two sides of one end of the cooling box (3), a plurality of partition plates (2) are fixed in the cooling box (3) at equal intervals, and the cooling box (3) is equally and intervally divided into a plurality of flow-through cavities by the partition plates (2). A plurality of flow guide plates (1) are fixed in the flow-through cavities at equal intervals, the flow guide plates (1) are grouped in pairs, a plurality of heat dissipation protrusions (6) are arranged in the flow-through cavities at equal intervals, and the heat dissipation protrusions (6) are made of copper.

2. The module water-cooling plate heat dissipation structure with a DOH heat sink design according to claim 1, characterized in that: One side of the cooling box (3) is provided with an opening, the opening is closed by a cover (7), and the cooling box (3) and the cover (7) are made of stainless steel.

3. The module water-cooling plate heat dissipation structure with a DOH heat sink design according to claim 2, characterized in that: The edges of the heat dissipation plate (10), the cooling box (3) and the second mounting plate (9) are fixed by a plurality of screws (11).

4. The module water-cooling plate heat dissipation structure with a DOH heat sink design according to claim 1, characterized in that: A plurality of heat dissipation fins (12) are arranged on the heat dissipation plate (10) at equal intervals, the heat dissipation fins (12) have a fish scale structure, and the heat dissipation fins (12) are made of one of copper, aluminum alloy and stainless steel.

5. The module water-cooling plate heat dissipation structure with a DOH heat sink design according to claim 1, characterized in that: The heat dissipation fins (12) have a cylindrical structure.

6. The module water-cooling plate heat dissipation structure with a DOH heat sink design according to claim 1, characterized in that: The heat dissipation fins (12) are composed of a plurality of rectangular heat dissipation blocks with equal sizes.

7. The module water-cooling plate heat dissipation structure with a DOH heat sink design according to claim 6, characterized in that: The heat dissipation fins (12) have a rectangular structure.

8. The module water-cooling plate heat dissipation structure with a DOH heat sink design according to claim 6, characterized in that: The heat dissipation fins (12) are coated with a graphene coating.

9. The module water-cooling plate heat dissipation structure with DOH heat sink design according to claim 6, characterized in that: ​ 10. The module water-cooling plate heat dissipation structure with a DOH heat sink design according to claim 6, characterized in that: ​