Cooling system, controller and vehicle
By combining a semiconductor cooler and a radial heat dissipation fin assembly into the vehicle controller, the problem of poor heat dissipation efficiency of the heat source in the vehicle controller is solved, achieving efficient heat dissipation and extended lifespan, while reducing assembly difficulty and noise.
Patent Information
- Application Number
- CN202423191166.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-12-23
- Estimated Expiration
- 2034-12-20
AI Technical Summary
In the vehicle controller, the increased load on the working components of the circuit control board used to control the vehicle sensing components leads to increased heat generation. The existing heat dissipation system is inefficient and affects its service life.
The device combines a semiconductor cooler with a heat dissipation mechanism. The cold end of the semiconductor cooler is thermally coupled to the heat source, and the hot end is thermally coupled to the heat dissipation mechanism. The heat dissipation mechanism includes a heat dissipation substrate and radially arranged heat dissipation fins. Thermally conductive materials are used to improve heat exchange efficiency, and a cooling fan accelerates airflow. The outer casing is designed with optimized air outlets to improve heat dissipation efficiency.
It improves heat dissipation efficiency, reduces the temperature of the heat source, extends service life, avoids refrigerant pollution and noise problems, and reduces assembly difficulty and size.
Smart Images
Figure CN223714426U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of vehicles, in particular to a heat dissipation system, a controller and a vehicle. BACKGROUND
[0002] With the development of intelligence of vehicles, the automation degree of vehicle-mounted products is getting higher and higher. For example, during the driving and parking of vehicles, vehicle-mounted sensing components such as radars, cameras and ultrasonic probes are usually arranged to detect the road environment. However, the increase of the automation degree of vehicle-mounted products leads to the increase of the load of the corresponding working elements (mostly electronic components) on the circuit control board for controlling these vehicle-mounted sensing components in the vehicle-mounted controller, the increase of power, the increase of heat production, and the continuous heating of the working elements as heat sources.
[0003] In the related art, the working elements are cooled by a heat dissipation system, but the heat dissipation efficiency is not good. CONTENT OF THE UTILITY MODEL
[0004] The embodiments of the present application provide a heat dissipation system, a controller and a vehicle to improve the heat dissipation efficiency.
[0005] In order to achieve the above-mentioned purpose, according to the first aspect of the present application, a heat dissipation system and a heat dissipation mechanism are provided. The heat dissipation system includes a semiconductor refrigerator having a cold end face and a hot end face, and the cold end face is configured to be thermally coupled with a heat source. The heat dissipation mechanism is thermally coupled with the hot end face, and the heat dissipation mechanism includes a heat dissipation substrate and a heat dissipation fin group, the heat dissipation fin group is arranged on the heat dissipation substrate, and the heat dissipation fin group is arranged radially. Wherein, the heat dissipation fin group includes first heat dissipation fins and second heat dissipation fins, and the first heat dissipation fins are farther away from the radiation center than the second heat dissipation fins.
[0006] In some embodiments, a plurality of second heat dissipation fins are arranged at intervals around the radiation center, and at least one first heat dissipation fin is arranged between two adjacent second heat dissipation fins.
[0007] In some embodiments, a plurality of first heat dissipation fins are arranged at intervals around the radiation center, and the first heat dissipation fins and the second heat dissipation fins are alternately arranged around the radiation center.
[0008] In some embodiments, the adjacent heat dissipation fins define an air duct, and the heat dissipation mechanism further includes a heat dissipation fan arranged on the heat dissipation substrate, and the heat dissipation fan is used to disturb air to flow along the air duct.
[0009] In some embodiments, the heat dissipation fan is a centrifugal fan.
[0010] In some embodiments, the heat dissipation fin group is arranged radially around the heat dissipation fan.
[0011] In some embodiments, the semiconductor refrigerator is configured to be thermally coupled with the heat source through a first thermally conductive material; and / or, the heat dissipation mechanism is thermally coupled with the heat terminal through a second thermally conductive material.
[0012] In some embodiments, at least one of the first thermally conductive material and the second thermally conductive material is a thermally conductive gel.
[0013] In some embodiments, the heat dissipation substrate is thermally coupled with the heat terminal.
[0014] In some embodiments, the heat dissipation fin group and the semiconductor refrigerator are respectively located on two sides of the thickness direction of the heat dissipation substrate.
[0015] In some embodiments, the heat dissipation system further comprises a housing, and the semiconductor refrigerator and the heat dissipation mechanism are arranged in the housing.
[0016] In some embodiments, the air duct has an air outlet, and the housing is provided with an opening for exposing the air outlet.
[0017] In some embodiments, the housing comprises a first sub-housing and a second sub-housing, the first sub-housing and the second sub-housing are arranged in a spaced manner, the heat dissipation mechanism is arranged between the first sub-housing and the second sub-housing, and the first sub-housing and the second sub-housing define the air outlet therebetween.
[0018] In some embodiments, the second sub-housing is provided with an air inlet corresponding to the heat dissipation fan.
[0019] In some embodiments, the housing comprises a first sub-housing and a second sub-housing, the first sub-housing and the second sub-housing are connected and define a containing space containing the semiconductor refrigerator and the heat dissipation mechanism.
[0020] According to a second aspect of the present application, a controller is provided, comprising the heat dissipation system of any one of the first aspect.
[0021] In some embodiments, the controller further comprises a circuit control board, and a working element is arranged on the circuit control board, the working element being the heat source.
[0022] According to a third aspect of the present application, a vehicle is provided, comprising the controller of any one of the second aspect.
[0023] In the heat dissipation system of the embodiments of the present application, the heat dissipation fin group is arranged such that the first heat dissipation fins are farther away from the radiation center than the second heat dissipation fins, so that the first heat dissipation fins are farther away from the radiation center, thereby reducing the density of the heat dissipation fin group near the radiation center, reducing the flow resistance of air, and helping to improve the heat dissipation efficiency.
[0024] Other features and advantages of the present application will be described in detail in the following detailed description of the embodiments. BRIEF DESCRIPTION OF DRAWINGS
[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without any creative effort on the basis of these drawings.
[0026] In order to more completely understand the present application and its beneficial effects, the following will be described in conjunction with the drawings, wherein the same reference numerals in the following description represent the same parts.
[0027] Figure 1 The structural schematic diagram of the controller provided for some embodiments of the present application is shown in
[0028] Figure 2 The top view of the controller shown in Figure 1
[0029] Figure 3 The sectional view along A-A of 2 is shown in
[0030] Figure 4 The exploded view of the controller provided for some embodiments of the present application is shown in
[0031] Figure 5 The structural schematic diagram of the controller provided for some embodiments of the present application is shown in
[0032] Figure 6 The top view of the controller shown in Figure 5
[0033] The sectional view along B-B of 6 is shown in Figure 7
[0034] The exploded view of the controller provided for some embodiments of the present application is shown in Figure 8
[0035] The structural schematic diagram of the heat dissipation mechanism provided for some embodiments of the present application is shown in Figure 9 Explanation of reference numerals:
[0036]
[0037] 1000, controller; 100, heat dissipation system; 10, circuit control board; 11, circuit substrate; 12, heat source; 20, semiconductor refrigerator; 30, heat dissipation mechanism; 31, heat dissipation substrate; 32, heat dissipation fin group; 32a, first heat dissipation fin; 32b, second heat dissipation fin; 321, air duct; 3211, air outlet; 33, heat dissipation fan; 50, shell; 51, first sub-shell; 52, second sub-shell; 521, air inlet; 61, first heat-conductive material; 62, second heat-conductive material. DETAILED DESCRIPTION
[0038] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person skilled in the art without creative effort fall within the protection scope of the present application.
[0039] In the embodiments of the present application, the words "exemplarily" or "for example" are used to represent as an example, illustration or description. Any embodiment or design scheme described as "exemplarily" or "for example" in the embodiments of the present application should not be interpreted as more preferred or more advantageous than other embodiments or design schemes. In fact, the words "exemplarily" or "for example" are used to present the relevant concept in a specific manner.
[0040] In the embodiments of the present application, the terms "first", "second" are only used for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features.
[0041] It should be understood that the terms used in the description of various described examples herein are merely for describing particular examples and are not intended to be limiting. As used in the description of various described examples, the singular forms "a," "an," and "the" are intended to include plural forms as well, unless the context clearly indicates otherwise.
[0042] In the present application, "at least one" means one, two or more, and "multiple" means more than two. "At least one of the following" or the like means any combination of the items, including any combination of single item or multiple items.
[0043] In the description of the embodiments of the present application, the term "or" is only a description of the association relationship of the associated objects, and means that two relationships can exist, for example, A or B, which means that A exists alone, and B exists alone.
[0044] It should be understood that the references herein to "some embodiments", "other embodiments", "one embodiment", "another embodiment", "an embodiment", etc. mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. The appearances of the phrases "in one embodiment" or "in another embodiment" in various places in the specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics can be combined in any suitable manner in one or more embodiments.
[0045] According to a first aspect of the application, there is provided a heat dissipation system 100, which is applicable to a controller 1000. The controller 1000 can be a controller in a vehicle system, such as a radar controller, an image sensor controller, an ultrasonic probe controller, a temperature sensor controller, etc. In the present application, the controller 1000 is exemplified by a radar controller. Figures 1 to 8 In the illustrated example, the structure of the controller 1000 to which the heat dissipation system 100 is applicable is shown, which includes a housing 50, a circuit control board 10, and the heat dissipation system 100. The circuit control board 10 is disposed in the housing 50. The circuit control board 10 includes a circuit substrate 11 and working elements (mostly electronic components) disposed on the circuit substrate 11. When the working elements work, they generate heat as a heat source, which shortens the service life of the circuit control board 10, and further shortens the service life of the controller 1000. Therefore, the heat dissipation system 100 is needed to dissipate heat from the working elements.
[0046] The heat dissipation system 100 provided by the embodiments of the application will be described in detail below with reference to the accompanying drawings.
[0047] The heat dissipation system 100 is used to dissipate heat from a heat source 12. The heat source 12 can be the working elements on the circuit control board 10, or some communication modules, etc.
[0048] Referring to Figures 1 to 8 , the heat dissipation system 100 includes a semiconductor refrigerator 20 and a heat dissipation mechanism 30.
[0049] The semiconductor refrigerator 20 is also called a thermoelectric cooler or TEC (Thermo-Electric Cooler). The semiconductor refrigerator 20 works based on the Peltier effect, which has a cold end face and a hot end face. When a direct current passes through an electric couple composed of two different types of semiconductor materials, heat absorption and heat release phenomena will occur at the two ends of the electric couple. Specifically, after the semiconductor refrigerator 20 is powered on, the cold end face has a low temperature, absorbs heat from the surroundings, and generates a heat absorption phenomenon; the hot end face releases heat to the surroundings, and generates a heat release phenomenon. The specific structure of the semiconductor refrigerator 20 can refer to the prior art, which will not be described here.
[0050] The heat dissipation mechanism 30 is thermally coupled with the hot end face, and the cold end face of the semiconductor refrigerator 20 is configured to be thermally coupled with the heat source 12.
[0051] By setting the semiconductor refrigerator 20, the cold end face is thermally coupled with the heat source 12, and the hot end face is thermally coupled with the heat dissipation mechanism 30, so that the heat of the heat source 12 is absorbed by the cold end face and transferred to the hot end face, and then released to the heat dissipation mechanism 30, and the heat is dissipated through the heat dissipation mechanism 30. It can be understood that the semiconductor refrigerator 20 can timely transfer the heat generated by the heat source 12 to the heat dissipation mechanism 30, so that the heat is not easy to gather around the heat source 12, thereby reducing the temperature of the heat source 12, which helps to prolong the service life of the heat source 12.
[0052] In addition, compared with water cooling heat dissipation, the heat dissipation system 100 provided by the embodiment of the application avoids the pollution problem caused by the refrigerant and the noise problem caused by the flow of the refrigerant, because the refrigerant is not needed. In addition, it is not necessary to set related pipelines, so that the assembly difficulty of the heat dissipation system 100 can be reduced, and the volume of the heat dissipation system 100 can be reduced.
[0053] The heat dissipation mechanism 30 includes a heat dissipation substrate 31 and a heat dissipation fin group 32, and the heat dissipation fin group 32 is arranged on the heat dissipation substrate 31, and the heat dissipation fin group 32 is arranged in a radial manner. It can be understood that the heat dissipation fin group 32 is composed of a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged in a radial manner. The air duct 321 is defined between the two adjacent heat dissipation fins 32.
[0054] Among them, the heat dissipation fin group includes first heat dissipation fins 32a and second heat dissipation fins 32b. The first heat dissipation fins 32a are farther away from the radiation center than the second heat dissipation fins 32. It can be understood that, compared with the end of the second heat dissipation fin 32b close to the radiation center, the end of the first heat dissipation fin 32a close to the radiation center is farther away from the radiation center.
[0055] It should be understood that the first heat dissipation fin 32a and the second heat dissipation fin 32b are both heat dissipation fins and have the same effect.
[0056] The heat dissipation substrate 31 provides a mounting basis for the heat dissipation fin group 32 and other components. For example, a connector interface can be mounted on the heat dissipation substrate 31 to facilitate connection with other functional devices.
[0057] The hot end face can be thermally coupled with the heat dissipation substrate 31, and the heat dissipation fin group 32 is arranged on the heat dissipation substrate 31.
[0058] Among them, the length of the first heat dissipation fin 32a and the second heat dissipation fin 32b can be the same or different.
[0059] Among them, the heat dissipation substrate 31 and the heat dissipation fin group 32 can be integrally formed, or can be manufactured separately and then fixedly connected.
[0060] The heat dissipation substrate 31 and the heat dissipation fin group 32 can be made of aluminum alloy material.
[0061] Since the heat dissipation fin groups 32 are arranged radially, the heat dissipation fin groups 32 have a tendency to converge near the radiation center. Therefore, the closer to the radiation center, the denser the heat dissipation fin groups 32, and the smaller the distance between adjacent two heat dissipation fins, resulting in the narrowing of the air duct 321, and further resulting in the air flow being blocked, and the area near the radiation center being poorly cooled. In the embodiment of the present application, the first heat dissipation fins 32a are arranged to be farther away from the radiation center than the second heat dissipation fins 32b, so that the first heat dissipation fins 32a are farther away from the radiation center. Thus, the density of the heat dissipation fin groups near the radiation center is reduced, and the air flow resistance is reduced, which helps to improve the cooling efficiency.
[0062] With reference to Figure 9 In some embodiments, a plurality of second heat dissipation fins 32b are arranged at intervals around the radiation center, and at least one first heat dissipation fin 32a is arranged between adjacent two second heat dissipation fins 32b. This helps to reduce the air resistance between adjacent two second heat dissipation fins 32b and improve the cooling efficiency.
[0063] It can be understood that one or more first heat dissipation fins 32 can be arranged between adjacent two second heat dissipation fins 32b. For example, one first heat dissipation fin is arranged between adjacent two second heat dissipation fins 32b.
[0064] With reference to Figure 9 In some embodiments, a plurality of first heat dissipation fins 32a are arranged around the radiation center alternately and at intervals with the second heat dissipation fins 32b. This helps to reduce the density of the heat dissipation fin groups 32 near the radiation center to a greater extent, and reduce the air flow resistance.
[0065] In some embodiments, the first heat dissipation fins 32a extend to the edge of the heat dissipation substrate 31.
[0066] In some embodiments, the second heat dissipation fins 32b extend to the edge of the heat dissipation substrate 31.
[0067] In some embodiments, the width of the first heat dissipation fins 32a or the second heat dissipation fins 32b can range from 1.5 mm to 2.5 mm, and the length can range from 10 mm to 40 mm, wherein the width refers to the size of the heat dissipation fin protruding from the heat dissipation substrate 31, and the length refers to the size of the heat dissipation fin in the extension direction of the air duct 321.
[0068] In the embodiment in which the first heat dissipation fins 32a and the second heat dissipation fins 32b are arranged alternately, the distance between adjacent first heat dissipation fins 32a and second heat dissipation fins 32b can range from 7 mm to 10 mm.
[0069] With reference to Figure 4 andFigure 8 In some embodiments, the heat dissipation mechanism 30 further comprises a heat dissipation fan 33, which is arranged on the heat dissipation substrate 31 and located on the same side of the heat dissipation substrate 31 as the heat dissipation fin group 32. The heat dissipation fan 33 can disturb air to flow along the air duct 321, increase the contact area of air with the heat dissipation mechanism 30 per unit time, accelerate the heat dissipation on the heat dissipation mechanism 30, and improve the heat dissipation efficiency.
[0070] The heat dissipation fan 33 can be a centrifugal fan, an axial fan, etc.
[0071] In some embodiments, the heat dissipation fan 33 is a centrifugal fan.
[0072] Compared with an axial fan, a centrifugal fan has a larger air disturbance range and smaller heat dissipation blind area, which is conducive to improving the heat dissipation efficiency of the heat dissipation mechanism 30.
[0073] Referring to Figure 4 and Figure 8 In some embodiments, the heat dissipation fin group 32 is arranged radially around the heat dissipation fan 33. In this way, the air outlet 3211 of the air duct 321 is directed in all directions, and the air is guided to flow outward from the radial center, so that the heat is diffused in all directions and is not easily concentrated.
[0074] The semiconductor refrigerator 20 can be thermally coupled to the heat dissipation mechanism 30 or the heat source 12 through a heat-conducting material, or can be directly attached to the heat dissipation mechanism 30 or the heat source 12 to achieve thermal coupling.
[0075] Referring to Figure 3 , Figure 4 , Figure 7 and Figure 8 In order to improve the heat exchange efficiency between the semiconductor refrigerator 20 and the heat source 12, in some embodiments, the semiconductor refrigerator 20 is thermally coupled to the heat source 12 through a first heat-conducting material 61.
[0076] In order to improve the heat exchange efficiency between the semiconductor refrigerator 20 and the heat dissipation mechanism 30, in some embodiments, the heat dissipation mechanism 30 is thermally coupled to the semiconductor refrigerator 20 through a second heat-conducting material 62.
[0077] The first heat-conducting material 61 and the second heat-conducting material 62 can be the same or different. Exemplarily, the first heat-conducting material 61 and the second heat-conducting material 62 can be heat-conducting glue, heat-conducting paste, etc.
[0078] In some embodiments, the first heat-conducting material 61 is heat-conducting gel.
[0079] In some embodiments, the second heat-conducting material 62 is heat-conducting gel.
[0080] The heat-conductive gel has certain fluidity, can conform to uneven surfaces, fill gaps, reduce air gaps, and form continuous heat-conductive channels. In the embodiments of the present application, the first heat-conductive material 61 is prepared by using the heat-conductive gel, which can improve the heat conduction efficiency between the semiconductor refrigerator 20 and the heat source 12; and the second heat-conductive material 62 is prepared by using the heat-conductive gel, which can improve the heat conduction efficiency between the semiconductor refrigerator 20 and the heat dissipation mechanism 30.
[0081] In some embodiments, the heat dissipation fin group 32 and the semiconductor refrigerator 20 are located on two sides of the thickness direction of the heat dissipation substrate 31, respectively.
[0082] In the embodiments in which the heat source 12 is the working element of the circuit control board 10, the circuit control board 10 and the semiconductor refrigerator 20 can be located on the same side of the heat dissipation substrate 31.
[0083] In the embodiments of the present application, the heat dissipation fin group 32 and the semiconductor refrigerator 20 are arranged on different sides of the heat dissipation substrate 31, so that the heat dissipation fin group 32 is away from the semiconductor refrigerator 20, avoiding the heat dissipated by the heat dissipation mechanism 30 into the air being absorbed by the semiconductor refrigerator 20, which affects the semiconductor refrigerator 20 to absorb the heat dissipated by the heat source 12.
[0084] In the embodiments in which the heat source 12 is the working element of the circuit control board 10, the heat dissipation fin group 32 and the semiconductor refrigerator 20 are arranged on different sides of the heat dissipation substrate 31, so that the semiconductor refrigerator 20 can be thermally coupled to the working element on the side away from the heat dissipation fin group 32, so as to make the circuit control board 10 away from the heat dissipation fin group 32, thereby the heat dissipated by the heat dissipation mechanism 30 into the air is not easily dissipated around the working element.
[0085] In order to improve the structural stability of the heat dissipation mechanism 30, in some embodiments, the heat dissipation system 100 further comprises an outer shell 50, and the semiconductor refrigerator 20 and the heat dissipation mechanism 30 are arranged in the outer shell 50.
[0086] The outer shell 50 can be made of aluminum alloy, so as to dissipate heat to the outside through the outer shell 50 and improve the heat dissipation efficiency.
[0087] Exemplarily, as shown in Figures 1 to 4 , the outer shell 50 is a semi-open structure, and the air outlet 3211 is exposed.
[0088] Exemplarily, as shown in Figures 5 to 8 , the outer shell 50 is a closed structure. This structure can block dust from entering the heat dissipation system 100, alleviate the adverse effects of dust on heat dissipation, and also can avoid the dust affecting the normal work of other components in the heat dissipation system 100, such as the heat source 12.
[0089] It should be understood that Figures 5 to 8In the shown example, the housing 50 does not need to form a completely closed space, since the housing 50 is of split structure and there are assembly gaps between the housing 50 and the components, so air can enter and exit through the assembly gaps.
[0090] In some embodiments, the housing 50 is provided with an opening for exposing the air outlet 3211.
[0091] In the embodiments of the present application, the opening for exposing the air outlet 3211 is provided on the housing 50, so that heat is directly discharged from the housing 50 through the air outlet 3211 of the air duct 321 and the opening, avoiding the accumulation of heat in the housing 50, which helps to improve the heat dissipation efficiency of the heat dissipation system 100.
[0092] In some embodiments, the housing 50 is of one-piece structure, and the opening for exposing the air outlet 3211 is formed on the housing 50.
[0093] In other embodiments of the housing 50, the housing 50 is of split structure, referring to Figures 1 to 4 In some embodiments, the housing 50 includes a first sub-housing 51 and a second sub-housing 52, and the heat dissipation mechanism 30 is arranged between the first sub-housing 51 and the second sub-housing 52, and the air outlet is defined between the first sub-housing 51 and the second sub-housing 52.
[0094] Specifically, the first sub-housing 51 and the second sub-housing 52 are arranged opposite and spaced apart, the first sub-housing 51 is connected with the heat dissipation base plate 31, and the second sub-housing 52 is connected with the heat dissipation fin group 32.
[0095] In some embodiments, the first sub-housing 51 can be configured as a single-side open cover, and the second sub-housing 52 can be configured as a flat plate. The heat dissipation mechanism covers the open side of the first sub-housing 51.
[0096] The spacing between the first sub-housing 51 and the second sub-housing 52 can be understood as the opening for exposing the air outlet 3211.
[0097] Referring to Figures 1 to 4 In some embodiments, the second sub-housing 52 is provided with an air inlet 521 corresponding to the heat dissipation fan 33. In this way, the heat dissipation fan 33 sucks air into the housing 50 through the air inlet 521, accelerates air convection, and helps to improve the heat dissipation efficiency.
[0098] Referring to Figures 5 to 8 In other embodiments of the housing 50, the housing 50 includes a first sub-housing 51 and a second sub-housing 52, and the first sub-housing 51 and the second sub-housing 52 are connected and define a containing space containing the semiconductor refrigerator 20 and the heat dissipation mechanism 30. In this way, external foreign matter is blocked outside the heat dissipation system 100, prolonging the service life of the heat dissipation system 100.
[0099] According to a second aspect of the present application, a controller 1000 is provided, comprising the heat dissipation system 100 of any of the embodiments of the first aspect. Since the controller 1000 comprises the heat dissipation system 100, the controller 1000 has all the beneficial effects of the heat dissipation system 100, which will not be repeated here.
[0100] In some embodiments, the controller 1000 further comprises the circuit control board 10, and the working element is disposed on the circuit control board 10, which is the heat source 12 described above.
[0101] With reference to Figures 1 to 4 In some embodiments, the controller 1000 comprises the housing 50, the circuit control board 10, the heat dissipation mechanism 30, and the semiconductor refrigerator 20. The housing 50 comprises a first sub-housing 51 and a second sub-housing 52, which are oppositely and spacedly arranged, the first sub-housing 51 is in a single-side open cover structure, and the second sub-housing 52 is in a flat plate shape. The heat dissipation mechanism 30 is disposed between the first sub-housing 51 and the second sub-housing 52, and the first sub-housing 51 and the second sub-housing 52 are respectively connected to the heat dissipation mechanism 30. The circuit control board 10 is located between the heat dissipation mechanism 30 and the first sub-housing 51, and is disposed in the first sub-housing 51. The circuit control board 10 comprises the circuit substrate 11 and the working element disposed on the circuit substrate 11, and the working element is located on the side of the circuit substrate 11 facing the heat dissipation mechanism 30. The heat dissipation mechanism 30 comprises the heat dissipation substrate 31, the heat dissipation fin group 32, and the heat dissipation fan 33, and the heat dissipation fin group 32 and the heat dissipation fan 33 are both disposed on the side of the heat dissipation substrate 31 facing the second sub-housing 52, and the heat dissipation fin group 32 is arranged radially around the heat dissipation fan 33. The heat dissipation substrate 31, the heat dissipation fin group 32, and the housing 50 are made of aluminum alloy. The semiconductor refrigerator 20 is disposed on the side of the heat dissipation substrate 31 facing the circuit control board 10 and between the heat dissipation substrate 31 and the working element. The semiconductor refrigerator 20 has a hot end face and a cold end face, the hot end face is thermally coupled to the heat dissipation substrate 31 through the heat-conducting gel, and the cold end face is thermally coupled to the working element through the heat-conducting gel.
[0102] With reference to Figures 5 to 8 In some embodiments, with reference to Figures 1 to 4In some embodiments, the controller 1000 comprises a housing 50, a circuit control board 10, a heat dissipation mechanism 30 and a semiconductor refrigerator 20. The circuit control board 10, the heat dissipation mechanism 30 and the semiconductor refrigerator 20 are all arranged in the housing 50. The heat dissipation mechanism 30 comprises a heat dissipation base plate 31, a heat dissipation fin group 32 and a heat dissipation fan 33, the heat dissipation fin group 32 and the heat dissipation fan 33 are both arranged on one side of the heat dissipation base plate 31, and the heat dissipation fin group 32 is arranged radially around the heat dissipation fan 33. The heat dissipation base plate 31, the heat dissipation fin group 32 and the housing 50 are all made of aluminum alloy. The circuit control board 10 is arranged on the side of the heat dissipation base plate 31 away from the heat dissipation fin group 32. The circuit control board 10 comprises a circuit base plate 11 and working elements arranged on the circuit base plate 11, and the working elements are located on the side of the circuit base plate 11 facing the heat dissipation mechanism 30. The semiconductor refrigerator 20 is located on the same side of the heat dissipation base plate 31 as the circuit control board 10, and is located between the heat dissipation base plate 31 and the working elements. The semiconductor refrigerator 20 has a hot end face and a cold end face, the hot end face is thermally coupled to the heat dissipation base plate 31 through a heat-conducting gel, and the cold end face is thermally coupled to the working elements through a heat-conducting gel.
[0103] According to a third aspect of the present application, a vehicle is provided, comprising the controller 1000 of any one of the second aspect. Since the vehicle comprises the controller 1000, the vehicle has all the beneficial effects of the controller, which are not repeated here.
[0104] The vehicle can be a fuel automobile, a plug-in hybrid electric vehicle or a new energy vehicle, etc., which is not limited in the present application.
[0105] In the above embodiments, the description of each embodiment focuses on different aspects, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.
[0106] The embodiments, implementation manners and related technical features of the present application can be combined or replaced with each other without conflict.
[0107] The above is only a preferred embodiment of the present application, and does not limit the present application in any form. Any simple modification, equivalent change and modification made according to the technical essence of the present application to the above embodiment, without departing from the technical solution of the present application, still falls within the scope of the technical solution of the present application.
Claims
1. A heat dissipation system, characterized by, The semiconductor refrigerator has a cold end face and a hot end face, and the cold end face is configured to be thermally coupled with a heat source. The heat dissipation mechanism is thermally coupled with the hot end face, and the heat dissipation mechanism includes a heat dissipation base plate and a heat dissipation fin group, the heat dissipation fin group is arranged on the heat dissipation base plate, and the heat dissipation fin group is arranged radially. The heat dissipation fin group includes first heat dissipation fins and second heat dissipation fins, and the first heat dissipation fins are farther away from the radiation center than the second heat dissipation fins. The second heat dissipation fins are arranged in a plurality of groups, and the second heat dissipation fins in each group are arranged at intervals around the radiation center, and at least one first heat dissipation fin is arranged between any two adjacent second heat dissipation fins.
2. The heat dissipation system of claim 1, wherein, The first heat dissipation fins are arranged in a plurality of groups, and the first heat dissipation fins and the second heat dissipation fins are arranged alternately and at intervals around the radiation center.
3. The heat dissipation system of claim 2, wherein, Adjacent heat dissipation fins define an air duct, and the heat dissipation mechanism further includes a heat dissipation fan arranged on the heat dissipation base plate, and the heat dissipation fan is used to disturb air to flow along the air duct.
4. The heat dissipation system of claim 1, wherein, The heat dissipation fan is a centrifugal fan.
5. The heat dissipation system of claim 4, wherein, The heat dissipation fin group is arranged radially around the heat dissipation fan.
6. The heat dissipation system of claim 4, wherein, The semiconductor refrigerator is configured to be thermally coupled with the heat source by a first heat-conducting material, and / or the heat dissipation mechanism is thermally coupled with the hot end face by a second heat-conducting material.
7. The heat dissipation system according to any one of claims 1-6, wherein, At least one of the first heat-conducting material and the second heat-conducting material is a heat-conducting gel.
8. The heat dissipation system of claim 7, wherein, The heat dissipation base plate is thermally coupled with the hot end face.
9. The heat dissipation system according to any one of claims 1-6, wherein, The heat dissipation fin group and the semiconductor refrigerator are respectively located on two sides of the heat dissipation base plate in the thickness direction.
10. The heat dissipation system of claim 9, wherein, The heat dissipation system further includes a housing, and the semiconductor refrigerator and the heat dissipation mechanism are arranged in the housing.
11. The heat dissipation system of any one of claims 1-3, wherein, Adjacent heat dissipation fins define an air duct, and the air duct has an air outlet, and the housing is provided with an opening for exposing the air outlet.
12. The heat dissipation system of claim 11, wherein, The housing includes a first sub-housing and a second sub-housing, the first sub-housing and the second sub-housing are arranged at intervals, the heat dissipation mechanism is arranged between the first sub-housing and the second sub-housing, and the first sub-housing and the second sub-housing define the air outlet.
13. The heat dissipation system of claim 12, wherein, The heat dissipation mechanism further includes a heat dissipation fan arranged on the heat dissipation base plate, and the heat dissipation fan is used to disturb air to flow along the air duct, and the second sub-housing is provided with an air inlet corresponding to the heat dissipation fan.
14. The heat dissipation system of claim 13, wherein, The housing includes a first sub-housing and a second sub-housing, the first sub-housing and the second sub-housing are connected and define a containing space containing the semiconductor refrigerator and the heat dissipation mechanism.
15. The heat dissipation system of claim 11, wherein, The heat dissipation system includes any one of claims 1-11.
16. A controller characterized by comprising: The controller further includes a circuit control board, and the circuit control board is provided with a working element, and the working element is the heat source.
17. The controller of claim 16, wherein, The controller includes any one of claims 16 or 17.
18. A vehicle characterized by comprising: