Bipolar plate with high heat conduction

Abstract

The utility model discloses a bipolar plate with high heat conduction, which comprises a substrate, the top of the substrate is fixedly connected with a composite graphite layer, the top of the composite graphite layer is fixedly connected with a copper sheet layer, the top of the copper sheet layer is fixedly connected with an aluminum sheet layer, and the top of the aluminum sheet layer is fixedly connected with an aluminum oxide ceramic vermicelli layer. An aluminum nitride layer is fixedly connected to the top of the aluminum oxide ceramic vermicelli layer, side protection plates are fixedly connected to the two sides of the base plate, protruding points are fixedly connected to the four corners of the top of the base plate, a carbon atom layer is arranged in the composite graphite layer, and a heat conduction paste layer is arranged at the bottom of the carbon atom layer. A silver powder layer is arranged at the bottom of the heat conduction paste layer and used in cooperation with the heat conduction paste layer. The bipolar plate provided by the utility model changes the phenomenon that heat conduction is carried out through a coating component traditionally, and adopts various heat conduction layers to carry out conduction treatment, so that the phenomenon that the conduction efficiency is not high does not occur, and the use quality of the bipolar plate is not influenced.

Description

TECHNICAL FIELD

[0001] The utility model relates to bipolar plate technical field, concretely is a kind of bipolar plate of high heat conduction. BACKGROUND

[0002] According to the patent disclosed by Chinese patent network, the patent name is: a bipolar plate, and the patent application number is: 202420333883.7, including anode plate and cathode plate, the opposite face and the face away from the anode plate and the cathode plate are each provided with flow channel assembly, for improving output performance;The opposite face and the face away from the anode plate and cathode plate are each provided with coating assembly, for improving electronic conductivity and increasing heat conduction efficiency;The flow channel assembly includes inlet, distribution groove, multiple groups of flow channel groove, collection groove and outlet;The inlet is arranged on the surface of the anode plate one side, the inlet is communicated with the distribution groove, the distribution groove is respectively communicated with multiple groups of flow channel groove, and the other end of multiple groups of flow channel groove is communicated with the collection groove, and the collection groove is communicated with the outlet;The utility model has the advantages of improving output performance, improving electronic conductivity and increasing heat conduction efficiency;And the bipolar plate in the above is all conducted by coating assembly when conducting heat, and the conduction is too slow and low speed only by coating assembly, and the conduction efficiency is not high, which affects its use quality.

[0003] Therefore, the bipolar plate needs to be designed and reformed to effectively prevent the phenomenon that the heat conduction is too low. UTILITY MODEL CONTENT

[0004] To solve the problems in the above background art, the utility model aims to provide a bipolar plate with high heat conduction, which has the advantage of increasing heat conduction and solves the problem of low heat conduction.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a bipolar plate with high heat conduction, comprising a substrate, a composite graphite layer fixedly connected to the top of the substrate, a copper sheet layer fixedly connected to the top of the composite graphite layer, an aluminum sheet layer fixedly connected to the top of the copper sheet layer, an aluminum oxide ceramic powder strip layer fixedly connected to the top of the aluminum sheet layer, an aluminum nitride layer fixedly connected to the top of the aluminum oxide ceramic powder strip layer, side guards fixedly connected to both sides of the substrate, and protruding points fixedly connected to the four corners of the top of the substrate.

[0006] As preferred in the utility model, the inside of the composite graphite layer is provided with a carbon atom layer, and the bottom of the carbon atom layer is provided with a heat-conducting paste layer.

[0007] As preferred in the utility model, the bottom of the heat-conducting paste layer is provided with a silver powder layer, and the silver powder layer is used in cooperation with the heat-conducting paste layer.

[0008] The diamond powder layer is used in cooperation with the aluminum nitride layer.

[0009] The diamond powder layer is used in cooperation with the aluminum nitride layer.

[0010] The diamond powder layer is used in cooperation with the aluminum nitride layer.

[0011] Compared with the prior art, the utility model has the advantages that:

[0012] 1、 the utility model discloses bipolar plate changed the traditional phenomenon through coating component heat conduction, adopted multiple heat conduction layer and conducted handling, just will not appear the phenomenon of low conduction efficiency, also will not influence its use quality.

[0013] 2、 the utility model discloses through the setting of carbon atom layer and heat conduction paste layer, can significantly improve the heat conduction performance of material, makes heat can faster, more evenly transmit.

[0014] 3、 the utility model discloses through the setting of silver powder layer, can protect the substrate from corrosion, increases its service life.

[0015] 4、 the utility model discloses through the setting of diamond powder layer, can significantly improve the hardness of bipolar plate, increases its use quality.

[0016] 5、 the utility model discloses through the setting of silicon carbide layer, can have very strong anti -radiation performance, can protect internal component from radiation damage.

[0017] 6、 the utility model discloses through the setting of gallium nitride layer, can cooperate diamond powder layer and silicon carbide layer together and carry out the heat conduction processing of increasing, increases the matching of use. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is the structure schematic drawing of the utility model;

[0019] Figure 2 It is the sectional view of the composite graphite layer of the utility model;

[0020] Figure 3 It is the sectional view of the aluminum nitride layer of the utility model;

[0021] Figure 4 It is the partial structure explosion drawing of the utility model.

[0022] In the figure: 1. Substrate; 2. Composite graphite layer; 3. Copper sheet layer; 4. Aluminum sheet layer; 5. Alumina ceramic powder layer; 6. Aluminum nitride layer; 7. Side plate; 8. Protrusion; 9. Carbon atom layer; 10. Thermal paste layer; 11. Silver powder layer; 12. Diamond powder layer; 13. Silicon carbide layer; 14. Gallium nitride layer. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] like Figures 1 to 4 As shown, the present invention provides a bipolar plate with high heat conduction, comprising a substrate 1, a composite graphite layer 2 fixedly connected to the top of the substrate 1, a copper sheet layer 3 fixedly connected to the top of the composite graphite layer 2, an aluminum sheet layer 4 fixedly connected to the top of the copper sheet layer 3, an alumina ceramic powder layer 5 fixedly connected to the top of the aluminum sheet layer 4, an aluminum nitride layer 6 fixedly connected to the top of the alumina ceramic powder layer 5, side guard plates 7 fixedly connected to both sides of the substrate 1, and protrusions 8 fixedly connected to the four corners of the top of the substrate 1.

[0025] refer to Figure 2 The composite graphite layer 2 has a carbon atom layer 9 inside, and a thermal conductive paste layer 10 is disposed at the bottom of the carbon atom layer 9.

[0026] As a technical optimization of this utility model, the setting of carbon atom layer 9 and thermal conductive paste layer 10 can significantly improve the thermal conductivity of the material, so that heat can be transferred faster and more evenly.

[0027] refer to Figure 2 A silver powder layer 11 is provided at the bottom of the thermal paste layer 10, and the silver powder layer 11 is used in conjunction with the thermal paste layer 10.

[0028] As a technical optimization of this utility model, the silver powder layer 11 can protect the substrate from corrosion and increase its service life.

[0029] refer to Figure 3 The aluminum nitride layer 6 has a diamond powder layer 12 inside, which is used in conjunction with the aluminum nitride layer 6.

[0030] As a technical optimization of this utility model, the diamond powder layer 12 can significantly improve the hardness of the bipolar plate and enhance its quality of use.

[0031] refer toFigure 3 The bottom of the diamond powder layer 12 is provided with a silicon carbide layer 13, and the silicon carbide layer 13 is used in cooperation with the diamond powder layer 12.

[0032] As a technical optimization scheme of the utility model, through the setting of the silicon carbide layer 13, very strong anti-radiation performance can be achieved, and internal components can be protected from radiation damage.

[0033] Reference Figure 3 The bottom of the silicon carbide layer 13 is provided with a gallium nitride layer 14, and the gallium nitride layer 14 is used in cooperation with the silicon carbide layer 13.

[0034] As a technical optimization scheme of the utility model, through the setting of the gallium nitride layer 14, the diamond powder layer 12 and the silicon carbide layer 13 can be used together to increase heat conduction treatment, and the matching property of use is increased.

[0035] The working principle and use process of the utility model are as follows: firstly, the carbon atom layer 9, the heat-conducting paste layer 10 and the silver powder layer 11 inside the composite graphite layer 2 are used for heat conduction treatment, then heat is transmitted to the copper sheet layer 3 and the aluminum sheet layer 4 for re-conduction, then the aluminum oxide ceramic powder strip layer 5 and the aluminum nitride layer 6 are used for re-conduction, the aluminum nitride layer 6 is used for re-heat conduction of the diamond powder layer 12, the silicon carbide layer 13 and the gallium nitride layer 14 inside, so that the effect of increasing heat conduction can be achieved.

[0036] In summary: the high-heat-conducting bipolar plate changes the phenomenon of heat conduction through the coating assembly in the traditional way, and uses multiple heat-conducting layers for conduction treatment, so that the phenomenon of low conduction efficiency does not occur, and the use quality is not affected.

[0037] It should be noted that, in this text, relational terms such as first and second are used merely to distinguish one entity or action from another, without necessarily requiring or implying any such actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof are intended to cover non-exclusive inclusions, so that a process, method, article, or device that includes a list of elements not only includes those elements, but also includes other elements not explicitly listed, or inherent to such a process, method, article, or device.

[0038] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A bipolar plate having a high heat conduction, comprising a substrate (1), characterized in that: The top of the substrate (1) is fixedly connected with a composite graphite layer (2), the top of the composite graphite layer (2) is fixedly connected with a copper sheet layer (3), the top of the copper sheet layer (3) is fixedly connected with an aluminum sheet layer (4), the top of the aluminum sheet layer (4) is fixedly connected with an alumina ceramic powder strip layer (5), the top of the alumina ceramic powder strip layer (5) is fixedly connected with an aluminum nitride layer (6), both sides of the substrate (1) are fixedly connected with side guard plates (7), and the top of the substrate (1) is fixedly connected with convex points (8) at four corners.

2. A bipolar plate according to claim 1, characterized in that: The inside of the composite graphite layer (2) is provided with a carbon atom layer (9), and the bottom of the carbon atom layer (9) is provided with a heat-conducting paste layer (10).

3. A bipolar plate according to claim 2, characterized in that: The bottom of the heat-conducting paste layer (10) is provided with a silver powder layer (11), and the silver powder layer (11) is used in cooperation with the heat-conducting paste layer (10).

4. The bipolar plate of claim 1, wherein: The inside of the aluminum nitride layer (6) is provided with a diamond powder layer (12), and the diamond powder layer (12) is used in cooperation with the aluminum nitride layer (6).

5. A bipolar plate according to claim 4, characterized in that: The bottom of the diamond powder layer (12) is provided with a silicon carbide layer (13), and the silicon carbide layer (13) is used in cooperation with the diamond powder layer (12).

6. A bipolar plate according to claim 5, characterized in that: The bottom of the silicon carbide layer (13) is provided with a gallium nitride layer (14), and the gallium nitride layer (14) is used in cooperation with the silicon carbide layer (13).

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