Heat dissipation structure and electronic product
By setting a heat dissipation structure between the heat source component and the mounting component, and using the mounting groove to fix the position of the heat-conducting component, the problem of controlling the distance between the heat source component and the heat sink is solved, which improves heat dissipation efficiency, protects the heat source component, and reduces manufacturing costs.
Patent Information
- Application Number
- CN202423323374.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-12-23
- Estimated Expiration
- 2034-12-31
AI Technical Summary
In existing technologies, the distance between heat source components and heat sinks is difficult to control, resulting in poor heat dissipation or damage to heat source components, which affects the performance and lifespan of electronic products.
The heat dissipation structure includes a heat sink, a first heat-conducting component, and a second heat-conducting component. The first heat-conducting component is connected to one of the heat source component and the mounting component through a mounting groove, and the second heat-conducting component is connected to the other one. This ensures that the spacing is controllable, avoids gaps and damage, and improves heat conduction efficiency.
It achieves controllable spacing between heat source components and mounting components, improving heat dissipation and service life, while reducing manufacturing difficulty and cost.
Smart Images
Figure CN223714447U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to electronic product technical field, more specifically, relate to a heat dissipation structure and electronic product. BACKGROUND
[0002] Electronic product usually is equipped with mounting piece, heat source piece, heat conduction pad and radiator, the radiator is through heat conduction pad and heat source piece is in order to heat source piece is carried out heat dissipation, and mounting piece is used to install heat source piece and radiator, in the related art, the interval of heat source piece and radiator is difficult to control, and the interval is too big and easily leads to the heat dissipation effect of radiator to heat source piece is poor, and the interval is too small and easily leads to radiator to break heat source piece, make the heat dissipation effect and service life of heat source piece are difficult to guarantee. SUMMARY
[0003] The utility model discloses at least one of the technical problems in the prior art is solved, for this, the utility model discloses one purpose is in heat dissipation structure, the interval of heat source piece and radiator is controllable in the heat dissipation structure, and it is favorable to improve the heat dissipation effect and service life of heat source piece.
[0004] Another purpose of the utility model is to propose an electronic product with the heat dissipation structure.
[0005] According to the heat dissipation structure of the utility model embodiment, be located between heat source piece and mounting piece, the heat dissipation structure includes: radiator, the radiator has opposite first side wall and second side wall, the first side wall is towards one of heat source piece and mounting piece, the second side wall is towards the other of heat source piece and mounting piece, the first side wall is equipped with installation groove and is suitable for with one of heat source piece and mounting piece is in, first heat conduction piece, first heat conduction piece is located in the installation groove, and first heat conduction piece is connected between one of heat source piece and mounting piece and the first side wall with heat conduction, second heat conduction piece, second heat conduction piece is connected between the other of heat source piece and mounting piece and the second side wall with heat conduction.
[0006] According to the heat dissipation structure of the utility model embodiment, by first heat conduction piece is installed in the installation groove and makes one of heat source piece and mounting piece and the first side wall, the installation space of first heat conduction piece and second heat conduction piece is controllable, and neither is easy to produce gap between radiator and heat source piece, nor is easy to lead to heat source piece to be broken, which is favorable to improve the heat dissipation effect and service life of heat source piece.
[0007] In addition, the heat dissipation structure according to the above embodiment of the utility model can also have the following additional technical features:
[0008] According to some embodiments of the present application, the first heat-conducting member is compressively deformable, the original thickness of the first heat-conducting member is a, the minimum thickness of the first heat-conducting member after compression is b, the depth of the mounting groove is c, and b≤c≤a.
[0009] According to some embodiments of the present application, the first heat-conducting member is compressively deformable, the original thickness of the first heat-conducting member is a, the original width of the first heat-conducting member perpendicular to the thickness direction is d, the size e of the mounting groove perpendicular to the depth direction, and 0.6a≤(e-d) / 2≤0.8a.
[0010] According to some embodiments of the present application, the heat sink comprises a plurality of rib plates arranged at intervals, the rib plates are connected between the first side wall and the second side wall, and the arrangement direction of the plurality of rib plates is perpendicular to the arrangement direction of the first side wall and the second side wall.
[0011] According to some embodiments of the present application, at least one of the rib plates extends obliquely relative to the first side wall and / or the second side wall.
[0012] According to some embodiments of the present application, the angle between at least one of the rib plates and the first side wall and / or the second side wall is γ, and 30°≤γ≤75°.
[0013] According to some embodiments of the present application, the second side wall is provided with a positioning portion, the second heat-conducting member is provided with a positioning matching portion matched with the positioning portion, and the positioning portion and the positioning matching portion are matched to position the second heat-conducting member.
[0014] The electronic product according to the embodiments of the present application comprises a heat source member, a mounting member, and the heat dissipation structure according to the embodiments of the present application, and the heat dissipation structure is arranged between the heat source member and the mounting member.
[0015] According to some embodiments of the present application, the first side wall is provided with a first mounting hole, one of the mounting member and the heat source member is provided with a second mounting hole, a first fastener is arranged in the first mounting hole and the second mounting hole, so that one of the mounting member and the heat source member abuts against the first side wall.
[0016] According to some embodiments of the present application, the second side wall is provided with a avoiding hole opposite to the first mounting hole, the aperture of the avoiding hole is larger than the maximum size of the first fastener, and the first fastener is adapted to pass through the avoiding hole to be arranged in the first mounting hole and the second mounting hole.
[0017] Additional aspects and advantages of the present application will be given in part in the following description, and will become apparent from the following description, or will be learned by practice of the present application. Attached Figure Description
[0018] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:
[0019] Figure 1 This is a schematic diagram of the structure of an electronic product according to an embodiment of the present utility model;
[0020] Figure 2 yes Figure 1 The center circle shows a magnified view of a portion of point A;
[0021] Figure 3 This is a structural schematic diagram of a heat sink according to an embodiment of the present utility model, wherein clearance holes are shown;
[0022] Figure 4 This is a schematic diagram of the structure of a heat sink according to an embodiment of the present utility model, wherein a first mounting hole is shown;
[0023] Figure 5 Top view of the radiator according to an embodiment of the present utility model;
[0024] Figure 6 yes Figure 5 A cross-sectional view along the direction indicated by line BB;
[0025] Figure 7 This is a side view of a heat sink according to an embodiment of the present utility model;
[0026] Figure 8 yes Figure 7 A cross-sectional view along the direction indicated by line CC.
[0027] Figure label:
[0028] 1000 electronic products;
[0029] Heat source component 200; PCB board 210; Heat source device 220;
[0030] Mounting component 300; Fin 320;
[0031] First fastener 410; Second fastener 420;
[0032] Heat dissipation structure 100;
[0033] Radiator 10; First sidewall 11; Mounting slot 111; First mounting hole 112; Second sidewall 12; Clearance hole 121; Rib 13;
[0034] First heat-conducting component 20; second heat-conducting component 30. Detailed Implementation
[0035] The embodiments of the present application are described below in detail, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary only, and are used only for explaining the present application, and cannot be understood as a limitation of the present application.
[0036] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "transverse", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "horizontal", "inner", "outer" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.
[0037] In the description of the present application, "first feature" and "second feature" can include one or more features, and "multiple" means two or more, and "above" or "below" of the first feature to the second feature can include direct contact of the first and second features, or can include indirect contact of the first and second features through another feature therebetween, and "above", "over" and "on" of the first feature to the second feature include directly above and obliquely above of the first feature to the second feature, or only indicate that the first feature is higher than the second feature in horizontal height.
[0038] The electronic product 1000 according to the embodiments of the present application is described below with reference to the drawings, which comprises a heat source member 200, a mounting member 300 and a heat dissipation structure 100 according to the embodiments of the present application.
[0039] The heat source member 200 generates a large amount of heat during operation, and if the heat cannot be dissipated in time, the temperature of the heat source member 200 will be too high, which will affect the performance and service life of the electronic product 1000, so the heat source member 200 needs to be cooled to protect the heat source member 200 and improve the performance and service life of the electronic product 1000.
[0040] The heat dissipation structure 100 is arranged between the heat source member 200 and the mounting member 300, so that the heat source member 200 can transfer heat to the heat dissipation structure 100, so as to cool the heat source member 200 through the heat dissipation structure 100. The mounting member 300 is used to mount the heat source member 200 and the heat dissipation structure 100, and the heat transferred by the heat source member 200 to the heat dissipation structure 100 can be transferred to the mounting member 300 through the heat dissipation structure 100, so as to be further cooled through the mounting member 300, and the heat dissipation effect of the heat source member 200 is better.
[0041] For example, in some embodiments, as Figure 1As shown, the electronic product 1000 is an edge computing box, the heat source member 200 includes a PCB board 210 and a heat source device 220 such as an electronic component arranged on the PCB board 210, the mounting member 300 is a shell, the heat source member 200 and the heat dissipation structure 100 are arranged in the shell, and the heat dissipation structure 100 is arranged between the heat source member 200 and one inner surface of the shell. Figure 1 The mounting member 300 is provided with a plurality of fins 320 (part of the fins 320 are marked), the fins 320 are in communication with external air, so that the mounting member 300 can quickly exchange heat with the external environment, so as to transfer the heat of the heat source member 200 to the mounting member 300 through the heat dissipation structure 100 and then exchange heat with the external environment, thereby achieving rapid heat dissipation of the heat source member 200, the mounting member 300 has the functions of mounting and heat dissipation, the risk of burning the heat source member 200 is reduced, and the service life of the electronic product 1000 is prolonged.
[0042] In some embodiments, the electronic product 1000 includes a fan, and the fan is used to blow air to the space between adjacent fins 320 to improve the heat dissipation effect of the mounting member 300, thereby improving the heat dissipation effect of the heat source member 200.
[0043] The heat dissipation structure 100 according to the embodiments of the present application will be described below with reference to the accompanying drawings.
[0044] Referring to Figures 1-8 As shown, the heat dissipation structure 100 according to the embodiments of the present application includes a heat radiator 10, a first heat conduction member 20 and a second heat conduction member 30.
[0045] Specifically, the heat radiator 10 has a first side wall 11 and a second side wall 12 opposite to each other, the first side wall 11 faces one of the heat source member 200 and the mounting member 300, and the second side wall 12 faces the other of the heat source member 200 and the mounting member 300, so that the heat radiator 10 is arranged between the heat source member 200 and the mounting member 300, so as to dissipate heat of the heat source member 200 and facilitate mounting of the heat source member 200 and the heat radiator 10 on the mounting member 300.
[0046] The first side wall 11 is provided with a mounting groove 111 and can abut against one of the heat source member 200 and the mounting member 300, the first heat conduction member 20 is located in the mounting groove 111, the first heat conduction member 20 is in thermal conduction connection between one of the heat source member 200 and the mounting member 300 and the first side wall 11, and the second heat conduction member 30 is in thermal conduction connection between the other of the heat source member 200 and the mounting member 300 and the second side wall 12.
[0047] The surfaces of the heat sink 10, the heat source member 200 and the mounting member 300 are usually slightly uneven or have gaps, which limits the heat conduction efficiency when any two of them are in direct contact. In the present application, the first heat-conducting member 20 or the second heat-conducting member 30 is installed between the heat sink 10 and the heat source member 200 and between the heat sink 10 and the mounting member 300, which can fill the gaps between the heat sink 10 and the heat source member 200 and between the heat sink 10 and the mounting member 300, improve the heat conduction efficiency between the heat sink 10 and the heat source member 200 and between the heat sink 10 and the mounting member 300, and improve the heat dissipation effect of the heat dissipation frame.
[0048] The first heat-conducting member 20 and the second heat-conducting member 30 not only can fill the gaps, but also have good heat conduction performance, which can further improve the heat conduction efficiency between the heat sink 10 and the heat source member 200 and between the heat sink 10 and the mounting member 300, and improve the heat dissipation effect of the heat source member 200.
[0049] The material of the first heat-conducting member 20 and the second heat-conducting member 30 can include silica gel and heat-conducting fillers, etc., so that the heat-conducting member has good heat conduction capacity to facilitate heat conduction. For example, in some embodiments, as shown in FIG. 1, the first heat-conducting member 20 and the second heat-conducting member 30 are heat-conducting pads, which can form a good heat conduction path between the heat sink 10 and the heat source member 200 and between the heat sink 10 and the mounting member 300 and fill the gaps, and have high heat conduction efficiency. Figures 1-2
[0050] In some related technologies, the heat sink is installed between the heat source member and the mounting member, one side of the heat sink is in contact with the mounting member through the first heat-conducting member and the other side is in contact with the heat source member through the second heat-conducting member, and the heat sink, the first heat-conducting member and the mounting member are connected by bolts. The first heat-conducting member and the second heat-conducting member are deformable, which makes it difficult to control the pre-tightening force of the bolts. For example, if the bolts are tightened too tightly, the compression amount of the first heat-conducting member will be too large and the installation space will be too small, which will cause the installation space of the second heat-conducting member to be too large, and gaps are likely to be generated between the heat source member, the second heat-conducting member and the heat sink, resulting in low heat conduction efficiency. If the bolts are tightened too loosely, the compression amount of the first heat-conducting member will be too small and the installation space will be too large, which will cause the installation space of the second heat-conducting member to be too small, and the compression force between the heat sink and the heat source member will be too large, which is likely to damage the heat source member.
[0051] In the application, the first heat-conducting member 20 is arranged in the mounting groove 111, the first side wall 11 provided with the mounting groove 111 is in abutment with one of the heat source member 200 and the mounting member 300, the mounting space of the first heat-conducting member 20, i.e. the mounting groove 111, is achieved by the fixed connection of one of the heat source member 200 and the mounting member 300 with the heat sink 10. The distance between one of the heat source member 200 and the mounting member 300 and the first side wall 11 is controllable by the mounting groove 111, so that the distance is not too large to cause a gap between one of the heat source member 200 and the mounting member 300 and the first side wall 11, and the heat-conducting efficiency is high; and the distance is not too small to cause one of the heat source member 200 and the mounting member 300 to be damaged by the first heat-conducting member 20, which is beneficial to the protection of one of the heat source member 200 and the mounting member 300.
[0052] For example, in the embodiment in which the first side wall 11, the first heat-conducting member 20 and the mounting member 300 are connected by bolts, when the mounting member 300 is in abutment with the part of the first side wall 11 which is not provided with the mounting groove 111 during the process of screwing the bolts, it can be determined that the bolts are screwed in place, and the problem that the mounting space of the first heat-conducting member 20 changes due to the bolts being screwed too tightly or too loosely is less likely to occur, the pre-tightening force of the bolts is more controllable, the installation is facilitated, and the assembly difficulty of the mounting member 300 with the heat sink 10 is reduced while the mounting space of the first heat-conducting member 20 is fixed.
[0053] After the mounting space of the first heat-conducting member 20 is fixed, the distance between the other one of the heat source member 200 and the mounting member 300 and the second side wall 12 can be fixed to arrange the second heat-conducting member 30, so that the mounting space of the second heat-conducting member 30 is less likely to be affected by the first heat-conducting member 20, i.e. the mounting space of the second heat-conducting member 30 is also fixed. Therefore, the distance between the other one of the heat source member 200 and the mounting member 300 and the second side wall 12 is controllable, for example, the distance can be flexibly set according to the size of the second heat-conducting member 30, so that the distance is not too large to cause a gap between the other one of the heat source member 200 and the mounting member 300 and the second side wall 12, and the heat-conducting efficiency is high; and the distance is not too small to cause the other one of the heat source member 200 and the mounting member 300 to be damaged by the second heat-conducting member 30, which is beneficial to the protection of the other one of the heat source member 200 and the mounting member 300.
[0054] For example, in some specific embodiments, as Figures 1-4As shown, the first side wall 11 faces the mounting member 300, the second side wall 12 faces the heat source member 200, the first heat conduction member 20 is arranged in the mounting groove 111 of the first side wall 11, the heat sink 10 is connected with the mounting member 300 through the first heat conduction member 20 at the mounting groove 111, and the part of the first side wall 11 without the mounting groove 111 abuts against the heat sink 10, so that the fixed connection of the heat sink 10 and the mounting member 300 is realized to fix the mounting space of the first heat conduction member 20. After the fixed connection of the heat sink 10 and the mounting member 300, the distance between the heat sink 10 and the heat source member 200 is controllable, for example, the distance between the heat sink 10 and the heat source member 200 is adjusted, so that the heat sink 10, the second heat conduction member 30 and the heat source member 200 abut against each other without damaging the heat source member 200, which is beneficial to improve the heat conduction efficiency while protecting the heat source member 200.
[0055] It should be noted that in the present application, the first heat conduction member 20 can be deformable or non-deformable, and the second heat conduction member 30 can be deformable or non-deformable, which can make the mounting space of the first heat conduction member 20 and the second heat conduction member 30 controllable, and can dissipate heat from the heat source member 200 without easily damaging the other one of the heat source member 200 and the mounting member 300.
[0056] In addition, in the present application, the heat sink 10 and the mounting member 300 are separate members, and one of the heat sink 10 and the mounting member 300 can be manufactured first in the manufacturing process, and then the other one is manufactured, and then the heat sink 10 and the mounting member 300 are connected. Compared with the related art that the heat sink and the mounting member are integrated, the manufacturing difficulty of the heat sink 10 and the mounting member 300 in the present application is low, which is beneficial to reduce the manufacturing cost and facilitate popularization and use.
[0057] According to the heat dissipation structure 100 of the embodiment of the present application, by arranging the first heat conduction member 20 in the mounting groove 111 and abutting one of the heat source member 200 and the mounting member 300 against the first side wall 11, the mounting space of the first heat conduction member 20 and the second heat conduction member 30 is controllable, and neither gap nor damage to the heat source member 200 is easily caused between the heat sink 10 and the heat source member 200 and between the heat sink 10 and the mounting member 300, which is beneficial to improve the heat dissipation effect and service life of the heat source member 200.
[0058] For the convenience of understanding, the first side wall 11 faces the mounting member 300, and the second side wall 12 faces the heat source member 200, and the embodiment that the first side wall 11 faces the heat source member 200 and the second side wall 12 faces the mounting member 300 can also be obtained.
[0059] Since the heat dissipation structure 100 has the beneficial technical effects described above, the electronic product 1000 according to the embodiment of the present application has the following advantages: the installation space of the first heat conduction member 20 and the second heat conduction member 30 is controllable by installing the first heat conduction member 20 in the installation groove 111 and making one of the heat source member 200 and the mounting member 300 abut against the first side wall 11, neither gap between the heat dissipation device 10 and the heat source member 200 nor gap between the heat dissipation device 10 and the mounting member 300 is easy to cause, and the heat source member 200 is not easy to be damaged, which is beneficial to improve the heat dissipation effect and service life of the heat source member 200.
[0060] In some embodiments of the present application, as shown in Figures 1-2 The first heat conduction member 20 can be compressed and deformed, the original thickness of the first heat conduction member 20 is a, the minimum thickness of the first heat conduction member 20 after compression is b, the depth of the installation groove 111 is c, and b≤c≤a. Among them, the original thickness of the first heat conduction member 20 refers to the thickness of the first heat conduction member 20 in the state of not being deformed. If c is too large, a gap is easy to be generated between the first side wall 11, the first heat conduction member 20 and the mounting member 300, which affects the heat conduction efficiency; if c is too small, the thickness of the first heat conduction member 20 exceeds the installation space of the installation groove 111 and the first heat conduction member 20 cannot be installed in the installation groove 111. The present application makes b≤c≤a, which can improve the heat conduction efficiency of the first heat conduction member 20 and facilitate the installation of the first heat conduction member 20 at the installation groove 111. For example, b=0.8a, c=0.8a, 0.9a or a, etc.
[0061] For the convenience of understanding, Figure 2 The first heat conduction member 20 is in the state of not being deformed, and the first heat conduction member 20 is in the state of being compressed and deformed after the first heat conduction member 20 is actually installed in the installation groove 111.
[0062] In some embodiments of the present application, as shown in Figures 1-2 And Figures 5-7 The first heat conduction member 20 can be compressed and deformed, the original thickness of the first heat conduction member 20 is a, the original width of the first heat conduction member 20 perpendicular to the thickness direction is d, the size e of the installation groove 111 perpendicular to the depth direction is 0.6a≤(e-d) / 2≤0.8a, that is, as shown in Figure 2As shown, the distance between the side wall of the mounting groove 111 and the edge of the first heat conduction member 20 is f, f=(e-d) / 2, 0.6a≤f≤0.8a. If f is too large, a large gap between the first side wall 11 and the mounting member 300 is easily caused, which affects the heat conduction efficiency. If f is too small, the compressed transverse edge of the first heat conduction member 20 is easily interfered with the side wall of the mounting groove 111, so that the first heat conduction member 20 is difficult to be mounted in the mounting groove 111. In the present application, 0.6a≤f≤0.8a, which can improve the heat conduction efficiency of the first heat conduction member 20 and facilitate the installation of the first heat conduction member 20 in the mounting groove 111. For example, f is 0.6a, 0.7a or 0.8a, etc.
[0063] In some embodiments of the present application, as shown in Figure 1 、 Figures 3-4 and Figures 6-7 , the heat sink 10 includes a plurality of spaced apart rib plates 13, the rib plates 13 are connected between the first side wall 11 and the second side wall 12, and the arrangement direction of the plurality of rib plates 13 is perpendicular to the arrangement direction of the first side wall 11 and the second side wall 12. The first side wall 11, the second side wall 12 and the adjacent two rib plates 13 define a cavity, and a plurality of cavities can be formed through the first side wall 11, the second side wall 12 and the plurality of rib plates 13, so as to transmit the heat of the heat source member 200 to the cavities of the heat sink 10, which is beneficial to improve the heat dissipation effect of the heat sink 10 on the heat source member 200.
[0064] In some embodiments, as shown in Figure 1 、 Figures 3-4 and Figures 6-8 , at least one rib plate 13 extends obliquely relative to at least one of the first side wall 11 and the second side wall 12. Among the plurality of rib plates 13 with the same thickness, the thickness of the rib plate 13 is g, and the cross-sectional thickness of the obliquely extending rib plate 13 is h at the extension plane parallel to at least one of the first side wall 11 and the second side wall 12, so that h is greater than g. The heat transmitted through the oblique rib plate 13 between the first side wall 11 and the second side wall 12 is more, and the second side wall 12 is connected with the heat source member 200 through the heat conduction member, which is beneficial to improve the heat dissipation effect on the heat source member 200.
[0065] For example, in some embodiments, as shown in Figure 1 and Figures 7-8 , the rib plates 13 at the left and right ends of the heat sink 10 extend obliquely relative to the first side wall 11 and the second side wall 12, the first side wall 11, the second side wall 12 and the heat source member 200 extend along a horizontal plane perpendicular to the up-down direction, and the cross-sectional thickness h of each of the rib plates 13 along the horizontal plane is greater than the thickness g of the rib plate 13, so that the heat source member 200 can transmit more heat to the heat sink 10, and the heat dissipation effect on the heat source member 200 is better. For example, g is 2mm, and h is 2.112mm.
[0066] In some embodiments, as shown in Figure 7 The angle between the at least one rib plate 13 and at least one of the first side wall 11 and the second side wall 12 is γ, 30°≤γ≤75°. If γ is too large, the cross-sectional size of the obliquely extending rib plate 13 is too small, and the heat dissipation effect is poor. If γ is too small, the distance between the first side wall 11 and the second side wall 12 is reduced, and the size of the heat sink 10 in the up-down direction is reduced, and the heat dissipation effect is poor. The present application sets 30°≤γ≤75°, which is beneficial to improve the heat dissipation effect of the heat sink 10 on the heat source member 200. For example, γ is 30°, 60°, or 75°, etc. Figure 7 The angle between the at least one rib plate 13 and at least one of the first side wall 11 and the second side wall 12 is γ, 30°≤γ≤75°. If γ is too large, the cross-sectional size of the obliquely extending rib plate 13 is too small, and the heat dissipation effect is poor. If γ is too small, the distance between the first side wall 11 and the second side wall 12 is reduced, and the size of the heat sink 10 in the up-down direction is reduced, and the heat dissipation effect is poor. The present application sets 30°≤γ≤75°, which is beneficial to improve the heat dissipation effect of the heat sink 10 on the heat source member 200. For example, γ is 30°, 60°, or 75°, etc.
[0067] For example, in some specific embodiments, as shown in Figure 7 The first side wall 11 and the second side wall 12 are parallel, the rib plate 13 at the left end of the heat sink 10 forms an acute angle γ with the second side wall 12, and the rib plate 13 at the right end of the heat sink 10 forms an acute angle γ with the second side wall 12.
[0068] In some embodiments of the present application, the second side wall 12 is provided with a positioning portion, and the second heat conduction member 30 is provided with a positioning matching portion matched with the positioning portion. The positioning portion and the positioning matching portion are matched to position the second heat conduction member 30. The positioning portion can be a protrusion or a groove, etc., and the positioning matching portion can be a groove or a protrusion matched with the positioning portion, etc. Through the positioning of the second heat conduction member 30 by the positioning portion and the positioning matching portion, the risk of the second heat conduction member 30 sliding out of the heat sink 10 and the heat source member 200 can be reduced, for example Figure 1 The second heat conduction member 30 falls out from the left side or the right side, and the reliability of the second heat conduction member 30 in conducting heat from the heat source member 200 and the heat sink 10 can be improved.
[0069] In some embodiments of the present application, as shown in Figure 1 and Figures 4-6 The first side wall 11 is provided with a first mounting hole 112, the mounting member 300 is provided with a second mounting hole, and the first fastener 410 is arranged in the first mounting hole 112 and the second mounting hole to abut the mounting member 300 with the first side wall 11. The first fastener 410 can be a bolt, a screw, or a rivet, etc. The first fastener 410 fixedly connects the mounting member 300 and the heat sink 10, and the part of the first side wall 11 without the mounting groove 111 abuts the mounting member 300, which can improve the mounting firmness of the heat sink 10 on the mounting member 300.
[0070] In some embodiments, as shown in Figure 1 and Figures 4-6As shown, the first mounting hole 112 can be arranged at the mounting groove 111 to fix the first heat-conducting member 20 at the position of the mounting groove 111 while fixing the mounting member 300 and the heat sink 10 by the first fastener 410, so as to reduce the possibility of the first heat-conducting member 20 moving laterally in the mounting groove 111 and affecting the heat-conducting efficiency, and facilitate improving the heat-conducting efficiency of the first heat-conducting member 20.
[0071] In some other embodiments, the first mounting hole 112 is arranged at the portion of the first side wall 11 which is not provided with the mounting groove 111, so as to directly connect the first side wall 11 and the mounting member 300, and make the portion of the first side wall 11 which is not provided with the mounting groove 111 not easy to move relative to the mounting member 300, so that the heat sink 10 is more firmly mounted on the mounting member 300.
[0072] In some embodiments, as shown in Figure 1 As shown, the PCB board 210 of the heat source member 200 is connected with the mounting member 300 by the second fastener 420, so as to firmly mount the heat source member 200 on the mounting member 300, and make the heat source member 200 not easy to shake during operation, so that the operation is more stable. The second fastener 420 can be a bolt, a screw or a rivet, etc.
[0073] In the embodiments in which the first side wall 11 and the second side wall 12 are arranged in the up-down direction, as shown in Figures 1-8 As shown, the first fastener 410 can be inserted into the heat sink 10 from the horizontal side of the heat sink 10 and then mounted in the first mounting hole 112, without the need to improve the heat sink 10, and the structure is simpler. The first fastener 410 can also be inserted into the heat sink 10 from the side of the heat sink 10 along the up-down direction and then directly mounted in the first mounting hole 112, and the operation is more convenient.
[0074] It should be noted that the description of the up-down-left-right directions in the present application is only based on the directions marked in the drawings, and is not a limitation on the actual use direction of the electronic product 1000.
[0075] In some embodiments, as shown in Figure 1 , Figure 3 and Figures 5-8 As shown, the second side wall 12 is provided with an avoiding hole 121 opposite to the first mounting hole 112, the hole diameter of the avoiding hole 121 is greater than the maximum size of the first fastener 410, and the first fastener 410 can pass through the avoiding hole 121 to be arranged in the first mounting hole 112 and the second mounting hole, so as to insert the first fastener 410 into the heat sink 10 from the side of the second side wall 12 which is away from the first side wall 11, and then directly mount the first fastener 410 in the first mounting hole 112, directly mount the first fastener 410 along the arrangement direction of the first side wall 11 and the second side wall 12, and the mounting operation of the first fastener 410 is more convenient, which facilitates improving the manufacturing efficiency of the electronic product 1000.
[0076] wherein the maximum dimension of the first fastener 410 is a maximum dimension of the first fastener 410 in a direction perpendicular to the direction in which the avoidance hole 121 is penetrated. For example, in an embodiment in which the first fastener 410 is a bolt, the diameter of the nut of the first fastener 410 is the maximum dimension of the first fastener 410.
[0077] Other configurations and operations of the heat dissipation structure 100 and the electronic product 1000 according to the embodiments of the present application are known to those skilled in the art, and thus will not be described in detail herein.
[0078] In the description of the present application, it should be noted that unless explicitly defined and limited, the terms "mounting", "connecting", "connection" should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0079] In the description of the present application, the description of the terms "embodiment", "specific embodiment", "example" and the like means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0080] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and purposes of the present application, and the scope of the present application is defined by the claims and their equivalents.
Claims
1. A heat dissipation structure, characterized in that, Located between the heat source component and the mounting component, the heat dissipation structure includes: A radiator having a first sidewall and a second sidewall facing away from each other, the first sidewall facing one of the heat source and the mounting member, and the second sidewall facing the other of the heat source and the mounting member, the first sidewall being provided with a mounting groove and adapted to abut against one of the heat source and the mounting member; A first heat-conducting element is located in the mounting groove and is thermally connected to one of the heat source element and the mounting element between the first sidewall. The second heat-conducting element is thermally connected between the heat source element and the other of the mounting elements and the second sidewall.
2. The heat dissipation structure according to claim 1, characterized in that, The first heat-conducting component is compressible and deformable. The original thickness of the first heat-conducting component is a, the minimum thickness of the first heat-conducting component after compression is b, and the depth of the mounting groove is c, where b≤c≤a.
3. The heat dissipation structure according to claim 1, characterized in that, The first heat-conducting element is compressible and deformable. The original thickness of the first heat-conducting element is a, the original width of the first heat-conducting element perpendicular to the thickness direction is d, and the dimension e of the mounting groove perpendicular to the depth direction is 0.6a≤(ed) / 2≤0.8a.
4. The heat dissipation structure according to claim 1, characterized in that, The radiator includes a plurality of spaced-apart ribs connected between the first sidewall and the second sidewall, and the arrangement direction of the plurality of ribs is perpendicular to the arrangement direction of the first sidewall and the second sidewall.
5. The heat dissipation structure according to claim 4, characterized in that, At least one of the ribs extends obliquely relative to the first sidewall and / or the second sidewall.
6. The heat dissipation structure according to claim 5, characterized in that, At least one of the ribs has an angle of γ with the first sidewall and / or the second sidewall, where 30°≤γ≤75°.
7. The heat dissipation structure according to claim 1, characterized in that, The second sidewall is provided with a positioning part, and the second heat-conducting component is provided with a positioning mating part that cooperates with the positioning part. The positioning part and the positioning mating part cooperate to position the second heat-conducting component.
8. An electronic product, characterized in that, It includes a heat source component, a mounting component, and a heat dissipation structure according to any one of claims 1-7, wherein the heat dissipation structure is disposed between the heat source component and the mounting component.
9. The electronic product according to claim 8, characterized in that, The first sidewall is provided with a first mounting hole, and one of the mounting component and the heat source component is provided with a second mounting hole. A first fastener passes through the first mounting hole and the second mounting hole so that one of the mounting component and the heat source component abuts against the first sidewall.
10. The electronic product according to claim 9, characterized in that, The second sidewall is provided with a clearance hole opposite to the first mounting hole. The diameter of the clearance hole is larger than the maximum size of the first fastener. The first fastener is adapted to pass through the clearance hole to be installed in both the first mounting hole and the second mounting hole.