Self-heat-dissipation structure in navigation controller of pushing AGV (Automatic Guided Vehicle)

By introducing a self-heating structure of semiconductor cooling chip and circulating fan into the AGV navigation controller, the problem of inefficient heat dissipation is solved, achieving rapid heat dissipation and drying, and improving the stability and service life of the controller.

CN223714463UActive Publication Date: 2025-12-23TIANJIN INJES TECH CO LTD
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Patent Information

Application Number
CN202520054590.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-01-10
Publication Date
2025-12-23
Estimated Expiration
2035-01-10

AI Technical Summary

Technical Problem

Existing AGV navigation controllers rely on their own cooling fans for heat dissipation, which leads to increased air temperature and ineffective heat dissipation, affecting the controller's lifespan and waterproofing.

Method used

It adopts a self-heating structure that combines a semiconductor cooling chip and a circulating fan. The cooling capacity is transferred through heat-conducting columns and heat-conducting plates, the circulating fan accelerates the airflow, and the desiccant plate keeps the interior dry, thus achieving rapid heat dissipation and cooling.

Benefits of technology

This technology enables rapid heat dissipation and cooling of the AGV navigation controller, improving its stability and waterproofness, and extending its service life.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the AGV technical field, and specifically relates to a pushing AGV navigation controller internal self-heat dissipation structure comprising a navigation controller body, heat dissipation installation grooves are arranged on two side surfaces of the navigation controller body, the heat dissipation installation grooves are symmetrically arranged, heat conduction jacks are arranged on the inner walls of the heat dissipation installation grooves in a penetrating manner, and the heat conduction jacks are inserted into the heat dissipation installation grooves. Heat conduction columns are inserted in inner cavities of the heat conduction insertion holes in a penetrating mode, the surfaces of one ends of the heat conduction columns are connected with outer heat conduction plates, the surfaces of the other ends of the heat conduction columns are connected with inner heat conduction plates, semiconductor chilling plates are installed on the surfaces of the outer heat conduction plates, circulating fans are installed on the surfaces of the inner heat conduction plates, and drying agent plates are movably arranged on the surfaces of the circulating fans. The semiconductor chilling plate is used for releasing cold energy, the cold energy is quickly released into the inner cavity of the navigation controller body, and the cold energy continuously circulates in the inner cavity of the navigation controller body, so that quick heat dissipation and cooling in the navigation controller body can be realized.
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Description

TECHNICAL FIELD

[0001] The utility model relates to AGV technical field, concretely is a kind of internal self-heat dissipation structure of pushing material AGV navigation controller. BACKGROUND

[0002] Inertial navigation is to install gyroscope on AGV, and install positioning block on the ground of driving area, AGV can determine its position and heading through the calculation of gyroscope deviation signal and the acquisition of ground positioning block signal, so as to realize guiding. There are many inertial navigation modules applied in AGV field, except for magnetic navigation AGV, all other AGVs need inertial navigation. There are few inertial navigation systems developed in this field, but with the continuous development of AGV field, the market of AGV inertial navigation and the companies that make AGV inertial navigation will also become more and more

[0003] The utility model discloses an AGV inertial navigation controller box, the shell is equipped with containing cavity, and the PCBA control panel is located in the containing cavity. A limiting column is arranged near each corner of the inner wall of the containing cavity, and a locking hole is arranged on each limiting column. One end of the limiting column is connected with the top of the shell. The four corners of the PCBA control panel are provided with mounting holes corresponding to the positions of the locking holes. When the PCBA control panel is located on the limiting column, the center of the locking hole and the corresponding mounting hole is on the same straight line. The PCBA control panel is fixed on the limiting column through the locking hole, so that the mounting surface of the PCBA control panel is lifted to half of the height of the box body. The suspension design ensures the stable output of the internal antenna signal of the product. The glue filling area is not easy to produce bubbles, and the glue filling is relatively uniform, which can make the electronic components generate heat for a long time. The service life of the overall product is prolonged. At the same time, the sealing ring can assist in waterproofing, moisture-proofing and high-low temperature-proofing, so that the controller box is suitable for different voltage environments and has high precision, so as to solve the problems that the existing AGV control box is directly connected with the control box through four locking screws, and then glue is filled, which is not conducive to the installation of the control panel by workers, and the positioning is not accurate during installation, and the waterproofness of the control box is poor.

[0004] The existing AGV navigation controller is internally cooled by the cooling fan on the AGV navigation controller. The cooling fan drives the air flow in the AGV navigation controller. During the flow process, the AGV navigation controller continuously releases heat, which causes the temperature of the air to rise until the temperature approaches the temperature of the controller. The air circulation cannot cool the controller. To solve the above problems, the present application proposes a kind of internal self-heat dissipation structure of pushing material AGV navigation controller. UTILITY MODEL CONTENTS

[0005] (I) Utility model purpose

[0006] To solve the technical problems in the background art, the utility model provides a push material AGV navigation controller internal self heat dissipation structure, the cold quantity that semiconductor refrigeration piece released is released to the navigation controller body inner chamber quickly, through the cold quantity in the navigation controller body inner chamber is circulated ceaselessly, can realize the quick heat dissipation cooling of navigation controller body inner, to solve the problem that the background art has proposed.

[0007] (II) Technical scheme

[0008] To solve the above technical problems, the utility model provides a push material AGV navigation controller internal self heat dissipation structure, including navigation controller body, navigation controller body both sides surface all are equipped with heat dissipation installation slot, heat dissipation installation slot is symmetrically arranged, the inner wall of heat dissipation installation slot all is equipped with heat conduction insertion hole, the inner chamber of heat conduction insertion hole all is inserted and is connected with heat conduction column, and heat conduction column one end surface is connected with outer heat conduction board, and heat conduction column other end surface is connected with inner heat conduction board, and outer heat conduction board surface is equipped with semiconductor refrigeration piece;

[0009] The inner heat conduction board surface is installed with a circulating fan;

[0010] The surface of the circulating fan is movably provided with a desiccant plate.

[0011] Preferably, the outer heat conduction board is located in the heat dissipation installation slot, and the surface of the outer heat conduction board is connected with the surface of the semiconductor refrigeration piece.

[0012] Preferably, the inner heat conduction board is located in the inner cavity of the navigation controller body, and the inner heat conduction board is a double-plate structure.

[0013] Preferably, the heating surface of the semiconductor refrigeration piece is provided with a heat dissipation fin, and the surface of the heat dissipation fin is provided with a heat dissipation fan, and the heat dissipation fan is symmetrically arranged.

[0014] Preferably, a drying box is installed on the surface of the inner heat conduction board, and the circulating fan is located between the inner heat conduction board and the drying box.

[0015] Preferably, one end of the drying box is provided with a plug-in port, and the desiccant plate is movably inserted into the inner cavity of the drying box through the plug-in port.

[0016] Preferably, a sealing ring is sleeved on the end surface of the desiccant plate, the outer wall of the sealing ring abuts against the inner wall surface of the plug-in port, and air holes are formed on the surfaces of the desiccant plate and the drying box.

[0017] The above technical scheme of the utility model has the following beneficial technical effects:

[0018] 1. The utility model, the cold end of semiconductor refrigeration piece passes through heat conduction silicone grease and transmits the cold quantity to the outer heat conduction board, the outer heat conduction board passes through the heat conduction column and transmits the cold quantity to the inner heat conduction board, the circulating fan can accelerate the air flow rate of the inner heat conduction board surface, thereby can make the cold quantity on the inner heat conduction board release to the navigation controller body inner chamber quickly, through the cold quantity in the navigation controller body inner chamber constantly circulates, can realize the quick heat dissipation cooling of the navigation controller body inner.

[0019] 2. The utility model, the circulating fan blows out the cold air and enters the dry box through the air hole and passes through the drier board, the drier board can absorb the moisture in the air through the inside drier powder to guarantee the dryness of the navigation controller body. DRAWINGS

[0020] Figure 1 It is the whole structure schematic diagram of the utility model a kind of push material AGV navigation controller internal self-heat dissipation structure;

[0021] Figure 2 It is the section structure schematic diagram of the utility model a kind of push material AGV navigation controller internal self-heat dissipation structure;

[0022] Figure 3 It is the heat dissipation structure schematic diagram of the utility model a kind of push material AGV navigation controller internal self-heat dissipation structure;

[0023] Figure 4 It is the navigation controller body structure schematic diagram of the utility model a kind of push material AGV navigation controller internal self-heat dissipation structure.

[0024] Reference signs:

[0025] 1, navigation controller body;2, heat dissipation mounting groove;3, heat conduction jack;4, heat conduction column;5, outer heat conduction board;6, semiconductor refrigeration piece;7, inner heat conduction board;8, circulating fan;9, heat dissipation fin;10, heat dissipation fan;11, dry box;12, plug-in interface;13, drier board;14, air hole;15, sealing ring. DETAILED DESCRIPTION

[0026] To make the purpose, technical scheme and advantage of the utility model more clear and obvious, below combining with specific embodiment and referring to drawing, the utility model is further detailed. It should be understood that these descriptions are only exemplary, and not to limit the scope of the utility model. Moreover, in the following description, the description of known structure and technology is omitted to avoid unnecessary confusion of the concept of the utility model.

[0027] As Figures 1-4As shown, the utility model provides a kind of internal self-heat dissipation structure of pushing material AGV navigation controller, including navigation controller body 1, navigation controller body 1 both sides surface are all provided with heat dissipation mounting groove 2, heat dissipation mounting groove 2 is symmetrically arranged, the inner wall of heat dissipation mounting groove 2 is all through and is provided with heat conduction jack 3, the inner cavity of heat conduction jack 3 is all through and is inserted with heat conduction column 4, one end surface of heat conduction column 4 is connected with outer heat conduction plate 5, the other end surface of heat conduction column 4 is connected with inner heat conduction plate 7, and outer heat conduction plate 5 surface is equipped with semiconductor refrigeration piece 6;

[0028] The inner heat conduction plate 7 is equipped with a circulating fan 8 on the surface.

[0029] It should be noted that when the semiconductor refrigeration piece 6 is coupled into a galvanic couple by a piece of N-type semiconductor material and a piece of P-type semiconductor material, a transfer of energy can be generated in this circuit after a direct current is connected, and the current is absorbed by the joint of the N-type element to the P-type element, becoming a cold end, and the joint of the P-type element to the N-type element releases heat, becoming a hot end. The cold energy is transmitted to the outer heat conduction plate 5 through the heat-conducting silicone grease, and the outer heat conduction plate 5 transmits the cold energy to the inner heat conduction plate 7 through the heat conduction column 4. The circulating fan 8 can accelerate the air flow rate on the surface of the inner heat conduction plate 7, so that the cold energy on the inner heat conduction plate 7 can be quickly released into the inner cavity of the navigation controller body 1. Through the continuous circulation of cold energy in the inner cavity of the navigation controller body 1, rapid heat dissipation and cooling of the inner cavity of the navigation controller body 1 can be achieved.

[0030] In this embodiment, as shown in the figure, Figure 3 The outer heat conduction plate 5 is located in the heat dissipation mounting groove 2, and the surface of the outer heat conduction plate 5 is connected to the surface of the semiconductor refrigeration piece 6 with heat-conducting silicone grease.

[0031] It should be noted that the heat-conducting silicone grease can improve the conduction effect of cold energy.

[0032] In this embodiment, as shown in the figure, Figure 3 The inner heat conduction plate 7 is located in the inner cavity of the navigation controller body 1, and the inner heat conduction plate 7 is a double-plate structure.

[0033] It should be noted that the double-plate structure of the inner heat conduction plate 7 can improve the conduction effect of cold energy.

[0034] In this embodiment, as shown in the figure, Figure 3 The surface of the heating surface of the semiconductor refrigeration piece 6 is equipped with a heat dissipation fin 9, the surface of the heat dissipation fin 9 is equipped with a heat dissipation fan 10, and the heat dissipation fan 10 is symmetrically arranged.

[0035] It should be noted that the circulating fan 8 can accelerate the air flow rate on the surface of the inner heat conduction plate 7, so that the cold energy on the inner heat conduction plate 7 can be quickly released into the inner cavity of the navigation controller body 1.

[0036] In this embodiment, as Figure 3 As shown, a desiccant plate 13 is movably provided on the surface of the circulating fan 8, and a drying box 11 is installed on the surface of the inner heat-conducting plate 7. The circulating fan 8 is located between the inner heat-conducting plate 7 and the drying box 11. An insertion interface 12 is provided at one end of the drying box 11, and the desiccant plate 13 is movably inserted into the inner cavity of the drying box 11 through the insertion interface 12.

[0037] It should be noted that the desiccant plate 13 is movably inserted into the inner cavity of the drying box 11 via the insertion interface 12, which makes it easy to replace the desiccant plate 13.

[0038] In this embodiment, as Figure 3 As shown, a sealing ring 15 is fitted on the end surface of the desiccant plate 13, and the outer wall of the sealing ring 15 abuts against the inner wall surface of the insertion interface 12. Ventilation holes 14 are provided on the surfaces of both the desiccant plate 13 and the drying box 11.

[0039] It should be noted that the sealing ring 15 can seal the connection between the insertion interface 12 and the desiccant plate 13 to prevent moisture leakage and improve the drying effect of the airflow. Moisture can pass through the vent hole 14 through the desiccant plate 13 and the drying box 11.

[0040] The working principle and usage of this utility model are as follows: The semiconductor cooling chip 6 is electrically connected to the heat dissipation fan of the navigation controller body 1. When the semiconductor cooling chip 6 is composed of an N-type semiconductor material and a P-type semiconductor material connected to form an electrical couple, energy transfer occurs when a DC current is applied to this circuit. The current flows from the N-type element to the P-type element's junction, absorbing heat and becoming the cold end. The current flows from the P-type element to the N-type element's junction, releasing heat and becoming the hot end. The cold end transfers the cooling energy to the outer heat-conducting plate 5 through thermal grease. The outer heat-conducting plate 5 transfers the cooling energy to the inner heat-conducting plate 7 through the thermally conductive pillars 4. The circulating fan 8 can accelerate the airflow speed on the surface of the inner heat-conducting plate 7, thereby enabling the inner heat-conducting plate 7 to cool down. The cold air on the hot plate 7 is quickly released into the inner cavity of the navigation controller body 1. The cold air circulates continuously in the inner cavity of the navigation controller body 1, which can achieve rapid heat dissipation and cooling inside the navigation controller body 1. The hot end of the semiconductor cooling chip 6 transfers heat to the heat dissipation fins 9. The heat dissipation fins 9 and the cooling fan 10 are used together to achieve rapid cooling of the hot end of the semiconductor cooling chip 6, so as to ensure the stability of the operation of the semiconductor cooling chip 6. The cold air blown out by the circulating fan 8 enters the drying box 11 through the vent 14 and passes through the desiccant plate 13. The desiccant plate 13 can absorb the moisture in the air through the desiccant powder inside, so as to ensure the dryness inside the navigation controller body 1.

[0041] It should be understood that the above specific embodiments of the present application are only used for illustrative or explanatory purposes of the principles of the present application, and do not constitute a limitation on the present application. Therefore, any modification, equivalent replacement, improvement, etc. made without departing from the spirit and scope of the present application shall be included in the protection scope of the present application. In addition, the appended claims of the present application are intended to cover all changes and modifications falling within the scope and boundary of the appended claims or the equivalent forms of such scope and boundary.

Claims

1. A self-heating structure inside a pusher AGV navigation controller, comprising a navigation controller body (1), characterized in that, The navigation controller body (1) has heat dissipation mounting grooves (2) on both sides. The heat dissipation mounting grooves (2) are arranged symmetrically. The inner wall of the heat dissipation mounting grooves (2) is provided with heat conduction holes (3). The inner cavity of the heat conduction holes (3) is provided with heat conduction columns (4). One end of the heat conduction column (4) is connected to an outer heat conduction plate (5). The other end of the heat conduction column (4) is connected to an inner heat conduction plate (7). The surface of the outer heat conduction plate (5) is equipped with a semiconductor cooling chip (6). A circulating fan (8) is installed on the surface of the inner heat-conducting plate (7); The surface of the circulating fan (8) is provided with a desiccant plate (13).

2. The self-heating structure inside the pusher AGV navigation controller according to claim 1, characterized in that, The external heat-conducting plate (5) is located in the heat dissipation mounting groove (2), and thermal grease is applied to the connection between the surface of the external heat-conducting plate (5) and the surface of the semiconductor cooling chip (6).

3. The self-heating structure inside the pusher AGV navigation controller according to claim 2, characterized in that, The inner heat-conducting plate (7) is located inside the navigation controller body (1), and the inner heat-conducting plate (7) has a double-plate structure.

4. The self-heating structure inside the pusher AGV navigation controller according to claim 3, characterized in that, The heating surface of the semiconductor cooling chip (6) is equipped with heat dissipation fins (9), and heat dissipation fans (10) are installed on the surface of the heat dissipation fins (9). The heat dissipation fans (10) are arranged symmetrically.

5. The self-heating structure inside the pusher AGV navigation controller according to claim 4, characterized in that, A drying box (11) is installed on the surface of the inner heat-conducting plate (7), and the circulating fan (8) is located between the inner heat-conducting plate (7) and the drying box (11).

6. The self-heating structure inside the pusher AGV navigation controller according to claim 5, characterized in that, The drying box (11) has an insertion interface (12) at one end, and the desiccant plate (13) is movably inserted into the inner cavity of the drying box (11) through the insertion interface (12).

7. The self-heating structure inside the pusher AGV navigation controller according to claim 6, characterized in that, A sealing ring (15) is fitted on the end surface of the desiccant plate (13), and the outer wall of the sealing ring (15) abuts against the inner wall surface of the insertion interface (12). Ventilation holes (14) are opened on the surfaces of the desiccant plate (13) and the drying box (11).

Citation Information

Patent Citations

  • AGV inertial navigation controller box

    CN218587451U