Silicon wafer polishing device

Abstract

The utility model provides a silicon wafer polishing device. The silicon wafer polishing device comprises a workbench; the rotary table is mounted on the table top of the workbench and can rotate; the multiple grinding tables are distributed on the upper surface of the rotary table in the rotating direction of the rotary table, and the grinding tables can rotate; a rough grinding and polishing assembly; and a fine grinding and polishing assembly. Wherein a silicon wafer can be placed on the grinding table, the grinding table can be driven by the rotary table to sequentially pass through the coarse grinding and polishing assembly and the fine grinding and polishing assembly, and the grinding table can drive the silicon wafer to rotate relative to the coarse grinding and polishing assembly and the fine grinding and polishing assembly so as to perform polishing operation. According to the technical scheme, through cooperation of the rotary table and the grinding table, the rough grinding and polishing assembly and the fine grinding and polishing assembly conduct rough grinding, fine grinding and step-by-step polishing on the silicon wafer in sequence, and damage to the silicon wafer in the polishing process is effectively reduced.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of silicon wafer processing, and particularly relates to a silicon wafer polishing device. BACKGROUND

[0002] In the process of processing a silicon wafer, the surface of the silicon wafer often needs to be polished, and the polishing effect directly affects the quality of the silicon wafer.

[0003] In the prior art, when a silicon wafer is polished by a silicon wafer polishing device, in order to ensure that the surface of the silicon wafer has sufficient flatness and smoothness, excessive polishing is prone to occur in the polishing process, which causes a deep damage layer on the surface of the silicon wafer, resulting in not only material loss but also insufficient thickness of the silicon wafer, thereby affecting the final performance of the silicon wafer. CONTENT OF THE INVENTION

[0004] One technical problem to be solved by the present disclosure is how to reduce damage to a silicon wafer caused by polishing.

[0005] To solve the above technical problem, the present disclosure provides a silicon wafer polishing device, which comprises a workbench, a turntable installed on the tabletop of the workbench and capable of rotating, a plurality of grinding tables distributed on the upper surface of the turntable along the rotation direction of the turntable and capable of rotating, a coarse grinding and polishing assembly, and a fine grinding and polishing assembly; wherein the grinding tables can place silicon wafers, the grinding tables can pass through the coarse grinding and polishing assembly and the fine grinding and polishing assembly in turn under the driving of the turntable, and the grinding tables can drive the silicon wafers to rotate relative to the coarse grinding and polishing assembly and the fine grinding and polishing assembly to perform polishing work.

[0006] In some embodiments, the coarse grinding and polishing assembly comprises a coarse grinding wheel and a first telescopic member, one end of the first telescopic member is connected to the workbench, and the other end of the first telescopic member is installed with the coarse grinding wheel; and the fine grinding and polishing assembly comprises a fine grinding wheel and a second telescopic member, one end of the second telescopic member is connected to the workbench, and the other end of the second telescopic member is installed with the fine grinding wheel.

[0007] In some embodiments, a pressure sensor is installed at the connection between the first telescopic member and the workbench.

[0008] In some embodiments, the turntable comprises a first rotating shaft fixedly installed on the workbench and a rotating disc capable of rotating relative to the first rotating shaft.

[0009] In some embodiments, the silicon wafer polishing device further comprises a first driving assembly, the first driving assembly comprises a first driving motor installed on the workbench, a first driving wheel installed on the first driving motor, and a first transmission belt in transmission connection with the first driving wheel and the rotating disc.

[0010] In some embodiments, the first driving assembly further comprises a tensioning wheel arranged between the rotating disc and the first driving wheel, the tensioning wheel being configured to adjust the tension of the first transmission belt.

[0011] In some embodiments, the grinding table comprises a second rotating shaft fixedly arranged on the rotating disc and a grinding disc rotatable relative to the second rotating shaft.

[0012] In some embodiments, the silicon wafer polishing device further comprises a second driving assembly, the second driving assembly comprising a second driving motor arranged on the rotating disc, a second driving wheel arranged on the second driving motor, and a second transmission belt transmissionally connecting the second driving wheel and the grinding disc.

[0013] In some embodiments, the grinding table comprises a vacuum through hole arranged on the upper surface of the grinding disc and a channel arranged on the second rotating shaft and having one end communicated with the vacuum through hole, the other end of the channel being connectable with a vacuum generating device.

[0014] In some embodiments, the workbench is provided with a protective cover, the rotating disc and the grinding table are arranged on a first side of the protective cover, the coarse grinding and polishing assembly and the fine grinding and polishing assembly are arranged on a second side of the protective cover, and the protective cover is provided with two polishing holes corresponding to the positions of the coarse grinding and polishing assembly and the fine grinding and polishing assembly.

[0015] By means of the above technical solution, the silicon wafer polishing device provided by the present disclosure utilizes the rotating disc to enable the silicon wafer to sequentially pass through the coarse grinding and polishing assembly and the fine grinding and polishing assembly, and then utilizes the grinding table to enable the silicon wafer to rotate relative to the coarse grinding and polishing assembly and the fine grinding and polishing assembly for polishing. By sequentially performing coarse grinding and fine grinding on the silicon wafer through the coarse grinding and polishing assembly and the fine grinding and polishing assembly, the silicon wafer is polished in steps, and the damage to the silicon wafer caused by the polishing process is effectively reduced. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0017] Figure 1 is a structural front view of the silicon wafer polishing device disclosed by the embodiments of the present disclosure;

[0018] Figure 2 is a structural top view of the silicon wafer polishing device disclosed by the embodiments of the present disclosure;

[0019] Figure 3 is a sectional view of the rotating disc and the grinding table disclosed by the embodiments of the present disclosure;

[0020] Figure 4is a structural top view of the protective cover disclosed by the embodiments of the present disclosure;

[0021] Figure 5 is a top view of a display turntable, a grinding table and a first driving assembly disclosed by the embodiments of the present disclosure;

[0022] Figure 6 is a front view of a display turntable, a grinding table and a first driving assembly disclosed by the embodiments of the present disclosure.

[0023] Legend of signs:

[0024] 1, workbench; 101, protective cover; 102, polishing hole; 103, polishing support; 2, turntable; 201, first rotating shaft; 202, rotating disc; 203, first bearing; 3, grinding table; 301, second rotating shaft; 302, grinding disc; 303, vacuum through hole; 304, channel; 305, second bearing; 4, coarse grinding and polishing assembly; 401, coarse grinding wheel; 402, first telescopic part; 5, fine grinding and polishing assembly; 501, fine grinding wheel; 502, second telescopic part; 6, silicon wafer; 7, first driving assembly; 701, first driving motor; 702, first driving wheel; 703, first transmission belt; 704, tension wheel; 8, second driving assembly; 801, second driving motor; 802, second driving wheel; 803, second transmission belt. DETAILED DESCRIPTION

[0025] The embodiments of the present disclosure are further described below in conjunction with the drawings and examples. The detailed description of the following examples and drawings are used to exemplarily illustrate the principles of the present disclosure, but cannot be used to limit the scope of the present disclosure, and the present disclosure can be implemented in many different forms, not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0026] The present disclosure provides these embodiments in order to make the present disclosure thorough and complete, and fully express the scope of the present disclosure to those skilled in the art. It should be noted that: unless otherwise specified, the relative arrangement of components and steps, the composition of materials, numerical expressions and values set forth in these embodiments should be interpreted as merely exemplary, and not as a limitation.

[0027] It should be noted that, in the description of the present disclosure, unless otherwise specified, the meaning of "a plurality of" is greater than or equal to two; the orientation or position relationship indicated by the terms "upper", "lower", "left", "right", "inner", "outer" and the like is only for the convenience of describing the present disclosure and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0028] In addition, "first", "second", and similar words used in the present disclosure do not represent any order, number or importance, but are only used to distinguish different parts. "Vertical" is not strictly vertical, but within the allowable range of error. "Parallel" is not strictly parallel, but within the allowable range of error. "Include" or "contain" and similar words mean that the elements before the word cover the elements listed after the word, and do not exclude the possibility of also covering other elements.

[0029] It should also be noted that in the description of the present disclosure, unless otherwise explicitly specified and limited, the terms "mount", "connect", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances. When it is described that a specific device is located between a first device and a second device, there can be or can not be an intermediate device between the specific device and the first device or the second device.

[0030] All terms used in the present disclosure have the same meaning as understood by those skilled in the art to which the present disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted to have meanings consistent with their meanings in the context of the relevant art, and should not be interpreted in an idealized or excessively formalized sense, unless specifically defined here.

[0031] Techniques, methods and devices known to those skilled in the relevant art can not be discussed in detail, but in appropriate cases, the techniques, methods and devices should be considered as part of the specification.

[0032] As shown in Figures 1 to 6 The present disclosure provides a silicon wafer polishing device, which comprises a workbench 1, a rotating table 2 installed on the tabletop of the workbench 1 and capable of rotating, a plurality of grinding tables 3 distributed on the upper surface of the rotating table 2 along the rotating direction of the rotating table 2 and capable of rotating, a coarse grinding and polishing assembly 4, and a fine grinding and polishing assembly 5; wherein the grinding table 3 can place a silicon wafer 6 thereon, the grinding table 3 can pass through the coarse grinding and polishing assembly 4 and the fine grinding and polishing assembly 5 in turn under the driving of the rotating table 2, and the grinding table 3 can drive the silicon wafer 6 to rotate relative to the coarse grinding and polishing assembly 4 and the fine grinding and polishing assembly 5 to perform polishing work.

[0033] Specifically, when the rotating table 2 rotates, the plurality of grinding tables 3 distributed on the upper surface thereof revolve around the rotating center of the rotating table 2, and the grinding tables 3 adjust their positions on the workbench 1 under the driving of the rotating table 2 so as to pass through the coarse grinding and polishing assembly 4 and the fine grinding and polishing assembly 5 in turn. When the grinding table 3 is located at the coarse grinding and polishing assembly 4 or the fine grinding and polishing assembly 5, the silicon wafer 6 placed on the upper surface thereof is driven to rotate relative to the polishing assembly by the self-rotation of the grinding table 3 to perform polishing.

[0034] During operation, the work staff places the silicon wafer 6 on the upper surface of the grinding table 3, and then the silicon wafer 6 is moved to the position of the coarse grinding and polishing assembly 4 under the driving of the self-rotation of the rotating table 2. The silicon wafer 6 is driven to rotate by the self-rotation of the grinding table 3 to perform the first step of coarse grinding. After the coarse grinding is completed, the rotating table 2 rotates to move the silicon wafer 6 to the position of the fine grinding and polishing assembly 5, and the silicon wafer 6 is driven to rotate by the self-rotation of the grinding table 3 to perform the second step of fine grinding. Through the step-by-step grinding and polishing of the silicon wafer 6 by the coarse grinding and polishing assembly 4 and the fine grinding and polishing assembly 5, the possibility of over-grinding is effectively reduced, and the damage to the silicon wafer 6 is reduced.

[0035] As shown in Figure 1 and Figure 2 , in some embodiments, the coarse grinding and polishing assembly 4 comprises a coarse grinding wheel 401 and a first telescopic member 402, one end of the first telescopic member 402 is connected to the workbench 1, and the other end is provided with the coarse grinding wheel 401; and the fine grinding and polishing assembly 5 comprises a fine grinding wheel 501 and a second telescopic member 502, one end of the second telescopic member 502 is connected to the workbench 1, and the other end is provided with the fine grinding wheel 501.

[0036] Specifically, the coarse grinding wheel 401 usually adopts a sand wheel with a relatively coarse friction granularity, such as a 600# sand wheel, and the purpose is to quickly process most of the machining allowance and make the silicon wafer 6 reach a certain surface flatness. In contrast, the fine grinding wheel 501 usually adopts a sand wheel with a relatively fine friction granularity, such as a 1000# sand wheel or a 2000# sand wheel, and the purpose is to remove the damage layer formed on the surface of the silicon wafer 6 by coarse grinding and further improve the flatness and smoothness of the surface of the silicon wafer 6.

[0037] In order to improve the stability of the polishing operation, as shown in Figure 1 and Figure 2 , when the silicon wafer 6 is moved to the position below the coarse grinding and polishing assembly 4 under the driving of the rotating table 2, the rotating table 2 stops rotating, the first telescopic member 402 is extended to drive the coarse grinding wheel 401 to contact the silicon wafer 6 fixed on the upper surface of the grinding table 3 downward, and correspondingly the grinding table 3 starts to rotate to drive the silicon wafer 6 to rotate to perform the first step of coarse grinding. After the coarse grinding is completed, the grinding table 3 stops rotating, and at the same time the first telescopic member 402 is retracted to remove the contact between the coarse grinding wheel 401 and the silicon wafer 6. The rotating table 2 continues to rotate to move the silicon wafer 6 to the position below the fine grinding and polishing assembly 5, and the above steps are repeated by using the second telescopic member 502 to complete the second step of fine grinding of the silicon wafer 6.

[0038] In some embodiments, a pressure sensor is installed at the connection between the first telescopic member 402 and the workbench 1.

[0039] Specifically, since both the first telescopic member 402 and the second telescopic member 502 are connected to the polishing wheel at one end and to the workbench 1 at the other end, the telescopic member is only subjected to force at both ends. By installing a pressure sensor at the connection between the telescopic member and the workbench, the reading of the pressure sensor can intuitively reflect the pressure of the polishing wheel acting on the silicon wafer 6. When processing silicon wafers 6 of different thicknesses, the staff can more conveniently adjust the polishing pressure through the reading of the pressure sensor, and also conveniently monitor the pressure change in the polishing process, so as to timely grasp the polishing degree of the silicon wafer 6. For the convenience of observation, the pressure of the polishing wheel acting on the silicon wafer 6 and the pressure received by the pressure sensor should be on the same straight line, so that they form a pair of action and reaction forces with equal size and opposite direction, reducing the observation error of the staff.

[0040] As shown in Figure 1 , Figure 3 and Figure 6 , in some embodiments, the turntable 2 includes a first rotating shaft 201 fixedly installed on the workbench 1 and a rotating disc 202 capable of rotating relative to the first rotating shaft 201.

[0041] Specifically, a plurality of grinding tables 3 are distributed on the upper surface of the rotating disc 202 along the rotating direction of the turntable 2, and the coarse grinding and polishing assembly 4 and the fine grinding and polishing assembly 5 are respectively installed above the rotating disc 202 through the polishing support 103. Through the rotation of the rotating disc 202 of the turntable 2 around the first rotating shaft 201, the plurality of grinding tables 3 are driven to pass under the coarse grinding and polishing assembly 4 and the fine grinding and polishing assembly 5 in turn, facilitating the step-by-step polishing of the silicon wafer 6. The rotating disc 202 is rotatably installed with the first rotating shaft 201 through the first bearing 203.

[0042] As shown in Figure 1 , Figure 5 and Figure 6 , in some embodiments, the silicon wafer polishing device further includes a first driving assembly 7, and the first driving assembly 7 includes a first driving motor 701 installed on the workbench 1, a first driving wheel 702 installed on the first driving motor 701, and a first transmission belt 703 in transmission connection with the first driving wheel 702 and the rotating disc 202.

[0043] Specifically, in order to facilitate the maintenance of the first driving assembly 7, the first driving motor 701 is installed outside the turntable 2, and the first driving motor 701 drives the first driving wheel 702 to rotate, and then the first transmission belt 703 drives the rotating disc 202 to rotate relative to the first rotating shaft 201, so as to adjust the relative position of the silicon wafer 6.

[0044] In some embodiments, in order to prevent slippage during transmission, the first transmission belt 703 can be replaced by a transmission rack, and the first driving wheel 702 and the rotating disc 202 are provided with grooves or protrusions capable of engaging with the rack on the surface in transmission contact with the first transmission belt 703, so as to ensure stable transmission.

[0045] As shown in Figure 5 and Figure 6 , in some embodiments, the first driving assembly 7 further comprises a tensioning wheel 704 arranged between the rotating disc 202 and the first driving wheel 702, which is used to adjust the tension of the first transmission belt 703.

[0046] Specifically, one end of the tensioning wheel 704 is mounted on the tabletop of the workbench 1, and the other end is in sliding contact with the first transmission belt 703, and the bottom is provided with an adjusting structure such as a tensioning screw, a tensioning spring, a tensioning hydraulic cylinder, etc. which can adjust the position of the tensioning wheel 704. When the first transmission belt 703 is loose, the staff can adjust the position or angle of the tensioning wheel 704 through the above-mentioned adjusting structure to adjust the tension of the first transmission belt 703, so as to ensure stable transmission.

[0047] As shown in Figure 5 , in some embodiments, two tensioning wheels 704 are installed on the workbench 1, which are respectively arranged at the positions where the first transmission belt 703 and the rotating disc 202 are about to contact and separate, so as to play a tensioning role while guiding the first transmission belt 703 to better fit the surface of the rotating disc 202 for transmission.

[0048] As shown in Figure 3 , in some embodiments, the grinding table 3 comprises a second rotating shaft 301 fixedly installed on the rotating disc 202 and a grinding disc 302 capable of rotating relative to the second rotating shaft 301.

[0049] Specifically, the grinding disc 302 is rotatably installed on the second rotating shaft 301 through a second bearing 305. When the rotating table 2 rotates, the rotating disc 202 drives the grinding disc 302 to move to the position of the coarse grinding and polishing assembly 4 or the fine grinding and polishing assembly 5 through the second rotating shaft 301, and then the grinding disc 302 rotates relative to the second rotating shaft 301 to drive the silicon wafer 6 on the upper surface thereof to rotate for polishing work.

[0050] As shown in Figure 3 , in some embodiments, the silicon wafer polishing device further comprises a second driving assembly 8, which comprises a second driving motor 801 installed on the rotating disc 202, a second driving wheel 802 installed on the second driving motor 801, and a second transmission belt 803 in transmission connection between the second driving wheel 802 and the grinding disc 302.

[0051] Specifically, when the polishing plate 302 needs to rotate, the second driving motor 801 drives the second driving wheel 802 to rotate, and the second transmission belt 803, which is in transmission connection between the second driving wheel 802 and the polishing plate 302, drives the polishing plate 302 to rotate, and the silicon wafer 6 fixed on the upper surface of the polishing plate 302 starts the polishing operation.

[0052] In some embodiments, in order to ensure the stability of the transmission process, the second transmission belt 803 can be replaced by a transmission rack, and the second driving wheel 802 and the polishing plate 302 are provided with grooves or protrusions capable of engaging with the rack on the surface in contact with the rack.

[0053] As shown in Figure 2 and Figure 3 , in some embodiments, the polishing table 3 includes a vacuum through hole 303 arranged on the upper surface of the polishing plate 302 and a channel 304 located in the second rotating shaft 301 and connected to the vacuum through hole 303 at one end, and the other end of the channel 304 can be connected to a vacuum generating device.

[0054] Specifically, the polishing plate 302 is provided with a vacuum cavity inside, the vacuum through hole 303 is connected to the upper surface where the silicon wafer 6 is placed and the vacuum cavity, and the channel 304 is arranged in the second rotating shaft 301 and extends along the center of the rotating shaft, one end of the channel 304 is connected to the vacuum cavity, and the other end is connected to an external vacuum generator or vacuum pump. When the silicon wafer 6 is placed on the upper surface of the polishing plate 302, a vacuum is generated by the vacuum device, so that a negative pressure is generated in the vacuum cavity, the silicon wafer 6 is adsorbed and fixed on the upper surface of the polishing plate 302, which is convenient for driving it to rotate for polishing operation.

[0055] As shown in Figure 1 , Figure 2 and Figure 4 , in some embodiments, the workbench 1 is provided with a protective cover 101, the rotating table 2 and the polishing table 3 are located on the first side of the protective cover 101, the coarse grinding and polishing assembly 4 and the fine grinding and polishing assembly 5 are located on the second side of the protective cover 101, and the protective cover 101 is provided with two polishing holes 102 corresponding to the positions of the coarse grinding and polishing assembly 4 and the fine grinding and polishing assembly 5.

[0056] Specifically, to prevent the polishing operation from causing debris to splash, a protective cover 101 is arranged on the workbench 1, and the positions corresponding to the two polishing holes 102 are the positions at which the silicon wafer 6 is subjected to coarse grinding and fine grinding. When the silicon wafer 6 is moved to the first polishing hole 102 under the drive of the turntable 2, the first telescopic member 402 of the coarse grinding and polishing assembly 4 is extended to drive the coarse grinding wheel 401 to contact the silicon wafer 6, the grinding table 3 is rotated to drive the silicon wafer 6 to rotate relative to the coarse grinding wheel 401 for coarse grinding. After the coarse grinding is completed, the silicon wafer 6 is moved to the position of the second polishing hole 102 under the drive of the turntable 2, and the silicon wafer 6 is subjected to fine grinding by the fine grinding and polishing assembly 5. In addition, the protective cover 101 is provided with an opening on the side away from the coarse grinding and polishing assembly 4 and the fine grinding and polishing assembly 5, so as to facilitate the workers to take the silicon wafer 6 after the polishing is completed, and to place the silicon wafer 6 to be polished.

[0057] So far, the embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concept of the present disclosure, some details known in the art are not described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein according to the above description.

[0058] Although some specific embodiments of the present disclosure have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration, and are not intended to limit the scope of the present disclosure. Those skilled in the art should understand that the above embodiments can be modified or some technical features can be replaced equivalently without departing from the scope and spirit of the present disclosure. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way.

Claims

1. A silicon wafer polishing apparatus, characterized by comprising: The silicon wafer polishing device comprises a workbench (1), a rotary table (2) installed on the tabletop of the workbench (1) and capable of rotating, a plurality of grinding tables (3) distributed on the upper surface of the rotary table (2) along the rotation direction of the rotary table (2) and capable of rotating, a coarse grinding and polishing assembly (4), and a fine grinding and polishing assembly (5). The grinding table (3) can place a silicon wafer (6) thereon, and the grinding table (3) can pass through the coarse grinding and polishing assembly (4) and the fine grinding and polishing assembly (5) in turn under the drive of the rotary table (2), and the grinding table (3) can drive the silicon wafer (6) to rotate relative to the coarse grinding and polishing assembly (4) and the fine grinding and polishing assembly (5) to perform polishing work. The coarse grinding and polishing assembly (4) comprises a coarse grinding wheel (401) and a first telescopic member (402), one end of the first telescopic member (402) is connected to the workbench (1), and the other end is provided with the coarse grinding wheel (401); the fine grinding and polishing assembly (5) comprises a fine grinding wheel (501) and a second telescopic member (502), one end of the second telescopic member (502) is connected to the workbench (1), and the other end is provided with the fine grinding wheel (501). The first telescopic member (402) and the second telescopic member (502) are provided with pressure sensors at the connection positions with the workbench (1). The rotary table (2) comprises a first rotating shaft (201) fixedly installed on the workbench (1) and a rotating disc (202) capable of rotating relative to the first rotating shaft (201). The grinding table (3) comprises a second rotating shaft (301) fixedly installed on the rotating disc (202) and a grinding disc (302) capable of rotating relative to the second rotating shaft (301). The grinding table (3) comprises a vacuum through hole (303) arranged on the upper surface of the grinding disc (302) and a channel (304) located at the second rotating shaft (301) and communicating with one end of the vacuum through hole (303), the other end of the channel (304) can be connected to a vacuum generating device. The workbench (1) is provided with a protective cover (101), the rotary table (2) and the grinding table (3) are located on the first side of the protective cover (101), the coarse grinding and polishing assembly (4) and the fine grinding and polishing assembly (5) are located on the second side of the protective cover (101), and the protective cover (101) is provided with two polishing holes (102) corresponding to the positions of the coarse grinding and polishing assembly (4) and the fine grinding and polishing assembly (5). The silicon wafer polishing device further comprises a first driving assembly (7), the first driving assembly (7) comprises a first driving motor (701) installed on the workbench (1), a first driving wheel (702) installed on the first driving motor (701), and a first transmission belt (703) in transmission connection with the first driving wheel (702) and the rotating disc (202). ​ ​ ​ ​ 2. The silicon wafer polishing apparatus of claim 1, wherein ​ 3. The apparatus of claim 2 wherein, The first driving assembly (7) further comprises a tensioning wheel (704) arranged between the rotating disc (202) and the first driving wheel (702), and the tensioning wheel (704) is used for adjusting the tension of the first transmission belt (703).

4. The silicon wafer polishing apparatus of claim 1, wherein The silicon wafer polishing device further comprises a second driving assembly (8), and the second driving assembly (8) comprises a second driving motor (801) installed on the rotating disc (202), a second driving wheel (802) installed on the second driving motor (801) and a second transmission belt (803) in transmission connection between the second driving wheel (802) and the grinding disc (302).

Images