Wafer thickness gauge

Abstract

The utility model discloses a wafer thickness gauge which comprises a bottom plate, the right side of the top of the bottom plate is fixedly connected with a control box, and the top of the control box is fixedly connected with a supporting arm. By pulling the moving plate rightwards, the moving plate drives the sliding rod to move rightwards, the spring is compressed by the mounting block and the moving plate, the moving plate drives the friction semicircular sleeve to move rightwards, the friction semicircular sleeve is separated from the round rod, the adjusting plate and the round rod can move up and down for adjustment, and the adjusting plate drives the ultrasonic detection probe to adjust the position. After the ultrasonic detection probe is adjusted to a proper position, the round rod, the adjusting plate and the ultrasonic detection probe can be positioned by loosening the movable plate, the wafer detection device has the advantage of being capable of detecting wafers with different thicknesses, the distance between the ultrasonic detection probe and the ultrasonic signal reflection head can be adjusted and can be flexibly adjusted according to actual detection requirements, and the detection efficiency is improved. The ultrasonic detection probe and the ultrasonic signal reflection head can effectively cover and detect the whole wafer.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer detection technical field, concretely is a wafer thickness gauge. BACKGROUND

[0002] The process of wafer detection needs to use wafer thickness gauge, and patent announcement number CN207395684U discloses a non-contact wafer thickness gauge, a control box and a display screen are installed at the rear part of the workbench, a fixed arm and an ultrasonic detection probe are installed at the front end of the control box, a wafer tray is installed in the middle part of the workbench, the center of the wafer tray is a hollow ring, wafer positioning heads are installed on the upper edge of the hollow ring, wafer support heads are installed on the inner side of the hollow ring, ultrasonic signal reflection heads are installed on the workbench in the hollow ring, two parallel and same-height slides are installed on the workbench, a sliding groove is designed on the wafer tray and is sleeved on the slide, by using the technical scheme, the wafer is placed on the wafer support head, fixed by the wafer fixing head, the wafer tray is slid on the slide, the thickness of the wafer at each point on a straight line track on the wafer can be detected, the wafer position is placed manually once, and the thickness on two intersecting lines of the wafer can be detected by sliding detection once, so that the average thickness, warping degree and bending degree of the wafer can be calculated.

[0003] The prior art in the above has the following defects: in the ultrasonic detection process, the distance between the ultrasonic detection probe and the ultrasonic signal reflection head is fixed, and cannot be flexibly adjusted according to the actual detection requirement, and this limitation is particularly obvious when facing the wafer with relatively thick thickness, when the wafer needs to be detected, the ultrasonic detection probe and the ultrasonic signal reflection head cannot effectively cover and detect the whole wafer due to the unadjustable distance, a large number of detection areas cannot be accurately detected, many key data cannot be obtained, and finally the detection result deviates or even completely fails, which not only greatly reduces the detection efficiency of the wafer, but also makes the detection process long and inefficient. UTILITY MODEL CONTENTS

[0004] To solve the problems in the above background art, the purpose of the utility model is to provide a wafer thickness gauge, which has the advantages of being able to detect wafers of different thicknesses, and solves the problem that in the ultrasonic detection process, the distance between the ultrasonic detection probe and the ultrasonic signal reflection head is fixed, and cannot be flexibly adjusted according to the actual detection requirement, and this limitation is particularly obvious when facing the wafer with relatively thick thickness, when the wafer needs to be detected, the ultrasonic detection probe and the ultrasonic signal reflection head cannot effectively cover and detect the whole wafer due to the unadjustable distance, a large number of detection areas cannot be accurately detected, many key data cannot be obtained.

[0005] In order to achieve the above object, the utility model provides the following technical scheme: a wafer thickness gauge, including the bottom plate, the right side fixed connection of bottom plate top has control box, the top fixed connection of control box has support arm, the left side fixed connection of support arm has square, the inside of square is provided with round rod, the top fixed connection of round rod has adjusting plate, the inside fixed connection of adjusting plate has ultrasonic detection probe, the bottom of ultrasonic detection probe is provided with ultrasonic signal reflection head, the bottom fixed connection of ultrasonic signal reflection head is in the top of bottom plate, the left side fixed connection of bottom plate top has the rack, the top fixed connection of square has locking mechanism.

[0006] As the utility model is preferred, the locking mechanism includes friction half round cover, the inner wall of friction half round cover is in contact with the surface of round rod, the right side fixed connection of friction half round cover has moving plate, the inside of moving plate is provided with mounting block, the bottom fixed connection of mounting block is in the top of square, the inside fixed connection of moving plate has slide rod, the slide rod is connected in the inside of mounting block, the left side of slide rod surface is equipped with spring.

[0007] As the utility model is preferred, the top fixed connection of mounting block has limit board, the bottom of limit board is in contact with the top of moving plate.

[0008] As the utility model is preferred, the right side fixed connection of moving plate top has the plectrum, and the plectrum is located in the right side of limit board.

[0009] As the utility model is preferred, the front side and rear side of moving plate are provided with limit rail, and the bottom fixed connection of limit rail is in the top of square.

[0010] As the utility model is preferred, the front side and rear side fixed connection of adjusting plate bottom has stabilizer, and the bottom of stabilizer penetrates to the bottom of square.

[0011] As the utility model is preferred, the bottom fixed connection of round rod has linkage board, and the top fixed connection of linkage board is in the bottom of stabilizer.

[0012] Compared with the prior art, the utility model has the advantages of the following:

[0013] 1. The utility model discloses a right side pull mobile plate, and the mobile plate drives the slide rod to move to the right side, and the spring is compressed by the mounting block and mobile plate, and the mobile plate drives the friction half -round cover to move to the right side, and the friction half -round cover separates with the round stick, and the round stick loses the fixed, and the adjusting plate and round stick can move to the up and down direction and adjust, and the adjusting plate drives the ultrasonic detection probe to adjust the position, when the ultrasonic detection probe adjusts to the proper position, releases the mobile plate, and the round stick, adjusting plate and ultrasonic detection probe can be positioned, have the advantage that can detect different thickness wafer, and the spacing between ultrasonic detection probe and ultrasonic signal reflection head can be adjusted, and can be flexibly adjusted according to actual detection demand, when facing the wafer of thickness, ultrasonic detection probe and ultrasonic signal reflection head can effectively cover and detect the whole wafer.

[0014] 2. The utility model discloses a locking mechanism is set up, can lock the round stick, avoid the round stick and adjusting plate and cannot be fixed, lead to the ultrasonic detection probe in the adjusting plate and cannot be positioned, improved the use effect of ultrasonic detection probe. DRAWINGS

[0015] Figure 1 It is the structural diagram of the utility model;

[0016] Figure 2 It is the perspective view of the adjusting plate of the utility model;

[0017] Figure 3 It is the perspective view of the stabilizer of the utility model;

[0018] Figure 4 It is the perspective view of the limiting rail of the utility model.

[0019] In the drawing: 1, bottom plate;2, control box;3, support arm;4, square block;5, round stick;6, adjusting plate;7, ultrasonic detection probe;8, ultrasonic signal reflection head;9, placing rack;10, locking mechanism;101, friction half -round cover;102, mobile plate;103, mounting block;104, slide rod;105, spring;11, limiting plate;12, paddle;13, limiting rail;14, stabilizer;15, linkage plate. DETAILED DESCRIPTION

[0020] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.

[0021] As Figures 1 to 4The utility model provides a wafer thickness gauge, including bottom plate 1, the right side fixed connection of bottom plate 1 top has control box 2, the top fixed connection of control box 2 has support arm 3, the left side fixed connection of support arm 3 has square 4, the inside of square 4 is provided with round bar 5, the top fixed connection of round bar 5 has adjusting plate 6, the inside fixed connection of adjusting plate 6 has ultrasonic detection probe 7, the bottom of ultrasonic detection probe 7 is provided with ultrasonic signal reflection head 8, the bottom fixed connection of ultrasonic signal reflection head 8 is at the top of bottom plate 1, the left side fixed connection of bottom plate 1 top has rack 9, the top fixed connection of square 4 has locking mechanism 10.

[0022] Reference Figure 4 Locking mechanism 10 includes friction half circle cover 101, the inner wall of friction half circle cover 101 is in contact with the surface of round bar 5, the right side fixed connection of friction half circle cover 101 has moving plate 102, the inside of moving plate 102 is provided with mounting block 103, the bottom fixed connection of mounting block 103 is at the top of square 4, the inside fixed connection of moving plate 102 has slide 104, and slide 104 is slidably connected in the inside of mounting block 103, and the left side of the surface of slide 104 is provided with spring 105.

[0023] As a technical optimization scheme of the utility model, by setting locking mechanism 10, the round bar 5 can be locked, the ultrasonic detection probe 7 in the adjusting plate 6 cannot be positioned due to the fact that the round bar 5 and the adjusting plate 6 cannot be fixed, and the use effect of the ultrasonic detection probe 7 is improved.

[0024] Reference Figure 4 The top of mounting block 103 is fixedly connected with a limiting plate 11, and the bottom of the limiting plate 11 is in contact with the top of the moving plate 102.

[0025] As a technical optimization scheme of the utility model, by setting the limiting plate 11, the sliding stability of the moving plate 102 can be improved.

[0026] Reference Figure 4 The right side of the top of the moving plate 102 is fixedly connected with a push piece 12, and the push piece 12 is located on the right side of the limiting plate 11.

[0027] As a technical optimization scheme of the utility model, by setting the push piece 12, the contact area between the user and the moving plate 102 can be increased, the contact area between the moving plate 102 and the user is small, and the pushing efficiency of the moving plate 102 is improved.

[0028] Reference Figure 4 The front side and the back side of the moving plate 102 are provided with a limiting rail 13, and the bottom of the limiting rail 13 is fixedly connected to the top of the square 4.

[0029] As a technical optimization scheme of the utility model, through setting the limiting rail 13, the moving plate 102 can be stably slid, avoiding shaking during the sliding movement of the moving plate 102, causing the moving plate 102 to be loose, and improving the sliding stability of the moving plate 102.

[0030] Reference Figure 3 The front side and the rear side of the bottom of the adjusting plate 6 are fixedly connected with the stabilizing rods 14, and the bottom of the stabilizing rod 14 penetrates to the bottom of the block 4.

[0031] As a technical optimization scheme of the utility model, through setting the stabilizing rod 14, the adjusting plate 6 can be stably slid, avoiding shaking during the sliding movement of the adjusting plate 6, causing the adjusting plate 6 to be loose, and improving the sliding stability of the adjusting plate 6.

[0032] Reference Figure 3 The bottom of the round rod 5 is fixedly connected with the linkage plate 15, and the top of the linkage plate 15 is fixedly connected to the bottom of the stabilizing rod 14.

[0033] As a technical optimization scheme of the utility model, through setting the linkage plate 15, the adjusting plate 6 can be stably slid, avoiding shaking during the sliding movement of the adjusting plate 6, causing the adjusting plate 6 to be loose, and improving the sliding stability of the adjusting plate 6.

[0034] The working principle and use process of the utility model are as follows: when the interval between the ultrasonic detection probe 7 and the ultrasonic signal reflection head 8 is adjusted, the moving plate 102 is pulled to the right side, the sliding rod 104 is driven by the moving plate 102 to move to the right side, the spring 105 is compressed by the mounting block 103 and the moving plate 102, the moving plate 102 drives the friction half-round sleeve 101 to move to the right side, the friction half-round sleeve 101 is separated from the round rod 5, the round rod 5 loses fixation, and the adjusting plate 6 and the round rod 5 can be adjusted in the up-down direction, the adjusting plate 6 drives the ultrasonic detection probe 7 to adjust the position, when the ultrasonic detection probe 7 is adjusted to the appropriate position, the round rod 5, the adjusting plate 6 and the ultrasonic detection probe 7 can be positioned by releasing the moving plate 102.

[0035] In summary: the wafer thickness gauge, through the cooperation of the bottom plate 1, the control box 2, the supporting arm 3, the block 4, the round rod 5, the adjusting plate 6, the ultrasonic detection probe 7, the ultrasonic signal reflection head 8, the placing rack 9 and the locking mechanism 10, solves the problem that the interval between the ultrasonic detection probe and the ultrasonic signal reflection head is fixed and cannot be flexibly adjusted according to actual detection requirements during ultrasonic detection, and this limitation is particularly obvious when facing wafers with relatively large thickness, when such wafers need to be detected, due to the unadjustable interval, the ultrasonic detection probe and the ultrasonic signal reflection head cannot effectively cover and detect the entire wafer, a large number of detection areas cannot be accurately detected, resulting in many key data cannot be obtained.

[0036] It is to be noted that, in the present document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0037] While the embodiments of the present application have been illustrated and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and alterations can be made therein without departing from the spirit and scope of the application, which is defined by the appended claims and their equivalents.

Claims

1. A wafer thickness gauge comprising a base plate (1), characterised in that: The right side of the top of the bottom plate (1) is fixedly connected with the control box (2), the top of the control box (2) is fixedly connected with the supporting arm (3), the left side of the supporting arm (3) is fixedly connected with the square block (4), the inside of the square block (4) is provided with the round rod (5), the top of the round rod (5) is fixedly connected with the adjusting plate (6), the inside of the adjusting plate (6) is fixedly connected with the ultrasonic detection probe (7), the bottom of the ultrasonic detection probe (7) is provided with the ultrasonic signal reflection head (8), the bottom of the ultrasonic signal reflection head (8) is fixedly connected to the top of the bottom plate (1), the left side of the top of the bottom plate (1) is fixedly connected with the placing rack (9), and the top of the square block (4) is fixedly connected with the locking mechanism (10).

2. A wafer thickness gauge according to claim 1, wherein: The locking mechanism (10) comprises a friction half-round sleeve (101), the inner wall of the friction half-round sleeve (101) is in contact with the surface of the round rod (5), the right side of the friction half-round sleeve (101) is fixedly connected with the moving plate (102), the inside of the moving plate (102) is provided with the mounting block (103), the bottom of the mounting block (103) is fixedly connected to the top of the square block (4), the inside of the moving plate (102) is fixedly connected with the slide rod (104), the slide rod (104) is slidingly connected in the inside of the mounting block (103), and the surface of the slide rod (104) is sleeved with the spring (105) on the left side.

3. A wafer thickness gauge according to claim 2, wherein: The top of the mounting block (103) is fixedly connected with the limiting plate (11), and the bottom of the limiting plate (11) is in contact with the top of the moving plate (102).

4. The wafer thickness gauge of claim 2 wherein: The right side of the top of the moving plate (102) is fixedly connected with the dial piece (12), and the dial piece (12) is located on the right side of the limiting plate (11).

5. The wafer thickness gauge of claim 2 wherein: The front side and the rear side of the moving plate (102) are provided with the limiting rail (13), and the bottom of the limiting rail (13) is fixedly connected to the top of the square block (4).

6. The wafer thickness gauge of claim 1 wherein: The front side and the rear side of the bottom of the adjusting plate (6) are fixedly connected with the stabilizing rod (14), and the bottom of the stabilizing rod (14) penetrates to the bottom of the square block (4).

7. A wafer thickness gauge according to claim 6, wherein: The bottom of the round rod (5) is fixedly connected with the connecting plate (15), and the top of the connecting plate (15) is fixedly connected to the bottom of the stabilizing rod (14).

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