Integrated circuit chip burning test jig adaptable to different sizes

By using clamping and adjusting mechanisms, the problem of existing test fixtures being unable to adapt to chips of different sizes has been solved, thereby improving flexibility and efficiency and reducing costs.

CN223727875UActive Publication Date: 2025-12-26WUXI XINYUAN MICRO TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202423226735.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-26
Publication Date
2025-12-26
Estimated Expiration
2034-12-26

AI Technical Summary

Technical Problem

Existing integrated circuit chip programming test fixtures cannot accommodate chips of different sizes, resulting in the need for test sockets of various specifications, which increases manufacturing costs and replacement time.

Method used

A test fixture including a clamping and adaptation mechanism and an adjustment mechanism was designed. The movable plate and clamping block are driven by a cylinder to clamp chips of different sizes, and the compaction is adjusted by a screw and a rubber pin to achieve adaptation of chips of different sizes.

Benefits of technology

It improves the flexibility and efficiency of the test fixture, reduces testing costs, can adapt to chips of different sizes, and reduces the time and effort required to change test sockets.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN223727875U_ABST
    Figure CN223727875U_ABST
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Abstract

The utility model relates to the field of integrated circuit chips, in particular to an integrated circuit chip burning test jig adaptable to different sizes, which comprises a test jig main body, and the test seat is mounted on the inner side above the test frame main body. According to the integrated circuit chip burning test jig capable of being adapted to different sizes, through the arrangement of the clamping adaption mechanism and the adjusting mechanism, the integrated circuit chip burning test jig can be adapted to the integrated circuit chips of different sizes, the test flexibility and the test efficiency are improved, the test cost is reduced, and the test efficiency is improved. The integrated circuit chips are placed on the test bases, then the air cylinder switch below the fixing plate is turned on, the base at the lower end is pushed, the base pulls the movable plates on the periphery in the moving process to drive the movable bases to be close to the clamping blocks above, and therefore the integrated circuit chips of different sizes are clamped and positioned. Compared with a traditional fixed test seat which cannot be adjusted and adapted, the overall flexibility is improved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to integrated circuit chip field, concretely relates to an integrated circuit chip burning test frame of different size adaptation. BACKGROUND

[0002] Integrated circuit chip is the electronic component including a silicon substrate, at least one circuit, a fixed ring, a ground ring and at least one protection ring, and integrated circuit chip, integrated circuit chip burning test frame is a kind of equipment specially designed for the burning and testing of integrated circuit chip.It realizes the burning, verification and testing of chip by fixing chip on test frame and connecting to corresponding test system or burning equipment.

[0003] After searching, a utility model PCBA board's burning test frame with announcement No.CN214585605U, including base, it further includes test plate and pressing plate, the test plate is fixedly installed on the upper surface of base, the upper surface of test plate is provided with containing recess, containing recess bottom surface is installed with a plurality of test pins for the burning of PCBA board, backboard is installed with manual lifting mechanism, two slide columns are fixedly installed on the lower surface of backboard close to test plate position, pressing plate and slide column are slidably connected, a plurality of rubber top rods are fixedly installed on the lower surface of pressing plate by screw, U-shaped seat upper portion is fixedly installed with buffer device, buffer device is connected with manual lifting mechanism.The utility model has simple structure, and manual operation is convenient, and procurement cost is lower, and it is suitable for small repair shop.

[0004] The size of the test seat is fixed during the burning and testing of the existing integrated circuit chip burning test frame, different sizes of integrated circuit chips cannot be burned and tested, and only the same size of integrated circuit chips can be adapted, and the burning test frame of CBA board in the above-mentioned comparative example is similar to the present patent type, but the test plate in the patent cannot also be adapted to different sizes of CBA board, so that in order to adapt to different sizes of chip or CBA board, the test frame may need to be equipped with a plurality of different specifications of test seat, the manufacturing cost of these test seats is higher, and it takes time and effort to replace the test seat.

[0005] Therefore, it is necessary to invent an integrated circuit chip burning test frame that can adapt to different sizes to solve the above problems. UTILITY MODEL CONTENTS

[0006] The utility model discloses a purpose lies in providing a kind of integrated circuit chip burning test rack of different sizes can be adapted, by integrated circuit chip is placed in test seat and test seat, after opening the air cylinder switch below fixed plate, push the base of lower end, and base moves in the process of pulling the movable plate of four around and driving movable seat and the clamping block above each other close, to different sizes integrated circuit chip is clamped and positioned, compared with the test seat of traditional fixed and cannot adjust adaptation, improve the flexibility of whole, to solve the burning test rack of CBA board in the above-mentioned comparative case proposed in the above background art, the test board in this patent also cannot be adapted according to different sizes CBA board, so as to adapt to different sizes chip or CBA board, test rack can need to be equipped with multiple different specifications test seat, the manufacturing cost of these test seats is higher, and the test seat needs to be replaced to consume time and energy problem.

[0007] In order to realize the above-mentioned purpose, the utility model provides the following technical scheme: a kind of integrated circuit chip burning test rack of different sizes can be adapted, including test rack main body;

[0008] Test seat is installed in the inside of test rack main body top, for placing integrated circuit chip, the inside of the test seat is provided with test needle, the rear side of the test rack main body is fixedly connected with support plate, the front side of the support plate is provided with handle, the lower end of the handle is fixedly connected with pressing plate, the inside of the rear side of the pressing plate is slidably connected with slide rod;

[0009] Clamping adaptation mechanism is installed in the inside of test rack main body and test seat lower side, for adapting integrated circuit chip of different sizes, the clamping adaptation mechanism includes fixed plate and clamping block;

[0010] Adjusting mechanism is installed in the lower side of pressing plate, for adjusting rubber top needle, the adjusting mechanism includes connecting plate and rubber top needle.

[0011] Preferably, the fixed plate is installed in the inside of test rack main body and below test seat, the lower side of the fixed plate is fixedly provided with air cylinder, the lower end of the air cylinder is fixedly connected with base, the movable plate is movably connected around the four of the base, the movable seat is movably connected on the upper side of the movable plate, and the clamping block is fixed on the upper side of the movable seat.

[0012] Preferably, the lower side of the movable seat is fixedly connected with slide sleeve, the upper side of the fixed plate is fixedly connected with slide block around, and the slide sleeve and slide block are used in cooperation.

[0013] Preferably, rubber pad is pasted in the inside of the clamping block, and the angle of the rubber pad is consistent with the angle of the clamping block.

[0014] Preferably, the connecting plate is installed below the pressing plate, right sides of the connecting plate are provided with handles, one end of the handle is fixedly connected with a screw rod, outer sides of the screw rod are threadedly connected with moving blocks, and the lower end of the moving block is fixedly connected with a rubber thimble.

[0015] Preferably, the screw rod is provided with two groups, and the two groups of screw rods are oppositely provided with threads.

[0016] In the above technical solution, the technical effects and advantages of the utility model are provided.

[0017] The utility model discloses a clamping adaptive mechanism and adjusting mechanism are set up, can adapt to integrated circuit chip of different sizes, not only improve the flexibility and test efficiency of test, also reduce test cost, through the integrated circuit chip is placed in the test seat with test seat, then opens the cylinder switch below the fixed plate, promotes the base of lower end, and the base moves in the process and pulls the movable plate of four around and drives the movable seat and the clamping block of upper to be close to each other to the integrated circuit chip of different sizes is clamped and positioned, compared with the traditional fixed test seat, can not adjust the adaptation, improve the flexibility of whole, and the rubber thimble below the connecting plate can also be adjusted and compacted according to different sizes integrated circuit chip, and the screw rod is rotated through the handle, and the threads of the screw rod two sides are oppositely threaded, thereby the moving block of two sides outside and the rubber thimble are moved to each other, and the integrated circuit chip of different sizes is compacted. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments described in the present application, and other drawings can also be obtained by those skilled in the art according to these drawings.

[0019] Figure 1 It is the overall structure schematic view of the utility model;

[0020] Figure 2 It is the test seat structure schematic view of the utility model;

[0021] Figure 3 It is the clamping adaptive mechanism structure schematic view of the utility model;

[0022] Figure 4 It is the clamping block structure schematic view of the utility model;

[0023] Figure 5 It is the adjusting mechanism structure schematic view of the utility model.

[0024] Explanation of reference signs:

[0025] 1, test frame main body; 2, test seat; 3, test needle; 4, clamping adaptive mechanism; 401, fixed plate; 402, air cylinder; 403, base; 404, movable plate; 405, movable seat; 406, sliding sleeve; 407, sliding block; 408, clamping block; 409, rubber pad; 5, support plate; 6, handle; 7, pressing plate; 8, sliding rod; 9, adjusting mechanism; 901, connecting plate; 902, handle; 903, screw; 904, moving block; 905, rubber ejector pin. DETAILED DESCRIPTION

[0026] In order to make the technical personnel of the prior art better understand the technical scheme of the present application, the present application will be further described in detail below with reference to the drawings.

[0027] The utility model provides a kind of integrated circuit chip burning test frame of different sizes can be adapted as shown in Figures 1-5 The utility model discloses a kind of integrated circuit chip burning test frame of different sizes can be adapted as shown in

[0028] Test seat 2 is installed in the inner side above test frame main body 1, for placing integrated circuit chip, the inside of test seat 2 is all provided with test needle 3, the rear side of test frame main body 1 is fixedly connected with support plate 5, the front side of support plate 5 is provided with handle 6, the lower end of handle 6 is fixedly connected with pressing plate 7, the rear side inside of pressing plate 7 is slidably connected with sliding rod 8;

[0029] Clamping adaptive mechanism 4 is installed in test frame main body 1 inside and test seat 2 lower side, for adapting integrated circuit chip of different sizes, clamping adaptive mechanism 4 includes fixed plate 401 and clamping block 408;

[0030] Adjusting mechanism 9 is installed in the lower side of pressing plate 7, for adjusting rubber ejector pin 905, adjusting mechanism 9 includes connecting plate 901 and rubber ejector pin 905, by placing integrated circuit chip on test seat 2 and test seat 2, then opening the air cylinder 402 switch below fixed plate 401, pushing the lower end base 403, while base 403 moves, pull movable plate 404 around to drive movable seat 405 and the clamping block 408 above each other close, so that integrated circuit chip of different sizes is clamped and positioned, compared with the test seat 2 of traditional fixed cannot adjust adaptation, improve the flexibility of whole, the rubber ejector pin 905 below connecting plate 901 can also be adjusted and compacted according to different sizes integrated circuit chip, by handle 902 drive screw 903 rotation, while the thread tapping on the two sides of screw 903 is opposite, so as to drive the moving block 904 outside on both sides and rubber ejector pin 905 each other moves, so as to cooperate integrated circuit chip of different sizes and compact.

[0031] As shown in Figure 1 , Figure 2 , Figure 3 And Figure 4As shown in the fixed plate 401 is installed in the test frame body 1 below the test seat 2, the lower fixed plate 401 is provided with a cylinder 402, the lower end of the cylinder 402 is fixedly connected with the base 403, the periphery of the base 403 is movably connected with the movable plate 404, the upper side of the movable plate 404 is movably connected with the movable seat 405, the clamping block 408 is fixed on the upper side of the movable seat 405, by opening the cylinder 402 switch to push the base 403 telescopic, and the base 403 telescopic process pulls the periphery of the movable plate 404 and the movable seat 405 to move into the fixed plate 401, so as to adapt to different size of integrated circuit chip clamping positioning.

[0032] As shown in the Figure 3 and Figure 4 the lower side of the movable seat 405 is fixedly connected with the sliding sleeve 406, the upper side of the fixed plate 401 is fixedly connected with the sliding block 407, the sliding sleeve 406 is used in cooperation with the sliding block 407, the movable seat 405 is pulled by the movable plate 404 and the base 403 during the process, the sliding sleeve 406 under the movable seat 405 slides on the sliding block 407 above the fixed plate 401, so as to improve the stability of the movable seat 405 and the clamping block 408 during the movement.

[0033] As shown in the Figure 3 and Figure 4 the inner side of the clamping block 408 is pasted with rubber pad 409, the angle of the rubber pad 409 is consistent with the angle of the clamping block 408, the inner side of the clamping block 408 is pasted with rubber pad 409, which is close to the integrated circuit chip, so as to avoid the direct contact of the clamping block 408 with the chip.

[0034] As shown in the Figure 1 and Figure 5 the connecting plate 901 is installed below the pressing plate 7, the right side of the connecting plate 901 is provided with a handle 902, one end of the handle 902 is fixedly connected with a screw rod 903, the outer side of the screw rod 903 is threadedly connected with a moving block 904, the lower end of the moving block 904 is fixedly connected with a rubber thimble 905, the handle 902 is rotated to drive the screw rod 903 to rotate, so as to drive the moving block 904 and the rubber thimble 905 on the outer side to move relative to each other, and the different sizes of integrated circuit chips are compacted.

[0035] As shown in the Figure 5 the screw rod 903 is provided with two groups, the two sides of the two groups of screw rods 903 are oppositely threaded, the outer side of the screw rod 903 is oppositely threaded, so that the moving block 904 and the rubber thimble 905 on the outer side of the screw rod 903 move relative to each other, so as to adjust according to different sizes of integrated circuit chips.

[0036] The utility model discloses a work principle: first, connect external power supply, then the integrated circuit chip is placed test seat 2 and test needle 3 top, then open the air cylinder 402 switch below fixed plate 401, promote the base 403 of lower extreme, and the base 403 removes the movable plate 404 of four around in the process and drive movable seat 405 and the clamping block 408 above are close to each other on test seat 2 and fixed plate 401, thereby the clamping positioning of integrated circuit chip of different size is carried out, compared with the test seat 2 of traditional fixed and cannot adjust adaptation, improve the flexibility of whole, then according to the four groups of rubber top needle 905 below connecting plate 901 and corresponding integrated circuit chip of different size, the distance between four connecting plate 901 is adjusted, through the handle 902 of rotating connecting plate 901 right side drive screw rod 903 rotation, and the thread tapping of screw rod 903 both sides is contrary, thereby drive both sides external moving block 904 and rubber top needle 905 remove each other, thereby cooperate the compaction of integrated circuit chip of different size, then press handle 6 drive pressing plate 7 and the connecting plate 901 and rubber top needle 905 below press down, make rubber top needle 905 rest on integrated circuit chip, realize the burning, verification and test etc. operation of chip through test needle 3 inside test seat 2, finally when burning test is finished, pull handle 6 drive pressing plate 7 and the rubber top needle 905 below lift, finally through the clamping step just, release integrated circuit chip then take out, when not use the device, cut off external power supply, like this the use process of the integrated circuit chip burning test frame of different size of this adaptable is completed.

[0037] The above only describes some exemplary embodiments of the utility model through the way of illustration, undoubtedly, for ordinary skilled person in the art, under the condition of not deviating from the spirit and scope of the utility model, can modify the described embodiment in various different ways. Therefore, the above drawing and description are illustrative in nature, and should not be understood as limiting the scope of protection of the utility model claims.

Claims

1. A test fixture adaptable to integrated circuit chip programming of different sizes, characterized in that: Including the main body of the test fixture (1); Test socket (2) is installed on the inner side above the test frame body (1) for placing integrated circuit chips. Test pins (3) are provided inside the test socket (2). A support plate (5) is fixedly connected to the rear side of the test frame body (1). A handle (6) is provided on the front side of the support plate (5). A pressure plate (7) is fixedly connected to the lower end of the handle (6). Slide rods (8) are slidably connected to the rear two sides of the pressure plate (7). The clamping adapter mechanism (4) is installed inside the test frame body (1) and under the test seat (2) to adapt to integrated circuit chips of different sizes. The clamping adapter mechanism (4) includes a fixing plate (401) and a clamping block (408). An adjustment mechanism (9) is installed on the lower side of the pressure plate (7) for adjusting the rubber pin (905). The adjustment mechanism (9) includes a connecting plate (901) and a rubber pin (905).

2. The integrated circuit chip programming and testing fixture adaptable to different sizes according to claim 1, characterized in that: The fixing plate (401) is installed inside the test frame body (1) and below the test seat (2). A cylinder (402) is fixedly installed below the fixing plate (401). A base (403) is fixedly connected to the lower end of the cylinder (402). A movable plate (404) is movably connected around the base (403). A movable seat (405) is movably connected to the upper side of the movable plate (404). The clamping block (408) is fixed on the upper side of the movable seat (405).

3. The integrated circuit chip programming and testing fixture adaptable to different sizes according to claim 2, characterized in that: A sliding sleeve (406) is fixedly connected to the lower part of the movable seat (405), and a slider (407) is fixedly connected to the upper periphery of the fixed plate (401). The sliding sleeve (406) and the slider (407) are used in conjunction.

4. The integrated circuit chip programming and testing fixture adaptable to different sizes according to claim 1, characterized in that: A rubber pad (409) is pasted on the inner side of the clamping block (408), and the angle of the rubber pad (409) matches the angle of the clamping block (408).

5. The integrated circuit chip programming and testing fixture adaptable to different sizes according to claim 1, characterized in that: The connecting plate (901) is installed below the pressure plate (7). A handle (902) is provided on the right side of the connecting plate (901). A screw (903) is fixedly connected to one end of the handle (902). A moving block (904) is threadedly connected to both sides of the screw (903). A rubber pin (905) is fixedly connected to the lower end of the moving block (904).

6. The integrated circuit chip programming and testing fixture adaptable to different sizes according to claim 5, characterized in that: The screw (903) is provided in two sets, and the two sets of screws (903) are arranged with opposite thread tapping on both sides.

Citation Information

Patent Citations

  • Burning test jig for PCBA (printed circuit board assembly)

    CN214585605U