Microstrip-waveguide conversion structure, signal transmission device and communication equipment

Abstract

The embodiment of the utility model discloses a microstrip-waveguide conversion structure, a signal transmission device and communication equipment. According to the technical scheme provided by the embodiment of the utility model, the mounting base and the cover plate which are detachably connected are arranged, the waveguide through hole is formed in the mounting base, and the connecting port communicated with the first end of the waveguide through hole is formed in the mounting base, so that external equipment can be connected to the connecting port; a reflection cavity is formed in the side, corresponding to the second end of the waveguide through hole, of the cover plate, a boss which is used for configuring a transmission zero point position and is of a preset height is arranged in the reflection cavity of the cover plate, and transverse electromagnetic waves are output from the output end of the microstrip circuit board, excited and converted into transverse electromagnetic waves through the reflection cavity and then transmitted along the waveguide through hole. The boss in the reflection cavity can add a transmission zero point in signal transmission, out-of-band rejection of signal transmission can be effectively achieved, the position of the transmission zero point can be preset based on the preset height of the boss, debugging work does not need to be additionally introduced in the production link, and the production efficiency is improved. And the production cost can be greatly reduced while the equipment size is effectively reduced.

Description

TECHNICAL FIELD

[0001] The embodiment of the utility model relates to satellite communication technical field, especially a microstrip-waveguide conversion structure, signal transmission device and communication equipment. BACKGROUND

[0002] With the development and application popularization of satellite communication, small power terminal users are more and more, and the size of product is smaller and smaller, and the miniaturization and low cost of product will play a great influence on product application promotion. With more and more mature high gain power amplifier technology, in order to meet the sufficient receiving channel suppression, it is needed to add the filter with high suppression to the receiving channel after the output of power amplifier.

[0003] At present, the scheme of obtaining higher out-of-band suppression is mainly realized by the way of loading resonant cavity on the output waveguide or loading tuning screw on the output waveguide. Among them, the resonant cavity realizes the suppression effect by forming a band-pass filter on the output waveguide, but the processing of resonant cavity is complex, and the size of equipment is large, which is not conducive to the miniaturization of small power products. Tuning screw realizes out-of-band suppression by introducing transmission zero point. But affected by the processing mode, the position of tuning screw cannot be fixed, which will introduce the debugging work of tuning screw in the production link, greatly increasing the production cost of product. UTILITY MODEL CONTENT

[0004] The embodiment of the utility model provides a microstrip-waveguide conversion structure, signal transmission device and communication equipment to solve the technical problem of large equipment size of related technology's out-of-band suppression scheme and high production cost caused by debugging work, can reduce production cost while effectively reducing equipment size.

[0005] In the first aspect, the embodiment of the utility model provides a microstrip-waveguide conversion structure, which comprises detachably connected mounting base and cover plate, wherein:

[0006] The mounting base is provided with a waveguide through hole, and the mounting base is provided with a connection port communicating with the first end of the waveguide through hole, and the connection port is used for connecting external equipment;

[0007] The cover plate is provided with a reflection cavity on the side corresponding to the second end of the waveguide through hole, and the cover plate is provided with a boss with a preset height for configuring the position of transmission zero point in the reflection cavity;

[0008] The cover plate and the mounting base are used for connecting the microstrip circuit board, and the signal output end of the microstrip circuit board is located at the second end of the waveguide through hole.

[0009] Further, the mounting base is provided with an output first matching platform between the first end of the waveguide through hole and the connection port.

[0010] Further, the waveguide through hole is an L-shaped through hole or an I-shaped through hole.

[0011] Further, in the case that the waveguide through hole is an L-shaped through hole, the mounting base is provided with a second matching platform body at the bending part of the waveguide through hole.

[0012] Further, the boss is provided in plurality, and different bosses correspond to different preset heights.

[0013] Further, the mounting base is provided with a threaded hole, and the cover plate is provided with a first mounting through hole for the screw to pass through and connect with the threaded hole at the position corresponding to the threaded hole.

[0014] Further, the microstrip circuit board comprises a microstrip line and a dielectric substrate, the microstrip line is mounted on the dielectric substrate, and the microstrip line is located on the side of the dielectric substrate facing the cover plate.

[0015] Further, the part of the dielectric substrate located in the waveguide through hole is milled off the metal skin, or the part of the dielectric substrate located in the waveguide through hole is hollowed out.

[0016] In the second aspect, the utility model embodiment provides a signal transmission device, including the microstrip-waveguide conversion structure as any one of the first aspect.

[0017] In the third aspect, the utility model embodiment provides a communication device, including the signal transmission device as the second aspect.

[0018] The utility model embodiment sets up the mounting base and the cover plate of detachable connection, is provided with the waveguide through hole in the mounting base, and the mounting base is provided with the connection port which communicates the first end of the waveguide through hole, can connect the external device on this connection port, the cover plate is provided with the reflection cavity on the side corresponding with the second end of the waveguide through hole, and the cover plate is provided with the boss of preset height for the configuration transmission zero point position in the reflection cavity, the transverse electromagnetic wave is output from the output end of the microstrip circuit board and is converted into the transverse wave after the excitation of reflection cavity and is transmitted along the waveguide through hole, and is sent to the external device on the transmission after the connection port, and the boss in the reflection cavity can add transmission zero point in signal transmission, can effectively realize the out-of-band suppression of signal transmission, and the transmission zero point position can be preset based on the preset height of the boss, need not introduce the debugging work extra in the production link, can effectively reduce the equipment size while greatly reducing the production cost. ACCURATE DRAWINGS

[0019] Figure 1 It is a structure schematic view of the microstrip-waveguide conversion structure provided by the utility model embodiment;

[0020] Figure 2is a cross section schematic view of a microstrip-waveguide conversion structure provided by the embodiment of the utility model;

[0021] Figure 3 is an explosion schematic view of a microstrip-waveguide conversion structure provided by the embodiment of the utility model;

[0022] Figure 4 is a structure schematic view of another microstrip-waveguide conversion structure provided by the embodiment of the utility model;

[0023] Figure 5 is a cross section schematic view of another microstrip-waveguide conversion structure provided by the embodiment of the utility model;

[0024] Figure 6 is a frequency-amplitude relation diagram of transverse electric wave transmission provided by the embodiment of the utility model;

[0025] Figure 7 is a waveguide frequency-amplitude relation diagram corresponding to a boss of different preset height provided by the scheme;

[0026] Figure 8 is a waveguide frequency-amplitude relation diagram corresponding to a boss of different number and different preset height provided by the embodiment of the utility model;

[0027] Figure 9 is a principle block diagram of a signal transmission device provided by the embodiment of the utility model;

[0028] Figure 10 is a principle block diagram of a communication equipment provided by the embodiment of the utility model.

[0029] Reference signs: 1, mounting base; 2, cover plate; 3, waveguide through hole; 4, reflection cavity; 5, boss; 6, through slot; 7, first matching table body; 8, second matching table body; 9, threaded hole; 10, first mounting through hole; 11, screw; 12, microstrip circuit board; 121, microstrip line; 122, dielectric substrate; 123, second mounting through hole. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical scheme and advantages of the utility model clearer, the utility model specific embodiments are further described in detail below in combination with the drawings. It can be understood that the specific embodiments described herein are only used to explain the utility model, and not limit the utility model. In addition, it should be noted that, in order to facilitate description, only the parts related to the utility model are shown in the drawings, not all contents. In the description of the embodiments of the utility model, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated, it can be mechanically connected, or it can be electrically connected, it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction relationship of two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0031] In the existing out-of-band suppression scheme, the out-of-band suppression is realized by loading resonant cavity on the output waveguide to form a band-pass filter, although the desired suppression effect can be obtained, but the device processing method is complex, and the size is large, which is not conducive to the miniaturization and low cost of low-power products. The out-of-band suppression is realized by loading tuning screw on the output waveguide to introduce transmission zero point, the position of the tuning screw cannot be fixed due to the influence of the device processing method, and the position of the tuning screw must be determined and debugged in the production process, which will introduce debugging work in the production link, thereby increasing the production cost of the product, and the out-of-band suppression effect is also difficult to guarantee. The out-of-band suppression is realized by loading short-circuit microstrip stub on the microstrip waveguide conversion structure to introduce partial transmission zero point, the zero point position is related to the microstrip size, and at present, only at 130GHz, it is obviously not suitable for Ku band commonly used in satellite communication. Based on this, the utility model embodiment provides a microstrip-waveguide conversion structure to solve the technical problems of large device size and high production cost caused by debugging work in the prior art.

[0032] Figure 1 The structure diagram of the microstrip-waveguide conversion structure provided by the utility model embodiment is shown, Figure 2 The cross-sectional view of the microstrip-waveguide conversion structure provided by the utility model embodiment is shown, Figure 2 Figure 1 The cross-sectional view of the microstrip-waveguide conversion structure provided by the utility model embodiment is shown, Figure 1 And Figure 2 The microstrip-waveguide conversion structure includes detachably connected mounting base 1 and cover plate 2. The material of the mounting base 1 and the cover plate 2 provided in the scheme is metal material.

[0033] ​The mounting base 1 provided by the scheme is provided with a waveguide through hole 3 communicating two ends, the two ends of the waveguide through hole 3 communicate the inside of the waveguide through hole 3 and the outside of the mounting base 1, wherein the mounting base 1 is provided with a connection port communicating the first end of the waveguide through hole 3, and the connection port can be used for connecting an external device (such as an antenna). Optionally, the connection port can be set as an interface of a standard waveguide size, facilitating connection with other external devices and realizing interconnection with other external devices. The rest of the microstrip-waveguide conversion structure can adopt a non-standard size, further reducing the overall size of the microstrip-waveguide conversion structure.

[0034] Further, the cover plate 2 is inwardly recessed on the side corresponding to the second end of the waveguide through hole 3 to form a reflection cavity 4. When the cover plate 2 is connected to the mounting base 1, the cover plate 2 covers the second end of the waveguide through hole 3, and the reflection cavity 4 on the cover plate 2 corresponds to the second end of the waveguide through hole 3 and communicates with the reflection cavity 4. The cover plate 2 is provided with a boss 5 of a preset height for configuring a transmission zero point position in the reflection cavity 4, and bosses 5 of different preset heights can configure different transmission zero point positions to realize different transmission zeros. The preset height of the boss 5 can be determined in advance according to the transmission zero point position to be configured, and the cover plate 2 can be produced according to the preset height to realize the introduction of the target transmission zero point, without the need to configure the transmission zero point position through debugging, greatly improving the production efficiency and reducing the production cost of the equipment. Optionally, the boss 5 can be a circular table, a square table, a hexagonal column, a triangular prism, etc.

[0035] The cover plate 2 and the mounting base 1 provided by the scheme can be used to connect a microstrip circuit board 12, and when the microstrip circuit board 12 is fixedly connected between the cover plate 2 and the mounting base 1, the signal output end of the microstrip circuit board 12 is located at the second end of the waveguide through hole 3, that is, one side of the signal output end of the microstrip circuit board 12 faces the inside of the waveguide through hole 3, and the other side faces the inside of the reflection cavity 4. Optionally, when the microstrip circuit board 12 is fixedly connected between the cover plate 2 and the mounting base 1, there is a gap between the signal output end of the microstrip circuit board 12 and the boss 5.

[0036] Optionally, a rectangular plane can be arranged on the upper surface of the mounting base 1, and the rectangular plane can be used to place the microstrip circuit board 12. The microstrip circuit board 12 is located between the rectangular plane of the mounting base 1 and the cover plate 2, and the microstrip line 121 is located on the upper surface of the microstrip circuit board 12 and is used to convert signals from a microstrip to a waveguide. The cover plate 2 is provided with a reflection cavity 4 and a boss 5, and the boss 5 is located in the reflection cavity 4. The zero point position can be adjusted by adjusting the height of the boss 5.

[0037] In the connection of the microstrip circuit board 12 and the microstrip-waveguide conversion structure, the microstrip circuit board 12 can be extended to the position of the second end of the waveguide through hole 3, so that the output end of the microstrip circuit board 12 outputting the transverse electromagnetic wave extends into the second end of the waveguide through hole 3, at this time, the cover plate 2 can be connected to the mounting base 1, and at this time, the cover plate 2 and the mounting base 1 can clamp the microstrip circuit board 12, thereby realizing the connection of the microstrip circuit board 12 and the microstrip-waveguide conversion structure. And the external device such as an antenna can be connected to the connection port on the mounting base 1, thereby realizing the connection of the external device and the microstrip-waveguide conversion structure.

[0038] The signal transmitted by the microstrip circuit board 12 is a transverse electromagnetic wave (TEM wave), and the waveguide transmits a transverse electric wave (TE wave). The microstrip-waveguide conversion structure can convert the transverse electromagnetic wave transmitted in the microstrip into a transverse electric wave transmitted in the waveguide, and the reflection cavity 4 can provide a cavity that can better excite the TE mode of the wave shape. In the working of the microstrip-waveguide conversion structure, the end of the microstrip circuit board 12 outputting the transverse electromagnetic wave outputs the transverse electromagnetic wave, which is converted into a transverse electric wave by the reflection cavity 4 and transmitted along the waveguide through hole 3, and transmitted to the external device through the connection port, thereby realizing the conversion and transmission of the transverse electromagnetic wave to the transverse electric wave. And due to the existence of the boss 5, a transmission zero point is introduced in the signal transmission, which can form the required out-of-band suppression of the signal transmission and improve the signal transmission quality.

[0039] In one embodiment, as shown in Figure 1 and Figure 2 The mounting base 1 provided by the scheme is provided with an output first matching table body 7 between the first end of the waveguide through hole 3 and the connection port, which is used to realize the transition between the waveguide through hole 3 and the connection port, and improve the matching between the ports.

[0040] In one embodiment, the waveguide through hole 3 provided by the scheme can be an L-shaped through hole or an I-shaped through hole, and the shape of the waveguide through hole 3 can be set according to the connection requirements of the microstrip-waveguide conversion structure and other devices or apparatuses, thereby facilitating the connection of the microstrip-waveguide conversion structure.

[0041] In combination with Figure 1 and Figure 2 , Figure 2With the waveguide via 3 being set as an L-shaped via as an example, the bending angle of the L-shaped via can be 90°. For example, the waveguide via 3 extends a distance from the first end to the inside of the mounting base 1, then bends 90° and extends along the bent direction until the second end is communicated to the outside of the mounting base 1. The transverse electromagnetic wave is output from the output end of the microstrip circuit board 12 and is converted into a transverse electric wave by the reflection cavity 4, then is transmitted along the waveguide via 3 from the second end of the waveguide via 3, is turned at the L-shaped bending position of the waveguide via 3 and continues to be transmitted, and is transmitted to the external device through the connecting port at the first end of the waveguide via 3 for further transmission. In this way, the conversion and transmission of the signal are ensured, and the connection of the microstrip-waveguide conversion structure and the external device is facilitated.

[0042] In one embodiment, when the waveguide via 3 is set as an L-shaped via, the mounting base 1 is provided with a second matching platform 8 at the bending position of the waveguide via 3, so that the transverse electric wave is matched at the bending position (the matching of the transverse electric wave of 90° is realized), and the signal transmission quality is improved.

[0043] Optionally, the mounting base 1 and the cover plate 2 can be detachably connected by one or more combinations of screw connection, clamping, sliding groove connection and adhesion. In one embodiment, the mounting base 1 and the cover plate 2 are connected by the screw 11 as an example, Figure 3 is an exploded schematic view of a microstrip-waveguide conversion structure provided by an embodiment of the utility model, which, in combination with Figure 1 , Figure 2 and Figure 3 , the mounting base 1 is provided with a plurality of threaded holes 9 (two threaded holes 9 are set as an example in the utility model (one threaded hole 9 is set on each side of the second end of the waveguide via 3)), the cover plate 2 is provided with a first mounting through hole 10 at the position corresponding to the threaded hole 9, the first mounting through hole 10 is used for the screw 11 to pass through and is connected with the threaded hole 9, the threaded hole 9 is provided with a thread matched with the screw 11, and the hole diameter of the end of the first mounting through hole 10 away from the threaded hole 9 is smaller than the diameter of the head of the screw 11, so that the screw 11 is connected in the threaded hole 9 and is tightened by passing through the first mounting through hole 10, the head of the screw 11 abuts against the position of the cover plate 2 at the end of the first mounting through hole 10, so that the cover plate 2 is stably fixed on the mounting base 1, and the microstrip circuit is stably fixed between the cover plate 2 and the mounting base 1.

[0044] In one embodiment, the second mounting through hole 123 is arranged on the microstrip circuit board 12 at a position corresponding to the threaded hole 9, and when the cover plate 2 and the microstrip circuit board 12 are mounted, the second mounting through hole 123 on the microstrip circuit board 12, the first mounting through hole 10 on the cover plate 2, and the threaded hole 9 on the mounting base are aligned, and the screw 11 is sequentially threaded through the first mounting through hole 10 and the second mounting through hole 123 and is screwed with the threaded hole 9, and the cover plate 2 and the mounting base 1 are clamped to the microstrip circuit board 12 by tightening the screw 11, and the microstrip circuit board 12 is stably fixed under the limiting action of the screw 11. The threaded hole 9, the first mounting through hole 10, and the screw 11 are used to achieve detachable connection of the cover plate 2 and the mounting base 1, thereby improving the mounting and dismounting efficiency of the cover plate 2 and the mounting base 1.

[0045] In one embodiment, the microstrip circuit board 12 provided by the scheme includes a microstrip line 121 and a dielectric substrate 122, and the second mounting through hole 123 is arranged on the dielectric substrate 122. The microstrip line 121 is mounted on the dielectric substrate 122, and the microstrip line 121 is located on the side of the dielectric substrate 122 facing the cover plate 2, so that the microstrip line 121 more accurately outputs transverse electromagnetic waves, which are converted into transverse electric waves by the reflection cavity 4 and are output through the waveguide through hole 3, thereby improving the signal transmission quality.

[0046] In one embodiment, the part of the dielectric substrate 122 located in the waveguide through hole 3 is hollowed out to form a through slot 6, thereby reducing the influence of the dielectric substrate 122 on signal transmission and improving the signal transmission quality. Optionally, the position of the through slot 6 formed by hollowing out the dielectric substrate 122 corresponds to the projection position of the reflection cavity 4 on the dielectric substrate 122.

[0047] In one embodiment, the metal skin of the part of the dielectric substrate 122 located in the waveguide through hole 3 can also be milled, that is, the copper skin of the inner layer and the bottom layer of the dielectric substrate 122 extending into the microstrip-waveguide conversion structure is milled, thereby reducing the influence of the metal skin of the dielectric substrate 122 on signal transmission and improving the signal transmission quality. Optionally, the position of the dielectric substrate 122 from which the copper skin is milled corresponds to the projection position of the reflection cavity 4 on the dielectric substrate 122.

[0048] The microstrip-to-waveguide conversion structure provided in this solution can be applied to the Ku band commonly used in satellite communication to achieve microstrip-to-waveguide conversion. The microstrip circuit board 12 and the microstrip-to-waveguide conversion structure can be connected via microstrip probes. The microstrip-to-waveguide conversion structure (e.g., the transverse cross-sectional shape of the waveguide via 3) can use rectangular or circular waveguides. Except for the final output section (i.e., the connection port), which uses standard waveguide dimensions for interconnection with other products, non-standard dimensions can be used in other locations, further reducing the overall size of the microstrip-to-waveguide conversion structure. The microstrip-to-waveguide conversion structure can be divided into a cover plate 2 and a mounting base 1 along the plane of the microstrip circuit board 12 (PCB). Both the mounting base 1 and the cover plate 2 can be obtained through mold processing. During use, the cover plate 2, microstrip circuit board 12, and mounting base 1 are connected by screws 11. The processing method of the microstrip-to-waveguide conversion structure is relatively simple, effectively avoiding the trouble of introducing a debugging stage in production caused by the inability to process the structure using tuning screws 11 from the waveguide port.

[0049] Figure 4 This is a schematic diagram of another microstrip-waveguide conversion structure provided in this embodiment of the present invention. Figure 5 This is a cross-sectional schematic diagram of another microstrip-waveguide conversion structure provided in this embodiment of the present invention. Figure 5 for Figure 4 The provided schematic diagram of the exploded cross-section of the microstrip-waveguide conversion structure, combined with Figure 4 and Figure 5 In this microstrip-waveguide conversion structure, the waveguide via 3 is configured as a type I via. The waveguide via 3 extends from the first end into the mounting base 1 until it connects to the outside of the mounting base 1 at the second end. Transverse electromagnetic waves are output from the output terminal of the microstrip circuit board 12 and converted into transverse electromagnetic waves by the reflecting cavity 4. These waves then propagate along the waveguide via 3 from the second end and are transmitted to an external device via a connection port at the first end of the waveguide via 3 for further transmission. This ensures signal conversion and transmission while facilitating the connection between the microstrip-waveguide conversion structure and external devices.

[0050] based on Figure 1 The provided microstrip-waveguide conversion structure can be used for signal conversion and transmission simulation to obtain results such as... Figure 6 The diagram shows a frequency-amplitude relationship for transverse electromagnetic wave transmission, where the horizontal axis represents the signal frequency and the vertical axis represents the signal amplitude. From... Figure 6 It can be seen that the microstrip-waveguide conversion structure provided by this solution is effective at 12.45 GHz (e.g., Figure 6 A transmission null point is introduced at the lowest point of the transverse radio wave transmission curve S21, thereby producing a good suppression effect within the satellite receiving passband (10.7-12.75GHz). Figure 7The waveguide frequency-amplitude relationship diagram corresponding to the boss 5 of different preset heights provided by the utility model for the embodiment, wherein H is the preset height, Figure 7 It can be seen that when the boss 5 of different preset heights is arranged, the transmission zero points are distributed at different positions (the lowest point positions of different curves), the preset height of the boss 5 can be determined in advance according to the need of the out-of-band suppression of signal transmission, the transmission zero point at a specific frequency point is introduced, thereby the interference signal of the out-of-band is suppressed, the position of the boss 5 does not need to be debugged again, the production efficiency of the microstrip-waveguide conversion structure is improved, and the situation that the transmission zero point is deviated due to the transmission, movement and collision and misoperation in the use process of the equipment, thereby affecting the signal transmission quality is reduced.

[0051] In one embodiment, a plurality of bosses 5 can be arranged at the corresponding positions of the reflection cavity 4, and the different bosses 5 correspond to different preset heights, so as to introduce the transmission zero points of different transmission zero point positions, and realize more abundant out-of-band suppression effect. Figure 8 The waveguide frequency-amplitude relationship diagram corresponding to the boss 5 of different number and different preset heights provided by the utility model for the embodiment, since the position of the transmission zero point is related to the height of the boss 5, a plurality of bosses 5 of different heights can be introduced to generate a plurality of transmission zero points, that is, the number of the transmission zero points can be increased by increasing the number of the boss 5, thereby increasing the width of the suppression band, or introducing a plurality of stop bands, so as to meet the suppression requirement of different frequency bands, Figure 8 The waveguide frequency-amplitude relationship diagram using two bosses 5 of different preset heights is shown, it can be seen that the two bosses 5 of different preset heights generate two transmission zero points, thereby increasing the suppression bandwidth.

[0052] The above, through setting the mounting base 1 and the cover plate 2 of detachable connection, the waveguide through hole 3 is arranged in the mounting base 1, the mounting base 1 is provided with the connecting port communicating with the first end of the waveguide through hole 3, the external device can be connected on the connecting port, the reflection cavity 4 is arranged on the side corresponding to the second end of the waveguide through hole 3 of the cover plate 2, the boss 5 of preset height for configuring the position of the transmission zero point is arranged in the reflection cavity 4 of the cover plate 2, the transverse electromagnetic wave is output from the output end of the microstrip circuit board 12 and is converted into transverse wave after being excited by the reflection cavity 4, is transmitted along the waveguide through hole 3 and is sent to the external device on the connecting port, and the boss 5 in the reflection cavity 4 can add the transmission zero point in the signal transmission, the out-of-band suppression of the signal transmission can be effectively realized, and the position of the transmission zero point can be preset based on the preset height of the boss 5, without additional debugging work in the production link, the device size can be effectively reduced, and the production cost is greatly reduced. By the way of adding the boss 5 in the reflection cavity 4, a new transmission zero point is introduced, the requirement of the stop band in the satellite communication is met, the size of the waveguide conversion structure is greatly reduced, and the machining and debugging requirements of the waveguide conversion structure are reduced.

[0053] In one embodiment, the utility model also provides a signal transmission device, such as Figure 9 The principle block diagram of the signal transmission device is shown, and the signal transmission device comprises the microstrip-waveguide conversion structure provided in any of the above embodiments.

[0054] The signal transmission device is provided with the waveguide through hole in the installation base, and the installation base is provided with the connecting port in communication with the first end of the waveguide through hole, so that the external device can be connected to the connecting port, the reflecting cavity is arranged on the side of the cover plate corresponding to the second end of the waveguide through hole, the boss with the preset height for configuring the transmission zero point position is arranged in the reflecting cavity of the cover plate, the transverse electromagnetic wave is output from the output end of the microstrip circuit board and is converted into the transverse wave after being excited by the reflecting cavity, and then is transmitted along the waveguide through hole and is transmitted to the external device through the connecting port, and the boss in the reflecting cavity can add the transmission zero point in the signal transmission, so that the out-of-band suppression of the signal transmission can be effectively realized, the transmission zero point position can be preset based on the preset height of the boss, and additional debugging work does not need to be introduced in the production link, so that the device size can be effectively reduced, and the production cost can be greatly reduced.

[0055] In one embodiment, the utility model also provides a communication device, such as Figure 10 The principle block diagram of the communication device is shown, and the communication device comprises the signal transmission device provided in the above embodiment.

[0056] The signal transmission device is provided with the waveguide through hole in the installation base, and the installation base is provided with the connecting port in communication with the first end of the waveguide through hole, so that the external device can be connected to the connecting port, the reflecting cavity is arranged on the side of the cover plate corresponding to the second end of the waveguide through hole, the boss with the preset height for configuring the transmission zero point position is arranged in the reflecting cavity of the cover plate, the transverse electromagnetic wave is output from the output end of the microstrip circuit board and is converted into the transverse wave after being excited by the reflecting cavity, and then is transmitted along the waveguide through hole and is transmitted to the external device through the connecting port, and the boss in the reflecting cavity can add the transmission zero point in the signal transmission, so that the out-of-band suppression of the signal transmission can be effectively realized, the transmission zero point position can be preset based on the preset height of the boss, and additional debugging work does not need to be introduced in the production link, so that the device size can be effectively reduced, and the production cost can be greatly reduced.

[0057] The above are only the preferred embodiments of the present application and the technical principles applied. The present application is not limited to the specific embodiments provided herein, and various obvious changes, re-adjustments and replacements that can be made by those skilled in the art will not depart from the protection scope of the present application. Therefore, although the present application has been described in more detail through the above embodiments, the present application is not limited to the above embodiments, and more other equivalent embodiments can be included without departing from the concept of the present application, and the scope of the present application is determined by the scope of the claims.

Claims

1. A microstrip-to-waveguide transition structure, characterized by, The mounting base and the cover plate are detachably connected, wherein: The mounting base is provided with a waveguide through hole, and the mounting base is provided with a connecting port communicating with the first end of the waveguide through hole, and the connecting port is used for connecting an external device; The cover plate is provided with a reflection cavity on the side corresponding to the second end of the waveguide through hole, and the cover plate is provided with a boss with a preset height for configuring the transmission zero point position in the reflection cavity; The cover plate and the mounting base are used for connecting a microstrip circuit board, and the signal output end of the microstrip circuit board is located at the second end of the waveguide through hole.

2. The microstrip-to-waveguide transition structure of claim 1, wherein, The mounting base is provided with an output first matching platform between the first end of the waveguide through hole and the connecting port.

3. The microstrip-to-waveguide transition structure of claim 1, wherein, The waveguide through hole is an L-shaped through hole or an I-shaped through hole.

4. The microstrip-to-waveguide transition structure of claim 3, wherein, In the case of the L-shaped waveguide through hole, the mounting base is provided with a second matching platform at the bending part of the waveguide through hole.

5. The microstrip-to-waveguide transition structure of claim 1, wherein, The boss is provided in multiple, and different bosses correspond to different preset heights.

6. The microstrip-to-waveguide transition structure of claim 1, wherein, The mounting base is provided with a threaded hole, and the cover plate is provided with a first mounting through hole at the position corresponding to the threaded hole, which is used for the screw to pass through and connect with the threaded hole.

7. The microstrip-to-waveguide transition structure of claim 1, wherein, The microstrip circuit board includes a microstrip line and a dielectric substrate, the microstrip line is installed on the dielectric substrate, and the microstrip line is located on the side of the dielectric substrate facing the cover plate.

8. The microstrip-to-waveguide transition structure of claim 7, wherein, The part of the dielectric substrate located in the waveguide through hole is milled off the metal skin, or the part of the dielectric substrate located in the waveguide through hole is hollowed out.

9. A signal transmission device, characterized by comprising: The microstrip-waveguide conversion structure as claimed in any one of claims 1-8.

10. A communication device, characterized by The signal transmission device as claimed in claim 9.

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