Circuit board with high heat conductivity

Abstract

The utility model provides a circuit board with high heat conduction capacity, which comprises a core board, and the upper surface of the core board is sequentially provided with a first copper foil layer, a first tin conduction layer, a first polyimide layer, a second copper foil layer, a first solder mask layer and a nano coating waterproof layer from bottom to top. A third copper foil layer, a second tin conducting layer, a second polyimide layer, a fourth copper foil layer and a second solder mask layer are sequentially arranged on the lower surface of the core plate from top to bottom, a plurality of air holes are formed in the core plate in a penetrating mode, a latticed filler groove is formed in the upper surface of the core plate, and the latticed filler groove is filled with a heat conducting filler layer; and the heat-conducting filler layer is a graphene filler layer. And high-temperature-resistant and high-heat-dissipation functions are realized.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board technical field especially relates to a high heat conduction circuit board. BACKGROUND

[0002] CN220776137U, the authorization announcement day is April 12, 2024, and it discloses a kind of circuit board and printed circuit board, belong to printed circuit board production technical field.Circuit board includes: base layer structure, first layer structure and second layer structure, base layer structure includes first core plate and first conducting layer, first core plate one end is equipped with insulating surface, the other end is connected with first conducting layer;First layer structure includes first adhesive layer and second conducting layer, first adhesive layer one end is connected to second conducting layer, the other end is connected to first conducting layer;Second layer structure includes second adhesive layer and third conducting layer, second adhesive layer one end is connected to insulating surface, the other end is connected to third conducting layer;Wherein, the thickness of second conducting layer and third conducting layer is identical.The utility model can reduce the possibility of uneven stress of base layer structure both ends, greatly reduce the risk of warping of circuit board, improve the quality of board.In actual application process, the defects of the prior art are: low heat conduction, and it is urgent to improve. SUMMARY

[0003] Therefore, the utility model discloses a kind of high heat conduction circuit boards, with high temperature resistance and high heat dissipation function.

[0004] The utility model provides a kind of high heat conduction circuit board, including core plate, the upper surface of core plate is sequentially provided with first copper foil layer, first tin layer, first polyimide layer, second copper foil layer, first solder resist layer, nano coating waterproof layer from below to above, the lower surface of core plate is sequentially provided with third copper foil layer, second tin layer, second polyimide layer, fourth copper foil layer, second solder resist layer from above to below, core plate is provided with a plurality of gas holes, the upper surface of core plate is provided with grid filler groove, grid filler groove is filled with and is provided with heat-conducting filler layer, heat-conducting filler layer is set as graphene filler layer.

[0005] Preferably, the thickness of the core plate is set to 2mm-3mm.

[0006] Preferably, the thickness of the first copper foil layer, the second copper foil layer, the third copper foil layer and the fourth copper foil layer is set to 10Z-1.5OZ.

[0007] Preferably, the thickness of the first tin layer and the second tin layer is set to 0.015mm-0.025mm.

[0008] Preferably, the thickness of the first polyimide layer and the second polyimide layer is set to 500μm-80μm.

[0009] Preferably, the thickness of the first solder resist layer and the second solder resist layer is set to 8-10um.

[0010] Preferably, the thickness of the nano-coating waterproof layer is set to 10-15um.

[0011] The utility model discloses the beneficial effect is: the utility model discloses by core plate, first copper foil layer, first tin layer, first polyimide layer, second copper foil layer, first solder resist layer, nano-coating waterproof layer, third copper foil layer second tin layer, second polyimide layer, fourth copper foil layer, second solder resist layer, heat conduction filler layer constitutes, and the basis of multilayer structure is combined with the core plate and is provided with a plurality of gas holes, and the heat conduction filler layer is set to graphene filler layer, can realize efficient heat transfer, thereby make this structure have high heat dissipation capacity, through first polyimide layer and second polyimide layer make this structure have high temperature resistant function, through setting up nano-coating waterproof layer, make this structure have waterproof anticorrosive function. BRIEF DESCRIPTION OF DRAWINGS

[0012] Fig. 1 It is the section view of the utility model.

[0013] Fig. 2 It is the plan view of core plate (show that the grid is filled in the filler groove and sets up heat conduction filler layer).

[0014] The figure mark is: core plate 10, first copper foil layer 11, first tin layer 12, first polyimide layer 13, second copper foil layer 14, first solder resist layer 15, nano-coating waterproof layer 16, third copper foil layer 17, second tin layer 18, second polyimide layer 19, fourth copper foil layer 20, second solder resist layer 21, heat conduction filler layer 22, gas hole 23. DETAILED DESCRIPTION

[0015] In order to further understand the characteristics, technical means and specific purposes and functions reached by the utility model, the utility model is described in further detail below in combination with specific embodiments and drawings.

[0016] In the utility model, unless another explicit provision and limitation, the terms "installation", "connection", "connect", "fix" and other terms should be understood broadly, for example, can be fixed connection, can be detachable connection, or integrally connected, can be mechanical connection, can be electrical connection, can be directly connected, can be indirectly connected through intermediate medium, can be the intercommunication of two elements. For ordinary skilled in the art, the specific meaning of the above-mentioned terms in the utility model can be understood according to specific circumstances.

[0017] Please refer to Figs. 1-2The utility model provides a high heat conduction circuit board, including core board 10, the upper surface of core board 10 is sequentially provided with first copper foil layer 11, first tin layer 12, first polyimide layer 13, second copper foil layer 14, first solder resist layer 15, nanometer coating waterproof layer 16 from below to above, the lower surface of core board 10 is sequentially provided with third copper foil layer 17, second tin layer 18, second polyimide layer 19, fourth copper foil layer 20, second solder resist layer 21 from above to below, core board 10 is provided with a plurality of gas holes 23, the upper surface of core board 10 is provided with grid filler groove by laser engraving mode, and the grid filler groove is filled with heat conduction filler layer 22 by hot-pressing process, and the heat conduction filler layer 22 is provided as graphene filler layer. Core board 10, first copper foil layer 11, first tin layer 12, first polyimide layer 13, second copper foil layer 14, first solder resist layer 15, third copper foil layer 17, second tin layer 18, second polyimide layer 19, fourth copper foil layer 20, second solder resist layer 21 adopt the mode of lamination and solidification to realize the connection, after completing the production of circuit pattern, through photoetching and etching, then using the coating mode to produce first solder resist layer 15, nanometer coating waterproof layer 16 and second solder resist layer 21.

[0018] In the embodiment, the thickness of the core board 10 is set to 2mm-3mm, the thickness of the first copper foil layer 11, the second copper foil layer 14, the third copper foil layer 17 and the fourth copper foil layer 20 is set to 10OZ-1.5OZ, the thickness of the first tin layer 12 and the second tin layer 18 is set to 0.015mm-0.025mm, the thickness of the first polyimide layer 13 and the second polyimide layer 19 is set to 500μm-80μm, and the thickness of the first solder resist layer 15 and the second solder resist layer 21 is set to 8μm-10μm.

[0019] In the embodiment, the core board, the first copper foil layer, the first tin layer, the first polyimide layer, the second copper foil layer, the first solder resist layer, the nanometer coating waterproof layer, the third copper foil layer, the second tin layer, the second polyimide layer, the fourth copper foil layer, the second solder resist layer and the heat conduction filler layer are combined, a plurality of gas holes are provided in the core board, and the heat conduction filler layer is set to a graphene filler layer, so that efficient heat transfer is realized, and the structure has high heat dissipation capacity; the first polyimide layer and the second polyimide layer enable the structure to have high temperature resistance; and the nanometer coating waterproof layer enables the structure to have waterproof and corrosion-resistant functions.

[0020] The above-described embodiments only express one implementation manner of the utility model, the description is more specific and detailed, but can not therefore be understood as the limitation of the utility model patent range. It should be pointed out that for ordinary skilled person in the art, without departing from the utility model concept, a number of variations and improvements can be made, which all belong to the protection range of the utility model. Therefore, the protection range of the utility model patent should be subject to the appended claims.

Claims

1. A high thermal conductivity circuit board, comprising a core board (10), characterized in that: The upper surface of the core board (10) is provided with a first copper foil layer (11), a first tin-conducting layer (12), a first polyimide layer (13), a second copper foil layer (14), a first solder resist layer (15), and a nano-coating waterproof layer (16) from bottom to top. The lower surface of the core board (10) is provided with a third copper foil layer (17), a second tin-conducting layer (18), a second polyimide layer (19), a fourth copper foil layer (20), and a second solder resist layer (21) from top to bottom. The core board (10) is provided with a number of vent holes (23) through it. The upper surface of the core board (10) is provided with a grid-shaped filler groove, and the grid-shaped filler groove is filled with a thermally conductive filler layer (22), which is a graphene filler layer.

2. The high thermal conductivity circuit board according to claim 1, characterized in that: The thickness of the core board (10) is set to 2mm-3mm.

3. The high thermal conductivity circuit board according to claim 1, characterized in that: The thicknesses of the first copper foil layer (11), the second copper foil layer (14), the third copper foil layer (17), and the fourth copper foil layer (20) are all set to 1 oz to 1.5 oz.

4. The high thermal conductivity circuit board according to claim 1, characterized in that: The thickness of the first tin-conducting layer (12) and the second tin-conducting layer (18) is set to 0.015mm-0.025mm.

5. A high thermal conductivity circuit board according to claim 1, characterized in that: The thickness of the first polyimide layer (13) and the second polyimide layer (19) is set to 500μm-80μm.

6. A high thermal conductivity circuit board according to claim 1, characterized in that: The thickness of both the first solder mask layer (15) and the second solder mask layer (21) is set to 8μm-10μm.

7. A high thermal conductivity circuit board according to claim 1, characterized in that: The thickness of the nano-coating waterproof layer (16) is set to 10μm-15μm.

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