Limiting device and machining equipment

By combining the limiting device and the vacuuming device, the profile can be conveniently limited and quickly detached, solving the problem of cumbersome profile processing in the existing technology and improving processing efficiency and accuracy.

CN223734716UActive Publication Date: 2025-12-30LIAOYUAN SHENGYUAN NEW MATERIAL TECHNOLOGY CO LTD +1
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Patent Information

Application Number
CN202520131682.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-01-20
Publication Date
2025-12-30
Estimated Expiration
2035-01-20

AI Technical Summary

Technical Problem

In the existing technology, the bonding method used to limit the position in the profile processing is cumbersome and time-consuming, resulting in a complicated processing process and wasted time.

Method used

A limiting device is adopted, utilizing the connecting structure of the first and second spaces, combined with a vacuum device to achieve convenient limiting and detachment of the profile. The detachment of the profile is achieved by quickly releasing gas after the profile processing is completed through the vacuum device.

Benefits of technology

It simplifies the profile processing, saves time, improves processing efficiency, and ensures precise positioning and rapid release of the profile.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a limiting device and machining equipment, the limiting device comprises a main body and a limiting structure, the main body is provided with a first surface and a second surface, and the first surface is a plane; the limiting structure is arranged on the main body and comprises a first space and a second space communicated with the first space, a first opening of the first space is correspondingly located on the first surface, and a second opening of the second space is correspondingly located on the second surface; the sum of the sizes of the second spaces in the direction parallel to the first surface is smaller than the sum of the sizes of the first spaces in the direction parallel to the first surface, and the second openings are used for being connected with a vacuumizing device. The vacuumizing device vacuumizes the first space and the second space at the second opening, so that the profile located on the side of the first opening is adsorbed to the first surface of the limiting device and / or the first space, and therefore the profile is conveniently limited through vacuumizing, and after the profile is machined, the profile can be conveniently separated from the first surface of the limiting device. The finished product profile can be separated by releasing gas through the vacuumizing device, the machining process is simple, and time is saved.
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Description

Technical Field

[0001] The present disclosure relates to the field of processing technologies, and particularly to a limiting device and a processing apparatus. Background Art

[0002] During the processing of profiles, it is necessary to limit the profiles to achieve precise processing.

[0003] In the related art, the profiles are limited to the processing platform by bonding. During the bonding process, the profiles need to be adhesively set first, then force is applied to achieve firm bonding between the profiles and the processing platform. Finally, the finished profiles need to be debonded to separate from the processing platform after processing, resulting in a cumbersome processing process and wasting time. Summary of the Utility Model

[0004] The present disclosure provides a limiting device and a processing apparatus. One technical problem to be solved is that by using the limiting device, the profiles can be limited conveniently to simplify the processing process and save time.

[0005] In a first aspect, the present disclosure provides a limiting device, which may include: a main body and a limiting structure. The main body has a first surface and a second surface, and the first surface is a plane. The limiting structure is disposed on the main body and includes: a first space and a second space communicating with the first space. The first opening of the first space is correspondingly located on the first surface, and the second opening of the second space is correspondingly located on the second surface. The sum of the dimensions of the second space in the direction parallel to the first surface is smaller than the sum of the dimensions of the first space in the direction parallel to the first surface, and the second opening is used to connect a vacuum pumping device.

[0006] In some embodiments, the first surface and the second surface are distributed along a first direction; the first space and the second space are distributed along the first direction.

[0007] In some embodiments, the orthographic projection of the second space onto the first space is located within the first space.

[0008] In some embodiments, the second space includes: a third space and a fourth space; the third space extends along a second direction and communicates with the first space; the fourth space extends along a third direction and communicates with the first space; wherein, the first direction, the second direction and the third direction are perpendicular to each other pairwise.

[0009] In some embodiments, the number of the third spaces is multiple and they are parallel to each other; the fourth space passes through each of the third spaces.

[0010] In some embodiments, the contour of the second space is in the shape of a king character or an I character.

[0011] In some embodiments, the main body is rectangular in shape, and the corners of the main body are provided with arc-shaped chamfered surfaces. The outline of the first space is similar to the outline of the main body; and / or, the first surface of the main body is provided with an elastic layer, and the elastic layer is provided with clearance holes at the positions corresponding to the first space.

[0012] In a second aspect, this disclosure provides a processing device, which may include: a processing platform and a limiting device according to any embodiment of the first aspect. The processing platform is provided with a receiving through hole, and the inner wall of the receiving through hole is stepped. The main body of the limiting device is disposed on the stepped surface of the receiving through hole so as to be supported on the stepped surface, and the main body located in the receiving through hole can be fixed relative to the receiving through hole.

[0013] In some embodiments, the processing equipment may further include a vacuum device, which is disposed on one side of the main body corresponding to the second space, and the vacuum port of the vacuum device is opposite to the second opening of the second space.

[0014] In some embodiments, the processing platform is provided with a first magnetic structure; the main body is provided with a second magnetic structure that can be attracted to the first magnetic structure, and the first magnetic structure is located between the second magnetic structure and the vacuum pumping device.

[0015] Through the above technical solution, the limiting device and processing equipment provided in this disclosure have a first space with a first opening and a second space with a second opening, and the first space and the second space are connected. This allows a vacuum device to evacuate the first space and the second space through the second opening, thereby causing the profile located on the first opening side to be adsorbed onto the first surface and / or the first space of the limiting device. This facilitates the limiting of the profile through vacuuming, and after the profile processing is completed, the finished profile can be detached by releasing the gas through the vacuum device. Thus, the processing process is simple and time-saving. Furthermore, since the sum of the dimensions of the second space in the direction parallel to the first surface is less than the sum of the dimensions of the first space in the direction parallel to the first surface, the second opening is used to connect the vacuum device. This allows the gas volume to decrease and the flow rate to increase as it enters the vacuum device from the first space and the second space, enabling rapid limiting of the profile and further saving time.

[0016] The above description is only an overview of the technical solution of this disclosure. In order to better understand the technical means of this disclosure and to implement it in accordance with the contents of the specification, the preferred embodiments of this disclosure are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 Schematic diagram of the limiting device provided in this disclosure Figure 1 ;

[0019] Figure 2 Schematic diagram of the limiting device provided in this disclosure Figure 2 .

[0020] Explanation of reference numerals in the attached figures:

[0021] 1. Main body; 11. First surface; 12. Second surface; 2. Limiting structure; 21. First space; 211. First opening; 22. Second space; 221. Second opening; 222. Third space; 223. Fourth space. Detailed Implementation

[0022] The embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and examples. The detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of this disclosure by way of example, but should not be used to limit the scope of this disclosure. This disclosure can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0023] These embodiments are provided to make the disclosure thorough and complete, and to fully express the scope of the disclosure to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values ​​set forth in these embodiments should be interpreted as exemplary only and not as limiting.

[0024] It should be noted that, in the description of this disclosure, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationship, are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0025] Furthermore, the terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. "Vertical" is not strictly vertical, but within the permissible margin of error. "Parallel" is not strictly parallel, but within the permissible margin of error. Terms such as "including" or "contains" mean that the element preceding the word encompasses the element listed after the word, and do not exclude the possibility of encompassing other elements as well.

[0026] It should also be noted that, in the description of this disclosure, unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure depending on the specific circumstances. When a particular device is described as being located between a first device and a second device, an intermediary device may or may not be present between the particular device and the first or second device.

[0027] All terms used in this disclosure have the same meaning as understood by one of ordinary skill in the art to which this disclosure pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and not as idealized or highly formalized, unless expressly defined herein.

[0028] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.

[0029] During the profile processing, it is necessary to limit the profile to achieve precise processing.

[0030] In related technologies, the profile is limited by bonding with the processing platform. The bonding process requires first setting the adhesive on the profile, then applying force to achieve a firm bond between the profile and the processing platform, and finally removing the finished profile from the processing platform after processing. This results in a cumbersome and time-consuming processing process.

[0031] In view of this, the present disclosure provides a limiting device, which is provided with a first space having a first opening and a second space having a second opening, and the first space and the second space are connected, so that a vacuum device can evacuate the first space and the second space through the second opening, thereby causing the profile located on the first opening side to be adsorbed onto the first surface and / or the first space, thus conveniently limiting the profile through vacuuming. After the profile processing is completed, the finished profile can be detached by releasing the gas through the vacuum device. Thus, the processing process is simple and saves time. At the same time, since the sum of the dimensions of the second space in the direction parallel to the first surface is less than the sum of the dimensions of the first space in the direction parallel to the first surface, the second opening is used to connect the vacuum device, so that the gas volume is reduced and the flow rate is increased as it enters the vacuum device from the first space and the second space, so as to quickly limit the profile, thereby further saving time. The profile can be wood, glass, etc.

[0032] First aspect

[0033] See Figure 1 and Figure 2 As shown, the limiting device may include: a main body 1 and a limiting structure 2. The main body 1 has a first surface 11 and a second surface 12. The first surface 11 is a plane. The limiting structure 2 is disposed on the main body 1 and includes: a first space 21 and a second space 22 communicating with the first space 21. The first opening 211 of the first space 21 is located on the first surface 11, and the second opening 221 of the second space 22 is located on the second surface 12. The sum of the dimensions of the second space 22 in the direction parallel to the first surface 11 is less than the sum of the dimensions of the first space 21 in the direction parallel to the first surface 11, and the second opening 221 is used to connect a vacuum pumping device.

[0034] The main body 1 has a first surface 11 and a second surface 12. The first surface 11 and the second surface 12 can be two surfaces on the main body 1 that are opposite to each other, two surfaces that are adjacent to each other, or two surfaces that are neither opposite to each other nor adjacent to each other. The first surface 11 is a plane so that after the profile is constrained by the first surface 11, the profile can fit against the first surface 11. Compared with a non-planar setting, this can reduce the probability of the profile wobbling relative to the first surface 11, thereby ensuring the processing accuracy of the profile.

[0035] The limiting structure 2 is disposed on the main body 1 and includes a first space 21 and a second space 22 that are connected to each other. The first opening 211 of the first space 21 corresponds to the first surface 11, and the second opening 221 of the second space 22 corresponds to the second surface 12. Thus, a vacuum device can be disposed on the second surface 12 side of the main body 1. The vacuum port of the vacuum device is opposite to the second opening 221, so that the gas in the first space 21 and the second space 22 can enter the vacuum device during the vacuuming process, thereby adsorbing the profile onto the first surface 11 and / or the first space 21 of the main body 1. The sum of the dimensions of the second space 22 in the direction parallel to the first surface 11 is less than the sum of the dimensions of the second space 22 in the direction parallel to the first surface 11. In other words, the sum of the cross-sectional dimensions of the first space 21 near the profile is greater than the sum of the cross-sectional dimensions of the second space 22 near the vacuum device. Thus, as the gas enters the vacuum device from the first space 21 and the second space 22, the space for the flowing gas becomes smaller, thereby reducing the volume of the gas and increasing the flow rate. This allows for rapid positioning of the profile, further saving processing time.

[0036] See one example. Figure 1 and Figure 2 As shown, the limiting device is made of materials such as stainless steel sheet metal and wood. The limiting device can include: a main body 1 and a limiting structure 2. The main body 1 has a first surface 11 and a second surface 12 that are opposite to each other. The first surface 11 is planar. The limiting structure 2 is disposed on the main body 1 and includes: a first space 21 and a second space 22 communicating with the first space 21. The first opening 211 of the first space 21 is located on the first surface 11, and the second opening 221 of the second space 22 is located on the second surface 12. The sum of the dimensions of the second space 22 in the direction parallel to the first surface 11 is less than the sum of the dimensions of the second space 22 in the direction parallel to the first surface 11, and the second opening 221 is used to connect a vacuum device. Here, the profile can be adsorbed onto the first surface 11, or onto the first surface 11 and the first space 21, or onto the first space 21, so that profiles of different sizes and shapes can be adsorbed according to the contours of different adsorption positions.

[0037] In this embodiment, the limiting device is provided with a first space 21 having a first opening 211 and a second space 22 having a second opening 221, and the first space 21 and the second space 22 are connected, so that the vacuuming device can evacuate the first space 21 and the second space 22 through the second opening 221, thereby causing the profile located on the first opening 211 side to be adsorbed onto the first surface 11 and / or the first space 21, thus conveniently limiting the profile through vacuuming. After the profile is processed, the finished profile can be detached by releasing the gas through the vacuuming device. Thus, the processing process is simple and saves processing time. At the same time, since the sum of the dimensions of the second space 22 in the direction parallel to the first surface 11 is less than the sum of the dimensions of the first space 21 in the direction parallel to the first surface 11, the second opening 221 is used to connect the vacuuming device, so that the volume of gas decreases and the flow rate increases as the gas enters the vacuuming device from the first space 21 and the second space 22, so as to quickly limit the profile, thereby further saving processing time.

[0038] In some embodiments, see Figure 1 and Figure 2 As shown, the first surface 11 and the second surface 12 are distributed along the first direction; the first space 21 and the second space 22 are distributed along the first direction.

[0039] In other words, the first surface 11 and the second surface 12 can be two surfaces on the main body 1 that are opposite to each other, and the first space 21 is close to the first surface 11 and the second space 22 is close to the second surface 12, so that the limiting structure 2 formed by the first space 21 and the second space 22 extends as straight as possible. Compared with the setting of the limiting structure 2 with a bend, the straight extension setting can reduce the situation where the gas is resisted at the bend and the flow is not smooth during the process of vacuuming to adsorb the profile or releasing the gas to release the profile, thereby further ensuring the adsorption speed and release speed of the profile, and further saving processing time.

[0040] The first direction can be vertically downward, horizontally to the right, or other directions. For ease of explanation, this article will use vertically downward as the first direction as an example.

[0041] In some embodiments, see Figure 1As shown, the orthographic projection of the second space 22 onto the first space 21 is located within the first space 21. This ensures that the limiting structure 2 formed by the first space 21 and the second space 22 extends in a straight line. Compared to a limiting structure 2 with bends, the straight-line extension reduces the risk of gas flow obstruction at bends during vacuuming to adsorb the profile or releasing gas to release the profile. This further ensures the adsorption and release speed of the profile, thereby saving processing time.

[0042] In some embodiments, see Figure 1 and Figure 2 As shown, the second space 22 includes a third space 222 and a fourth space 223; the third space 222 extends along the second direction and is connected to the first space 21; the fourth space 223 extends along the third direction and is connected to the first space 21; wherein the first direction, the second direction and the third direction are perpendicular to each other.

[0043] Alternatively, it can be described that the third space 222 and the fourth space 223 can both be elongated and perpendicular to each other, and the thickness space containing the third space 222 and the fourth space 223 is parallel to the thickness space containing the first space 21. Simultaneously, the third space 222 and the fourth space 223 are connected to the first space 21. In this way, the gas in the first space 21 can enter the vacuum device through the third space 222 and the fourth space 223 respectively to achieve adsorption-type limiting of the profile; and the gas in the vacuum device can enter the first space 21 through the third space 222 and the fourth space 223 respectively to release the profile. Here, the third space 222 and the fourth space 223 each include portions opposite to different positions in the first space 21, so that adsorption force can be provided to the profile from multiple positions, and release force can be provided to the profile from multiple positions, thereby achieving stable adsorption and stable release of the profile.

[0044] In some embodiments, see Figure 1 and Figure 2 As shown, there are multiple third spaces 222, which are parallel to each other; the fourth space 223 passes through each third space 222.

[0045] There are multiple parallel third spaces 222, which can simultaneously provide adsorption and release forces to the positions of the first space 21 corresponding to multiple third spaces 222, thereby achieving more stable adsorption and release of the profile. The fourth space 223 passes through each third space 222. In the event of blockage in a third space 222, the fourth space 223 can provide adsorption or release forces to the profile at the position corresponding to the third space 222, thereby reducing the probability of insufficient adsorption or release forces at the profile position corresponding to the third space 222 and thus shaking.

[0046] In some embodiments, referring to Figure 1 and Figure 2 as shown, the contour of the second space 22 is in the shape of a Chinese character 'Wang' or a Chinese character 'Gong'. In the case where the contour of the second space 22 is in the shape of a Chinese character 'Wang', stable adsorption and release can be performed at at least three parallel positions of the profile; in the case where the contour of the second space 22 is in the shape of a Chinese character 'Gong', the processing time of the profile can be shortened.

[0047] In other embodiments, the second space 22 may include a plurality of fifth spaces (not shown in the figure). The plurality of fifth spaces are spaced apart from each other and are respectively connected to the first space 21, and a plurality of openings of the plurality of second spaces 22 facing away from the first space 21 form a second opening 221. The plurality of openings can be evacuated respectively through a plurality of vacuum pumping devices, so that the evacuation intensity of different second spaces 22 can be controlled separately, thereby realizing providing different adsorption forces for profiles with different thicknesses at different positions, or can be evacuated simultaneously through one vacuum pumping device.

[0048] In some embodiments, referring to Figure 1 and Figure 2 as shown, the main body 1 is in the shape of a cuboid, and the corners of the main body 1 are provided with arc chamfered surfaces. The contour of the first space 21 is similar to the contour of the main body 1; and / or, an elastic layer (not shown in the figure) is provided on the first surface 11 of the main body 1, and an avoidance hole is provided at the position of the elastic layer corresponding to the first space 21.

[0049] The outer contour in the shape of a cuboid can adapt to profiles such as cube profiles, cuboid profiles, circular plate profiles, etc. The provision of arc chamfered surfaces can reduce the chance of sharp edges scratching the profile. The contour of the first space 21 is similar to the contour of the main body 1, so that there is a visually similar beauty between the first space 21 and the main body 1. The elastic layer can buffer the profile adsorbed on the first surface 11 to reduce the chance of the profile being scratched by the first surface 11, and an avoidance hole is provided at the position of the elastic layer corresponding to the first space 21 to ensure that the vacuum pumping device can adsorb or release the profile through the limiting structure 2 and the avoidance hole.

[0050] Second aspect

[0051] The present disclosure provides a processing device, which may include: a processing platform and the limiting device in any one of the embodiments of the first aspect. The processing platform is provided with a receiving through hole, and the inner wall of one circle of the receiving through hole is in a stepped shape; the main body 1 of the limiting device is arranged on the stepped surface of one circle of the receiving through hole to be carried on the stepped surface of one circle, and the main body 1 located in the receiving through hole can be fixed relative to the receiving through hole.

[0052] The upper surface of the processing platform can extend downward to have a accommodating through hole, and its inner wall is stepped. That is, the inner diameter of the upper end of the accommodating through hole is larger than the inner diameter of the lower end of the accommodating through hole, so as to form a stepped surface at a horizontal plane in the accommodating through hole. The main body 1 of the limiting device can be supported on the stepped surface, and the main body 1 located on the stepped surface is fixed relative to the accommodating through hole.

[0053] After the main body 1 is positioned within the accommodating through hole, a circumferential surface of the main body 1 can abut against the inner wall of the accommodating through hole to reduce the probability of horizontal displacement of the main body 1, thereby ensuring the processing accuracy of the profile. The relative fixation of the main body 1 and the accommodating through hole can be achieved by fixing the main body 1 to the accommodating through hole with screws, by fixing it to the accommodating through hole with a snap-fit ​​structure, or by other means; no specific limitation is made here.

[0054] Here, before adsorbing and limiting the profile, the vacuum pumping device can be moved to the bottom of the processing platform, and then the vacuum port of the vacuum pumping device can be connected to the second opening 221 of the second space 22 to perform the vacuum operation.

[0055] In this embodiment, the processing equipment is equipped with a limiting device, which can adsorb and fix the profile by vacuuming, thereby completing the processing of the profile. After processing, the profile can be released by releasing gas through the vacuuming device. The whole process is convenient and quick.

[0056] In some embodiments, the processing equipment may further include a vacuuming device, which is disposed on one side of the main body 1 corresponding to the second space 22, and the vacuuming port of the vacuuming device is opposite to the second opening 221 of the second space 22. Thus, during the process of limiting the profile, vacuuming can be performed conveniently and quickly to adsorb the profile, and the profile can be released after processing. Compared to moving the vacuuming device to the second opening 221, this method saves time and effort.

[0057] In some embodiments, the processing platform is provided with a first magnetic structure; the main body 1 is provided with a second magnetic structure that can be attracted to the first magnetic structure, and the first magnetic structure is located between the second magnetic structure and the vacuum device.

[0058] Thus, after the limiting device is placed within the accommodating through-hole of the machining platform, the first magnetic structure and the second magnetic structure can attract each other, fixing the limiting device relative to the accommodating through-hole. The first magnetic structure is positioned between the second magnetic structure and the vacuum device, allowing the vacuum device to provide an attractive force to the limiting device. The direction of this attractive force is consistent with the direction in which the second magnetic structure on the limiting device is attracted by the first magnetic structure, further securing the limiting device relative to the accommodating through-hole. Furthermore, through the attraction of the first and second magnetic structures, and the attraction of the limiting device by the vacuum device, when the limiting device needs to be replaced or cleaned, the vacuum device releases gas to reduce the attractive force on the limiting device, allowing it to be moved away from the machining platform. This allows for convenient and quick removal of the limiting device from the machining platform. Here, both the first and second magnetic structures can be magnets.

[0059] It should be noted that the limiting device in the processing equipment provided in this disclosure is similar to the limiting device embodiments described above, and has similar beneficial effects. For technical details not disclosed in the processing equipment embodiments of this disclosure, please refer to the description of the limiting device embodiments in this disclosure for understanding; further details will not be repeated here.

[0060] The embodiments of this disclosure have now been described in detail. To avoid obscuring the concept of this disclosure, some details known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein based on the above description.

[0061] While specific embodiments of this disclosure have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of this disclosure. Those skilled in the art should understand that modifications can be made to the above embodiments or equivalent substitutions can be made to some technical features without departing from the scope and spirit of this disclosure. In particular, as long as there is no structural conflict, the technical features mentioned in the various embodiments can be combined in any manner.

Claims

1. A position limiting device, characterized by, The application relates to a limiting device, comprising: a main body (1) having a first surface (11) and a second surface (12), wherein the first surface (11) is a plane; a limiting structure (2) arranged on the main body (1) and comprising a first space (21) and a second space (22) in communication with the first space (21), wherein a first opening (211) of the first space (21) is located on the first surface (11) in correspondence, a second opening (221) of the second space (22) is located on the second surface (12) in correspondence, the sum of the sizes of the second space (22) in the direction parallel to the first surface (11) is less than the sum of the sizes of the first space (21) in the direction parallel to the first surface (11), and the second opening (221) is used for connecting a vacuumizing device.

2. The limiting device according to claim 1, wherein: the first surface (11) and the second surface (12) are distributed along a first direction; the first space (21) and the second space (22) are distributed along the first direction.

3. The limiting device according to claim 2, wherein: a positive projection of the second space (22) on the first space (21) is located in the first space (21).

4. The limiting device according to claim 3, wherein: the second space (22) comprises a third space (222) and a fourth space (223); the third space (222) extends along a second direction and is in communication with the first space (21); the fourth space (223) extends along a third direction and is in communication with the first space (21); wherein the first direction, the second direction and the third direction are perpendicular to each other.

5. The limiting device according to claim 4, wherein: the number of the third spaces (222) is plural and the third spaces (222) are parallel to each other; the fourth space (223) passes through each of the third spaces (222).

6. The limiting device according to claim 5, wherein: the contour of the second space (22) is in the shape of a Chinese character Wang or a Chinese character Gong.

7. The limiting device according to any one of claims 1 to 6, wherein: the main body (1) is in the shape of a cuboid, the corner of the main body (1) is provided with an arc-shaped chamfer surface, and the contour of the first space (21) is similar to the contour of the main body (1); and / or, the first surface (11) of the main body (1) is provided with an elastic layer, and the elastic layer is provided with a relief hole in the position corresponding to the first space (21).

8. A processing apparatus characterized by comprising: The application also relates to a machining platform, comprising: a receiving through hole, wherein the inner wall of the receiving through hole is in the shape of a step; the limiting device according to any one of claims 1 to 7, wherein the main body (1) of the limiting device is arranged on the step surface of the receiving through hole to be carried on the step surface, and the main body (1) located in the receiving through hole can be fixed relative to the receiving through hole.

9. The processing apparatus of claim 8, wherein, The application also relates to a machining platform, comprising: A vacuumizing device is arranged on one side of the main body (1) corresponding to a second space (22), and a vacuumizing port of the vacuumizing device is opposite to a second opening (221) of the second space (22).

10. The processing device according to claim 9, wherein, The processing platform is provided with a first magnetic structure; The main body (1) is provided with a second magnetic structure capable of being mutually adsorbed with the first magnetic structure, and the first magnetic structure is correspondingly located between the second magnetic structure and the vacuumizing device.