Powder atomic layer deposition equipment

Abstract

The utility model belongs to the technical field of atomic layer deposition, and relates to powder atomic layer deposition equipment, which comprises a first gas input assembly, a second gas input assembly and a third gas input assembly, the second gas input assembly is used for inputting second reaction gas; the reaction assembly is used for providing a reaction space; the reaction assembly is respectively connected with the first gas input assembly and the second gas input assembly; the heating assembly is used for heating a reaction substance in the reaction assembly; the heating assembly is arranged in the reaction assembly; the output assembly is used for outputting reaction substances in the reaction assembly; the output assembly is connected with the reaction assembly; the collecting assembly is used for collecting products; and the collecting assembly is connected with the output assembly. According to the equipment disclosed by the invention, a powder sample can be in a fluidized state under the action of airflow, gaps among particles are promoted to be opened, a precursor source is in full contact with each particle, the wrapping uniformity is ensured, and the non-uniform coating thickness is avoided.

Description

Technical Field

[0001] This utility model relates to the field of atomic layer deposition technology, and in particular to a powder atomic layer deposition device. Background Technology

[0002] Atomic layer deposition (ALD), also known as atomic layer epitaxy (ALE) or atomic layer chemical vapor deposition (ALCVD), was first proposed by Finnish scientists in 1974. It boasts advantages such as sequential deposition of single atomic layers, extremely uniform layer thickness, and high three-dimensional conformal properties, and has become a key step in the development of advanced semiconductor process technology.

[0003] In atomic layer deposition (ALD), the chemical reactions of new atomic layers are directly related to those of previous layers. ALD involves alternately introducing two or more gaseous precursor sources into a reactor, where they undergo chemisorption reactions on the substrate surface to form a deposited thin film. This is achieved by utilizing chemical bonds to alternately adsorb substances A and B, enabling surface-level reactive growth. ALD is self-limiting; within each pulse cycle, the gaseous precursor reacts only at the bonding sites of atoms on the substrate surface, precisely covering the substrate surface with saturation. This allows for repeatable atomic-layer growth over a very wide process window.

[0004] Traditional ALD deposition is generally suitable for smaller objects or substrates, while fluidized bed ALD can handle larger particles, making it suitable for samples with larger particle sizes. Its production efficiency is much higher than traditional ALD, making it suitable for large-scale industrial applications. Furthermore, it can handle various types of particles and irregularly shaped objects, making it applicable to a variety of fields such as catalysts, nanomaterials, and powder coatings. In terms of equipment manufacturing, traditional ALD requires a complex vacuum system to maintain a low-pressure environment during the reaction process, as well as precise temperature and flow control, making its operation relatively complex. Utility Model Content

[0005] In view of this, the present invention provides a powder atomic layer deposition device.

[0006] Specifically, this utility model is achieved through the following technical solution:

[0007] According to a first aspect of the present invention, a powder atomic layer deposition apparatus is provided, comprising:

[0008] The first gas input component is used to input the first reaction gas;

[0009] The second gas input component is used to input the second reaction gas;

[0010] A reaction assembly for providing a reaction space; the reaction assembly is connected to the first gas input assembly and the second gas input assembly respectively.

[0011] A heating component is used to heat the reactants inside the reaction assembly; the heating component is disposed within the reaction assembly.

[0012] An output component is used to output the reactants inside the reaction assembly; the output component is connected to the reaction assembly.

[0013] A collection component is used to collect the generated products; the collection component is connected to the output component.

[0014] Optionally, the first gas input component includes a first pipe and a first precursor source bottle, wherein the outlet of the first pipe is connected to the reaction component, and the first precursor source bottle is connected to the first pipe.

[0015] Optionally, the first gas input component further includes a first regulating valve, which is disposed on the first pipeline.

[0016] Optionally, the second gas input component includes: a second pipe and a second precursor source bottle, wherein the outlet of the second pipe is connected to the reaction component, and the second precursor source bottle is connected to the second pipe.

[0017] Optionally, the second gas input component further includes a second regulating valve, which is disposed on the second pipeline.

[0018] Optionally, the reaction assembly includes a fluidized bed and a gas distribution plate. The bottom end of the fluidized bed is connected to the outlet of the first pipe in the first gas input assembly and the outlet of the second pipe in the second gas input assembly, respectively. The top end of the fluidized bed is connected to the inlet of the gas-solid separator in the output assembly. A storage bin is formed inside the bottom end of the fluidized bed. The gas distribution plate is disposed inside the fluidized bed and is higher than the storage bin. An inlet is provided on the bottom sidewall of the fluidized bed. The inlet is connected to the storage bin and is lower than the gas distribution plate.

[0019] Optionally, the heating assembly includes a heating element disposed on the inner wall of the fluidized bed in the reaction assembly.

[0020] Optionally, the output component includes a gas-solid separator and a vacuum pump, wherein the inlet of the gas-solid separator is connected to the fluidized bed in the reaction component, the outlet of the gas-solid separator is connected to the collection component, the outlet of the gas-solid separator is open to the air, and the gas-solid separator is connected to the vacuum pump.

[0021] Optionally, the output component further includes a discharge lock, which is disposed at the inlet of the gas-solid separator.

[0022] Optionally, the collection component includes a collection chamber connected to the outlet of the gas-solid separator in the output component.

[0023] The technical solution provided by this utility model brings at least the following beneficial effects:

[0024] The powder atomic layer deposition equipment provided in this application allows powder samples to be fluidized under the action of airflow, promoting the opening of gaps between particles, enabling the precursor source and each particle to fully contact, ensuring the uniformity of coating, and avoiding uneven coating thickness. Attached Figure Description

[0025] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.

[0026] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of a powder atomic layer deposition apparatus provided in an embodiment of the present invention. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0029] Figure 1 The illustration schematically depicts a powder atomic layer deposition apparatus suitable for embodiments of the present invention.

[0030] Reference Figure 1 As shown, this application provides a powder atomic layer deposition apparatus, comprising:

[0031] The first gas input component 10 is used to input the first reaction gas;

[0032] The second gas input component 20 is used to input the second reaction gas;

[0033] A reaction assembly 30 is used to provide a reaction space; the reaction assembly 30 is connected to the first gas input assembly 10 and the second gas input assembly 20 respectively.

[0034] A heating component 40 is used to heat the reaction substances inside the reaction component 30; the heating component 40 is disposed in the reaction component 30;

[0035] Output component 50 is used to output the reactants inside the reaction component 30; the output component 50 is connected to the reaction component 30.

[0036] A collection component 60 is used to collect the generated products; the collection component 60 is connected to the output component 50.

[0037] In this embodiment, the powder particles to be coated are placed in the reaction assembly 30. A first reaction gas and a second reaction gas are input into the reaction assembly 30 through a first gas input assembly 10 and a second gas input assembly 20, respectively. Then, a heating assembly 40 heats the powder particles, the first reaction gas, and the second reaction gas. The reactants are output through an output assembly 50, the reacted gases are discharged, and the reacted products are stored in a collection assembly 60. The powder atomic layer deposition equipment provided in this embodiment demonstrates significant inventiveness in its structural design and functional implementation, specifically in the following aspects:

[0038] 1. Modular and integrated design

[0039] Modular Design: The device is cleverly divided into multiple functional components, including modules for gas input, reaction, heating, output, and collection. This design not only improves the maintainability and scalability of the device but also makes the connections between components more flexible and efficient. Integrated Design: The heating component 40 is directly installed inside the reaction component 30, achieving a tight integration of the reaction space and the heating source. This design not only reduces energy loss but also improves heating efficiency and reaction rate.

[0040] 2. Precise gas control and reaction management

[0041] Dual gas input system: Through the first gas input component 10 and the second gas input component 20, the input amount and timing of the two reactive gases can be precisely controlled, thereby achieving precise control of the reaction process. Optimization of reaction components: The reaction component 30 not only provides sufficient reaction space, but also ensures uniform distribution of reactive gases and effective reaction through a reasonable structural design.

[0042] 3. Efficient reactant processing and collection

[0043] Flexibility of the output component: The output component 50 can efficiently output the reactants while maintaining stable pressure inside the reaction component 30, enabling continuous reactions. Practicality of the collection component: The collection component 60 can easily collect the reactants, avoiding waste and pollution, and improving the overall efficiency of the equipment.

[0044] 4. Innovation in the coating process

[0045] Powder particle coating: This invention is the first to use powder particles as the coating target, achieving high-quality coating of powder particles through atomic layer deposition (ALD) technology. This method not only improves the uniformity and adhesion of the coating but also expands the application fields of ALD technology.

[0046] 5. Potential for Automation and Intelligence

[0047] Potential for automated control: Although not explicitly shown in the figures, the device structure of this invention offers the possibility of automated control. By introducing intelligent components such as sensors and controllers, real-time monitoring and precise control of the equipment's operating status can be achieved, further improving the equipment's production efficiency and product quality.

[0048] In summary, the powder atomic layer deposition equipment provided in this application demonstrates significant ingenuity in both structural design and functional implementation. This equipment not only improves the efficiency and quality of the coating process but also expands the application areas of atomic layer deposition technology, possessing broad market prospects and practical value.

[0049] For example, the first gas input component 10 includes a first pipe 11 and a first precursor source bottle 12, wherein the outlet of the first pipe 11 is connected to the reaction component 30, and the first precursor source bottle 12 is connected to the first pipe 11.

[0050] In this embodiment of the application, inert gas is transported to the reaction assembly 30 through the first pipe 11. When the inert gas flows through the first pipe 11, the first precursor source bottle 12 is also carried into the reaction assembly 30 by the inert gas.

[0051] For example, the first gas input component 10 further includes a first regulating valve 13, which is disposed on the first pipe 11.

[0052] In this embodiment, the first regulating valve 13 is used to regulate the flow rate of the first pipe 11.

[0053] For example, the second gas input component 20 includes a second pipe 21 and a second precursor source bottle 22, wherein the outlet of the second pipe 21 is connected to the reaction component 30, and the second precursor source bottle 22 is connected to the second pipe 21.

[0054] In this embodiment, the oxygen source is transported to the reaction assembly 30 through the second pipe 21. When the oxygen source flows through the second pipe 21, the second precursor source bottle 22 is also carried into the reaction assembly 30 through the oxygen source.

[0055] For example, the second gas input component 20 further includes a second regulating valve 23, which is disposed on the second pipe 21.

[0056] In this embodiment, the second regulating valve 23 is used to regulate the flow rate of the second pipe 21.

[0057] For example, the reaction assembly 30 includes a fluidized bed 31 and a gas distribution plate 32. The bottom end of the fluidized bed 31 is connected to the outlet of the first pipe 11 in the first gas input assembly 10 and the outlet of the second pipe 21 in the second gas input assembly 20, respectively. The top end of the fluidized bed 31 is connected to the inlet of the gas-solid separator 51 in the output assembly 50. A storage silo 33 is formed inside the bottom end of the fluidized bed 31. The gas distribution plate 32 is disposed inside the fluidized bed 31 and is higher than the storage silo 33. An inlet 34 is provided on the bottom sidewall of the fluidized bed 31. The inlet 34 is connected to the storage silo 33 and is lower than the gas distribution plate 32.

[0058] In this embodiment, the powder particles to be coated enter the storage silo 33 through inlet 34. When the fluid in the first pipe 11 and the second pipe 21 flows through the storage silo 33, it carries the powder particles to the central space of the fluidized bed 31. When the fluid in the first pipe 11 and the second pipe 21 flows through the gas distribution plate 32, the gas distribution plate 32 can make the fluid flow rate uniform and stable, preventing chaotic fluid from impacting the powder. The heating component 40 in the central space of the fluidized bed 31 heats the reactants, promotes the reaction, and produces the products.

[0059] For example, the heating assembly 40 includes a heating element 41, which is disposed on the inner sidewall of the fluidized bed 31 in the reaction assembly 30.

[0060] In this embodiment, the heating element 41 is arranged on the inner wall of the fluidized bed 31, which can generate heat in the surrounding space to heat the fluid input into the first pipe 11 and the second pipe 21 as well as the powder particles to be coated, thereby accelerating the reaction.

[0061] For example, the output component 50 includes a gas-solid separator 51 and a vacuum pump 52, wherein the inlet of the gas-solid separator 51 is connected to the fluidized bed 31 in the reaction component 30, the outlet of the gas-solid separator 51 is connected to the collection component 60, the outlet of the gas-solid separator 51 is open to the air, and the gas-solid separator 51 is connected to the vacuum pump 52.

[0062] In this embodiment of the application, the vacuum pump 52 can create a vacuum inside the gas-solid separator 51. The reacted gas and products are separated by the gas-solid separator 51. The solid products enter the collection assembly 60 through the outlet of the gas-solid separator 51, and the gaseous unreacted gas is discharged through the outlet of the gas-solid separator 51.

[0063] For example, the output component 50 further includes a discharge lock 53, which is disposed at the inlet of the gas-solid separator 51.

[0064] In this embodiment, the discharge lock 53 is used to open or close the connection between the gas-solid separator 51 and the fluidized bed 31.

[0065] For example, the collection component 60 includes a collection chamber 61, which is connected to the outlet of the gas-solid separator 51 in the output component 50.

[0066] In this embodiment of the application, the solid product enters the collection chamber 61 through the outlet of the gas-solid separator 51 for collection.

[0067] In this embodiment, the powder particles to be coated are added from inlet 34 into storage silo 33. Storage silo 33 contains a heater set to a specific heating temperature. The powder sample is allowed to stand for a period of time to ensure it reaches the required temperature. Simultaneously, the heating element 41 inside the fluidized bed 31 is also set to the appropriate temperature. A gas distribution plate 32 of suitable size is installed above storage silo 33. After coating begins, the flow rate of nitrogen gas is controlled by the first regulating valve 13 and the second regulating valve 23 connected to storage silo 33. After the particles are blown into the fluidized bed 31, the manual valves of the first precursor source bottle 12 and the second precursor source bottle 22 are opened, and nitrogen gas sequentially carries the precursor sources from the precursor sources into the fluidized bed 31 to begin coating. During the reaction, the discharge lock 53 at the lower end of the gas-solid separator 51 is locked to prevent uncoated solid particles from entering the gas-solid separator 51. After the particles complete the corresponding number of ALD cycles, the discharge lock 53 of the gas-solid separator 51 is opened, and the manual valves of the first precursor source bottle 12 and the second precursor source bottle 22 are closed. Nitrogen gas continues to be introduced into the fluidized bed 31 chamber to accelerate the entry of solid particles into the gas-solid separator 51. After passing through the gas-solid separator 51, the coated particles are separated into the collection bin 61, and excess gas is discharged. The connection between the storage bin 33 and the fluidized bed 31 can be disassembled to allow for the installation of gas distribution plates 32 of different sizes.

[0068] The powder atomic layer deposition equipment provided in this application is innovative not only in the ingenious design of its overall architecture, but also in the meticulous optimization and functional synergy of its various components:

[0069] 1. Innovative design of the gas input component

[0070] Integration of precursor source bottles and pipelines: Both the first gas input assembly 10 and the second gas input assembly 20 cleverly combine the precursor source bottles (12, 22) and pipelines (11, 21), achieving stable delivery of the precursor gas. This design not only simplifies the equipment structure but also improves the utilization efficiency of the precursor gas. Introduction of regulating valves: The setting of the first regulating valve 13 and the second regulating valve 23 enables precise control of the gas flow rate, thereby ensuring the stability and repeatability of the reaction process.

[0071] 2. Innovation of reaction components

[0072] The combination of fluidized bed and gas distribution plate: The ingenious combination of fluidized bed 31 and gas distribution plate 32 in reaction assembly 30 achieves uniform distribution of powder particles and efficient reaction in the reaction space. Gas distribution plate 32 can balance and stabilize fluid flow rate, preventing chaotic fluid from impacting the powder, thereby improving reaction efficiency and coating quality. Storage silo design: The storage silo 33 not only facilitates the storage and preheating of powder particles, but also connects to fluidized bed 31 through inlet 34 below, realizing continuous conveying and reaction of powder particles.

[0073] 3. High-efficiency utilization of heating components

[0074] The ingenious arrangement of the heating elements: The heating elements 41 in the heating assembly 40 are arranged on the inner wall of the fluidized bed 31, which can generate heat in the surrounding space and uniformly heat the fluid and powder particles, thereby accelerating the reaction process.

[0075] 4. Intelligent design of output components

[0076] Synergy between the gas-solid separator and the vacuum pump: The gas-solid separator 51 and the vacuum pump 52 in the output assembly 50 work together to achieve effective separation of the gas and products after the reaction. The gas-solid separator 51 can separate the solid products, while the vacuum pump 52 can create a vacuum environment to accelerate the discharge of gas. Introduction of the discharge lock: The discharge lock 53 ensures the stability of the coating process. During the coating process, the discharge lock 53 is locked to prevent uncoated solid particles from entering the gas-solid separator 51. After the coating is completed, the discharge lock 53 is opened, allowing the coated particles to enter the collection assembly 60.

[0077] 5. The usability of the collected components

[0078] Convenient collection: The collection chamber 61 in the collection assembly 60 is connected to the outlet of the gas-solid separator 51, enabling convenient collection of coated particles. This design not only improves collection efficiency but also avoids waste and pollution of the generated products.

[0079] 6. Automation and intelligentization of the overall process

[0080] Potential for automated control: Although not explicitly shown in the figures, the structure of this invention provides ample room for automated control. By introducing intelligent components such as sensors and controllers, real-time monitoring and precise control of the equipment's operating status can be achieved, thereby further improving production efficiency and product quality.

[0081] In summary, the powder atomic layer deposition (ALD) equipment provided in this application demonstrates significant innovation in all aspects, including gas input, reaction, heating, output, and collection. This equipment not only improves the efficiency and quality of the coating process but also expands the application fields of ALD technology, possessing broad market prospects and practical value. Furthermore, its modular, integrated, and intelligent design concept provides unlimited possibilities for future equipment upgrades and expansions. The powder ALD equipment provided in this application allows powder samples to be fluidized under the action of airflow, promoting the opening of gaps between particles, ensuring sufficient contact between the precursor source and each particle, guaranteeing uniform coating, and avoiding uneven coating thickness.

[0082] It should be noted that in this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are mainly for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0083] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0084] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0085] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0086] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A powder atomic layer deposition apparatus, characterized by, The application relates to a reaction device for preparing nanometer materials, which comprises the following components: a first gas input component for inputting a first reaction gas; a second gas input component for inputting a second reaction gas; a reaction component for providing a reaction space, which is connected with the first gas input component and the second gas input component respectively; a heating component for heating reaction substances in the reaction component, which is arranged in the reaction component; an output component for outputting the reaction substances in the reaction component, which is connected with the reaction component; a collection component for collecting products, which is connected with the output component.

2. The powder atomic layer deposition apparatus according to claim 1, characterized by The first gas input component comprises a first pipeline and a first precursor source bottle, wherein the gas outlet of the first pipeline is connected with the reaction component, and the first precursor source bottle is connected with the first pipeline.

3. The powder atomic layer deposition apparatus according to claim 2, characterized by The first gas input component further comprises a first adjusting valve arranged on the first pipeline.

4. The powder atomic layer deposition apparatus of claim 1, wherein, The second gas input component comprises a second pipeline and a second precursor source bottle, wherein the gas outlet of the second pipeline is connected with the reaction component, and the second precursor source bottle is connected with the second pipeline.

5. The powder atomic layer deposition apparatus according to claim 4, characterized by The second gas input component further comprises a second adjusting valve arranged on the second pipeline.

6. The powder atomic layer deposition apparatus of claim 1, wherein, The reaction component comprises a fluidized bed and a gas distribution plate, the bottom end of the fluidized bed is connected with the gas outlets of the first pipeline in the first gas input component and the second pipeline in the second gas input component respectively, the top end of the fluidized bed is connected with the feeding port of a gas-solid separator in the output component, the bottom end of the fluidized bed forms a storage bin inside, the gas distribution plate is arranged in the fluidized bed and is higher than the storage bin, the sidewall of the bottom end of the fluidized bed is provided with an inlet connected with the storage bin and lower than the gas distribution plate.

7. The powder atomic layer deposition apparatus of claim 1, wherein, The heating component comprises a heating sheet arranged on the inner sidewall of the fluidized bed in the reaction component.

8. The powder atomic layer deposition apparatus of claim 1, wherein, The output component comprises a gas-solid separator and a gas suction pump, wherein the feeding port of the gas-solid separator is connected with the fluidized bed in the reaction component, the discharging port of the gas-solid separator is connected with the collection component, the gas outlet of the gas-solid separator is open to the air, and the gas-solid separator is connected with the gas suction pump.

9. The powder atomic layer deposition apparatus according to claim 8, characterized by The output component further comprises a discharging lock arranged at the feeding port of the gas-solid separator.

10. The powder atomic layer deposition apparatus of claim 1, wherein, The collection component comprises a collection bin connected with the discharging port of the gas-solid separator in the output component.

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