Full-automatic wafer measuring equipment

Abstract

The utility model discloses a full-automatic wafer measuring device. The full-automatic wafer measuring device comprises a base; the outer cover is mounted on the base, and the outer cover and the base form a closed detection chamber; the feeding and discharging module is arranged on the front side of the outer cover, the feeding and discharging module is provided with a feeding and discharging chamber and a door, the feeding and discharging chamber and the detection chamber are communicated through an opening formed in the outer cover, a taking and placing opening is formed in the front side of the feeding and discharging chamber, and the door is used for opening and closing the taking and placing opening; the carrying module is positioned in the detection chamber and is mounted on the base; the edge-finding photographing module is positioned in the detection chamber and is mounted on one side of the carrying module; the measuring module is positioned in the detection chamber and is mounted on the other side of the carrying module; and the control box is electrically connected with the feeding and discharging module, the carrying module, the edge-searching photographing module and the measuring module. The full-automatic wafer measuring equipment is high in integration level, compact and simple in structure, easy to maintain, small in occupied space and simple to operate.

Description

TECHNICAL FIELD

[0001] The utility model relates to the measurement technical field especially relates to a full -automatic wafer measuring equipment. BACKGROUND

[0002] The geometric parameter (such as three-dimensional topography, thickness etc.) of wafer is the key index of measuring wafer quality, and its accurate measurement is the important link in the semiconductor manufacturing process. At present, the semiconductor industry generally adopts semi-automatic measuring equipment to carry out wafer detection. However, in the process of using semi-automatic equipment, since the wafer needs to be manually carried, the following problems exist:

[0003] 1. the wafer is prone to knock damage in the manual carrying process;

[0004] 2. manual operation increases the risk of dust pollution;

[0005] 3. manual intervention reduces the detection efficiency.

[0006] To solve the above problems, full-automatic wafer measuring equipment emerges as the times require. Compared with semi-automatic equipment, full-automatic measuring equipment can significantly reduce the interference of human factors, not only can better guarantee the cleanliness and integrity of the wafer, but also can improve the detection efficiency.

[0007] However, the existing full-automatic wafer measuring equipment still has certain limitations. Such equipment is usually composed of upper and lower feeding modules, edge finder modules, wafer test modules and carrying modules and other functional units. Due to the irregular size of each module, when the system is integrated, it often leads to too large floor area of the whole machine, which is not conducive to the optimization of production line layout and space utilization. UTILITY MODEL CONTENT

[0008] Therefore, it is necessary to provide a full-automatic wafer measuring equipment to realize the miniaturization design of the equipment while ensuring the measurement accuracy and automation degree in view of the problems of the prior art.

[0009] A full-automatic wafer measuring equipment comprises:

[0010] a base;

[0011] an outer cover mounted on the base and forming a closed detection chamber with the base;

[0012] an upper and lower feeding module arranged on the front side of the outer cover, the upper and lower feeding module having an upper and lower feeding chamber and a door, the upper and lower feeding chamber and the detection chamber being communicated through an opening arranged on the outer cover, the front side of the upper and lower feeding chamber being provided with a taking and placing opening, and the door being used for opening and closing the taking and placing opening;

[0013] a carrying module located in the detection chamber and mounted on the base;

[0014] An edge searching and photographing module is located in the detection chamber and is installed on one side of the conveying module.

[0015] A measuring module is located in the detection chamber and is installed on the other side of the conveying module.

[0016] A control box is electrically connected with the feeding and discharging module, the conveying module, the edge searching and photographing module, and the measuring module.

[0017] In one of the embodiments, the base is a rectangular structure extending along the X-axis and Y-axis directions, and the edge searching and photographing module, the conveying module, the measuring module, and the control box are arranged along the length direction of the base.

[0018] In one of the embodiments, the feeding and discharging module comprises:

[0019] A bottom plate extending along the X-axis and Y-axis directions;

[0020] An outer cover installed on the base and forming a feeding and discharging chamber with the bottom plate, and the outer cover is provided with the taking and placing opening;

[0021] A positioning mechanism arranged on the bottom plate, the positioning mechanism comprising at least two front end positioning blocks and at least one rear end positioning block, the at least two front end positioning blocks and the at least one rear end positioning block being arranged at intervals along the Y-axis direction, each of the front end positioning blocks having left and right positioning steps arranged at intervals along the X-axis direction, and the interval between the left and right positioning steps of the front end positioning block in front being greater than the interval between the left and right positioning steps of the front end positioning block behind along the direction from front to back.

[0022] In one of the embodiments, the front end positioning block comprises a left front end positioning block and a right front end positioning block, the left front end positioning block and the right front end positioning block being respectively fixed on the bottom plate, and the left and right positioning steps being respectively arranged on the left front end positioning block and the right front end positioning block.

[0023] In one of the embodiments, the feeding and discharging module further comprises a size detection mechanism comprising a telescopic pin and a position detection sensor, the telescopic pin being installed in the mounting hole of the bottom plate and being capable of telescopic movement up and down along the Z-axis direction, and the position detection sensor being used for detecting the displacement state of the telescopic pin.

[0024] In one of the embodiments, the feeding and discharging module further comprises an alignment detection mechanism comprising an alignment detection sensor and a reflecting member, the alignment detection sensor being installed on the bottom plate, and the reflecting member being located above the alignment detection sensor and being used for emitting detection light along the Z-axis direction.

[0025] In one of the embodiments, the loading and unloading module further comprises a wafer detection mechanism, which comprises a reflective photoelectric sensor and a lifting mechanism, the reflective photoelectric sensor is used to detect whether the wafer in the wafer rack is placed at a designated position, and the lifting mechanism is used to drive the reflective photoelectric sensor to move up and down along the Z-axis direction.

[0026] In one of the embodiments, the lifting mechanism comprises a mounting rod and a screw rod mechanism, the mounting rod is used to mount the reflective photoelectric sensor, and the screw rod mechanism comprises a screw rod extending along the Z-axis direction and a sliding block threadedly matched with the screw rod, and the sliding block is connected with the mounting rod.

[0027] In one of the embodiments, one end of the door is pivotally connected with the outer cover, and a lock is arranged between the other end of the door and the bottom plate.

[0028] In one of the embodiments, a door detection mechanism is arranged between the front end of the door and the bottom plate, and is used to detect whether the door is closed.

[0029] The full-automatic wafer measuring device, the loading and unloading module, the carrying module, the edge searching and photographing module, the measuring module and the control box are all mounted on the base, so that the device has high integration, compact and simple structure, is easy to maintain, occupies small space and is easy to operate. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 It is a perspective view of the full-automatic wafer measuring device in one of the embodiments of the utility model;

[0031] Figure 2 It is a perspective view of the full-automatic wafer measuring device in one of the embodiments of the utility model; Figure 1

[0032] It is a perspective view of the full-automatic wafer measuring device in one of the embodiments of the utility model; Figure 3 Figure 1 It is a perspective view of the full-automatic wafer measuring device in one of the embodiments of the utility model;

[0033] Figure 4 Figure 1 It is a perspective view of the full-automatic wafer measuring device in one of the embodiments of the utility model;

[0034] Figure 5 It is a perspective view of the full-automatic wafer measuring device in one of the embodiments of the utility model; Figure 4

[0035] , Figure 6 It is a perspective view of the full-automatic wafer measuring device in one of the embodiments of the utility model; 7 Figure 4 It is a perspective view of the full-automatic wafer measuring device in one of the embodiments of the utility model;

[0036] Figure 8 Figure 1 It is a perspective view of the full-automatic wafer measuring device in one of the embodiments of the utility model; ​​​​

[0037] Reference signs:

[0038] 1, base;

[0039] 2, cover; 201, front side opening; 202, front side plate;

[0040] 3, feeding and discharging module; 301, feeding and discharging chamber; 302, door; 303, bottom plate; 304, first side plate; 305, second side plate; 306, cross beam; 307, electromagnetic lock; 308, left front end positioning block; 308a, left positioning step; 309, right front end positioning block; 309a, right positioning step; 310, rear end positioning block;

[0041] 311, reflected photoelectric sensor; 312, mounting rod; 313, lead screw; 314, sliding block;

[0042] 316, telescopic pin; 317, in-place detection sensor;

[0043] 320, alignment detection sensor; 321, reflecting member;

[0044] 4, edge searching and photographing module; 401, edge searcher; 402, wafer bracket; 403, lens; 404, camera; 405, cushion block; 406, air cylinder; 407, light source;

[0045] 5, measurement module;

[0046] 6, carrying module; 601, mechanical hand; 602, base table;

[0047] 8, wafer rack;

[0048] 9, wafer;

[0049] 10, control box. DETAILED DESCRIPTION

[0050] In order to make the above-mentioned purposes, features and advantages of the present application more apparent, clear and understandable, the specific embodiments of the present application will be described in detail below with reference to the drawings. Obviously, the specific details described below are only part of the embodiments of the present application, and the present application can also be implemented in many other embodiments different from those described herein. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor shall fall within the protection scope of the present application.

[0051] In this document, when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can also be present. The relative terms "front", "back", "upper", "lower", etc. are used to describe the orientation of the components in the drawings and are not intended to be limiting as to the scope of the present application.

[0052] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0053] Referring to Figure 1 , the wafer measuring device in one embodiment of the present application comprises a base 1, a loading and unloading module 3, an edge finding and photographing module 4, a measuring module 5, a carrying module 6, a control box 10 and an outer cover 2. For the purpose of illustration, a three-dimensional coordinate system is defined in this embodiment, in which the X-axis and Y-axis represent two orthogonal directions of the horizontal plane, and the Z-axis represents the vertical direction. The coordinate system is used to accurately describe the spatial positional relationship and movement direction of each component.

[0054] Base

[0055] The base 1 in this embodiment adopts a rectangular structure design extending along the X-axis and Y-axis directions, and its main function is to provide a stable support platform for the entire wafer measuring device. The outer cover 2 is fixedly installed on the base 1, and forms a closed detection chamber through close cooperation. The edge finding and photographing module 4, the measuring module 5, the carrying module 6 and the control box 10 are all installed on the base 1 and located within the closed space. The front side plate 202 of the outer cover 2 is provided with at least one front side opening 201, which is mainly used for the loading and unloading operation of the wafer 9.

[0056] Loading and unloading module

[0057] As shown in Figures 1-3 , the loading and unloading module 3 is arranged at the front side of the outer cover 2, and its position is opposite to the front side opening 201 of the outer cover 2. It is mainly used to realize the loading and unloading of the wafer rack 8. The loading and unloading module 3 is provided with a loading and unloading chamber 301 and a door 302. The loading and unloading chamber 301 is in communication with the front side opening 201, and the front side of the loading and unloading chamber 301 is provided with a taking and placing opening for the loading and unloading operation of the wafer rack 8. The door 302 is arranged at the taking and placing opening, and is used to open and close the taking and placing opening to realize the sealing of the loading and unloading chamber 301.

[0058] Specifically, as shown in Figures 3-7As shown, the feeding and discharging module 3 includes a bottom plate 303, a first side plate 304 and a second side plate 305. The bottom plate 303 is a rectangular structure extending along the X-axis and Y-axis directions, serving as the base platform of the entire feeding and discharging module 3 for supporting the installation of all other components. The rear end of the bottom plate 303 is fixed to the front side plate 202 of the outer cover 2, ensuring the stability of the entire feeding and discharging module 3. The first side plate 304 and the second side plate 305 are perpendicular to the bottom plate 303, arranged along the X-axis direction, and parallel to the plane defined by the Z-axis and Y-axis. The lower end of the first side plate 304 and the second side plate 305 is fixed to the bottom plate 303, and the rear end is fixed to the front side plate 202 of the outer cover 2, thereby ensuring the overall stability and structural rigidity of the feeding and discharging module 3. Preferably, the feeding and discharging module 3 further includes a crossbeam 306 extending along the X direction, and the two ends of the crossbeam 306 are respectively fixed to the upper ends of the first side plate 304 and the second side plate 305, forming an upper support structure. The design of the crossbeam 306 enhances the rigidity of the feeding and discharging module 3 in the X-axis direction, effectively supporting the door 302 and other components. The rear end of the door 302 is pivotally connected to the crossbeam 306, which facilitates the opening and closing of the door 302.

[0059] In one embodiment, the front end of the door 302 is provided with an electromagnetic lock 307 for ensuring the locked state of the door 302 during equipment operation, preventing the door 302 from being accidentally opened and interfering with normal operation. In one embodiment, a door detection mechanism is provided between the front end of the door 302 and the bottom plate 303 for detecting whether the door is closed. The door detection mechanism includes a door detection sensor, which can be a photoelectric sensor, a magnetic force sensor, a proximity sensor, etc., capable of accurately sensing the position change of the door 302. When the door 302 is completely closed, the door detection sensor can detect the corresponding signal and feedback the state of the door 302 to the control system.

[0060] In one embodiment, the feeding and discharging module 3 further includes a positioning mechanism for accurately fixing the wafer rack 8. The positioning mechanism ensures the stable and accurate positioning of the wafer rack 8 in the X-axis and Y-axis directions for subsequent measurement or handling operations. As an example, the positioning mechanism includes front end positioning blocks 308, 309 and a rear end positioning block 310, which are arranged in front of and behind each other along the Y-axis direction. The front end positioning blocks 308, 309 have left and right positioning steps 308a, 309a arranged along the X-axis direction. The wafer rack 8 has a bottom groove (not shown in the figure) extending along the Y-axis direction, and the left and right positioning steps 308a, 309a are inserted into the front end of the bottom groove and cooperate with the steps on the left and right sides of the bottom groove opening, respectively. The front end face of the rear end positioning block 310 is in contact with the rear side of the lower end of the wafer rack 8. By positioning the wafer rack 8 in the X-axis and Y-axis directions through the front end positioning blocks and the rear end positioning block 310, the wafer rack 8 is prevented from shifting or shaking.

[0061] As an example, the front end positioning blocks 308, 309 include a left front end positioning block 308 and a right front end positioning block 309, which are respectively fixed on the bottom plate 303, and the left front end positioning block 308 and the right front end positioning block 309 are respectively provided with a left positioning step 308a and a right positioning step 309a. In this way, the front end positioning blocks require less material and are convenient to process.

[0062] As an example, the front end positioning blocks 308, 309 are multiple, and the multiple front end positioning blocks 308, 309 are arranged at intervals along the Y-axis direction, and the front end positioning blocks are arranged from front to back, and the distance between the left positioning step 308a and the right positioning step 309a of the front one of the front end positioning blocks is greater than the distance between the left positioning step 308a and the right positioning step 309a of the rear one of the front end positioning blocks. This design allows the positioning mechanism to adapt to different specifications of the wafer rack 8, such as 2 inches, 4 inches, 6 inches, etc., and has a wide adaptation range.

[0063] The working principle of the positioning mechanism in the embodiment is as follows:

[0064] As shown in Figure 5 , 6 , during operation of the equipment, the wafer rack 8 is placed into the loading and unloading module 3. The front end of the bottom groove of the wafer rack 8 is precisely clamped into the left positioning step 308a of the left front end positioning block 308 and the right positioning step 309a of the right front end positioning block 309, and the rear side of the lower end of the wafer rack 8 cooperates with the front side of the rear end positioning block 310, thereby realizing positioning of the wafer rack 8 in the X-axis and Y-axis directions. Moreover, it can adapt to different specifications of the wafer rack 8, such as 2 inches, 4 inches, 6 inches, etc.

[0065] In one embodiment, the loading and unloading module 3 further includes a wafer detection mechanism for detecting whether the wafer placement position in the wafer rack 8 is empty, i.e., confirming whether the wafer rack 8 correctly places a wafer. The wafer detection mechanism includes a reflective photoelectric sensor 311 and a lifting mechanism, and the reflective photoelectric sensor 311 is used to detect whether the wafer in the wafer rack 8 is placed at a designated position. The working principle is that the reflective photoelectric sensor 311 emits a light signal, and if the wafer 9 is correctly placed in the wafer rack 8, the surface of the wafer 9 will reflect the light signal back to the sensor, and the strength or change of the reflected signal can indicate the position of the wafer 9. If there is no wafer 9 in the wafer rack 8, the sensor will not receive the reflected signal, thereby judging that the wafer rack 8 is empty. The lifting mechanism is used to drive the reflective photoelectric sensor 311 to move up and down along the Z-axis direction, thereby being able to detect each placement position in the wafer rack 8. As an example, the lifting mechanism includes a mounting rod 312 and a lead screw mechanism, the mounting rod 312 is used to mount the reflective photoelectric sensor 311, and the lead screw mechanism 313 includes a lead screw 313 extending along the Z-axis direction and a sliding block 314 threadedly cooperating with the lead screw, and the sliding block 314 is connected with the mounting rod 312.

[0066] In one embodiment, the loading and unloading module 3 further comprises at least two size detection mechanisms for detecting the size specification of the wafer rack. Each size detection mechanism comprises a retractable pin 316 and a position detection sensor 317. The retractable pin 316 is installed in a mounting hole of the bottom plate 303 and can move up and down along the Z-axis direction. When a wafer rack 8 of a specific size is placed, the bottom of the wafer rack 8 will contact and compress the retractable pin 316 of the corresponding size detection mechanism. The position detection sensor 317 is used to detect the displacement state of the retractable pin 316 and transmit a signal to the control box, so that the control box can accurately identify the size specification of the currently placed wafer rack 8. The position detection sensor 317 can be an optical sensor that detects the movement of the retractable pin 316 by emitting and receiving light signals. The optical sensor can accurately capture the up and down movement of the retractable pin 316 and send a signal when the retractable pin 316 moves down, confirming that the wafer rack 8 is in place. When the retractable pin 316 is compressed by the wafer rack 8, the optical sensor detects the change and sends a signal to the control system, indicating that the wafer rack 8 has been installed in place.

[0067] In one embodiment, the loading and unloading module 3 further comprises an alignment detection mechanism for detecting whether the wafers 9 in the wafer rack 8 are aligned. The alignment detection mechanism comprises an alignment detection sensor 320 and a reflecting member 321. The alignment detection sensor 320 is installed on the bottom plate 303 and is used to emit detection light along the Z-axis direction. The reflecting member 321 is installed at the upper edge of the front opening 201 and is opposite to the alignment detection sensor 320. Its function is to reflect the detection signal emitted by the alignment detection sensor 320. When the wafers 9 in the wafer rack 8 are correctly aligned, the signal will be reflected back to the alignment detection sensor 320 through the reflecting member 321, thus forming a complete signal path. The reflecting member 321 is usually made of optical reflecting material to ensure that it can effectively reflect the signal emitted by the sensor. Its position and angle are designed to ensure that it can reflect all effective signals within the detection range. When all the wafers 9 are correctly aligned, the signal emitted by the alignment detection sensor 320 will be reflected back through the reflecting member 321 and accurately returned to the alignment detection sensor 320. At this time, the sensor can detect the reflected signal and confirm that the positions of all the wafers 9 are aligned. When one or more wafers 9 are not aligned, the misaligned wafers 9 will protrude or deviate from their original positions, causing these wafers 9 to be located on the path between the alignment detection sensor 320 and the reflecting member 321. Due to this deviation, the detection signal cannot be correctly reflected back to the alignment detection sensor 320 through the reflecting member 321, or the strength and direction of the reflected signal change, which cannot be received by the sensor. At this time, the system will not receive a complete reflected signal, thus determining that the wafers 9 in the wafer rack 8 are not aligned.

[0068] As Figure 5 , 6The working principle of the loading and unloading module 3 is as follows:

[0069] 1. Wafer holder 8 positioning:

[0070] When the wafer holder 8 is placed into the loading and unloading module 3, the left front end positioning block 308, the right front end positioning block 309, and the rear end positioning block 310 work together to ensure the position of the wafer holder 8 in the X-axis and Y-axis directions. The left front end positioning block 308, the right front end positioning block 309 have three types, corresponding to different specifications of wafer holders 8 (such as 2-inch, 4-inch, 6-inch wafer holders 8). The front end positioning block adapts to different specifications of wafer holders 8 through different spacings and positioning steps to ensure stable positioning of the wafer holder 8.

[0071] The bottom of the wafer holder 8 will press the telescopic pin 316, triggering the action of the in-place detection sensor 317, confirming that the wafer holder 8 has been correctly placed.

[0072] 2. Door 302 operation and locking:

[0073] During the operation of the equipment, in order to ensure safety, the door 302 needs to be closed and locked through the electromagnetic lock 307. When the door 302 is locked and the in-place detection sensor 317 is triggered, the system enters the working state.

[0074] 3. Alignment detection and wafer 9 detection start:

[0075] After the in-place detection sensor 317 is triggered, the alignment detection sensor 320 starts working to detect the alignment of the wafer holder 8, ensuring that the wafer 9 in the wafer holder 8 is correctly aligned.

[0076] The screw rod mechanism drives the mounting rod 312 to move upward along the Z-axis direction, ensuring that the sensor can reach the correct height. The action driven by the mounting rod 312 is controlled accurately to ensure that the reflective photoelectric sensor 311 can detect the wafer 9 at the correct height.

[0077] The reflective photoelectric sensor 311 is triggered to start detecting whether the wafer 9 in the wafer holder 8 is correctly placed. Through the detection of the reflected signal, the system can determine whether the wafer 9 exists and confirm whether it is aligned.

[0078] 4. Processing after wafer 9 detection is completed:

[0079] After the wafer 9 detection is completed, the system confirms the placement of the wafer 9 in the wafer holder 8 (whether it is placed, whether it is aligned). If the wafer 9 is detected to be correctly placed and aligned, the equipment will automatically prepare for the next operation.

[0080] Carrying module

[0081] As shown in the figure, the carrying module 6 in the embodiment is fixedly arranged on the base 1 at the rear side of the loading and unloading module 3. The carrying module 6 is used to perform an automatic carrying process of the wafer 9, and specifically includes the following working procedures:

[0082] 1. grabbing the wafer 9 to be measured from the loading and unloading chamber 301 of the loading and unloading module 3;

[0083] 2. carrying the wafer 9 to the edge searching and photographing module 4 for edge searching positioning and character code photographing;

[0084] 3. after the edge searching and photographing is completed, carrying the wafer 9 to the measuring module 5 for related parameter measurement;

[0085] 4. after the measurement process is completed, carrying the wafer 9 back to the loading and unloading chamber 301.

[0086] In the preferred scheme of the embodiment, the carrying module 6 includes a base 602 and a mechanical hand 601. The mechanical hand 601 adopts a multi-degree-of-freedom mechanical arm structure and can realize accurate grabbing, carrying and placing of the wafer 9 in a three-dimensional space. The motion trajectory and position accuracy of the mechanical hand 601 are both controlled in real time by a control system to ensure the safety and reliability of the wafer 9 in the carrying process.

[0087] Edge searching and photographing module

[0088] The edge searching and photographing module 4 is located at one side of the carrying module 6 and is mainly used to realize automatic edge searching positioning of the wafer 9 and optical character recognition (OCR) photographing and storage of the character code on the back of the wafer 9. As shown in the figure, the edge searching and photographing module 4 mainly includes an edge searcher 401 and an OCR photographing assembly. Figure 8

[0089] The edge searcher 401 is used to realize the automatic edge searching positioning function of the wafer 9 and includes a wafer cradle 402. Specifically, the edge searcher 401 can automatically scan and identify the edge profile of the wafer 9 through a built-in high-precision sensor array or a machine vision system, so as to accurately determine the spatial position of the wafer 9. The edge searcher 401 also contains a precision motion control system, which can adjust the position and attitude of the wafer 9 in real time according to the identification result, so as to ensure that the wafer 9 can be accurately aligned with the subsequent photographing area. Since the edge searcher 401 adopts existing mature technology, the specific structure thereof will not be described here.

[0090] The OCR photographing assembly is responsible for high-resolution photographing of the character code on the back of the wafer 9 after the wafer 9 completes the edge searching positioning. As shown in the figure, Figure 7 ​As shown, the OCR photographing assembly includes a light source 407 and a camera 404, wherein the light source 407 is arranged below the wafer carrier 402 to provide stable and uniform lighting conditions, thereby ensuring clear imaging of the character code image. The camera 404 is also arranged below the wafer carrier 402, and its function is to collect the character code image on the back of the wafer 9 and transmit the collected image data to the control box 10 in real time. The control box 10 can convert the obtained image into recognizable character information through the built-in image processing algorithm. These character information can be applied to subsequent product quality detection, production traceability, and product identification, etc.

[0091] In a preferred embodiment of the present embodiment, the OCR photographing assembly further includes a lens 403 for providing good imaging quality.

[0092] In another preferred embodiment of the present embodiment, the OCR photographing assembly is further provided with a photographing driving device. The main function of the photographing driving device is to drive the light source 407, the camera 404 and the lens 403 to move along the radial direction of the wafer carrier 402 to adapt to the photographing needs of wafers 9 of different diameter specifications. Specifically, the photographing driving device includes a pad 405 and a cylinder 406, wherein the camera 404 is fixedly installed on the pad 405, and the extension rod of the cylinder 406 is connected with the pad 405, and the extension rod of the cylinder 406 drives the entire photographing assembly to adjust the position through the extension movement.

[0093] Measurement module

[0094] As shown, the measurement module 5 in the present embodiment is arranged on the other side of the handling module 6 relative to the edge finding photographing module 4. The measurement module 5 is mainly used for precise measurement of various geometric parameters of the wafer 9, including but not limited to the flatness, warpage, thickness uniformity, and surface topography of the wafer 9. The measurement module 5 is a prior art, and will not be described here.

[0095] Control box

[0096] The control box 10 is located on the side of the measurement module 5 away from the arm of the handling module 6. The control box 10 serves as the control center of the entire system, and mainly includes the following functional units:

[0097] 1. Industrial computer, used for overall control of the system and display of the man-machine interface;

[0098] 2. Electrical control unit, responsible for power management and signal control of each module;

[0099] 3. Motion control unit, used for precise control of the handling module 6 and each motion component;

[0100] 4. Image processing unit, used for processing the character code image collected by the edge finding photographing module 4;

[0101] 5. A data acquisition unit for acquiring and storing measurement data of the measurement module 5.

[0102] The full-automatic wafer measurement device has the following beneficial effects:

[0103] 1. Linear type, compact and simple structure, easy to maintain, small space occupation, and simple operation;

[0104] 2. Full automation, high cleanliness, and high precision measurement.

[0105] 3. Compatible with 2, 4, and 6-inch wafer automatic feeding, and compatible with 2, 4, and 6-inch wafer edge detection and character code shooting.

[0106] The above-described embodiments only express several embodiments of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the scope of the present application. It should be pointed out that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the protection scope of the present application.

Claims

1. A fully automatic wafer measuring apparatus characterized by comprising: The application relates to a wafer detection device. The device comprises a base, a cover installed on the base and forming a closed detection chamber with the base, an upper and lower feeding module arranged on the front side of the cover, the upper and lower feeding module having an upper and lower feeding chamber and a door, the upper and lower feeding chamber and the detection chamber being connected through an opening arranged on the cover, the front side of the upper and lower feeding chamber being provided with a taking and placing opening, and the door being used for opening and closing the taking and placing opening. The device further comprises a carrying module arranged in the detection chamber and installed on the base, an edge searching and photographing module arranged in the detection chamber and installed on one side of the carrying module, a measuring module arranged in the detection chamber and installed on the other side of the carrying module, and a control box arranged in the detection chamber and electrically connected with the upper and lower feeding module, the carrying module, the edge searching and photographing module and the measuring module. The base is a rectangular structure extending along the X-axis and Y-axis directions, and the edge searching and photographing module, the carrying module, the measuring module and the control box are arranged along the length direction of the base. The upper and lower feeding module comprises a bottom plate extending along the X-axis and Y-axis directions, and an outer cover installed on the base and forming the upper and lower feeding chamber with the bottom plate, the outer cover being provided with the taking and placing opening. The positioning mechanism comprises at least two front end positioning blocks and at least one rear end positioning block, the at least two front end positioning blocks and the at least one rear end positioning block being arranged at intervals along the Y-axis direction, each front end positioning block being provided with left and right positioning steps arranged at intervals along the X-axis direction, and the interval between the left and right positioning steps of a front end positioning block being greater than the interval between the left and right positioning steps of a rear end positioning block. The front end positioning block comprises a left front end positioning block and a right front end positioning block, the left front end positioning block and the right front end positioning block being respectively fixed on the bottom plate and provided with the left and right positioning steps. The upper and lower feeding module further comprises at least two size detection mechanisms, each size detection mechanism comprising a telescopic pin and a position detection sensor, the telescopic pin being installed in a mounting hole of the bottom plate and being capable of moving up and down along the Z-axis direction, and the position detection sensor being used for detecting the displacement state of the telescopic pin.

2. The fully automated wafer measurement apparatus according to claim 1, wherein The upper and lower feeding module further comprises an alignment detection mechanism, the alignment detection mechanism comprising an alignment detection sensor and a reflecting member, the alignment detection sensor being installed on the bottom plate, and the reflecting member being arranged above the alignment detection sensor and being used for emitting detection light along the Z-axis direction.

3. The fully automated wafer measurement apparatus according to claim 1, wherein The upper and lower feeding module further comprises a wafer detection mechanism, the wafer detection mechanism comprising a reflecting photoelectric sensor and a lifting mechanism, the reflecting photoelectric sensor being used for detecting whether a wafer in a wafer rack is placed at a specified position, and the lifting mechanism being used for driving the reflecting photoelectric sensor to move up and down along the Z-axis direction. The lifting mechanism comprises a mounting rod and a screw mechanism, the mounting rod being used for mounting the reflecting photoelectric sensor, and the screw mechanism comprising a screw rod extending along the Z-axis direction and a sliding block threadedly matched with the screw rod, the sliding block being connected with the mounting rod. One end of the door is pivotally connected with the outer cover, and the other end of the door is provided with a lock between the outer cover and the bottom plate. ​ 4. The fully automated wafer measurement apparatus according to claim 3, wherein ​ 5. The fully automated wafer measurement apparatus according to claim 3, wherein ​ 6. The fully automated wafer measurement apparatus according to claim 3, wherein ​ 7. The fully automated wafer measurement apparatus according to claim 3, wherein ​ 8. The fully automated wafer measurement apparatus according to claim 7, wherein ​ 9. The fully automated wafer measurement apparatus according to Claim 3, wherein ​ 10. The fully automated wafer measurement apparatus according to claim 9, wherein A door detection mechanism is arranged between the front end of the door and the bottom plate for detecting whether the door is closed.

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