Integrated high-reliability aging case with super-large-scale channel
The modular design of the integrated high-reliability aging chassis solves the problems of complex connections and high number of plug-and-play cycles in existing aging chassis, and realizes efficient and safe multi-channel testing, which is suitable for ultra-large-scale chip aging verification.
Patent Information
- Application Number
- CN202520414904.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-11
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2035-03-11
AI Technical Summary
The existing old refining chamber has a complex connection method between the high-temperature aging test area and the normal temperature equipment area, which is prone to errors. The frequent plugging and unplugging leads to poor contact and safety hazards, which limits the number of test channels and increases manpower and time costs.
Design an integrated high-reliability aging test chassis with ultra-large-scale channels. It adopts a modular design and achieves stable connection between modules through a pull-out structure and connectors, reducing the number of plug-in and unplugging cycles. It integrates signal driver boards and power supply boards, provides multiple test channels, and supports full-function verification of single or multiple chips.
It improves the ease and safety of operation, reduces the difficulty of troubleshooting, saves manpower and time costs, and enables a single chassis to provide thousands of test channels, making it suitable for laboratory and large-scale chip aging tests.
Smart Images
Figure CN223742674U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip aging equipment technology, specifically to an integrated high-reliability aging chassis with ultra-large-scale channels. Background Technology
[0002] The existing aging test chamber is divided into a high-temperature aging test area and a normal temperature equipment area. The two areas are connected to the connectors via high-density, high-temperature resistant cables, or the connectors are directly connected. There are many signal lines between the two areas.
[0003] If cables and connectors are used for connection, the wiring before aging and testing is complicated, prone to errors, and interferes with signal transmission.
[0004] If connectors or gold fingers are used for connection, poor contact may occur between connectors on different boards or between gold fingers and connectors as the number of insertions and removals increases. This poses a safety hazard during the aging process and increases the difficulty of troubleshooting.
[0005] When there are many signal connections between two zones, the insertion and removal force between connectors or gold fingers is large, requiring the use of electrical plugging tools. After each chip replacement, the system status must be carefully checked and confirmed. Users need to purchase additional electrical plugging tools, and operators must possess a high level of relevant expertise, resulting in significant manpower costs for each status check. These factors limit the number of test channels in aging test systems; existing aging test systems only have 128 or 256 test channels, which is insufficient for full-function aging verification testing of the chip under test. Therefore, this invention provides an integrated high-reliability aging chassis with an ultra-large-scale channel configuration to solve the above problems. Utility Model Content
[0006] The purpose of this invention is to provide an integrated, highly reliable aging chassis with ultra-large-scale channels to solve the problems mentioned in the background art.
[0007] To achieve the above objectives, this utility model provides the following technical solution: an integrated high-reliability aging chassis with ultra-large-scale channels, including a chassis, an aging test sub-board, a fan, a display screen, a pull-out structure, an aging motherboard, a core control board, a signal drive board, a power board, a power board heat sink, an AC-DC power converter, and a fan at the bottom of the chassis.
[0008] A display screen is embedded in the center of the front face of the chassis. A network port is provided on the lower side of the center of the rear face of the chassis, and power interfaces are installed on both sides of the network port. A main power button is installed on the right side of the display screen on the front face of the chassis. A pull-out structure is fixed to the bottom face of the chassis with screws. A fan is provided on the upper side of the rear face of the chassis.
[0009] An aging test sub-board is installed on the top of the chassis. There are two symmetrical aging test sub-boards and multiple sets in front and behind. An aging seat is installed on each set of aging test sub-boards. An aging mother board is provided inside the top of the chassis at the lower end of the aging test sub-boards. The aging mother board and the aging test sub-boards are connected by a connector.
[0010] Inside the chassis, below the old refining motherboard, there are two signal drive boards with a symmetrical structure on the left and right, and multiple sets are arranged in front and behind. A power board is installed between each set of signal drive boards. The core control board is fixed to the old refining motherboard through a connector.
[0011] A chassis bottom cooling fan is installed at the bottom of the chassis. The chassis bottom cooling fan is located at the bottom of the power board, and multiple chassis bottom cooling fans are evenly spaced from front to back. An AC-DC power converter is located at the rear end of the chassis bottom, next to the chassis bottom cooling fan.
[0012] As a preferred embodiment of this utility model, the pull-out structure includes a lockable telescopic guide rail, a folding cable management rack, a crossbeam, and a tray. Both ends of the tray are equipped with lockable telescopic guide rails, and a crossbeam is installed on the lockable telescopic guide rails. A folding cable management rack is installed on the crossbeam on the left side of the tray.
[0013] In a preferred embodiment of this invention, the rear end of the folding cable management rack is rotatably connected to the tray.
[0014] In a preferred embodiment of this invention, the fan is provided in four sets, and the four sets of fans are aligned with the core control board.
[0015] As a preferred embodiment of this utility model, fans are installed on both sides of the display screen inside the front surface of the chassis, and a heat dissipation window is provided in front of the fans.
[0016] As a preferred embodiment of this invention, a power supply heat sink is installed on the power board.
[0017] As a preferred embodiment of this utility model, a gap is provided at the position of the mating connector between the aging mother plate and the aging test daughter plate.
[0018] Compared with the prior art, the beneficial effects of this utility model are:
[0019] 1. The internal functional modules of the aging chamber are highly integrated. During use, there is no need to change the connection relationship between the functional modules or use electrically assisted plugging and unplugging tools; simply set the aging parameters on the chamber screen or host computer, open the aging socket to place or replace the aging chip, and the operation is convenient and simple. No special professional skills are required for the operators, saving costs in procurement, manpower and time.
[0020] 2. By opening the aging socket and moving the customized pull-out structural component, the connectors or gold fingers on the printed circuit board of the aging function in the traditional aging system are replaced by plugging and unplugging. This reduces the safety hazards caused by poor contact due to excessive plugging and unplugging and increases the difficulty of troubleshooting, thereby improving the reliability, safety and convenience of the system.
[0021] 3. A single aging test chassis can provide thousands of test channels, which can meet the full-function verification of aging a single ultra-large-scale chip, as well as the full-function verification of aging multiple small chips. The number of test channels can be automatically configured according to the actual test channel requirements of the chip under test.
[0022] 4. A single aging chassis can independently complete the entire chip aging process. Chassis and racks can also be cascaded via network cable, enabling flexible configuration. A single chassis is suitable for small-batch chip aging testing in laboratories and early-stage chip development, saving research costs. Cascaded chassis and racks are suitable for large-scale chip aging testing, screening high-reliability chips for high-end manufacturing fields such as weaponry, precision manufacturing, and aerospace. Attached Figure Description
[0023] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0024] Figure 2 This is a rear view of the chassis of this utility model;
[0025] Figure 3 This is a front view of the chassis of this utility model;
[0026] Figure 4 This is a schematic diagram of the bottom tray structure of the chassis of this utility model;
[0027] Figure 5 This is a schematic diagram of the pull-out structure at the bottom of the chassis of this utility model.
[0028] Figure 6 This is a schematic diagram of the connection structure between the old refining mother plate and the old refining test daughter plate of this utility model;
[0029] Figure 7 This is a schematic diagram of the connection structure between the core control board, power supply board and signal drive board of this utility model;
[0030] Figure 8 This is a top view of the connection structure between the signal driver board and the power board heat sink of this utility model.
[0031] Figure 9 This is a schematic diagram of the bottom opening structure of the chassis of this utility model.
[0032] In the diagram: 1. Chassis; 2. Refining test daughterboard; 3. Refining socket; 4. Fan; 5. Electrical interface; 6. Network port; 7. Display screen; 8. Main power button; 9. Pull-out structure; 91. Lockable telescopic rail; 92. Folding cable management rack; 93. Crossbeam; 94. Tray; 10. Fixing component; 11. Refining motherboard; 12. Core control board; 13. Signal driver board; 14. Power board; 15. Power board heatsink; 16. AC-DC power converter; 17. Chassis bottom fan. Detailed Implementation
[0033] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.
[0034] In the description of this utility model, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, in the description of this utility model, "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0035] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or a connection through an intermediate medium; and they can refer to the internal connection of two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances. "Multiple" means two or more, and unless otherwise explicitly limited, all of them fall within the scope of protection of this utility model.
[0036] Example 1: As Figure 1 , 3 -5. This utility model provides a technical solution including a chassis 1, a aging test sub-board 2, a fan 4, a display screen 7, a pull-out structure 9, an aging motherboard 11, a core control board 12, a signal drive board 13, a power board 14, a power board heat sink 15, an AC-DC power converter 16, and a chassis bottom fan 17.
[0037] A display screen 7 is embedded in the center of the front face of the chassis 1. A network port 6 is provided on the lower side of the center of the rear face of the chassis 1, and power interfaces 5 are installed on both sides of the network port 6. A main power button 8 is installed on the right side of the display screen 7 on the front face of the chassis 1. A pull-out structure 9 is fixed to the bottom face of the chassis 1 by screws. A fan 4 is provided on the upper side of the rear face of the chassis 1.
[0038] A aging test sub-board 2 is installed on the top of the chassis 1. The aging test sub-board 2 has two symmetrical structures on the left and right, and multiple sets are arranged in front and behind. An aging seat 3 is installed on each set of aging test sub-board 2. An aging mother board 11 is provided inside the top of the chassis 1 at the lower end of the aging test sub-board 2, and the aging mother board 11 is connected to the aging test sub-board 2 through a connector.
[0039] Inside the chassis 1, below the old refining motherboard 11, there are two signal drive boards 13 with a symmetrical structure on the left and right, and multiple sets are arranged in front and behind. A power board 14 is installed between each set of signal drive boards 13. The core control board 12 is fixed to the old refining motherboard 11 through a connector.
[0040] A bottom cooling fan 17 is installed inside the chassis 1 at the bottom. The bottom cooling fan 17 is located at the bottom of the power board 14, and multiple bottom cooling fans 17 are evenly spaced from front to back. An AC-DC power converter 16 is located at the rear bottom of the chassis 1 on one side of the bottom cooling fan 17.
[0041] The pull-out structure 9 includes a lockable telescopic guide rail 91, a folding cable management rack 92, a crossbeam 93, and a tray 94. Both ends of the tray 94 are equipped with lockable telescopic guide rails 91, and a crossbeam 93 is installed on the lockable telescopic guide rails 91. The folding cable management rack 92 is installed on the crossbeam 93 on the left side of the tray 94.
[0042] The rear end of the folding cable management rack 92 is rotatably connected to the tray 94.
[0043] In this embodiment, by opening the aging socket and moving the customized pull-out structural component, the connectors or gold fingers on the aging function printed circuit board in the traditional aging system are replaced with plugging and unplugging. This reduces the safety hazards caused by poor contact due to excessive plugging and unplugging and increases the difficulty of troubleshooting, thereby improving the reliability, safety and convenience of the system.
[0044] Example 2: Figure 1 , 3 6-9, This utility model provides a technical solution including a chassis 1, a aging test sub-board 2, a fan 4, a display screen 7, a pull-out structure 9, an aging motherboard 11, a core control board 12, a signal drive board 13, a power board 14, a power board heat sink 15, an AC-DC power converter 16, and a chassis bottom fan 17.
[0045] A display screen 7 is embedded in the center of the front face of the chassis 1. A network port 6 is provided on the lower side of the center of the rear face of the chassis 1, and power interfaces 5 are installed on both sides of the network port 6. A main power button 8 is installed on the right side of the display screen 7 on the front face of the chassis 1. A pull-out structure 9 is fixed to the bottom face of the chassis 1 by screws. A fan 4 is provided on the upper side of the rear face of the chassis 1.
[0046] A aging test sub-board 2 is installed on the top of the chassis 1. The aging test sub-board 2 has two symmetrical structures on the left and right, and multiple sets are arranged in front and behind. An aging seat 3 is installed on each set of aging test sub-board 2. An aging mother board 11 is provided inside the top of the chassis 1 at the lower end of the aging test sub-board 2, and the aging mother board 11 is connected to the aging test sub-board 2 through a connector.
[0047] Inside the chassis 1, below the old refining motherboard 11, there are two signal drive boards 13 with a symmetrical structure on the left and right, and multiple sets are arranged in front and behind. A power board 14 is installed between each set of signal drive boards 13. The core control board 12 is fixed to the old refining motherboard 11 through a connector.
[0048] A bottom cooling fan 17 is installed inside the chassis 1 at the bottom. The bottom cooling fan 17 is located at the bottom of the power board 14, and multiple bottom cooling fans 17 are evenly spaced from front to back. An AC-DC power converter 16 is located at the rear bottom of the chassis 1 on one side of the bottom cooling fan 17.
[0049] There are four sets of fans 4, and the four sets of fans 4 are aligned with the core control board 12.
[0050] Fans are installed on both sides of the display screen 7 inside the front panel of the chassis 1, and a heat dissipation window is provided in front of the fan.
[0051] A power supply heat sink 15 is installed on the power board 14.
[0052] There is a gap at the position of the mating connector between the old motherboard 11 and the old test daughterboard 2.
[0053] In this embodiment, the internal functional modules of the aging chamber are highly integrated. During use, there is no need to change the connections between the modules or use electrically assisted plugging / unplugging tools; simply set the aging parameters on the chamber screen or host computer, open the aging socket to place or replace the aging chip, making operation convenient and simple. No specific professional skills are required for the operators, saving on procurement, manpower, and time costs.
[0054] The chassis includes: 1. Aging Chassis: The chassis has external interfaces of 220V power and network ports. It houses an AC-DC power converter, aging motherboard, core control board, power board, signal driver board, aging test daughterboard, aging socket, heat dissipation device, and monitoring and alarm device. The AC-DC power converter, aging motherboard, core control board, power board, signal driver board, heat dissipation device, and monitoring and alarm device are installed inside the chassis. The aging test daughterboard and aging socket are located on the top surface of the chassis. The aging socket incorporates heating, heat dissipation, and temperature acquisition devices to separate the normal temperature zone from the high temperature zone. This partitioning avoids prolonged exposure of the aging printed circuit board to high temperatures, which could lead to circuit instability, poor soldering, or solder joint breakage; it also reduces the cost of additional components required to meet high-temperature conditions.
[0055] The 220V AC mains power is converted to 12V DC by an AC-DC power converter for standby power. Both the rear panel and bottom plate of the chassis are equipped with cooling devices, powered by 12V DC. One cooling method is air cooling. Air intake ducts are provided on both sides of the front panel, multiple fans on the rear panel exhaust air outwards, and multiple fans on the bottom plate blow air upwards, creating a front-to-rear and bottom-to-top airflow pattern inside the chassis. The display screen is fixed in the center of the front panel, while the 220V power port and network port are located on the rear panel.
[0056] 2. Aged Refinery Cabinet: This cabinet can accommodate multiple aged refinery chassis and is equipped with a switch and 220V distribution terminals. Chassis cascading is achieved via network ports and switches, while the 220V distribution terminals provide 220V AC power to the chassis. The cabinet's external interfaces include a 220V power port and a network port. The 220V power port connects to AC power, and the network port connects to a computer, facilitating centralized computer control of the cabinet.
[0057] The chassis is secured within the cabinet via a crossbeam, locking telescopic rails, a tray, and a folding cable management rack. The crossbeam is fixed to the inside of the cabinet's vertical beams, perpendicular to them. The locking telescopic rails are fixed inside the grooves of the crossbeams, forming a single unit. When the rails are fully folded or extended, they lock and cannot be pulled out; they can only be pulled out by pressing the unlock button. The tray is secured to the inside of the locking telescopic rails with screws, its plane perpendicular to the vertical beams. When the chassis is fixed to the tray, it rests on one side of the cabinet's vertical beam along with the folding cable management rack, with one end fixed to the back of the tray. When the tray is pulled out to move the chassis, the folding cable management rack moves with the tray, preventing the 220V power and network cables from being pulled during tray movement.
[0058] By using a movable pull-out structural component, the old refining machine chassis automatically locks itself when pulled out or pushed into the designated position in the cabinet, preventing the chassis from sliding out of the cabinet.
[0059] 3. Refined Motherboard: The refined motherboard is used for the 12V power and signal conversion between boards. One side of the motherboard connects to the core control board, power board, and signal driver board, while the other side connects to the refined test daughterboard. The motherboard is fixed to the top of the chassis. The top of the chassis is cut out according to the position of the mating connectors of the refined motherboard and the refined test daughterboard, so that the mating connectors can extend to the upper surface of the chassis. The core control board, power board, and signal driver board are fixed to the lower side of the motherboard.
[0060] A 12V DC power supply is connected to the motherboard to provide operating power for the heat dissipation device, and then connected to the core control board, power board, and signal driver board via connectors. Each functional board performs secondary power conversion for its internal use, and the power board performs secondary power conversion to provide adjustable core power and auxiliary power to the CPU under test.
[0061] 4. Core Control Board: This board receives control information from the chassis display screen or computer, controls and collects the operating status of the chassis during aging, and transmits the aging status to the chassis display screen or computer interface. The chassis display screen only controls and displays the operating status of a single chassis, while the computer can control and display the operating status of cascaded chassis and racks. A network port is reserved on the board for chassis cascading.
[0062] 5. Power Supply Board: Provides the chip under test (DUT) with an adjustable voltage, high-current core power supply and multiple auxiliary power supplies. The power supply board can simultaneously output 12 adjustable voltage, high-current power supplies, or connect two power supplies in parallel to increase the output current of a single power supply. The number of power supply outputs on the power supply board is 6 ≤ a ≤ 12, meeting the power supply needs of higher power consumption DUTs. The following is one scenario where the power supply board outputs 6 power supplies in parallel with every 2 power supplies: Core power supply 0.8V-2V, total current 600A. 5 adjustable auxiliary power supplies: 1.2V adjustable range ±0.3V, total current no less than 50A; 1.8V adjustable range ±0.3V, total current no less than 50A; 2.5V adjustable range ±0.5V, total current no less than 50A; 3.3V adjustable range ±0.5V, total current no less than 50A; 5V adjustable range ±0.5V, total current no less than 50A.
[0063] The power supply board uses connectors to plug into the motherboard, transmitting power to the motherboard. The motherboard then connects to the aging test board via connectors to provide operating power to the chips to be aged. Each power supply board is equipped with an independent heat dissipation device, one of which is a heat sink, which, together with the cooling fan at the bottom of the chassis, forms a good heat dissipation airflow.
[0064] 6. Signal Driver Board: Provides test I / O channels for the chip to be aged. The I / O channel frequency is adjustable, with each channel frequency not less than 100MHz. One configuration allows for 400 test channels per signal driver board, while a single chassis can provide 3200 test channels, meeting the I / O test channel requirements for most chip aging processes. The core control board can configure the number of channels and the operating status of each signal driver board.
[0065] 7. Aging Test Daughter Board: The aging test daughter board is connected to the motherboard via connectors and fixed to the mounting brackets on the upper surface of the chassis. The aging socket is installed on the aging test daughter board and is used to hold the chip to be aged. The aging socket has heating, heat dissipation, and temperature acquisition functions, providing real-time and accurate control and acquisition of the chip temperature. Heating can be achieved using resistance wire or TEC, heat dissipation can be achieved using air cooling, a heat sink, or water cooling, and temperature acquisition can be achieved using PT1000 or PT100.
[0066] For single-chassis placement or replacement of aging chips, simply unscrew the aging chip socket to replace the chip. For chassis installed in a server rack, simply press the unlock button on the locking telescopic rail, pull the rail, and it will automatically lock when fully extended. Then, open the aging chip socket to replace the chip. After replacement, simply press the unlock button on the locking telescopic rail, push the rail, and it will automatically lock when fully retracted into the rack.
[0067] During the aging process, users only need to move the guide rail and open the aging socket to complete the chip replacement, replacing the need to plug and unplug the connectors or gold fingers on the aging function printed circuit board, thereby improving the system's reliability, security, convenience and service life.
[0068] Monitoring and alarm system: The system consists of a chassis display screen / computer monitor and a main power button. The chassis display screen or host computer monitor can display the aging status and fault information. The main power button is a dual-color indicator light; when the main power supply is working normally, the indicator light is green; when the main power supply is abnormal, the indicator light is red.
[0069] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
Claims
1. An integrated high-reliability aging machine case of super-large channel, comprising a case (1), an aging test sub-board (2), a fan (4), a display screen (7), a pull-out structure (9), an aging mother board (11), a core control board (12), a signal driving board (13), a power supply board (14), a power supply board heat sink (15), an AC-DC power converter (16) and a case bottom fan (17), characterized in that: the display screen (7) is embedded at the center of the front end face of the case (1), the network port (6) is arranged at the lower side of the center of the rear end face of the case (1), and the electrical interface (5) is arranged on both sides of the network port (6), the total power button (8) is arranged on the right side of the display screen (7) on the front end face of the case (1), the pull-out structure (9) is fixed on the bottom end face of the case (1) by screws, and the fan (4) is arranged on the upper side of the rear end face of the case (1); the aging test sub-board (2) is arranged on the top end of the case (1), the aging test sub-board (2) is arranged in two symmetrical structures and multiple groups from front to back, the aging seat (3) is arranged on each aging test sub-board (2), the aging mother board (11) is arranged at the lower end of the aging test sub-board (2) in the inside of the top end of the case (1), and the aging mother board (11) is connected with the aging test sub-board (2) through a connector; the signal driving board (13) is arranged below the aging mother board (11) in the inside of the case (1), the signal driving board (13) is arranged in two symmetrical structures and multiple groups from front to back, the power supply board (14) is arranged between each group of the signal driving board (13), and the core control board (12) is fixed on the aging mother board (11) through a connector; the case bottom heat dissipation fan (17) is arranged at the bottom end in the inside of the case (1), the case bottom heat dissipation fan (17) is arranged at the bottom of the power supply board (14), and multiple case bottom heat dissipation fans (17) are arranged at equal intervals from front to back, and the AC-DC power converter (16) is arranged on one side of the case bottom heat dissipation fan (17) at the rear end of the bottom of the case (1).
2. The high-reliability aging chassis of claim 1, wherein: The pull-out structure (9) comprises a telescopic guide rail (91) with a lock, a folding wire arranging rack (92), a cross beam (93) and a tray (94), the telescopic guide rail (91) with a lock is arranged at both ends of the tray (94), the cross beam (93) is arranged on the telescopic guide rail (91) with a lock, and the folding wire arranging rack (92) is arranged on the cross beam (93) on the left side of the tray (94).
3. The high-reliability aging chassis of claim 2, wherein: The rear end of the folding wire arranging rack (92) is rotationally connected with the tray (94).
4. The high-reliability aging chassis of claim 1, wherein: The fan (4) is arranged in four groups, and the four groups of the fan (4) are aligned with the core control board (12).
5. The high-reliability aging chassis of claim 1, wherein: The fan is arranged on both sides of the display screen (7) in the inside of the front end face of the case (1), and the heat dissipation window is arranged in front of the fan.
6. The high-reliability aging chassis of claim 1, wherein: The power supply board (14) is provided with the power supply heat sink (15).
7. The high-reliability aging chassis of claim 1, wherein: The aging mother board (11) is provided with a spacing at the plug-in connector position of the aging test sub-board (2).