Arrangement assembly of automatic material arrangement mechanism

Abstract

The utility model relates to the technical field of semiconductor equipment, and provides a neatening assembly of an automatic material neatening mechanism, and the neatening assembly comprises an in-place neatening assembly which comprises a first fixing plate and a lifting mechanism used for driving the first fixing plate to vertically lift, and the first fixing plate is provided with a neatening plate assembly and a first translation mechanism used for driving the neatening plate assembly to translate; the normalizing plate assembly comprises a pushing plate and a normalizing plate, one side of the pushing plate is connected to the first translation mechanism, and the normalizing plate is elastically connected to the other side of the pushing plate through a spring mechanism; and the positioning assembly comprises a second fixing plate connected to the jacking mechanism, and a second translation mechanism used for driving the lifting mechanism to translate is arranged on the second fixing plate. According to the invention, the spring mechanism is arranged between the normalizing plate and the pushing plate, so that a buffering effect can be achieved, and the risk of damage to silicon wafers is reduced.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and more specifically, to a material straightening component of an automated material straightening mechanism. Background Technology

[0002] In the silicon wafer semiconductor industry, automated material handling systems are currently key equipment used in the semiconductor manufacturing process to efficiently and accurately handle silicon wafers. These automated systems aim to improve production efficiency, reduce human error and contamination risks, and ensure the integrity and quality of silicon wafers throughout the manufacturing process.

[0003] Current automated material straightening mechanisms generally include lifting components for lifting materials and straightening components for straightening materials. Since silicon wafers have high requirements for surface quality, they need to be handled with care during the straightening process to avoid scratches or deformation due to pressure, so as to ensure that their surface quality and integrity are not damaged. However, the current straightening components have low positioning accuracy during straightening, which leads to unstable quality of silicon wafers after straightening.

[0004] Therefore, existing technologies still need improvement and development. Utility Model Content

[0005] The purpose of this application is to propose a sizing component for an automated material sizing mechanism to solve the technical problem that the low positioning accuracy of sizing components in the prior art leads to unstable quality of silicon wafers after sizing.

[0006] To achieve the above objectives, the technical solution adopted in this application is: to provide a standardizing component of an automated material standardizing mechanism, connected to a lifting mechanism and used for standardizing materials, the standardizing component comprising:

[0007] The positioning alignment component includes a first fixed plate and a lifting mechanism for driving the first fixed plate to move vertically up and down. The first fixed plate is provided with an alignment plate assembly and a first translation mechanism for driving the alignment plate assembly to move horizontally. The alignment plate assembly includes a push plate and an alignment plate. One side of the push plate is connected to the first translation mechanism, and the alignment plate is elastically connected to the other side of the push plate through a spring mechanism.

[0008] The positioning component includes a second fixing plate connected to the lifting mechanism, and the second fixing plate is provided with a second translation mechanism for driving the lifting mechanism to translate.

[0009] Furthermore, the spring mechanism includes:

[0010] A translation guide rod is provided. The push plate has a through hole, and a guide bearing is provided in the through hole. One end of the translation guide rod is connected to the guide bearing and is adapted to move horizontally within the guide shaft. The other end of the translation guide rod is connected to the leveling plate.

[0011] A return spring is fitted onto the translation guide rod, with its two ends abutting against the leveling plate and the push plate, respectively.

[0012] Furthermore, the aligning plate includes a first aligning plate and a second aligning plate. The first aligning plate is connected to the translation guide rod, and the second aligning plate is connected to the side of the second aligning plate opposite to the translation guide rod. The second aligning plate is a flexible plate.

[0013] In some embodiments, the positioning alignment component further includes:

[0014] A third fixing plate is connected to the first straightening plate. The third fixing plate is provided with a bag-pressing plate and a bag-pressing cylinder for driving the bag-pressing plate to move vertically up and down. The bag-pressing plate extends to the side of the second straightening plate opposite to the first straightening plate.

[0015] Furthermore, the bag-pressing plate includes a first plate area and a second plate area, the first plate area being connected to the bag-pressing cylinder, and the second plate area extending from directly behind the first straightening plate to directly in front of the first straightening plate.

[0016] In some embodiments, the second translation mechanism is connected to a pusher assembly, the pusher assembly comprising:

[0017] The translation guide rail is fixedly connected to the second fixing plate;

[0018] A guide rail connecting and fixing plate, one end of which is connected to the lifting mechanism, and the other end of which is slidably engaged with the translation guide rail;

[0019] The push arm plate is connected between the second translation mechanism and the guide rail connecting and fixing plate.

[0020] Furthermore, the guide rail connecting fixing plate has a sleeve opening, the lifting mechanism is disposed in the sleeve opening, and the inner wall of the sleeve opening abuts against the lifting mechanism.

[0021] In some embodiments, the second fixed plate has a U-shaped opening, and the translation guide rails are respectively provided on both sides of the U-shaped opening. The guide rail connecting fixed plate spans the U-shaped opening and is slidably connected to the translation guide rails on both sides of the U-shaped opening. The lifting mechanism is disposed in the U-shaped opening and connected to the guide rail connecting fixed plate.

[0022] Furthermore, the second fixing plate is provided with reinforcing ribs that are connected to the lifting mechanism.

[0023] In some embodiments, the lifting mechanism and the first translation mechanism include cylinders, and the second translation mechanism includes a stepper motor.

[0024] The beneficial effects of the arranging component of the automated material arranging mechanism provided in this application are at least as follows: By setting a spring mechanism between the arranging plate and the push plate, when the arranging plate abuts against the silicon wafer, if the abutting force reaches a preset strength threshold, the elastic mechanism will contract, thereby reducing the force applied to the silicon wafer, achieving a buffering effect, and reducing the risk of damage to the silicon wafer. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 A perspective view of the straightening component of the automated material straightening mechanism provided in the embodiments of this application;

[0027] Figure 2 for Figure 1 A stereoscopic view of the regularized components in another perspective;

[0028] Figure 3 This is a schematic diagram of the positioning alignment component provided in the embodiments of this application;

[0029] Figure 4 This is a schematic diagram of the positioning component provided in an embodiment of this application;

[0030] Figure 5 for Figure 4 A schematic diagram of the positioning component from another perspective.

[0031] The following are the labeling elements in the figure:

[0032] 1. Positioning and alignment of components;

[0033] 11. First fixing plate;

[0034] 12. Lifting mechanism;

[0035] 13. Push plate; 131. Through hole; 132. Guide bearing; 133. Translation guide rod;

[0036] 14. Regularized slab; 141. First regularized slab; 142. Second regularized slab;

[0037] 15. First translation mechanism;

[0038] 16. Return spring;

[0039] 17. Third fixing plate;

[0040] 18. Bag pressing plate; 181. First plate area; 182. Second plate area;

[0041] 19. Bag-pressing cylinder;

[0042] 2. Positioning components;

[0043] 21. Second fixed plate; 22. Second translation mechanism; 23. Translation guide rail; 24. Guide rail connecting fixed plate; 25. Sleeve opening; 26. Push arm plate; 27. U-shaped opening;

[0044] 3. Reinforcing ribs. Detailed Implementation

[0045] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0046] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it may be directly or indirectly located on that other component. When a component is referred to as "connected to" another component, it may be directly or indirectly connected to that other component. The terms "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate orientations or positions based on the accompanying drawings, and are for ease of description only, and should not be construed as limiting the technical solution. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality" means two or more, unless otherwise explicitly defined.

[0047] The following description, with reference to the accompanying drawings, describes the organizing components of an automated material organizing mechanism according to an embodiment of this application.

[0048] Please see Figure 1 and Figure 2 , Figure 1 and Figure 2 A perspective view of the organizing components of the automated material organizing mechanism of this application is shown.

[0049] The automated material straightening mechanism includes a lifting mechanism and a straightening component. The straightening component is connected to the lifting mechanism and is used to straighten the material. The straightening component includes a positioning straightening component 1 and a positioning component 2.

[0050] Positioning component 2 is connected to the lifting mechanism and is used to move positioning and straightening component 1. Its function is to raise or lower positioning and straightening component 1 from one horizontal plane to another. It is mainly used to transfer positioning and straightening component 1 from the position to be straightened to the processing position, which refers to the position where the silicon wafer needs to be straightened. The straightening component is used to accurately position the silicon wafer at its geometric center, aligning it with the working center of the subsequent processing equipment.

[0051] Specifically, see Figures 1-3 The positioning alignment component 1 includes a first fixed plate 11 and a lifting mechanism 12 for driving the first fixed plate 11 to move vertically up and down. The first fixed plate 11 is provided with an alignment plate assembly and a first translation mechanism 15 for driving the alignment plate assembly to move horizontally. The alignment plate assembly includes a push plate 13 and an alignment plate 14. One side of the push plate 13 is connected to the first translation mechanism 15, and the alignment plate 14 is elastically connected to the other side of the push plate 13 through a spring mechanism.

[0052] The positioning component 2 includes a second fixed plate 21 connected to the lifting mechanism, and the second fixed plate 21 is provided with a second translation mechanism 22 for driving the lifting mechanism 12 to translate.

[0053] When the alignment component of this application is in operation, taking the alignment of silicon wafers as an example, firstly, the second translation mechanism 22 on the positioning component 2 is activated, driving the lifting mechanism 12 to move horizontally so that the positioning alignment component 1 is in a suitable horizontal position. Then, the lifting mechanism 12 is activated, driving the alignment plate component on the first fixed plate 11 to a suitable height, which means that the alignment plate component is relatively level with the silicon wafer on the lifting mechanism. Finally, the first translation mechanism 15 is activated, driving the push plate 13 to move towards the silicon wafer. At the same time as the push plate 13 moves, the alignment plate 14 also moves towards the silicon wafer. After the alignment plate 14 stops on the silicon wafer, it neatly arranges the silicon wafer.

[0054] Since the leveling plate 14 has a certain degree of hardness, and the silicon wafer has high requirements for surface quality, it is easy to cause impact damage to the silicon wafer when the leveling plate 14 abuts against the silicon wafer. This application sets a spring mechanism between the leveling plate 14 and the push plate 13. When the leveling plate 14 abuts against the silicon wafer, if the abutting force reaches a preset strength threshold, the elastic mechanism will contract, thereby reducing the force applied to the silicon wafer, achieving a buffering effect, and reducing the risk of damage to the silicon wafer.

[0055] Furthermore, the straightening assembly includes three position adjustment devices: a second translation mechanism 22, a lifting mechanism 12, and a first translation mechanism 15. The second translation mechanism 22 is used to adjust the lifting mechanism 12 to a suitable horizontal position to prevent the straightening assembly 1 on the lifting mechanism 12 from colliding with other components during lifting. The lifting mechanism 12 is used to move the straightening plate assembly on the first positioning plate to a suitable height to facilitate the straightening of the silicon wafers. The first translation mechanism 15 is used to adjust the position of the straightening plate assembly to straighten the material.

[0056] Of course, the above implementation method refers to the operation steps when the material is sorted. When the sorting is completed and it is necessary to return each component to its original position, the above steps can be reversed.

[0057] It should be noted that although both the first translation mechanism 15 and the second translation mechanism 22 push the components to perform translational movements, the second translation mechanism 22 translates the entire lifting mechanism 12 and the positioning and straightening component 1 to avoid collisions during the lifting process, while the first translation mechanism 15 is used to translate the position of the straightening board component for actual straightening of silicon wafers.

[0058] Further, see Figures 1-3 The spring mechanism includes a translation guide rod 133 and a return spring 16.

[0059] The push plate 13 is provided with a through hole 131, and a guide bearing 132 is provided in the through hole 131. One end of the translation guide rod 133 is connected to the guide bearing 132 and is suitable for horizontal movement in the guide shaft. The other end of the translation guide rod 133 is connected to the leveling plate 14.

[0060] The return spring 16 is fitted onto the translation guide rod 133, and the two ends of the return spring 16 abut against the leveling plate 14 and the push plate 13, respectively.

[0061] When the leveling plate 14 abuts against the material, and the force between the leveling plate 14 and the material reaches the deformation force of the return spring 16, which is the threshold of the force between the leveling plate 14 and the material, the return spring 16 will be compressed to achieve a buffering effect, thus preventing the silicon wafer material from being squeezed and damaged within a certain range. When the force between the leveling plate 14 and the material does not reach the deformation force of the return spring 16, the return spring 16 remains in its natural state, and the leveling plate 14 abuts against the material normally.

[0062] When the leveling plate 14 and the push plate 13 move relative to each other, the guide bearing 132 causes the translation guide rod 133 to move along a predetermined direction to achieve the guiding function, prevent the leveling plate 14 from tilting during the movement, and maintain the accuracy of the leveling angle and posture.

[0063] Further, see Figures 1-5 The aligning plate 14 includes a first aligning plate 141 and a second aligning plate 142. The first aligning plate 141 is connected to the translation guide rod 133, and the second aligning plate 142 is connected to the side of the second aligning plate 142 away from the translation guide rod 133. The second aligning plate 142 is a flexible plate.

[0064] In some embodiments, the sizing plate 14 is a polyurethane material, and the soft material can reduce friction and collisions with the silicon wafer, thereby reducing damage to the material.

[0065] In some implementations, see Figures 1-3 The positioning and straightening component 1 also includes a third fixing plate 17, which is connected to the first straightening plate 141. The third fixing plate 17 is provided with a bag pressing plate 18 and a bag pressing cylinder 19 for driving the bag pressing plate 18 to rise and fall vertically. The bag pressing plate 18 extends to the side of the second straightening plate 142 away from the first straightening plate 141.

[0066] Unlike the straightening plate which is used to hold the material from the side, when the pressing cylinder 19 descends, the pressing plate 18 can press down the plastic part of the material from the top and bottom, so that the material is straightened and placed in place.

[0067] In some implementations, see Figures 1-3 The bag pressing plate 18 includes a first plate area 181 and a second plate area 182. The first plate area 181 is connected to the bag pressing cylinder 19, and the second plate area 182 extends from the rear of the first straightening plate 141 to the front of the first straightening plate 141.

[0068] In order to make the pressure plate 18 press down on the material more accurately, a part of the pressure plate 18 is extended to the front of the first straightening plate 141. In this way, when the first straightening plate 141 comes into contact with the material, the pressure plate 18 can also press down on the material.

[0069] In some implementations, see Figure 1 , Figure 2 , Figure 4 and Figure 5 The second translation mechanism 22 is connected to a push arm assembly, which includes a translation guide rail 23, a guide rail connecting and fixing plate 24, and a push arm plate 26.

[0070] The translation guide rail 23 is fixedly connected to the second fixed plate 21; one end of the guide rail connecting fixed plate 24 is connected to the lifting mechanism 12, and the other end is slidably engaged with the translation guide rail 23; the push arm plate 26 is connected between the second translation mechanism 22 and the guide rail connecting fixed plate 24.

[0071] Furthermore, the second translation mechanism 22 is a stepper motor, used to adjust the regular position, and the stepper motor provides accurate positioning.

[0072] After the second translation mechanism 22 is activated, the second translation mechanism 22 drives the push arm plate 26 to push the guide rail connecting fixed plate 24, and then the guide rail pushes the fixed plate to drive the lifting mechanism 12 to move. When the lifting mechanism 12 moves horizontally, the translation guide rail 23 provides guidance for the movement of the lifting mechanism 12 so that the lifting mechanism 12 moves horizontally in the specified direction.

[0073] Further, see Figure 1 , Figure 2 , Figure 4 and Figure 5 The guide rail connecting fixing plate 24 has a sleeve opening 25, and the lifting mechanism 12 is set inside the sleeve opening 25. The inner wall of the sleeve opening 25 abuts against the lifting mechanism 12.

[0074] Furthermore, a U-shaped opening 27 is provided on the second fixed plate 21, and translation guide rails 23 are respectively provided on both sides of the U-shaped opening 27. The guide rail connecting fixed plate 24 spans the U-shaped opening 27 and is slidably connected to the translation guide rails 23 on both sides of the U-shaped opening 27. The lifting mechanism 12 is located inside the U-shaped opening 27 and connected to the guide rail connecting fixed plate 24.

[0075] In some implementations, see Figure 1 , Figure 2 , Figure 4 and Figure 5 The second fixed plate 21 is provided with a reinforcing rib plate 3 that is connected to the lifting mechanism.

[0076] Furthermore, the lifting mechanism 12 and the first translation mechanism 15 include cylinders, and the second translation mechanism 22 includes a stepper motor.

[0077] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A regularizing assembly of an automated material regularizing mechanism, connected to a jacking mechanism and used for regularizing material, characterized in that, The utility model relates to a to position regular assembly, including first fixed plate and be used for driving first fixed plate vertical lift lifting mechanism, be equipped with regular board subassembly and be used for driving first regular board subassembly translation first translation mechanism on first fixed plate, regular board subassembly includes push plate and regular board, one side of push plate is connected to first translation mechanism, and regular board is elastically connected on the other side of push plate through spring mechanism, Positioning assembly, including second fixed plate connected on the lifting mechanism, second fixed plate is equipped with second translation mechanism for driving the lifting mechanism translation. The spring mechanism includes:

2. The singulating assembly of an automated material singulating mechanism of claim 1, wherein, Translation guide rod, the push plate is equipped with through hole, the through hole is equipped with guide bearing, one end of translation guide rod is matched with guide bearing and is suitable for horizontal movement in the guide shaft, the other end of translation guide rod is connected to the regular board, Reset spring, matched sleeve is connected on the translation guide rod, both ends of reset spring stop respectively regular board and push plate. The regular board includes a first regular board and a second regular board, the first regular board is connected to the translation guide rod, the second regular board is connected to the side of the second regular board away from the translation guide rod, and the second regular board is a flexible plate.

3. The singulating assembly of an automated material singulating mechanism of claim 2, wherein, The to position regular assembly further includes:

4. The singulating assembly of an automated material singulating mechanism of claim 3, wherein, Third fixed plate, connected on the first regular board, the third fixed plate is equipped with bag pressing plate and is used for driving bag pressing plate vertical lift bag pressing cylinder, bag pressing plate extends to the side of the second regular board away from the first regular board. The bag pressing plate includes a first plate region and a second plate region, the first plate region is connected to the bag pressing cylinder, and the second plate region extends from the back of the first regular board to the front of the first regular board.

5. The singulating assembly of an automated material singulating mechanism of claim 4, wherein, The second translation mechanism is connected with a push arm assembly, and the push arm assembly includes:

6. The singulating assembly of an automated material singulating mechanism of claim 4, wherein, Translation guide rail, fixedly connected to the second fixed plate, Guide rail connecting fixed plate, one end of the guide rail connecting fixed plate is connected to the lifting mechanism, and the other end is slidingly connected with the translation guide rail, Push arm plate, connected between the second translation mechanism and the guide rail connecting fixed plate. The guide rail connecting fixed plate is provided with a sleeving opening, and the lifting mechanism is arranged in the sleeving opening.

7. The singulating assembly of an automated material singulating mechanism of claim 6, wherein, The second fixed plate is provided with a U-shaped opening, and the U-shaped opening is provided with the translation guide rail on both sides.

8. The singulating assembly of an automated material singulating mechanism of claim 7, wherein, The second fixed plate is provided with a reinforcing rib plate connected to the lifting mechanism.

9. The singulating assembly of an automated material singulating mechanism of claim 1, wherein, The lifting mechanism and the first translation mechanism include a cylinder, and the second translation mechanism includes a stepping motor.

10. The singulating assembly of an automated material singulating mechanism of claim 1, wherein, ​

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