Wafer cleaning device

Abstract

The utility model provides a wafer cleaning device which comprises a cleaning mechanism used for cleaning a wafer and comprising a nozzle, a swing arm assembly and a tail rod, the tail rod is provided with a first end and a second end which are opposite, one end of the swing arm assembly is connected with the nozzle, the other end of the swing arm assembly is connected with the first end, and the nozzle and the tail rod are driven by the swing arm assembly to move in the same direction; the first limiting structure is arranged on one side of the cleaning mechanism and comprises a limiting part; when the height of the spray head is lower than the preset height, the second end is lower than the top end of the limiting part, so that the limiting part abuts against the tail rod to prevent the tail rod from rotating in the preset direction. In the scheme, the safety of the wafer cleaning device is improved through the arrangement of the first limiting structure and the tail rod, when the swing arm assembly is in an out-of-control state due to loss of a control signal or abnormal rotation, the first limiting structure can block the tail rod to prevent the swing arm assembly from driving the spray head to continue to move, and the spray head is prevented from impacting other parts in the device; and the operation stability of the wafer cleaning device is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor wafer processing, in particular to a wafer cleaning device. BACKGROUND

[0002] During the manufacturing of a wafer, the wafer will be exposed to various materials in different processing environments, and is likely to be contaminated by particulate matter, organic matter, metal ions and oxides, etc. These contaminants can affect the performance of semiconductor devices, possibly leading to a decrease in the yield and poor performance of the devices. Wafer cleaning is a step in the semiconductor processing process, which removes various contaminants on the surface of the wafer to ensure that subsequent processing steps can be performed on a clean wafer surface.

[0003] In the current wafer cleaning process, the cleaning equipment is usually provided with an arm swinging device, a liquid spraying device and a wafer carrying device. The arm swinging device drives the liquid spraying device to swing back and forth above the wafer to spray cleaning liquid to achieve cleaning of the wafer. When the cleaning work is completed, the arm swinging device will receive a signal to end the work and move from the working position to the initial position. Due to the height difference between the working position and the initial position, if the arm swinging device rotates abnormally or the position detection signal is lost, the arm swinging device may continue to swing and hit the wafer carrying device, thus causing damage to the cleaning equipment and affecting the safety of the equipment.

[0004] Therefore, how to provide a wafer cleaning equipment with high safety is a technical problem that needs to be solved by those skilled in the art. CONTENT OF THE UTILITY MODEL

[0005] The present application aims to solve the technical problems existing in the prior art. To this end, the present application provides a wafer cleaning device to solve the technical problem that the arm swings and hits the wafer carrying device in an abnormal and out-of-control state in the prior art.

[0006] To solve the above technical problems, the technical solution adopted by the present application is:

[0007] A wafer cleaning device, comprising: a cleaning mechanism for cleaning a wafer, comprising a spray head, an arm swinging assembly and a tail rod, the tail rod having opposite first and second ends, one end of the arm swinging assembly being connected to the spray head and the other end being connected to the first end, the spray head and the tail rod moving in the same direction under the driving of the arm swinging assembly;

[0008] A first limiting structure is provided on one side of the cleaning mechanism and comprises a limiting part;

[0009] When the height of the spray head is lower than the preset height, the height of the second end is lower than the height of the top end of the limiting part, so that the tail rod abuts against the limiting part to prevent the tail rod from rotating in the preset direction.

[0010] Preferably, the limiting portion comprises a first side and a second side arranged oppositely.

[0011] When the shower head moves from the initial position to the wafer, if the height of the shower head is lower than the preset height, the tail rod abuts against the second side when moving to the limiting portion, so as to prevent the shower head from continuously moving to the wafer.

[0012] When the shower head moves from the wafer to the initial position, if the height of the shower head is lower than the preset height, the tail rod abuts against the first side when moving to the limiting portion, so as to prevent the shower head from continuously moving to the initial position.

[0013] The initial position is a position where the shower head is located when the shower head is not working.

[0014] Preferably, the wafer cleaning device further comprises a rotating structure for driving the swing arm assembly to rotate, so as to move the shower head between a first working position and a second working position.

[0015] The first working position is close to or located at a circumferential edge of the wafer, and the second working position is close to or located at a center of the wafer.

[0016] Preferably, the wafer cleaning device further comprises a second limiting structure, one end of which is connected to the first limiting structure, and the other end of which is provided with a limiting slot, wherein two ends of the limiting slot are respectively provided with a first limiting socket and a second limiting socket.

[0017] The rotating structure is provided with a limiting rod on a side close to the limiting slot, and the limiting rod is arranged in the limiting slot.

[0018] The limiting rod is located in the first limiting socket, so as to make the shower head located at the initial position.

[0019] The limiting rod is located in the second limiting socket, so as to make the shower head located at the second working position.

[0020] Preferably, on a horizontal projection plane of the wafer cleaning device, the rotating structure has a center point, and an extreme included angle is formed between a line connecting the first limiting socket and the center point and a line connecting the second limiting socket and the center point.

[0021] Preferably, an adjusting slot and an adjusting rod are arranged on an end of the first limiting structure away from the limiting portion, the second limiting structure is provided with an adjusting hole, and the adjusting rod is sequentially arranged in the adjusting slot and the adjusting hole; wherein the adjusting rod and the adjusting hole have a preset matching tolerance.

[0022] Preferably, the wafer cleaning apparatus further includes a rotating mechanism, comprising a motor connected to the side of the rotating structure that does not have the limiting rod.

[0023] Preferably, the wafer cleaning device further includes: a lifting mechanism, comprising a cylinder and a supporting structure, wherein the supporting structure is connected to the side of the rotating structure having the limiting rod and maintains a preset distance from the second limiting structure, the mounting end of the cylinder is located on the side of the supporting structure away from the rotating structure, and the output end is connected to the swing arm assembly.

[0024] Preferably, the swing arm assembly includes a swing arm, a first connector and a second connector. One end of the first connector is connected to the tail rod, and the other end is connected to the output end of the cylinder and the swing arm respectively. One end of the second connector is connected to the nozzle, and the other end is connected to the end of the swing arm away from the first connector.

[0025] Preferably, the wafer cleaning apparatus further includes a wafer carrier mechanism, comprising a stage and a protective structure. The stage is used to support the wafer and drive the wafer to rotate in the working state. The protective structure is disposed around the stage and has a dormant position and a protective position, and is used to move from the dormant position to the protective position in the working state to shield the wafer from all sides.

[0026] According to the specific embodiments provided in this application, the following technical effects are disclosed:

[0027] This application provides a wafer cleaning apparatus, comprising: a cleaning mechanism for cleaning wafers, including a nozzle, a swing arm assembly, and a tail rod. The tail rod has a first end and a second end opposite to each other. One end of the swing arm assembly is connected to the nozzle, and the other end is connected to the first end. The nozzle and the tail rod move in the same direction under the drive of the swing arm assembly. A first limiting structure is provided on one side of the cleaning mechanism, including a limiting part. When the height of the nozzle is lower than a preset height, the height of the second end is lower than the height of the top of the limiting part, so that the limiting part abuts against the tail rod to prevent the tail rod from rotating in a preset direction. In this solution, the setting of the first limiting structure and the tail rod improves the safety of the wafer cleaning apparatus. When the swing arm assembly is out of control due to loss of control signal or abnormal rotation, the first limiting structure can block the tail rod to prevent the swing arm assembly from driving the nozzle to continue moving, preventing it from impacting other components in the apparatus, and improving the operational stability of the wafer cleaning apparatus. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is an overall schematic diagram of the wafer cleaning apparatus provided in the embodiments of this application;

[0030] Figure 2 This is one of the side view schematic diagrams of the wafer cleaning apparatus provided in the embodiments of this application;

[0031] Figure 3 This is a second side view schematic diagram of the wafer cleaning apparatus provided in the embodiments of this application;

[0032] Figure 4 This is a top view schematic diagram of the wafer cleaning apparatus provided in the embodiments of this application;

[0033] Figure 5 This is a schematic diagram of the fit between the limiting rod and the limiting groove provided in an embodiment of this application;

[0034] Figure 6 This is an enlarged schematic diagram of the testing institution provided in the embodiments of this application;

[0035] Figure 7 This is a schematic diagram of the limiting included angle provided in the embodiments of this application;

[0036] Figure 8 This is a schematic diagram of the first and second moving angles provided in the embodiments of this application.

[0037] Figure label:

[0038] 10. Wafer; 20. Nozzle; 30. Swing arm assembly; 40. Tail rod; 50. Base point; 60. Origin position; 70. First working position; 80. First limiting structure; 90. Second working position; 100. Second limiting structure; 110. Rotating structure; 120. Motor; 130. Cylinder; 140. Bearing structure; 150. Protective structure; 170. Origin position sensor; 180. First working position sensor; 190. Second working position sensor; 200. Mounting plate; 300. Swing arm; 310. First connector; 320. Second connector; 400. Liquid collection box; 500. Mounting base; 800. Limiting part; 810. Adjusting groove; 820. Adjusting rod; 1000. Limiting groove; 1010. First limiting slot; 1020. Second limiting slot; 1030. Adjusting hole; 1100. Limiting rod. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0040] As described in the background section, current wafer cleaning processes typically include a swing arm, a spray device, and a wafer carrier. The swing arm drives the spray device to swing back and forth above the wafer, spraying cleaning fluid to clean the wafer. When the cleaning process is complete, the swing arm receives a signal indicating the end of the process and moves from the working position back to the initial position. However, due to the height difference between the working and initial positions, if the swing arm rotates abnormally or the position detection signal is lost, the swing arm may continue to swing and collide with the wafer carrier, potentially damaging the cleaning equipment and compromising its safety.

[0041] Based on this, this application provides a wafer cleaning device, which aims to solve the technical problem in the prior art where the swing arm impacts the wafer carrier device under abnormal or uncontrolled conditions.

[0042] refer to Figures 1 to 6 The wafer cleaning apparatus of this application generally includes: a wafer carrier mechanism for carrying and protecting the wafer 10; a cleaning mechanism including a nozzle 20, a swing arm assembly 30, and a tail rod 40, wherein the nozzle 20 and the tail rod 40 are respectively disposed at both ends of the swing arm assembly 30, and the swing arm assembly 30 drives the nozzle 20 to move between the origin position 60, the first working position 70, and the second working position 90; a first limiting structure 80 for blocking the tail rod 40 when the swing arm assembly 30 is abnormal or out of control, so as to prevent the swing arm assembly 30 from continuing to move from the first working position 70 toward the origin position 60 and impacting other components in the apparatus, such as the wafer carrier mechanism; a second limiting structure 100 for preventing the rotating structure 110 from rotating too far by utilizing the cooperation of the limiting rod 1100 and the limiting groove 1000; a rotating mechanism for driving the swing arm assembly 30 to rotate; a lifting mechanism for driving the swing arm assembly 30 to lift; and a detection mechanism for detecting the position of the nozzle 20.

[0043] The wafer cleaning apparatus of this application will be analyzed in detail below with reference to the accompanying drawings. Figures 1 to 6The wafer cleaning apparatus includes: a wafer carrier mechanism, including a stage (not shown) and a protective structure 150. The stage carries the wafer 10 and rotates the wafer 10 during operation. The protective structure 150 surrounds the stage and has a sleep position and a protected position. During operation, it moves from the sleep position to the protected position, shielding the wafer 10. A cleaning mechanism for cleaning the wafer 10 includes a nozzle 20, a swing arm assembly 30, and a tail rod 40. The tail rod 40 has a first end and a second end. One end of the swing arm assembly 30 is connected to the nozzle 20, and the other end is connected to the first end. The nozzle 20 and the tail rod 40 move in the same direction under the drive of the swing arm assembly 30, specifically making the nozzle 20 and the tail rod 40 perform circular motion in the same direction, and also making the nozzle 20 and the tail rod 40 rise and fall in the same direction. Figure 1 and Figure 4 As shown, the projection point of the rotating arm of the swing arm assembly 30 on the horizontal projection plane of the entire wafer cleaning apparatus is taken as the base point 50, and the swing arm assembly 30 rotates around the base point 50. The first limiting structure 80 is provided in the direction close to the cleaning mechanism and includes a limiting part 800. When the height of the nozzle 20 is lower than the preset height, the height of the second end is lower than the height of the top of the limiting part 800, so that the limiting part 800 abuts against the tail rod 40 to prevent the tail rod 40 from rotating in the preset direction.

[0044] In a specific embodiment, such as Figure 1 As shown, the limiting part 800 has a first side and a second side disposed opposite to each other. The nozzle 20 has an initial position in a non-operating state. When the nozzle 20 moves from the initial position toward the wafer 10, if the height of the nozzle 20 is lower than a preset height, the tail rod 40 moves to the limiting part 800 and abuts against the second side to prevent the nozzle 20 from continuing to move toward the wafer 10; when the nozzle 20 moves from the wafer 10 toward the initial position, if the height of the nozzle 20 is lower than the preset height, the tail rod 40 moves to the limiting part 800 and abuts against the first side to prevent the nozzle 20 from continuing to move toward the initial position.

[0045] The preset height can be set according to the arrangement of components within the wafer cleaning device to ensure that the nozzle 20 does not touch related components, and that the tail rod 40 does not touch the first limiting structure 80 at its initial position. In this embodiment, the initial position of the nozzle 20 is located above the liquid collection box 400, denoted as the origin position 60; combined with Figure 1Analysis shows that during the transition from the initial state to the working state, the nozzle 20 moves from the origin position 60 towards the wafer 10. If the height of the nozzle 20 during movement is greater than the preset height, the tail rod 40 will not touch the limiting part 800, and the nozzle 20 continues to move towards the wafer 10. If the height of the nozzle 20 during movement is less than the preset height, the tail rod 40 will abut against the second side when it reaches the limiting part 800, preventing the nozzle 20 from continuing to move towards the wafer 10. During the transition from the working state to the initial state, the nozzle 20 moves from the wafer 10 towards the origin position 60. If the height of the nozzle 20 during movement is greater than the preset height, the tail rod 40 will not touch the limiting part 800, and the nozzle 20 continues to move towards the origin position 60. If the height of the nozzle 20 during movement is less than the preset height, the tail rod 40 will abut against the first side when it reaches the limiting part 800, preventing the nozzle 20 from continuing to move towards the origin position 60.

[0046] In one embodiment of initiating wafer cleaning, such as Figure 1 and Figure 4As shown, the wafer carrier mechanism is located on one side of the cleaning mechanism. In the initial state, the wafer 10 is placed on the carrier platform of the wafer carrier mechanism, and the swing arm assembly 30 is located directly above the liquid collection box 400, so that the nozzle 20 is located above the liquid collection box 400. At this time, the position of the nozzle 20 is the origin position 60. The liquid collection box 400 is used to store the cleaning liquid, and when the nozzle 20 needs to be added, the nozzle 20 is immersed in it to draw the cleaning liquid. In operation, the protective structure 150 of the wafer carrier mechanism rises from the dormant position to the protective position, shielding the perimeter of the wafer 10. The first working position 70 is near or located at the circumference of the wafer 10, and the second working position 90 is near or located at the center of the wafer 10. Both working positions are lower than the height of the origin position 60. First, the swing arm assembly 30 lifts the nozzle 20 to remove it from the liquid collection box 400. Simultaneously, the tail rod 40 rises, exceeding the top surface of the limiting part 800. Then, the swing arm assembly 30 rotates the nozzle 20 from the origin position 60 towards the wafer 10, bringing the nozzle 20 above the first working position 70. Throughout this process, the tail rod 40 remains above the top surface of the limiting part 800. If an emergency occurs and the swing arm assembly 30 fails to reach the first working position 70... If the nozzle 20 moves downward due to a misalignment or loss of control, the tail rod 40 will touch the top of the limiting part 800 to prevent the swing arm assembly 30 from moving further downward and trigger an alarm to remind the staff to perform maintenance. Then, the swing arm assembly 30 will drive the nozzle 20 to move downward to the first working position 70. At this time, the tail rod 40 will abut against the first side of the limiting part 800 of the first limiting structure 80, and the nozzle 20 will be within the range blocked by the protective structure 150. Finally, the swing arm assembly 30 will drive the nozzle 20 to move back and forth between the first working position 70 and the second working position 90. The tail rod 40 will swing back and forth synchronously in the left side A area of ​​the limiting part 800, and will only abut against the first side of the limiting part 800 when the nozzle 20 is in the first working position 70. At the same time, the stage will drive the wafer 10 to rotate to achieve cleaning of the surface of the wafer 10.

[0047] The shape of the first limiting structure 80 is not limited; in one case, such as Figure 1 As shown, the first limiting structure 80 is composed of a main board and sub-boards extending vertically from both ends of the main board. The upper sub-board serves as the limiting part 800, and the lower sub-board serves as the fixing part. In another case, the first limiting structure 80 is a solid cuboid plate. In yet another case, the limiting part 800 of the first limiting structure 80 is provided with a groove structure so that the tail rod 40 is engaged in the groove structure when it abuts against the limiting part 800.

[0048] In one embodiment of nozzle position detection, such as Figure 1 and Figures 4 to 6As shown, the wafer cleaning apparatus further includes a detection mechanism, comprising a mounting plate 200, and an origin position sensor 170, a first working position sensor 180, and a second working position sensor 190 disposed on the mounting plate 200. The origin position sensor 170 is used to detect whether the nozzle 20 has reached the origin position 60, the first working position sensor 180 is used to detect whether the nozzle 20 has reached the first working position 70, and the second working position sensor 190 is used to detect whether the nozzle 20 has reached the second working position 90. When the swing arm assembly 30 moves the nozzle 20 to a preset position, the sensor at the corresponding position receives the corresponding positioning signal to determine that the nozzle 20 is in place.

[0049] In one embodiment of ending wafer cleaning, such as Figure 1 As shown, under normal circumstances, firstly, the swing arm assembly 30 moves the nozzle 20 from the second working position 90 to the first working position 70. The first working position sensor 180 confirms that the nozzle 20 is in place. Then, the swing arm assembly 30 raises the nozzle 20 to the height of the origin position 60. At this time, the nozzle 20 has exceeded the shielding range of the protective structure 150. Then, the swing arm assembly 30 moves the nozzle 20 back to the origin position 60. If liquid needs to be added, the swing arm assembly 30 moves the nozzle 20 down into the liquid collection box 400. If liquid does not need to be added, the swing arm assembly 30 keeps the nozzle 20 at the origin position 60, and the wafer cleaning process ends.

[0050] like Figure 1 As shown, in an abnormal situation, firstly, the swing arm assembly 30 moves the nozzle 20 from the second working position 90 to the first working position 70. At this time, if the swing arm assembly 30 itself is out of control or the detection signal of the first working position sensor 180 is lost, it cannot be confirmed whether the nozzle 20 is in position, resulting in the swing arm assembly 30 not receiving the lifting signal. Then, the swing arm assembly 30 moves the nozzle 20 from the height of the first working position 70 towards the origin position 60. The nozzle 20 does not move out of the shielding range of the protective structure 150, and the nozzle 20 and the swing arm assembly 30 collide with the protective structure 150, causing damage to the wafer cleaning device. However, with the cooperation of the tail rod 40 and the first limiting structure 80, when the swing arm assembly 30 moves the nozzle 20 from the height of the first working position 70 towards the origin position 60, the tail rod 40 abuts against the limiting part 800 to prevent the swing arm assembly 30 from moving further. At this time, an alarm is triggered to remind the staff to go for maintenance.

[0051] In an optional embodiment, the working positions include at least a first working position 70 located at the circumference of the wafer 10 surface and a second working position 90 located at the center of the wafer 10 surface. The nozzle 20, in its working state, moves between the first working position 70 and the second working position 90 to achieve full-surface cleaning of the wafer 10. Due to different cleaning processes, there are also several sub-working positions between the first working position 70 and the second working position 90. The nozzle 20, in its working state, moves between different sub-working positions, and the cleaning range covers a portion of the wafer 10 surface to achieve partial cleaning of the wafer 10 according to actual cleaning needs.

[0052] In summary, when the wafer cleaning operation ends and the swing arm assembly 30 is unable to drive the nozzle 20 back to the origin position 60 from the first working position 70 along the correct path, the first limiting structure 80 blocks the tail rod 40 to prevent the swing arm assembly 30 from driving the nozzle 20 to continue moving. This avoids the swing arm assembly 30 and the nozzle 20 from continuing to move and colliding with other components in the wafer cleaning device (such as the protective structure 150 of the wafer carrier mechanism), which could cause damage to the swing arm assembly 30, the nozzle 20, and other components. This improves the safety and stability of the wafer cleaning device.

[0053] Preferably, refer to Figures 1 to 5 The wafer cleaning apparatus further includes: a second limiting structure 100 connected to the first limiting structure 80, and a limiting groove 1000 at one end away from the first limiting structure 80, wherein the two ends of the limiting groove 1000 are respectively provided with a first limiting slot 1010 and a second limiting slot 1020; a rotating structure 110 for driving the swing arm assembly 30 to rotate, and a limiting rod 1100 provided on the side of the rotating structure 110 near the limiting groove 1000, the limiting rod 1100 passing through the limiting groove 1000; the limiting rod 1100 is located at the first limiting slot 1010 so that the nozzle 20 is located in the initial position; the limiting rod 1100 is located at the second limiting slot 1020 so that the nozzle 20 is located in the second working position 90.

[0054] In a specific embodiment, such as Figure 5As shown, when the nozzle 20 reaches the origin position 60, if the origin position sensor 170 is damaged or loses its detection signal, it cannot confirm whether the nozzle 20 is in position. As a result, the swing arm assembly 30 cannot receive the stop signal and continues to drive the nozzle 20 from the origin position 60 in a direction away from the wafer 10 (rotating structure 110 rotates counterclockwise). Then, the limit rod 1100 abuts against the first limit latch 1010 to avoid damage to the wafer cleaning device caused by the swing arm assembly 30 over-rotating. Similarly, when the nozzle 20 reaches the second working position 90, if the second working position sensor 190 is damaged or loses its detection signal, it cannot confirm whether the nozzle 20 is in position. As a result, the swing arm assembly 30 cannot receive the stop signal and continues to drive the nozzle 20 from the second working position 90 in a direction away from the origin position 60 (rotating structure 110 rotates clockwise). Then, the limit rod 1100 abuts against the second limit latch 1020 to avoid damage to the wafer cleaning device caused by the swing arm assembly 30 over-rotating.

[0055] In a specific embodiment, such as Figure 1 As shown, the mounting plate 200 is located on one side of the rotating structure 110 and is on the same plane as the rotating structure 110, so that the three sensors on the plate can determine the position of the nozzle 20 according to the rotation angle of the rotating structure 110, so as to realize the detection of the position of the nozzle 20.

[0056] In summary, the cooperation between the second limiting structure 100 and the limiting rod 1100 prevents damage to the device caused by excessive swing of the swing arm assembly 30, further enhancing the safety and stability of the wafer cleaning device and ensuring the smooth progress of the cleaning process and the reliable operation of the device.

[0057] Preferably, refer to Figure 7 On the horizontal projection surface of the wafer cleaning device, the rotating structure 110 has a center point, the limiting groove 1000 is arc-shaped, and there is a limit angle between the line connecting the first limiting slot 1010 and the center point and the line connecting the second limiting slot 1020 and the center point.

[0058] The rotating structure 110 is connected to the swing arm assembly 30, and the two are coaxial. The projection of the rotating arm of the swing arm assembly 30 on the projection plane coincides with the center point, that is, the center point coincides with the base point 50, and the extreme included angle is at... Figure 7 In this context, θ is used to represent the position of the swing arm assembly 30. By changing the curvature of the limiting groove 1000 and the positions of the first limiting slot 1010 and the second limiting slot 1020, the value of θ can be changed, thereby satisfying the changing installation position of the swing arm assembly 30 and adapting to the installation size requirements of various internal cavities of equipment, such as... Figure 8 The length dimensions of A and B are shown in the figure.

[0059] Preferably, refer to Figure 8On the horizontal projection plane of the wafer cleaning device, there is a first moving angle between the line connecting the origin position 60 and the base point 50 and the line connecting the first working position 70 and the base point 50, and there is a second moving angle between the line connecting the first working position 70 and the base point 50 and the line connecting the second working position 90 and the base point 50.

[0060] Wherein, the first angle of movement is Figure 8 In this context, α is used to represent the size of the wafer. By changing the value of α, the size of the wafer can be adapted to different wafer dimensions; the second moving angle is... Figure 8 The value of β is determined by the size of the wafer or the process parameters.

[0061] Preferably, refer to Figure 1 and Figure 5 The first limiting structure 80 is provided with an adjusting groove 810 and an adjusting rod 820 at one end away from the limiting part 800. The second limiting structure 100 is provided with an adjusting hole 1030. The adjusting rod 820 passes through the adjusting groove 810 and the adjusting hole 1030 in sequence. The adjusting rod 820 and the adjusting hole 1030 have a preset fit tolerance.

[0062] In a specific embodiment, such as Figure 1 As shown, by utilizing the fit tolerance of the adjusting rod 820 and the adjusting hole 1030, rotating the adjusting rod 820 changes the position of the first limiting structure 80 relative to the second limiting structure 100, causing the first limiting structure 80 to move left or right to adapt to changes in the size of different wafers. For example, when a wafer Q is provided on the wafer carrier mechanism, and the size of wafer Q is smaller than the size of the aforementioned wafer 10, there is a third movement angle between the line connecting the origin position 60 and the base point 50, and between the line connecting the first working position 70 and the base point 50, denoted as α+δ. At this time, rotating the adjusting rod 820 causes the first limiting structure 80 to move to the left relative to the second limiting structure 100, so that when the tail rod 40 and the limiting part 800 abut, the angle of rotation of the tail rod 40 is α+δ.

[0063] Preferably, refer to Figures 1 to 3 The wafer cleaning apparatus further includes: a rotating mechanism, including a motor 120 connected to the side of the rotating structure 110 without the limiting rod 1100, for driving the rotating structure 110 to rotate; and a lifting mechanism, including a cylinder 130 and a bearing structure 140, the bearing structure 140 being connected to the side of the rotating structure 110 with the limiting rod 1100 and maintaining a preset distance from the second limiting structure 100, the cylinder 130 being fixedly disposed on the side of the bearing structure 140 away from the rotating structure 110, and the output end being connected to the swing arm assembly 30 for driving the swing arm assembly 30 to lift.

[0064] The bearing structure 140 and the second limiting structure 100 maintain a preset distance, and the length of the limiting rod 1100 is less than the preset distance, so as to ensure that the limiting rod 1100 will not touch the bearing structure 140 when the rotating structure 110 rotates, thus ensuring the safety of the rotation process.

[0065] In one specific embodiment, when the limit rod 1100 abuts against the first limit latch 1010 and when the limit rod 1100 abuts against the second limit latch 1020, the motor 120 will activate its built-in safety torque shutdown function (STO) to stop the rotation of the output shaft, thereby stopping the rotation structure 110 from rotating.

[0066] In one specific embodiment, the motor 120 is a servo drive motor with a preset step angle, located at the bottom of the mounting base 500. The output shaft of the motor 120 passes through the mounting base 500 and is connected to the rotating structure 110 to achieve low vibration, low noise and high precision drive.

[0067] In one specific embodiment, the rotating structure 110 adopts a single-pole helical gear with a clearance adjustment structure. This gear has high repeatability and small backlash to suppress vibration caused by mechanical gear clearance during rotation.

[0068] In one specific embodiment, the rotating structure 110 and the bearing structure 140 are connected and supported by a cross roller bearing with preset rigidity to withstand various torques such as radial, axial and tilting torques, and suppress the vibration of the swing arm assembly 30 due to insufficient rigidity.

[0069] In one specific embodiment, the rotating structure 110 is precision bored after installation to ensure the concentricity and coaxiality of the plane of the rotating structure 110, so as to suppress the fluctuation of the arc of the movement trajectory of the swing arm assembly 30.

[0070] Preferably, refer to Figures 1 to 4 The swing arm assembly 30 includes a swing arm 300, a first connector 310 and a second connector 320. One end of the first connector 310 is connected to the tail rod 40, and the other end is connected to the output end of the cylinder 130 and the swing arm 300 respectively. One end of the second connector 320 is connected to the nozzle 20, and the other end is connected to the end of the swing arm 300 away from the first connector 310.

[0071] In a specific embodiment, such as Figures 1 to 4As shown, the swing arm 300 is L-shaped and has a long plate and a short plate. The vertical connection between the long plate and the short plate is the base point 50 of the swing arm 300. In the longitudinal direction of the device, the short plate, cylinder 130, bearing structure 140, rotating structure 110 and motor 120 are arranged on the same central axis to improve the operating accuracy of the wafer cleaning device. The first connector 310 is perpendicular to the short plate and is connected to it. The tail rod 40 extends toward the plane of the rotating structure 110 and has different positional relationships with the first limiting structure 80 in different states of the swing arm 300. The second connector 320 is perpendicular to the long plate and the nozzle 20 is located below the long plate and is set toward the liquid collection box 400.

[0072] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0073] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0074] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A wafer cleaning apparatus, characterized by comprising: The wafer cleaning device comprises: A cleaning mechanism for cleaning a wafer (10), comprising a spray head (20), a swing arm assembly (30), and a tail rod (40), the tail rod (40) having opposite first and second ends, one end of the swing arm assembly (30) being connected to the spray head (20), and the other end being connected to the first end, the spray head (20) and the tail rod (40) moving in the same direction under the drive of the swing arm assembly (30); A first limiting structure (80) provided on one side of the cleaning mechanism, comprising a limiting part (800); When the height of the spray head (20) is lower than a preset height, the height of the second end is lower than the height of the top end of the limiting part (800), so that the limiting part (800) abuts against the tail rod (40) to prevent the tail rod (40) from rotating in a preset direction.

2. The wafer cleaning apparatus according to claim 1, wherein The limiting part (800) comprises opposite first and second sides; When the spray head (20) moves from an initial position to the direction of the wafer (10), if the height of the spray head (20) is lower than the preset height, the tail rod (40) abuts against the second side when moving to the limiting part (800), to prevent the spray head (20) from continuing to move in the direction of the wafer (10); When the spray head (20) moves from the wafer (10) to the direction of the initial position, if the height of the spray head (20) is lower than the preset height, the tail rod (40) abuts against the first side when moving to the limiting part (800), to prevent the spray head (20) from continuing to move in the direction of the initial position; The initial position is the position of the spray head (20) when it is not working.

3. The wafer cleaning apparatus according to claim 2, wherein The wafer cleaning device further comprises: A rotating structure (110) for driving the swing arm assembly (30) to rotate, so that the spray head (20) moves between a first working position (70) and a second working position (90); The first working position (70) is close to or located at the circumferential edge of the wafer (10), and the second working position (90) is close to or located at the center of the wafer (10).

4. The wafer cleaning apparatus according to claim 3, wherein The wafer cleaning device further comprises: A second limiting structure (100) connected to one end of the first limiting structure (80), and provided with a limiting slot (1000) at the other end, wherein the two ends of the limiting slot (1000) are respectively provided with a first limiting slot (1010) and a second limiting slot (1020); The rotating structure (110) is provided with a limiting rod (1100) on one side close to the limiting slot (1000), and the limiting rod (1100) is provided in the limiting slot (1000); When the limiting rod (1100) is located in the first limiting slot (1010), the spray head (20) is located in the initial position; When the limiting rod (1100) is located in the second limiting slot (1020), the spray head (20) is located in the second working position (90).

5. The wafer cleaning apparatus according to claim 4, wherein The rotation structure (110) has a center point on the horizontal projection plane of the wafer cleaning device, and the first limiting socket (1010) and the second limiting socket (1020) have a limiting angle with the center point.

6. The wafer cleaning apparatus according to claim 4 or 5, wherein The first limiting structure (80) is provided with an adjusting slot (810) and an adjusting rod (820) at one end away from the limiting part (800), and the second limiting structure (100) is provided with an adjusting hole (1030), and the adjusting rod (820) passes through the adjusting slot (810) and the adjusting hole (1030) in sequence. The adjusting rod (820) and the adjusting hole (1030) have a preset matching tolerance.

7. The wafer cleaning apparatus according to claim 6, wherein The wafer cleaning device further comprises: The rotating mechanism comprises a motor (120) connected to the side of the rotation structure (110) without the limiting rod (1100).

8. The wafer cleaning apparatus according to claim 7, wherein The wafer cleaning device further comprises: The lifting mechanism comprises a cylinder (130) and a bearing structure (140), the bearing structure (140) is connected to the side of the rotation structure (110) with the limiting rod (1100), and the distance between the bearing structure (140) and the second limiting structure (100) is kept at a preset distance, the mounting end of the cylinder (130) is arranged on the side of the bearing structure (140) away from the rotation structure (110), and the output end is connected with the swing arm assembly (30).

9. The wafer cleaning apparatus according to claim 8, wherein The swing arm assembly (30) comprises a swing arm (300), a first connecting piece (310) and a second connecting piece (320), one end of the first connecting piece (310) is connected with the tail rod (40), and the other end is connected with the output end of the cylinder (130) and the swing arm (300) respectively, one end of the second connecting piece (320) is connected with the spray head (20), and the other end is connected with the swing arm (300) away from the first connecting piece (310).

10. The wafer cleaning apparatus of claim 1, wherein The wafer cleaning device further comprises: The slide mechanism comprises a slide rail (200) and a slide block (210), the slide rail (200) is arranged on the side of the bearing structure (140) away from the rotation structure (110), and the slide block (210) is arranged on the side of the swing arm (300) away from the first connecting piece (310), the slide block (210) is connected with the slide rail (200) through the slide rail (200) and the slide block (210). The wafer cleaning device further comprises: The slide mechanism comprises a slide rail (200) and a slide block (210), the slide rail (200) is arranged on the side of the bearing structure (140) away from the rotation structure (110), and the slide block (210) is arranged on the side of the swing arm (300) away from the first connecting piece (310), the slide block (210) is connected with the slide rail (200) through the slide rail (200) and the slide block (210). The wafer cleaning device further comprises: The slide mechanism comprises a slide rail (200) and a slide block (210), the slide rail (200) is arranged on the side of the bearing structure (140) away from the rotation structure (110), and the slide block (210) is arranged on the side of the swing arm (300) away from the first connecting piece (310), the slide block (210) is connected with the slide rail (200) through the slide rail (200) and the slide block (210).

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