Case heat dissipation structure and inverter

Abstract

The utility model discloses a case heat dissipation structure and an inverter, the case heat dissipation structure comprises a closed shell, a first fan assembly, a second fan assembly, a first heating element and a second heating element, the first fan assembly, the second fan assembly, the first heating element and the second heating element are arranged in the shell, and the first fan assembly and the second fan assembly are arranged at an interval to form a closed circulating air duct in the shell; the air inlet side of the first fan assembly is arranged close to the first heating element, the air outlet side of the second fan assembly is arranged close to the second heating element, and the air outlet side of the first fan assembly corresponds to the air inlet side of the second fan assembly; wherein the first fan assembly is used for driving airflow to flow through the first heating element to dissipate heat of the first heating element and conveying the airflow to the second fan assembly; the second fan assembly drives the air flow to flow through the second heating element to dissipate heat of the second heating element, and the air flow after heat dissipation finally flows back to the first fan assembly.

Description

Technical Field

[0001] This application relates to the field of inverter technology, and more specifically to a chassis heat dissipation structure and an inverter. Background Technology

[0002] Currently, high-power inverters often employ forced air cooling for heat dissipation, making airflow design a crucial part of the inverter's cooling system. The main function of the airflow is to guide airflow and remove the heat generated by power components. However, the sealed casing of high IP-protected inverters prevents the air-cooled system from completing the exchange of air between the inside and outside, limiting internal heat transfer efficiency and thus restricting the overall power output of the unit.

[0003] However, even with a sealed casing, the heat output of the components inside the inverter varies. Without forced convection, hot air rises naturally and easily forms high-temperature air masses, i.e., local hot spots, above components that generate significant heat, such as IGBTs and inductors. This causes the temperature of these components to far exceed the average internal temperature, making them prone to damage or derating due to overheating. Utility Model Content

[0004] The purpose of this application is to provide a chassis heat dissipation structure and an inverter to solve the problem of local hot spots within the chassis heat dissipation structure.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows: a chassis heat dissipation structure is provided, comprising: a closed housing, and a first fan assembly, a second fan assembly, a first heating element, and a second heating element disposed within the housing. The first fan assembly and the second fan assembly are spaced apart to form a closed circulating air duct inside the housing. The air inlet side of the first fan assembly is disposed close to the first heating element, and the air outlet side of the second fan assembly is disposed close to the second heating element. The air outlet side of the first fan assembly corresponds to the air inlet side of the second fan assembly. The first fan assembly is used to drive airflow through the first heating element to dissipate heat and to deliver the airflow to the second fan assembly. The second fan assembly drives the airflow through the second heating element to dissipate heat, and the dissipated airflow eventually returns to the first fan assembly.

[0006] As a preferred embodiment, the device further includes a flow guide, which is disposed within the housing and positioned between the air outlet side of the first fan assembly and the air inlet side of the second fan assembly; wherein the flow guide is used to guide the airflow from the air outlet side of the first fan assembly to the second fan assembly.

[0007] As another preferred embodiment, the flow guide includes a connecting portion and a flow guide portion. One end of the connecting portion is used to be fixedly connected to the inner sidewall of the housing, and the other end is connected to the flow guide portion. The flow guide portion is arranged in an arc-shaped bend relative to the connecting portion.

[0008] More preferably, the first fan assembly is disposed perpendicular to the bottom wall of the housing, and its air delivery direction is parallel to the bottom wall of the housing; the second fan assembly is disposed perpendicular to the side wall of the housing, and its air delivery direction is parallel to the side wall of the housing, pointing from the top wall of the housing to the bottom wall.

[0009] Further preferably, it also includes a support plate, which is disposed inside the housing, connected to the inner wall of the housing and parallel to the bottom wall of the housing; wherein the support plate is positioned in the middle of the internal space of the housing to divide the internal space of the housing into a first chamber and a second chamber in the vertical direction.

[0010] Preferably, the first chamber is located near the top wall of the housing, and the second chamber is located near the bottom wall of the housing; the second fan assembly is fixedly mounted on the support plate to blow the airflow in the first chamber toward the second chamber.

[0011] Preferably, the first heating element includes an element body and an element mounting plate. The element body is connected to the element mounting plate, and the element mounting plate is disposed perpendicular to the bottom wall of the housing. The first fan assembly is fixedly connected to the element mounting plate, and thus the first fan assembly is disposed adjacent to the element body.

[0012] Preferably, it further includes a heat sink assembly connected to the bottom wall of the housing.

[0013] Preferably, the heat dissipation area of ​​the radiator assembly covers the projection area of ​​the closed-loop air duct on the bottom wall of the housing.

[0014] Furthermore, the radiator assembly includes heat dissipation fins, a cooling fan, and a grille shell. The heat dissipation fins are attached to the outer side of the bottom wall of the shell, the cooling fan is located at the end of the heat dissipation fins, and the grille shell covers the heat dissipation fins and the cooling fan to form a heat dissipation duct that communicates with the outside air.

[0015] Furthermore, this application also provides an inverter, which includes the chassis heat dissipation structure of any of the above.

[0016] Compared with the prior art, the beneficial effects of this application are as follows:

[0017] The closed-loop airflow inside the casing is formed by two sets of fan assemblies. By driving the air inside the casing to form directional forced convection, local hot spots are effectively eliminated, and the efficiency of heat transfer from the inside to the casing is significantly enhanced. Thus, while ensuring the sealing and protection of the chassis heat dissipation structure, the heat dissipation bottleneck is broken through, and the power density and reliability of the inverter are improved simultaneously. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the chassis heat dissipation structure.

[0019] Figure 2 This is an exploded view of the chassis's heat dissipation structure.

[0020] Figure 3 This is a schematic diagram of the internal structure of the chassis heat dissipation structure.

[0021] Figure 4 This is a top-down view of the internal structure of the chassis's heat dissipation system.

[0022] Figure 5 This is a top-down view of the chassis's heat dissipation structure.

[0023] Figure 6 for Figure 5 Side sectional view at point AA.

[0024] Figure 7 This is a schematic diagram of the chassis heat dissipation structure from the front view.

[0025] Figure 8 This is a schematic diagram of the structure of the heat sink assembly, showing the heat sink fins and cooling fan distributed on the bottom wall of the housing.

[0026] In the diagram: 1. Chassis heat dissipation structure; 10. Shell; 11. First chamber; 12. Second chamber; 13. Power board; 14. Terminal block; 15. Shielding plate; 16. PCB board; 17. Top wall; 171. Top cover; 18. Side wall; 19. Bottom wall; 20. First fan assembly; 30. Second fan assembly; 40. First heating element; 41. Component body; 42. Component mounting plate; 50. Second heating element; 60. Air guide; 61. Connecting part; 62. Air guide; 70. Support plate; 71. Main board; 80. Heat sink assembly; 81. Heat sink fins; 82. Cooling fan; 83. Grille shell. Detailed Implementation

[0027] The present application will be further described below with reference to specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0028] In the description of this application, it should be noted that the directional terms such as "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this application.

[0029] It should be noted that the terms "first," "second," etc., in the specification and claims of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0030] The terms “comprising” and “having”, and any variations thereof, in the specification and claims of this application are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0031] In a preferred embodiment, see Figures 1 to 8 This application provides a chassis heat dissipation structure 1, including: a closed housing 10, and a first fan assembly 20, a second fan assembly 30, a first heating element 40, and a second heating element 50 disposed within the housing 10. The first fan assembly 20 and the second fan assembly 30 are spaced apart to form a closed circulating air duct inside the housing 10. The air inlet side of the first fan assembly 20 is disposed close to the first heating element 40, and the air outlet side of the second fan assembly 30 is disposed close to the second heating element 50, with the air outlet side of the first fan assembly 20 corresponding to the air inlet side of the second fan assembly 30. The first fan assembly 20 drives airflow through the first heating element 40 to dissipate heat and delivers the airflow to the second fan assembly 30. The second fan assembly 30 drives the airflow through the second heating element 50 to dissipate heat, and the dissipated airflow eventually returns to the first fan assembly 20.

[0032] The entire heat dissipation process circulates within the sealed housing 10. During operation, the first fan assembly 20 starts, drawing in air from its intake side. As this air flows over the surface of the first heating element 40, it carries away the heat it generates, forming a primary heat exchange. Subsequently, this pre-heated airflow is blown out by the first fan assembly 20 and directly delivered to the intake side of the second fan assembly 30. After the second fan assembly 30 draws in this airflow, it pressurizes and accelerates its flow. This high-momentum airflow directly impacts the heat dissipation surface of the second heating element 50, undergoing a secondary heat exchange and efficiently carrying away its core heat. After completing the two heat exchanges, the airflow temperature further increases and diffuses within the housing 10. Due to the continuous suction of the first fan assembly 20, this hot air eventually flows back to the intake side of the first fan assembly 20, thus forming a complete, self-circulating, closed airflow channel.

[0033] Since the housing 10 is completely enclosed, the closed-loop air duct is also completely closed, preventing external dust and moisture from entering. During the airflow process, the airflow first dissipates heat from the first heating element 40, and then the second fan assembly 30 directs the airflow to the second heating element 50, avoiding localized heat accumulation inside the housing 10. At the same time, through the relay drive of the two sets of fans, a forced and controllable turbulence is formed inside the housing 10, effectively improving the heat exchange efficiency.

[0034] That is, the closed-loop air duct inside the housing 10 is formed by two sets of fan assemblies. By driving the air inside the housing 10 to form directional forced convection, local hot spots are effectively eliminated and the efficiency of heat transfer from the inside to the enclosure is significantly enhanced. Thus, while ensuring the sealing and protection of the enclosure heat dissipation structure 1, the heat dissipation bottleneck is broken through, and the power density and reliability of the inverter are improved simultaneously.

[0035] As a preferred option, see Figure 3 and Figure 4 The chassis heat dissipation structure 1 also includes a guide element 60, which is disposed inside the housing 10 and positioned between the exhaust side of the first fan assembly 20 and the intake side of the second fan assembly 30; wherein, the guide element 60 is used to guide the airflow from the exhaust side of the first fan assembly 20 to the second fan assembly 30.

[0036] Specifically, the function of the air guide 60 is to receive the potentially divergent airflow blown out from the first fan assembly 20 and guide and converge it to the air intake side of the second fan assembly 30 with high efficiency and low loss.

[0037] As another preferred embodiment, the flow guide 60 includes a connecting portion 61 and a flow guide portion 62. One end of the connecting portion 61 is fixedly connected to the inner sidewall 18 of the housing 10, and the other end is connected to the flow guide portion 62. The flow guide portion 62 is arranged in an arc-shaped bend relative to the connecting portion 61.

[0038] One end of the connecting part 61 is rigidly fixed to the inner side wall 18 of the housing 10 by means of screws or welding, while the other end is connected to the guide part 62. The guide part 62 is arranged in an arc shape relative to the connecting part 61. This arc shape can be a continuous smooth surface or a guide surface approximately composed of multiple folds.

[0039] For further optimization, see Figure 5 and Figure 6 The first fan assembly 20 is disposed perpendicular to the bottom wall 19 of the housing 10, and its air delivery direction is parallel to the bottom wall 19 of the housing 10, indicating that it blows air horizontally inside the housing 10; the second fan assembly 30 is disposed perpendicular to the side wall 18 of the housing 10, and its air delivery direction is parallel to the side wall 18 of the housing 10, pointing from the top wall 17 of the housing 10 to the bottom wall 19, indicating that it blows air vertically inside the housing 10.

[0040] The layout of the aforementioned fan assemblies ensures that the airflow directions of the first fan assembly 20 and the second fan assembly 30 are perpendicular to each other in space, forming an L-shaped core airflow path. The first fan is responsible for driving airflow in the horizontal plane, and the second fan is responsible for driving airflow in the vertical plane. This causes the airflow inside the casing 10 to no longer move in a simple laminar flow, but to form a turbulent flow with slight disturbances. This turbulent flow can further enhance the heat exchange process. Secondly, it achieves three-dimensional and all-round heat dissipation of the internal space of the chassis. The horizontal airflow blown by the first fan assembly 20 is responsible for sweeping and dissipating heat from the components located in the lower part of the chassis, while the second heat dissipation assembly, which blows air from top to bottom, precisely impacts the second heat-generating element 50 located in its path, while simultaneously driving the mixing of air in the upper and lower spaces, preventing hot air from accumulating in the upper part and forming thermal stratification.

[0041] Meanwhile, the layout of the first fan assembly 20 and the second fan assembly 30 is very conducive to the utilization of space inside the chassis. Components of different shapes and with different heat dissipation requirements can be arranged in different sections of the air duct to achieve the optimal configuration of space and heat dissipation performance.

[0042] Further preferably, the chassis heat dissipation structure 1 also includes a support plate 70, which is disposed inside the housing 10, connected to the inner wall of the housing 10 and parallel to the bottom wall 19 of the housing 10, so as to further optimize the internal space layout of the housing 10; wherein, the support plate 70 is placed in the middle of the internal space of the housing 10 to divide the internal space of the housing 10 into a first chamber 11 and a second chamber 12 in the vertical direction, the first chamber 11 is close to the top wall 17 of the housing 10, and the second chamber 12 is close to the bottom wall 19 of the housing 10; the second fan assembly 30 is fixedly installed on the support plate 70 to blow the airflow in the first chamber 11 to the second chamber 12.

[0043] Specifically, the support plate 70 is disposed inside the housing 10, and its edge is firmly connected to the inner sidewall 18 of the housing 10 by screws or rivets. Preferably, there is a certain gap between the support plate 70 and the second fan assembly 30 to optimize the airflow path.

[0044] The support plate 70 serves as a structural support and can also act as a guide baffle for airflow inside the housing 10. The first chamber 11 is usually located near the top wall 17 of the housing 10, while the second chamber 12 is located near the bottom wall 19 of the housing 10. The support plate 70 provides an ideal mounting platform for the second fan assembly 30. At the same time, the support plate 70 divides the internal space of the housing 10, allowing circuit modules that are sensitive to temperature or generate heat differently to be arranged in the two chambers for differentiated thermal management. Specifically, the support plate 70 is a motherboard 71 mounting plate. The motherboard 71 is located in the first chamber 11 at the top of the motherboard 71 mounting plate, while the power board 13 and the second heating element 50 are located in the second chamber 12 at the bottom of the support plate 70.

[0045] Preferably, the first heating element 40 includes an element body 41 and an element mounting plate 42. The element body 41 is connected to the element mounting plate 42. The element mounting plate 42 is disposed perpendicular to the bottom wall 19 of the housing 10. The first fan assembly 20 is fixedly connected to the element mounting plate 42, and thus the first fan assembly 20 is disposed adjacent to the element body 41.

[0046] Specifically, the component body 41 of the first heating element 40 is a bus capacitor board, and the component mounting plate 42 is a bus capacitor mounting plate. The second heating element 50 is a high-voltage board. See [link to relevant documentation]. Figure 2 The components distributed on the left side of the power board include the terminal block 14, shielding plate 15, and PCB board 16. Preferably, the top wall 17 of the housing 10 is composed of a cover 171, wherein a heat dissipation channel for the bus capacitor is formed between the bus capacitor mounting plate and the inner wall of the housing 10. The air intake side of the first fan assembly 20 carries away the heat generated by the bus capacitor in the form of exhaust, and blows the airflow to the guide member 60 in the form of blowing. The airflow is guided by the guide part 62 of the guide member 60 to the power board 13 and the second fan assembly 30, which are subject to severe heat generation. At this time, the air intake side of the second fan assembly 30 draws in the air in the form of exhaust, and then blows the airflow from the first chamber 11 to the power board in the second chamber 12 in the form of blowing. After being heated, the airflow spreads out from the power board and finally flows to the first fan assembly 20, thus forming a complete airflow cycle. By combining the first fan assembly 20, the air guide 60, and the second fan assembly 30, airflow is driven within the sealed casing 10 of the chassis heat dissipation structure 1 to form an airflow pattern. Figure 4The directional forced flow shown achieves uniform heat distribution inside the shell 10, avoiding local hot spots.

[0047] It should also be noted that, through the aforementioned airflow circulation, the heat transfer path inside the housing 10 is as follows: from the surface of the element to the air inside the housing 10, from the air inside the housing 10 to the inner wall of the housing 10, from the inner wall of the housing 10 to the outer wall of the housing 10, and then the outer wall of the housing 10 exchanges heat with the external air; thus, forced convection can improve the convective heat transfer efficiency from the surface of the element to the air inside the housing 10, and from the air inside the housing 10 to the inner wall of the housing 10, thereby improving the overall heat transfer efficiency of the machine.

[0048] Further, see Figure 2 , Figure 7 and Figure 8 The chassis heat dissipation structure 1 also includes a heat sink assembly 80, which is connected to the bottom wall 19 of the housing 10.

[0049] Preferably, the heat sink assembly 80 is tightly attached to the outside of the bottom wall 19 of the housing 10 using thermal grease or a thermal pad. The bottom wall 19 of the housing 10 then acts as a large heat-conducting plate, conducting heat from the air in the internal air duct and dissipating it into the surrounding air through the external heat sink assembly 80. Therefore, the external heat sink assembly 80 of the housing 10 can further facilitate heat exchange between the closed system inside the housing 10 and the external environment, improving the heat dissipation effect.

[0050] Since the closed-loop airflow inside the housing 10 is the area where the heat of the entire chassis heat dissipation structure 1 is concentrated, the heat dissipation area of ​​the heat sink assembly 80 covers the projection area of ​​the closed-loop airflow on the bottom wall 19 of the housing 10. When viewed from a direction perpendicular to the bottom wall 19, the area occupied by the entire internal airflow is covered by the heat sink assembly 80, which can avoid local hot spots and thermal bottlenecks caused by insufficient heat sink area. At the same time, the heat sink assembly 80 does not cover the entire area of ​​the bottom wall 19 of the housing 10, which to a certain extent avoids redundancy in heat dissipation effect and reduces the quality and production cost of the chassis heat dissipation structure 1.

[0051] The radiator assembly 80 includes heat dissipation fins 81, a cooling fan 82, and a grille housing 83. The heat dissipation fins 81 are attached to the outer side of the bottom wall 19 of the housing 10. The cooling fan 82 is located at the end of the heat dissipation fins 81. The grille housing 83 covers the heat dissipation fins 81 and the cooling fan 82 to form a heat dissipation duct that communicates with the outside air.

[0052] Preferably, multiple arrays of heat dissipation fins 81 and multiple sets of cooling fans 82 can be set according to heat dissipation requirements. The specific working process is as follows: the internal circulation duct of the housing 10 transfers the heat of each heat-generating element to the bottom wall 19 of the housing 10. The bottom wall 19 conducts the heat to the external heat dissipation fins 81. The cooling fan 82 draws in external cold air, which flows through the gaps between the heat dissipation fins 81 to carry away the heat. The hot air is discharged from the outlet of the grille housing 83.

[0053] Furthermore, this embodiment also provides an inverter, which includes the chassis heat dissipation structure 1 of any of the above.

[0054] The basic principles, main features, and advantages of this application have been described above. Those skilled in the art should understand that this application is not limited to the above embodiments. The embodiments and descriptions in the specification are merely the principles of this application. Various changes and modifications can be made to this application without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection claimed by this application is defined by the appended claims and their equivalents.

Claims

1. A chassis heat dissipation structure, characterized in that, The application relates to a heat dissipation structure of a case, which comprises a closed housing, a first fan assembly, a second fan assembly, a first heat generating element and a second heat generating element arranged in the housing, and a closed circulating air duct formed by the first fan assembly and the second fan assembly. The air inlet side of the first fan assembly is arranged close to the first heat generating element, the air outlet side of the second fan assembly is arranged close to the second heat generating element, and the air outlet side of the first fan assembly corresponds to the air inlet side of the second fan assembly. The first fan assembly drives air flow to flow through the first heat generating element to dissipate heat, and then the air flow is delivered to the second fan assembly; the second fan assembly drives the air flow to flow through the second heat generating element to dissipate heat, and then the air flow is finally returned to the first fan assembly.

2. The heat dissipation structure of the case as claimed in claim 1, further comprising a flow guide arranged in the housing and between the air outlet side of the first fan assembly and the air inlet side of the second fan assembly. The flow guide guides the air flow on the air outlet side of the first fan assembly to the air inlet side of the second fan assembly.

3. The heat dissipation structure of the case as claimed in claim 2, wherein the flow guide comprises a connecting portion and a flow guiding portion, one end of the connecting portion is fixedly connected to the inner side wall of the housing, the other end is connected to the flow guiding portion, and the flow guiding portion is arranged in an arc shape relative to the connecting portion.

4. The heat dissipation structure of the case as claimed in claim 1, wherein the first fan assembly is arranged perpendicularly to the bottom wall of the housing, and the air supply direction is parallel to the bottom wall of the housing; and the second fan assembly is arranged perpendicularly to the side wall of the housing, and the air supply direction is parallel to the side wall of the housing and points from the top wall to the bottom wall of the housing.

5. The heat dissipation structure of the case as claimed in claim 4, further comprising a support plate arranged in the housing and connected to the inner wall of the housing and parallel to the bottom wall of the housing. The support plate is arranged at the middle position of the internal space of the housing to divide the internal space of the housing into a first chamber and a second chamber in the up-down direction. The first chamber is close to the top wall of the housing, and the second chamber is close to the bottom wall of the housing. The second fan assembly is fixedly installed on the support plate to blow the air flow in the first chamber to the second chamber.

6. The heat dissipation structure of the case as claimed in claim 4, wherein the first heat generating element comprises an element body and an element mounting plate, the element body is connected to the element mounting plate, the element mounting plate is arranged perpendicularly to the bottom wall of the housing, the first fan assembly is fixedly connected to the element mounting plate, and then the first fan assembly is arranged adjacent to the element body.

7. The heat dissipation structure of the case as claimed in any one of claims 1-6, further comprising a radiator assembly connected to the bottom wall of the housing.

8. The heat dissipation structure of the case as claimed in claim 7, wherein the radiator assembly comprises a plurality of heat dissipation fins arranged in the housing. ​ ​ ​ ​ ​ ​ ​ ​ The heat dissipation area of the heat sink assembly covers the projected area of the closed circulation air duct on the bottom wall of the shell.

9. The cabinet heat dissipation structure of claim 8, wherein, The heat sink assembly comprises heat dissipation fins, a heat dissipation fan and a grating shell, the heat dissipation fins are connected to the outside of the bottom wall of the shell, the heat dissipation fan is arranged at the end of the heat dissipation fins, and the grating shell covers the heat dissipation fins and the heat dissipation fan to form a heat dissipation air duct in communication with the external air.

10. An inverter, characterized by comprising: The cabinet heat dissipation structure of any one of claims 1-9.

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