Multi-heat-source liquid cooling device

Abstract

The utility model relates to a multi-heat-source liquid cooling device. The plurality of liquid cooling row groups comprise a first liquid cooling row group and a second liquid cooling row group which are arranged in parallel, the first liquid cooling row group comprises a first liquid cooling row and a first pump, and the second liquid cooling row group comprises a second liquid cooling row and a second pump. The plurality of first heating elements and the plurality of second heating elements are arranged on one side of the liquid cooling row group in groups. The plurality of first liquid cooling head groups comprise a plurality of first liquid cooling heads and a plurality of first liquid cooling pipes. The first liquid cooling head is in thermal conduction connection with the first heating element, and the first liquid cooling pipe is connected with the first liquid cooling row. The plurality of second liquid cooling head groups comprise a plurality of second liquid cooling heads and a plurality of second liquid cooling pipes, the second liquid cooling heads are in thermal conduction connection with the second heating elements, and the second liquid cooling pipes are connected with the second liquid cooling row; therefore, a plurality of dispersed heat sources are constructed, and the heat of the plurality of heat sources is effectively dissipated.

Description

TECHNICAL FIELD

[0001] The utility model relates to a liquid cooling device, in particular to a multi-heat source liquid cooling device. BACKGROUND

[0002] The common liquid cooling device on the market usually transports the cooling liquid to the heat dissipation module through the pump, and the cooling liquid releases heat through the cooler, such as the heat dissipation fin or the heat exchanger, after absorbing the heat of the heat source, forming a circulation path. In addition, the heat dissipation module of the multi-heat source design usually includes multiple branch pipes connected to different heat sources, such as CPU, GPU or power module, to achieve the purpose of cooling multiple heat sources at the same time.

[0003] In addition, with the light and thin of electronic devices and electronic equipment, the substrate (such as circuit board, mainboard) provided with heat source needs to reduce the area while trying to keep the setting position of the chip, circuit or other electronic components. For this purpose, how to construct a liquid cooling device for multiple dispersed heat sources to effectively dissipate heat from multiple heat sources is the research motivation of the applicant. UTILITY MODEL CONTENT

[0004] The utility model discloses a multi-heat source liquid cooling device, which is constructed for multiple dispersed heat sources to effectively dissipate heat from multiple heat sources, thereby increasing the convenience of use.

[0005] In order to achieve the above purpose, the utility model is a multi-heat source liquid cooling device, which includes multiple liquid cooling groups, multiple first heat generating elements, multiple second heat generating elements, multiple first liquid cooling head groups and multiple second liquid cooling head groups. The multiple liquid cooling groups include the first liquid cooling group and the second liquid cooling group arranged side by side, the first liquid cooling group includes the first liquid cooling row and the first pump arranged in the first liquid cooling row, and the second liquid cooling group includes the second liquid cooling row and the second pump arranged in the second liquid cooling row. The multiple first heat generating elements are arranged in groups on one side of the liquid cooling group. The multiple second heat generating elements are arranged in groups on one side of the first heat generating element. The multiple first liquid cooling head groups include multiple first liquid cooling heads and multiple first liquid cooling pipes, the first liquid cooling head is in thermal conduction with the first heat generating element, and the first liquid cooling pipe is connected to the first liquid cooling row. The multiple second liquid cooling head groups include multiple second liquid cooling heads and multiple second liquid cooling pipes, the second liquid cooling head is in thermal conduction with the second heat generating element, and the second liquid cooling pipe is connected to the second liquid cooling row.

[0006] In an embodiment of the utility model, multiple heat source type liquid cooling device more include third heat generating element and third liquid cooling head group, the liquid cooling group includes the third liquid cooling group that second liquid cooling group is arranged in parallel with, the third liquid cooling group includes a third liquid cooling row and the third pump that sets up in the third liquid cooling row, the third liquid cooling head group includes third liquid cooling head and third liquid cooling pipe, the third liquid cooling head heat conduction connects the third heat generating element, the third liquid cooling pipe is connected the third liquid cooling row.

[0007] In an embodiment of the utility model, the first liquid cooling head group further includes a plurality of first pipe joints, the first pipe joints are respectively arranged on the first liquid cooling pipes and located between the first liquid cooling heads and the first liquid cooling rows.

[0008] In an embodiment of the utility model, the second liquid cooling head group further includes a plurality of second pipe joints, the second pipe joints are respectively arranged on the second liquid cooling pipes and located between the second liquid cooling heads and the second liquid cooling rows.

[0009] In an embodiment of the utility model, the multiple heat source type liquid cooling device further includes a mainboard, the first heat generating elements and the second heat generating elements are arranged on the mainboard.

[0010] In an embodiment of the utility model, the multiple heat source type liquid cooling device further includes a partition plate, the partition plate is arranged between the mainboard and the liquid cooling group.

[0011] In an embodiment of the utility model, the multiple heat source type liquid cooling device further includes a fan group, the fan group is arranged on one side of the liquid cooling group.

[0012] In an embodiment of the utility model, the multiple heat source type liquid cooling device further includes a shell, the liquid cooling group, the mainboard and the fan group are arranged in the shell.

[0013] In an embodiment of the utility model, each first liquid cooling head includes a first shell seat, a plurality of first fins arranged in the first shell seat, and a plurality of first connecting pipes communicating the inside of the first shell seat, the first connecting pipes are connected to the first liquid cooling pipes.

[0014] In an embodiment of the utility model, each second heat generating element is arranged on a machine plate, and the second liquid cooling head further includes a back plate, the machine plate is clamped and positioned between the back plate and the second liquid cooling head.

[0015] Compared with the prior art, the multiple heat source type liquid cooling device of the utility model includes a first liquid cooling group and a second liquid cooling group arranged in parallel, and the first and second heat generating elements are arranged in groups on one side of the liquid cooling group. In addition, a plurality of first and second liquid cooling head groups are arranged corresponding to the first and second heat generating elements. Therefore, the construction of the multiple heat source type liquid cooling device 1 can effectively dissipate heat from multiple heat sources, thereby increasing the practicality and convenience in use. Attached Figure Description

[0016] The preferred embodiments will be described below in a clear and easy-to-understand manner, with reference to the accompanying drawings, to further explain the above-mentioned characteristics, technical features, advantages and implementation methods of a multi-heat source liquid cooling device.

[0017] Figure 1 This is a schematic diagram of the application of a multi-heat-source liquid cooling device.

[0018] Figure 2 and Figure 3 This is a three-dimensional appearance diagram of the multi-heat source liquid cooling device of this utility model from two side views.

[0019] Figure 4 This is a combined cross-sectional view of the multi-heat source liquid cooling device of this utility model.

[0020] Figure 5 This is a three-dimensional schematic diagram of the first liquid cooling head of this utility model.

[0021] Figure 6 This is a combined cross-sectional view of the first liquid cooling head of this utility model.

[0022] Figure 7 This is a schematic diagram of the combination of the second liquid cooling head and the second heating element of this utility model.

[0023] Figure 8 This is a three-dimensional exploded view of the second liquid cooling head and the second heating element of this utility model.

[0024] Explanation of icon numbers:

[0025] 1: Multi-heat source liquid cooling device; 10: Liquid cooling radiator assembly; 11: First liquid cooling radiator assembly; 111: First liquid cooling radiator; 112: First pump; 12: Second liquid cooling radiator assembly; 121: Second liquid cooling radiator; 122: Second pump; 13: Third liquid cooling radiator assembly; 131: Third liquid cooling radiator; 132: Third pump; 20: First heating element; 30: Second heating element; 31: Circuit board; 40: First liquid cooling head assembly; 41: First liquid cooling head; 4 11: First housing, 412: First fin, 413: First connecting pipe, 42: First liquid cooling pipe, 43: First pipe connector, 50: Second liquid cooling head assembly, 51: Second liquid cooling head, 511: Backplate, 52: Second liquid cooling pipe, 53: Second pipe connector, 60: Third heating element, 70: Third liquid cooling head assembly, 71: Third liquid cooling head, 72: Third liquid cooling pipe, 80: Motherboard, 81: Partition, 82: Fan assembly, 83: Housing. Detailed Implementation

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, specific implementation manners of the present application will be described below with reference to the drawings. Obviously, the drawings in the following description only represent some embodiments of the present application, and for those skilled in the art, other drawings can be obtained from these drawings without creative labor, and other embodiments can also be obtained.

[0027] In order to make the drawing simple, only the parts related to the present application are shown in each drawing, which does not represent the actual structure of the product. In addition, in order to make the drawing simple and easy to understand, in some drawings, only one of the components with the same structure or function is shown, or only one of them is marked. In this paper, "one" not only means "only one", but also means "more than one" situation.

[0028] It should be further understood that the term "and / or" used in the present application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes these combinations.

[0029] In this paper, it should be pointed out that, unless otherwise specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances. In addition, in the description of the present application, the terms "first", "second" and the like are only used for distinction, and cannot be understood as indicating or implying relative importance.

[0030] The detailed description and technical content of the present application are described as follows with reference to the drawings, however, the attached drawings are only provided for reference and description, and are not used to limit the present application.

[0031] Please refer to Figures 1 to 4The utility model discloses a multi-heat source liquid cooling device's application schematic diagram, two side directions'stereo appearance schematic diagram and combined sectional view. The utility model discloses a multi-heat source liquid cooling device 1, including complex liquid cooling row group 10, complex first heat generating element 20, complex second heat generating element 30, complex first liquid cooling head group 40 and complex second liquid cooling head group 50. The liquid cooling row group 10 includes a first liquid cooling row group 11 and a second liquid cooling row group 12 arranged side by side. The first liquid cooling row group 11 includes a first liquid cooling row 111 and a first pump 112 arranged in the first liquid cooling row 111. In addition, the second liquid cooling row group 12 includes a second liquid cooling row 121 and a second pump 122 arranged in the second liquid cooling row 121. Furthermore, the first heat generating element 20 is arranged in groups on one side of the liquid cooling row group 10. The second heat generating element 30 is arranged in groups on one side of the first heat generating element 20.

[0032] Furthermore, the first liquid cooling head group 40 includes a plurality of first liquid cooling heads 41 and a plurality of first liquid cooling pipes 42. The first liquid cooling heads 41 are thermally connected to the first heat generating elements 20. The first liquid cooling pipes 42 are connected to the first liquid cooling row 111. In addition, the second liquid cooling head group 50 includes a plurality of second liquid cooling heads 51 and a plurality of second liquid cooling pipes 52. The second liquid cooling heads 51 are thermally connected to the second heat generating elements 30. The second liquid cooling pipes 52 are connected to the second liquid cooling row 121.

[0033] It is to be noted that the first liquid cooling head group 40 further includes a plurality of first pipe joints 43. The first pipe joints 43 are respectively arranged on each first liquid cooling pipe 42 and located between each first liquid cooling head 41 and each first liquid cooling row 111. In addition, the second liquid cooling head group 50 further includes a plurality of second pipe joints 53. The second pipe joints 53 are respectively arranged on each second liquid cooling pipe 52 and located between each second liquid cooling head 51 and each second liquid cooling row 121.

[0034] In the embodiment of the utility model, the multi-heat source liquid cooling device 1 further includes a plurality of third heat generating elements 60 and a plurality of third liquid cooling head groups 70. The liquid cooling row group 10 includes a third liquid cooling row group 13 arranged side by side with the second liquid cooling row group 12. The third liquid cooling row group 13 includes a third liquid cooling row 131 and a third pump 132 arranged in the third liquid cooling row 131. The third liquid cooling head group 70 includes a plurality of third liquid cooling heads 71 and a plurality of third liquid cooling pipes 72. The third liquid cooling heads 71 are thermally connected to the third heat generating elements 60. The third liquid cooling pipes 72 are connected to the third liquid cooling row 131.

[0035] In the embodiment, the multi-heat-source liquid cooling device 1 further comprises a mainboard 80, a partition plate 81, a fan group 82 and a casing 83. The liquid cooling banks 10, the mainboard 80 and the fan group 82 are installed in the casing 83. The mainboard 80 is provided with the first heat-generating elements 20, the second heat-generating elements 30 and the third heat-generating elements 60. The partition plate 81 is arranged between the mainboard 80 and the liquid cooling banks 10. The fan group 82 is arranged on one side of the liquid cooling banks 10. Accordingly, the structure of the multi-heat-source liquid cooling device 1 can effectively dissipate heat from multiple heat sources.

[0036] Please refer to Figure 5 and Figure 6 for the schematic diagram of the three-dimensional appearance and the combined sectional view of the first liquid cooling head of the utility model. The first liquid cooling head 41 comprises a first housing 411, a plurality of first fins 412 arranged in the first housing 411 and a plurality of first connecting pipes 413 communicating with the inside of the first housing 411. The first connecting pipes 413 are used to connect the first liquid cooling pipe 42.

[0037] Please refer to Figure 7 and Figure 8 for the schematic diagram of the combination of the second liquid cooling head and the second heat-generating element and the three-dimensional exploded schematic diagram of the utility model. The internal structure of the second liquid cooling head 51 is substantially the same as that of the first liquid cooling head 41, which will not be described here. In the embodiment, the second heat-generating element 30 is arranged on a board 31. The second liquid cooling head 51 further comprises a back plate 511. The board 31 is clamped between the back plate 511 and the second liquid cooling head 51 and is positioned, so that the second liquid cooling head 51 can dissipate heat from the second heat-generating element 30.

[0038] The above description is only the preferred embodiment of the utility model, not to define the patent range of the utility model, other equivalent changes using the patent spirit of the utility model should also belong to the protection range of the patent. For ordinary skilled in the art, without departing from the principle of the utility model, can also make a number of improvements and refinements, these improvements and refinements should also be regarded as the protection range of the utility model.

Claims

1. A multi-heat-source liquid cooling device, characterized by comprising: The application relates to a liquid cooling system, comprising: a plurality of liquid cooling banks, including a first liquid cooling bank and a second liquid cooling bank arranged in parallel, the first liquid cooling bank comprising a first liquid cooling bank and a first pump arranged in the first liquid cooling bank, the second liquid cooling bank comprising a second liquid cooling bank and a second pump arranged in the second liquid cooling bank; a plurality of first heat generating elements arranged in groups on one side of the liquid cooling banks; a plurality of second heat generating elements arranged in groups on one side of the first heat generating elements; a plurality of first liquid cooling head groups, including a plurality of first liquid cooling heads and a plurality of first liquid cooling pipes, the first liquid cooling heads being in thermal conduction with the first heat generating elements, and the first liquid cooling pipes being connected to the first liquid cooling bank; and a plurality of second liquid cooling head groups, including a plurality of second liquid cooling heads and a plurality of second liquid cooling pipes, the second liquid cooling heads being in thermal conduction with the second heat generating elements, and the second liquid cooling pipes being connected to the second liquid cooling bank.

2. The multi-heat-source liquid cooling device according to claim 1, wherein The application further comprises a plurality of third heat generating elements and a plurality of third liquid cooling head groups, the liquid cooling banks comprising a third liquid cooling bank arranged in parallel with the second liquid cooling bank, the third liquid cooling bank comprising a third liquid cooling bank and a third pump arranged in the third liquid cooling bank, the third liquid cooling head groups comprising a plurality of third liquid cooling heads and a plurality of third liquid cooling pipes, the third liquid cooling heads being in thermal conduction with the third heat generating elements, and the third liquid cooling pipes being connected to the third liquid cooling bank.

3. The multi-heat-source liquid cooling device according to claim 1, wherein The first liquid cooling head groups further comprise a plurality of first pipe joints, each first pipe joint being arranged on each first liquid cooling pipe and located between each first liquid cooling head and each first liquid cooling bank.

4. The multi-heat-source liquid cooling device according to claim 1, wherein The second liquid cooling head groups further comprise a plurality of second pipe joints, each second pipe joint being arranged on each second liquid cooling pipe and located between each second liquid cooling head and each second liquid cooling bank.

5. The multi-heat-source liquid cooling device according to claim 1, wherein The application further comprises a mainboard, the first heat generating elements and the second heat generating elements being arranged on the mainboard.

6. The multi-heat-source liquid cooling device according to claim 5, wherein The application further comprises a partition plate arranged between the mainboard and the liquid cooling banks.

7. The multi-heat-source liquid cooling device according to claim 5, wherein The application further comprises a fan group arranged on one side of the liquid cooling banks.

8. The multi-heat-source liquid cooling device according to claim 7, wherein The application further comprises a casing, the liquid cooling banks, the mainboard and the fan group being arranged in the casing.

9. The multi-heat-source liquid cooling device according to claim 1, wherein Each first liquid cooling head comprises a first housing, a plurality of first fins arranged in the first housing, and a plurality of first connecting pipes communicating with the inside of the first housing, the first connecting pipes being connected to the first liquid cooling pipes.

10. The multi-heat-source liquid cooling device according to claim 1, wherein Each second heat generating element is arranged on a machine plate, the second liquid cooling head further comprising a back plate, the machine plate being sandwiched between the back plate and the second liquid cooling head and being positioned.

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