Adjustable chip suction nozzle

Abstract

The utility model discloses an adjustable chip suction nozzle, which comprises a base and an elastic sealing gasket, and is characterized in that the base is connected with a chip mounter, and the base is provided with an air channel; the suction nozzle is located at the bottom of the base, an air hole used for adsorbing a chip is formed in the suction nozzle, an elastic component is arranged between the suction nozzle and the base for elastic connection, and the air channel is communicated with the air hole; the adjusting part is located on the base and used for adjusting the angle of the suction nozzle; the elastic sealing gasket is arranged between the base and the suction nozzle and is used for supporting and sealing; according to the invention, the suction nozzle can be adjusted to compensate the inclination angle of the suction nozzle, the flatness of the attachment of the suction nozzle and the chip can be ensured, and the chip mounting precision is further ensured.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of patch machine suction nozzles, and particularly relates to an adjustable chip suction nozzle. BACKGROUND

[0002] The main function of a patch machine is to accurately place surface-mounted components on the pads of a PCB (Printed Circuit Board) by moving a mounting head. In this process, the patch machine realizes the full automation of picking up electronic components from a feeder and accurately placing them on the predetermined position of the PCB.

[0003] Large chips generally refer to processor chips with a larger area, a larger number of transistors and high performance indicators. Compared with small chips, large chips have a larger size and a larger number of transistors, and require stronger adsorption force and a larger contact area to maintain balance during picking up or mounting.

[0004] In combination Figure 1 The mounting head generally moves in the longitudinal direction by driving the suction nozzle thereon through a longitudinal moving mechanism to pick up or mount the chip. However, it is difficult for the mounting head to maintain a vertical state with the horizontal plane or the chip, and a small inclination angle a exists. Therefore, a small inclination angle a also exists between the suction nozzle mounted on the mounting head and the chip, and it is difficult to ensure the adhesion of the suction nozzle to the large chip during the picking up and mounting of the chip, thereby affecting the patch precision. This problem is particularly obvious due to the larger contact area. CONTENT OF THE UTILITY MODEL

[0005] The application provides an adjustable chip suction nozzle to solve the problems in the prior art. The following technical scheme is adopted:

[0006] The adjustable chip suction nozzle comprises a base, wherein the base is connected with a patch machine, and a gas channel is arranged on the base;

[0007] A suction nozzle is arranged at the bottom of the base, a gas hole for adsorbing a chip is arranged on the suction nozzle, and an elastic component is arranged between the suction nozzle and the base to elastically connect them, and the gas channel is in communication with the gas hole;

[0008] A plurality of adjusting components are arranged on the base, and the adjusting components are used for adjusting the angle of the suction nozzle;

[0009] An elastic sealing gasket is arranged between the base and the suction nozzle to support and seal.

[0010] Preferably, the adjusting components are distributed at the outer edge of the base, the adjusting components can move along the z-axis direction on the base, and the bottom end of the adjusting component abuts against the suction nozzle.

[0011] Preferably, the base bottom is provided with a protrusion, the air channel penetrates through the protrusion, the elastic sealing pad is arranged in the groove, the suction nozzle is provided with a groove corresponding to the protrusion, the air hole is communicated with the groove, and the bottom end of the protrusion abuts against the top of the elastic sealing pad.

[0012] Preferably, the elastic sealing pad is provided with a through hole communicated with the air hole, and the top end of the elastic sealing pad extends out of the groove.

[0013] Preferably, the protrusion and the groove are both polygons, the protrusion is movably arranged in the groove, and the outer side wall of the protrusion abuts against the elastic sealing pad.

[0014] Preferably, the base comprises a connecting rod and a fixing plate, and the fixing plate and the connecting rod are integrally formed.

[0015] Preferably, the bottom of the suction nozzle is provided with a protruding block, the protruding block is provided with an adsorption groove, and the adsorption groove is communicated with the air hole.

[0016] Preferably, the bottom of the suction nozzle is in a V-shaped structure, and the bottom of the suction nozzle extends outward, so as to more conveniently suck the chip.

[0017] Preferably, a spring is arranged between two adjacent adjusting components.

[0018] The application has the following beneficial effects:

[0019] (1) The application can adjust the angle of the suction nozzle to compensate for the angle of self-inclination, can ensure the flatness of the suction nozzle and the chip, and can further ensure the patch precision.

[0020] (2) When the protrusion is arranged in the groove, the groove is larger than the protrusion, the outer side wall of the protrusion abuts against the elastic sealing pad in the groove, at this time, the adjusting component can not only adjust the angle of the suction nozzle, but also can limit the rotation of the suction nozzle along the z axis, and can further improve the patch precision of the chip. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 is a schematic view of the suction nozzle adsorbing the chip;

[0022] Figure 2 is a three-dimensional schematic view of the application;

[0023] Figure 3 is a front view of the application;

[0024] Figure 4 is a structural schematic view of the application;

[0025] Figure 5is another structural schematic diagram of the present application;

[0026] Figure 6 is another structural schematic diagram of the present application.

[0027] in the figure:

[0028] 1, base, 10, fixed seat, 11, connecting rod, 12, protruding part, 110, airway, 200, chip;

[0029] 2, suction nozzle, 20, air hole, 21, groove, 22, protruding block, 23, adsorption groove, 24, through hole;

[0030] 3, elastic component, 4, adjusting component, 5, elastic sealing gasket. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings of the present application. Obviously, the embodiments described in the present application are only some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0032] Reference Figures 2 to 6 , the present application is further described in detail:

[0033] Adjustable chip suction nozzle for adjusting the angle of the suction nozzle, which comprises a base 1, a suction nozzle 2 and an adjusting component 4, the base 1 is connected with the mounting head of the chip mounter, the base 1 is provided with an airway 110, the mounting head drives the suction nozzle 2 to move, and the chip is sucked by providing negative pressure in the airway 110; wherein the base 1 comprises a connecting rod 11 and a fixed plate 10, the fixed plate 10 and the connecting rod 11 are integrally formed; in some embodiments, the connecting rod 11 and the fixed plate 10 can also be a split structure.

[0034] In combination Figures 2 to 4 , the suction nozzle 2 is arranged at the bottom of the fixed plate 10, the suction nozzle 2 is provided with an air hole 20 for adsorbing the chip, the suction nozzle 2 is elastically connected with the fixed plate 10, the airway 110 is communicated with the air hole 20, and the chip is adsorbed by the negative pressure of the air hole 20; the adjusting component 4 is arranged on the fixed plate 10, and the adjusting component 4 is used for adjusting the parallelism between the suction nozzle 2 and the chip; as Figure 2 , the fixed plate 10 and the suction nozzle 2 can be elastically connected by arranging a plurality of elastic components 3 therebetween, the elastic components 3 are arranged between two adjacent adjusting components 4, and the elastic components 3 can be springs; in combination Figure 4The nozzle 2 is supported and sealed by an elastic sealing pad 5 between the nozzle 2 and the fixed plate 10. The elastic sealing pad 5 is provided with a through hole 24, the through hole 24 connects the air channel 110 and the air hole 20 to form an adsorption channel. The elastic component 3 pulls the nozzle 2 to be close to the fixed plate 10 to extrude the elastic sealing pad to realize sealing. The elastic sealing pad can be rubber material.

[0035] In combination Figure 2 The adjusting component 4 is distributed at the outer edge of the base 1, the adjusting component 4 can move along the z-axis direction on the base 1, and the bottom end of the adjusting component 4 abuts against the nozzle 2. Wherein, the adjusting component 4 is arranged on the fixed plate 10 and moves along the z-axis direction, and adjusts the angle between the nozzle 2 and the horizontal plane or the chip. In this embodiment, the fixed plate 10 is exemplified as a quadrilateral, and the adjusting component 4 is arranged at the four corners of the fixed plate 10 respectively. By adjusting the adjusting component 4 at the four corners of the fixed plate 10 respectively, the angle of the nozzle 2 is adjusted. The fixed plate 10 is tightly attached to the nozzle 2 by the elastic deformation of the elastic sealing pad 5 itself, so as to ensure the sealing performance of the adsorption channel. Of course, the fixed plate 10 can also be other shapes.

[0036] The adjusting component 4 can be an adjusting screw, the adjusting screw is in threaded connection with the fixed plate 10, and the bottom end of the adjusting screw abuts against the upper surface of the nozzle 2. In use, the adjusting screw is rotated to adjust the nozzle 2. The mutual parallelism between the nozzle 2 and the chip can be ensured, so as to improve the attachment degree between them in the process of sucking or mounting, and then the attachment precision and flatness are ensured.

[0037] In combination Figure 5 The base 1 is provided with a protruding portion 12, the air channel 110 penetrates through the protruding portion 12, the nozzle 2 is provided with a groove 21 corresponding to the protruding portion 12, the air hole 20 communicates with the groove 21, the elastic sealing pad 5 is arranged in the groove 21, the elastic sealing pad 5 extends out of the groove 21, and when the bottom of the protruding portion 12 abuts against the upper surface of the elastic sealing pad 5, the air channel 110 and the air hole 20 communicate through the through hole 24.

[0038] In combination Figure 5 The bottom of the nozzle 2 is provided with a protruding block 22, and the bottom of the nozzle 2 is in a “V” shape structure, so as to be more convenient for sucking the chip. The protruding block 22 is internally provided with an adsorption groove 23, and the adsorption groove 23 communicates with the air hole 20. The adsorption groove 23 can increase the area of the adsorbed chip, so as to ensure that the chip can be stably adsorbed and the deformation is reduced.

[0039] In combination Figure 6In an embodiment, the protrusion 12 and the groove 21 are both polygons. Among them, the protrusion 12 and the groove 21 are both quadrilaterals; of course, other polygonal shapes are also possible; the groove is larger than the protrusion, that is, the length and width of the groove 21 are larger than the length and width of the protrusion 12; the protrusion 12 is arranged in the groove 21, the outer side wall of the protrusion 12 abuts against the elastic sealing gasket 5, at this time, by adjusting the suction nozzle 2 through the adjusting component 4, the angle of the suction nozzle 2 can be adjusted, at the same time, the protrusion 12 and the groove 21 can limit the rotation of the suction nozzle along the z-axis through the elastic sealing gasket, and the mounting precision of the chip can be further improved.

[0040] The elastic component 3 can pull the suction nozzle 2 close to the fixed plate 10 to compress the elastic sealing gasket 5, one end of the adjusting component 4 abuts against the suction nozzle 2 to adjust the angle of the suction nozzle 2 to compensate for the inclination angle a, and the elastic sealing gasket 5 can ensure that the fixed plate 10 and the suction nozzle 2 always guarantee a sealed state when the suction nozzle 2 is adjusted, and ensure the suction force on the chip; the structure is simple and stable, the adjustment is convenient, the fit between the suction nozzle and the chip during suction or mounting can be improved, and then the mounting precision and flatness can be ensured.

Claims

1. An adjustable chip aspirator, characterized by: The base is connected with a patch machine, and an air passage is arranged on the base; A suction nozzle is arranged at the bottom of the base, and an air hole for adsorbing a chip is arranged on the suction nozzle, the suction nozzle is elastically connected with the base through an elastic component, and the air passage is communicated with the air hole; A plurality of adjusting components are arranged on the base, and the adjusting components are used for adjusting the angle of the suction nozzle; An elastic sealing gasket is arranged between the base and the suction nozzle for supporting and sealing.

2. The adjustable chip aspirator of claim 1, wherein: The adjusting components are distributed at the outer edge of the base, the adjusting components can move along the z-axis direction on the base, and the bottom end of the adjusting component abuts against the suction nozzle.

3. The adjustable chip aspirator of claim 1, wherein: The base is provided with a protruding portion at the bottom, the air passage penetrates through the protruding portion, the suction nozzle is provided with a groove corresponding to the protruding portion, the air hole is communicated with the groove, the elastic sealing gasket is arranged in the groove, and the bottom end of the protruding portion abuts against the top of the elastic sealing gasket.

4. The adjustable chip aspirator of claim 3, wherein: A through hole is arranged on the elastic sealing gasket, the through hole is communicated with the air hole, and the top end of the elastic sealing gasket extends out of the groove.

5. The adjustable chip aspirator of claim 3, wherein: The protruding portion and the groove are both polygons, the protruding portion is movably arranged in the groove, and the outer side wall of the protruding portion abuts against the elastic sealing gasket.

6. The adjustable chip aspirator of claim 1, wherein: The base comprises a connecting rod and a fixed plate, and the fixed plate and the connecting rod are integrally formed.

7. The adjustable chip aspirator of claim 1, wherein: The bottom of the suction nozzle is provided with a protruding block, the protruding block is provided with an adsorption groove, and the adsorption groove is communicated with the air hole.

8. The adjustable chip aspirator of claim 1, wherein: The bottom of the suction nozzle is in a "V" shape structure.

9. The adjustable chip aspirator of claim 1, wherein: A spring is arranged between the base and the suction nozzle, and the spring is arranged between two adjacent adjusting components.

Images