Electrified grinding device of grinding disc

Abstract

The utility model relates to an electrified grinding device of a grinding disc, which comprises a machine body, a rotary table is arranged in the machine body, a power supply unit is arranged in the rotary table, a base plate which rotates synchronously with the rotary table is arranged on the rotary table, the power supply unit is connected with the base plate, and a grinding cushion which rotates synchronously with the base plate is arranged on the base plate. The grinding cushion is clamped on the base plate, and the power supply unit conducts electricity to the grinding cushion through the base plate. According to the electrified grinding device of the grinding disc, through the structures of the power supply unit, the conductive unit, the lug plate and the like, grinding liquid in grinding work can be ionized, the mobility and adhesion of the grinding liquid can be improved through the ionization effect, uniform distribution of grinding materials and a better lubricating effect are facilitated, and therefore the overall grinding effect is further improved; after the grinding liquid is ionized, charged particles and free radicals can be generated, and the charged particles can remarkably enhance the interaction between the grinding material and the surface of a workpiece, so that the grinding efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of grinding equipment, specifically to an electrically powered grinding device for a grinding disc. Background Technology

[0002] Semiconductor material grinding equipment is an important tool used to grind semiconductor materials (such as silicon wafers, gallium arsenide, gallium nitride, etc.). These devices are typically used to improve the surface quality and thickness control of materials to meet the requirements of subsequent processing technologies. Semiconductor material grinding equipment plays an important role in the semiconductor manufacturing process. Selecting the right equipment can significantly improve the processing quality and production efficiency of materials. In the semiconductor manufacturing process, the grinding process is a key step in achieving a smooth and glossy surface of the material. Effective grinding not only depends on the action of mechanical force, but is also closely related to the performance of the grinding fluid.

[0003] In existing semiconductor material grinding equipment, the grinding fluid mainly serves to cool, lubricate, and carry grinding debris during grinding. This can reduce frictional heat and wear to some extent. However, during the grinding process, insufficient fluid flow can easily occur, which can lead to ineffective transmission of grinding force and thus affect the final grinding effect. When the fluid flow is insufficient, it can also affect the distribution, flow, and contact state of the abrasive with the workpiece, further impacting the grinding effect.

[0004] Therefore, an electrically powered grinding device for a grinding disc is proposed to solve the problem of insufficient fluidity of the grinding liquid affecting the grinding effect. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model provides an electrically powered grinding device for a grinding disc, which has the advantages of good grinding fluid flowability, improving the grinding effect, and solving the problem of insufficient grinding fluid flowability affecting the grinding effect.

[0006] To achieve the above objectives, the present invention provides the following technical solution: an electrically powered grinding device for a grinding disc, comprising a body, a rotatable turntable disposed within the body, a power supply unit disposed within the turntable, a base plate disposed on the turntable and rotating synchronously therewith, the power supply unit being connected to the base plate, a grinding pad disposed on the base plate and rotating synchronously therewith, and the grinding pad being snapped onto the base plate, the power supply unit conducting electricity to the grinding pad through the base plate.

[0007] Preferably, the machine body has a receiving cavity, and a rotary motor is installed in the receiving cavity. The turntable is connected to the output shaft of the rotary motor, and a groove is opened on the top surface of the turntable. The power supply unit is detachably installed in the groove.

[0008] Preferably, the machine body is provided with a grinding disc that can be extended and retracted vertically corresponding to the grinding pad.

[0009] Preferably, two connecting blocks are fixed on the bottom surface of the substrate, and a connecting groove is opened on the upper end surface of the turntable corresponding to the connecting blocks. The connecting blocks are snapped into the connecting grooves, and the two connecting blocks are symmetrically distributed along the axis of the substrate. The connecting blocks move linearly up and down in the connecting grooves.

[0010] Preferably, the substrate includes a support plate and an ear plate. The bottom surface of the support plate has two mounting grooves. A conductive unit is fixed in the mounting groove. The electrode of the power supply unit is located in the mounting groove. One end of the conductive unit is connected to the ear plate, and the other end is connected to the electrode of the power supply unit. The ear plate is made of iron.

[0011] The ear plate is fixed to the outside of the support plate, and there are four ear plates. The ear plate is an L-shaped plate, and the inner top wall of the ear plate is higher than the top surface of the support plate. A placement space is formed between the inner top wall of the ear plate and the top surface of the support plate. The grinding pad is placed in the placement space. The grinding pad is located on the top surface of the support plate and is snapped into the ear plate and abuts against the inner top wall of the ear plate.

[0012] Preferably, a snap-fit ​​groove is provided on the top surface of the grinding pad near its outer peripheral surface, corresponding to the ear plate, and the ear plate snap-fit ​​groove is snapped in place. The top surface of the grinding pad is provided with a plurality of receiving grooves arranged in a warp and weft pattern.

[0013] Preferably, the polishing pad includes a substrate layer and a light-transmitting polishing layer. Four adjacent receiving grooves arranged in a warp and weft pattern surround the top surface of the polishing pad to form a protrusion. The substrate layer has perforations corresponding to the protrusions. The light-transmitting polishing layer is an acrylic polishing layer.

[0014] The support plate includes an upper plate, a conductive plate, and a lower plate connected in sequence. The power supply unit electrode is connected to the conductive plate. The upper plate has a corresponding through hole with an installation hole, and an LED bead is installed in the installation hole. The LED bead is connected to the conductive plate.

[0015] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0016] 1. The electrically powered grinding device of this grinding disc, through its power supply unit, conductive unit, and ear plate, enables the grinding fluid to ionize during the grinding process. Ionization improves the fluidity and adhesion of the grinding fluid, which helps to achieve uniform distribution of abrasive and better lubrication, thereby enhancing the overall grinding effect. At the same time, after the grinding fluid is ionized, charged particles and free radicals are generated. These charged particles can significantly enhance the interaction between the abrasive and the workpiece surface. During the grinding process, this enhanced interaction can effectively promote material removal and improve grinding efficiency.

[0017] 2. The electrically powered grinding device of this grinding disc, through its power supply unit, LED beads, and perforations, allows the LED beads powered by the power supply unit to irradiate the ionized grinding slurry during ionization. This enables the grinding slurry to trigger photoelectric effects and photocatalytic reactions during the grinding process. These reactions promote the generation of active substances in the grinding slurry, enhance its chemical activity, and thus help remove some contaminants or oxides from the material surface, improving surface cleanliness. In addition, the generation of free electrons and holes under light increases the conductivity of semiconductor materials, further improving their performance. This combination of ionization and light irradiation can significantly improve the grinding effect, making the grinding process more efficient and comprehensive. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0019] Figure 2 This is a schematic diagram of the internal structure of the body in this utility model;

[0020] Figure 3 This is a schematic diagram of the connection structure between the connecting groove and the connecting block in this utility model;

[0021] Figure 4 This is a schematic diagram of the internal structure of the transfer platform of this utility model;

[0022] Figure 5 This is a bottom view of the substrate structure in this utility model;

[0023] Figure 6 This is a top view of the grinding pad structure in this utility model;

[0024] Figure 7 This is a schematic diagram of the connection structure between the conductive plate and the LED beads in this utility model;

[0025] Figure 8 This is a cross-sectional view of the grinding pad in this utility model.

[0026] The reference numerals in the attached drawings are as follows: 100, body; 110, receiving cavity; 120, rotary motor; 200, turntable; 210, groove; 300, substrate; 310, connecting block; 320, connecting groove; 330, support plate; 331, upper plate; 332, conductive plate; 333, lower plate; 334, mounting hole; 335, lamp bead; 340, ear plate; 350, mounting groove; 360, conductive unit; 400, power supply unit; 500, grinding pad; 510, receiving groove; 520, snap-fit ​​groove; 530, substrate layer; 540, light-transmitting polishing layer; 550, protrusion; 560, perforation; 600, grinding disc. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Example 1:

[0029] Please see Figure 1-8 The electrically powered grinding device for a grinding disc in this embodiment includes a body 100, a rotatable turntable 200 inside the body 100, a power supply unit 400 inside the turntable 200, a base plate 300 that rotates synchronously with the turntable 200, the power supply unit 400 being connected to the base plate 300, a grinding pad 500 that rotates synchronously with the base plate 300 being disposed on the base plate 300, and the grinding pad 500 being snapped onto the base plate 300, and the power supply unit 400 conducting electricity to the grinding pad 500 through the base plate 300.

[0030] In application, the substrate 300 is first placed on the turntable 200, and then the polishing pad 500 is snapped onto the substrate 300. After the polishing pad 500 is placed, polishing slurry is introduced onto the polishing pad 500. Then, the power supply unit 400 is activated to supply power. After the power supply unit 400 supplies power, it can conduct electricity to the polishing slurry on the polishing pad 500 through the substrate 300, thereby ionizing the polishing slurry. When the polishing slurry is ionized, it can effectively improve the subsequent polishing effect. After the polishing slurry undergoes the ionization reaction, it can generate charged particles and free radicals. These charged particles can enhance the interaction between the abrasive and the workpiece surface during the polishing process, promoting the effective removal of materials. At the same time, the electrically charged polishing slurry can improve the fluidity and adhesion of the liquid through ionization, thereby promoting the uniform distribution of abrasive and better lubrication effect.

[0031] Specifically, the machine body 100 has a receiving cavity 110, and a rotary motor 120 is installed in the receiving cavity 110. The turntable 200 is connected to the output shaft of the rotary motor 120. A groove 210 is formed on the top surface of the turntable 200, and the power supply unit 400 is detachably installed in the groove 210. A vertically retractable grinding disc 600 is provided on the machine body 100 corresponding to the grinding pad 500, and an infusion assembly is provided corresponding to the grinding pad 500. The infusion assembly is known to those skilled in the art, so it will not be described in detail. During grinding, Abrasive fluid containing the semiconductor material to be abraded is introduced into the abrasive pad 500 through the infusion assembly. Then, the rotary motor 120 operates, driving the turntable 200 and the abrasive pad 500 to rotate. At this time, the abrasive disc 600 also moves downward to contact the abrasive pad 500 and rotates in the opposite direction relative to the abrasive pad 500, thus starting the abrasive work. During the abrasive work, different abrasive work can be adapted by adjusting the rotation speed of the turntable 200 and the abrasive disc 600 and adjusting different rotation directions.

[0032] Example 2:

[0033] The basic content is the same as in Example 1, except that:

[0034] Please see Figure 1-6 In this embodiment, two connecting blocks 310 are fixed to the bottom surface of the substrate 300. A connecting groove 320 is formed on the upper surface of the turntable 200 corresponding to the connecting blocks 310. The connecting blocks 310 are engaged within the connecting groove 320. The two connecting blocks 310 are symmetrically distributed along the axis of the substrate 300. The connecting blocks 310 move linearly up and down within the connecting groove 320. The substrate 300 includes a support plate 330 and an ear plate 340. Two mounting grooves 350 are formed on the bottom surface of the support plate 330. A conductive unit 360 is fixed within the mounting groove 350. The electrodes of the power supply unit 400 are located within the mounting groove 350. One end of the conductive unit 360 is connected to the ear plate 340, and the other end is connected to the electrode of the power supply unit 400. The ear plate 340 is an iron plate. The ear plate 340 is fixed on the outside of the support plate 330. There are four ear plates 340. The ear plate 340 is an L-shaped plate. The inner top wall of the ear plate 340 is higher than the top surface of the support plate 330. A placement space is formed between the inner top wall of the ear plate 340 and the top surface of the support plate 330. The grinding pad 500 is placed in the placement space. The grinding pad 500 is located on the top surface of the support plate 330 and is snapped into the ear plate 340 and abuts against the inner top wall of the ear plate 340.

[0035] In application, before operation, the substrate 300 needs to be mounted on the turntable 200. During installation, the connecting block 310 needs to be inserted into the connecting groove 320. After the connecting block 310 connects to the connecting groove 320, the substrate 300 is mounted on the turntable 200 and rotates synchronously with it. After the substrate 300 is installed, a polishing pad 500 needs to be installed on it. To install the polishing pad 500, it is first placed in the placement space and brought into contact with the support plate 330. Then, the snap-fit ​​groove 520 on the polishing pad 500 connects with the ear plate 340, allowing the ear plate 340 to move into the snap-fit ​​groove 520. After the 0 is connected to the slot 520, the polishing pad 500 can be placed flat in the placement space. At this time, polishing fluid is injected into the polishing pad 500 through the infusion assembly. When the polishing work begins, the power supply unit 400 operates to supply power, and under the action of the two conductive units 360 as positive and negative poles and the ear plate 340, electricity is passed through the polishing fluid on the polishing pad 500, forming an electric field in the polishing fluid and ionizing the polishing fluid. Specifically, after the infusion assembly injects polishing fluid into the polishing pad 500, the polishing fluid will contact the ear plate 340, and the two wire units are respectively connected to the positive and negative poles of the power supply unit 400. At this time, the voltage provided by the power supply unit 400 will form an electric field at the corresponding two ear plates 340 and in the surrounding polishing fluid.

[0036] Example 3:

[0037] The basic content is the same as in Example 2, except that:

[0038] Please see Figure 3-8 In this embodiment, a snap-fit ​​groove 520 is provided on the top surface of the grinding pad 500 near its outer peripheral surface, corresponding to the ear plate 340. The ear plate 340 snaps into the ear plate 340 via the snap-fit ​​groove 520. The top surface of the grinding pad 500 has a plurality of receiving grooves 510 arranged in a warp and weft pattern. The grinding pad 500 includes a substrate layer 530 and a light-transmitting polishing layer 540. Four adjacent receiving grooves 510 arranged in a warp and weft pattern enclose the top surface of the grinding pad 500 to form a protrusion 550. The substrate layer 530 has a perforation 560 corresponding to the protrusion 550, and the light-transmitting polished layer 540 is an acrylic polished layer; the carrier plate 330 includes an upper plate 331, a conductive plate 332 and a lower plate 333 connected in sequence from top to bottom, the electrodes of the power supply unit 400 are connected to the conductive plate 332, the upper plate 331 has a mounting hole 334 corresponding to the perforation 560, the mounting hole 334 is provided with an LED bead 335, and the LED bead 335 is connected to the conductive plate 332.

[0039] During application, the power supply unit 400 supplies power to ionize the polishing slurry, effectively improving the polishing effect. While the power supply unit 400 is ionizing the polishing slurry, it can also supply power to the LED beads 335 through the conductive plate 332. The LED beads 335 emit light when powered on. The light emitted by the LED beads 335 passes through the perforation 560 and shines on the polishing slurry through the light-transmitting polishing layer 540. When the semiconductor material being polished receives light, a photoelectric effect or photocatalytic reaction occurs. The photocatalytic reaction can promote the generation of active substances in the polishing slurry, thereby enhancing the chemical activity of the polishing slurry. These active substances may help remove some contaminants or oxides from the material surface during the polishing process, improving surface cleanliness. Under the photoelectric effect, the generation of free electrons and holes in the semiconductor material may lead to an increase in the conductivity of the material, thereby improving its overall performance.

[0040] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention.

Claims

1. An electrically conductive grinding device for a grinding disc, comprising a machine body (100), characterized in that: The machine body (100) is provided with a rotatable rotating table (200), the rotating table (200) is provided with a power supply unit (400), the rotating table (200) is provided with a substrate (300) rotating synchronously, the power supply unit (400) is connected with the substrate (300), the substrate (300) is provided with a grinding soft pad (500) rotating synchronously, and the grinding soft pad (500) is clamped on the substrate (300), and the power supply unit (400) conducts electricity to the grinding soft pad (500) through the substrate (300).

2. The electrically powered abrasive disc polishing apparatus of claim 1, wherein: The machine body (100) is provided with a rotatable rotating table (200), the rotating table (200) is provided with a power supply unit (400), the rotating table (200) is provided with a substrate (300) rotating synchronously, the power supply unit (400) is connected with the substrate (300), the substrate (300) is provided with a grinding soft pad (500) rotating synchronously, and the grinding soft pad (500) is clamped on the substrate (300), and the power supply unit (400) conducts electricity to the grinding soft pad (500) through the substrate (300).

3. The electrically powered abrasive disc polishing apparatus of claim 1, wherein: The machine body (100) is provided with a rotatable rotating table (200), the rotating table (200) is provided with a power supply unit (400), the rotating table (200) is provided with a substrate (300) rotating synchronously, the power supply unit (400) is connected with the substrate (300), the substrate (300) is provided with a grinding soft pad (500) rotating synchronously, and the grinding soft pad (500) is clamped on the substrate (300), and the power supply unit (400) conducts electricity to the grinding soft pad (500) through the substrate (300).

4. The electrically powered abrasive disc polishing apparatus of claim 1, wherein: The bottom surface of the substrate (300) is fixed with two connecting blocks (310), the upper end surface of the rotating table (200) is provided with a connecting groove (320) corresponding to the connecting block (310), the connecting block (310) is clamped in the connecting groove (320), and the two connecting blocks (310) are symmetrically distributed along the axis of the substrate (300).

5. The electrically powered abrasive disc polishing apparatus of claim 1, wherein: The substrate (300) includes a bearing plate (330) and an ear plate (340), the bottom surface of the bearing plate (330) is provided with two mounting grooves (350), the mounting grooves (350) are fixed with conductive units (360), the electrodes of the power supply unit (400) are located in the mounting grooves (350), one end of the conductive unit (360) is connected with the ear plate (340), the other end is connected with the electrode of the power supply unit (400), and the ear plate (340) is an iron plate. The ear plate (340) is fixed outside the bearing plate (330), and the number of the ear plate (340) is four, the ear plate (340) is an L-shaped plate, the inner top wall of the ear plate (340) is higher than the top surface of the bearing plate (330), a placing space is formed between the inner top wall of the ear plate (340) and the top surface of the bearing plate (330), the grinding soft pad (500) is placed in the placing space, the grinding soft pad (500) is located on the top surface of the bearing plate (330) and is clamped in the ear plate (340) and abuts against the inner top wall of the ear plate (340).

6. A powered abrasive disc assembly according to claim 5, wherein: The top surface of the grinding soft pad (500) and the position close to the outer circumferential surface are provided with a clamping groove (520) corresponding to the ear plate (340), the ear plate (340) is clamped in the clamping groove (520), and the top surface of the grinding soft pad (500) is provided with a plurality of containing grooves (510) arranged in warp and weft.

7. A powered abrasive disc assembly according to claim 6, wherein: The polishing soft pad (500) comprises a base material layer (530) and a light-transmitting polishing layer (540), four adjacent containing grooves (510) arranged in warp and weft direction form a convex part (550) on the top surface of the polishing soft pad (500), the base material layer (530) is provided with a through hole (560) corresponding to the convex part (550), and the light-transmitting polishing layer (540) is an acrylic polishing layer; The bearing plate (330) comprises an upper plate (331), a conductive plate (332) and a lower plate (333) connected in sequence from top to bottom, the electrode of the power supply unit (400) is connected with the conductive plate (332), the upper plate (331) is provided with a mounting hole (334) corresponding to the through hole (560), a lamp bead (335) is arranged in the mounting hole (334), and the lamp bead (335) is connected with the conductive plate (332).

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