Integrated ceramic tube shell and Dewar assembly

Abstract

The utility model relates to the technical field of refrigeration infrared detectors, and particularly discloses an integrated ceramic tube shell and Dewar assembly. The integrated ceramic tube shell comprises an outer shell, a first ceramic substrate and a second ceramic substrate, the outer shell is used for being connected with a Dewar; the first ceramic base body is arranged on the inner side of the outer shell; a first pin bonding area and a second pin bonding area are embedded in the first ceramic substrate; the second ceramic substrate is arranged on the outer side of the outer shell; and a third pin bonding area and a fourth pin bonding area are embedded in the second ceramic substrate. According to the scheme, the pin bonding areas are embedded in the first ceramic substrate and the second ceramic substrate, so that the ceramic tube shell does not need to be connected with the outside through outwards extending pins, the overall structure of the ceramic tube shell can be simplified, and the effects of reducing the machining difficulty, reducing the machining cost, improving the installation convenience and improving the transportation convenience are achieved.

Description

Technical Field

[0001] This application relates to the field of cooled infrared detector technology, and more particularly to an integrated ceramic housing and Dewar assembly. Background Technology

[0002] An infrared cooled detector is a device used to detect infrared radiation. Its working principle is based on the physical effects produced by the interaction between infrared radiation and the detector material. When infrared radiation shines on the detector's sensitive element, it causes changes in certain physical properties of the material, such as the photoelectric effect or thermoelectric effect. Because the detector itself generates thermal noise during operation, affecting its ability to detect weak infrared signals, a cooling device is incorporated into the detector.

[0003] Inside an infrared cooled detector, there is a ceramic housing and a Dewar flare. The Dewar flare is a vacuum-insulated container used to maintain the detector's low-temperature environment. The ceramic housing is typically used to encapsulate the detector element of the infrared detector, acting as a bridge connecting the chip and external circuitry. The ceramic housing and its internal detector element are often housed inside the Dewar flare.

[0004] Existing ceramic tube housings mostly adopt a composite structure. In order to connect to external circuits, a large number of copper core pins need to be set on the upper part of the ceramic tube housing, which is difficult to process and causes inconvenience in installation and transportation because the pins are easily deformed. Utility Model Content

[0005] In view of this, the purpose of this application is to provide an integrated ceramic tube shell and Dewar assembly to solve the problems of existing ceramic tube shells being difficult to process and inconvenient to install and transport.

[0006] To achieve the above-mentioned technical objectives, the first aspect of this application provides an integrated ceramic tube shell, comprising: an outer shell, a first ceramic substrate, and a second ceramic substrate;

[0007] The outer casing is used to connect the Dewar;

[0008] The first ceramic substrate is disposed on the inner side of the outer shell;

[0009] The first ceramic substrate is provided with a first pin bonding region and a second pin bonding region.

[0010] The second ceramic substrate is disposed on the outer side of the outer shell;

[0011] The second ceramic substrate is embedded with a third pin bonding area and a fourth pin bonding area.

[0012] Furthermore, the first ceramic substrate and the second ceramic substrate are integrally connected.

[0013] Furthermore, the outer casing includes an upper casing and a lower casing;

[0014] The upper shell is disposed above the first ceramic substrate and the second ceramic substrate;

[0015] The lower housing is disposed below the first ceramic substrate and the second ceramic substrate.

[0016] Furthermore, the second ceramic substrate extends radially outward from the outer shell to form a protrusion;

[0017] The third pin bonding area is disposed on the top surface of the protrusion;

[0018] The fourth pin bonding area is located on the bottom surface of the protrusion.

[0019] Furthermore, a perforation is provided in the middle of the first ceramic substrate;

[0020] The first pin bonding area and the second pin bonding area are disposed around the outer periphery of the through hole.

[0021] Furthermore, a plurality of slots are provided on the first ceramic substrate around the periphery of the perforation;

[0022] The slot is used for the support column of the cooling finger to be inserted.

[0023] A second aspect of this application provides a Dewar assembly, comprising: a Dewar and an integrated ceramic housing as described in any one of the preceding claims;

[0024] In the integrated ceramic tube shell, the bottom of the outer shell is connected to the top of the Dewar.

[0025] Furthermore, in the integrated ceramic tube shell, a first copper pillar and a second copper pillar are provided at the bottom of the first ceramic substrate; a third copper pillar and a fourth copper pillar are provided at the bottom of the second ceramic substrate;

[0026] The first copper pillar, the third copper pillar, and the outer casing are electrically connected to each other.

[0027] The second copper pillar and the fourth copper pillar are electrically connected to each other.

[0028] Furthermore, it also includes a getter holder;

[0029] The getter holder is disposed within the Dewar;

[0030] The getter holder is electrically connected to the second copper column.

[0031] Furthermore, it also includes: ceramic substrate and cold finger;

[0032] The cold finger covers the bottom of the Dewar;

[0033] A connecting post is provided in the middle of the cold finger;

[0034] The top of the connecting post passes through the Dewar and the outer shell.

[0035] The ceramic substrate is disposed on the top of the connecting post, and the ceramic substrate is electrically connected to the first pin bonding area and the second pin bonding area.

[0036] As can be seen from the above technical solutions, this application provides an integrated ceramic tube shell and Dewar assembly; wherein, the integrated ceramic tube shell includes: an outer shell, a first ceramic substrate and a second ceramic substrate; the outer shell is used to connect the Dewar; the first ceramic substrate is disposed on the inner side of the outer shell; a first pin bonding area and a second pin bonding area are embedded on the first ceramic substrate; the second ceramic substrate is disposed on the outer side of the outer shell; a third pin bonding area and a fourth pin bonding area are embedded on the second ceramic substrate.

[0037] In this solution, by embedding a pin bonding area on the first ceramic substrate and the second ceramic substrate, the ceramic tube shell does not need to be connected to the outside through extended pins. This simplifies the overall structure of the ceramic tube shell and achieves the effects of reducing processing difficulty, reducing processing costs, improving installation convenience, and improving transportation convenience. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0039] Figure 1 A perspective view of an integrated ceramic tube shell provided for an embodiment of this application;

[0040] Figure 2 A side cross-sectional view of a Dewar assembly provided in an embodiment of this application;

[0041] Figure 3 A top view of an integrated ceramic tube shell provided for an embodiment of this application;

[0042] Figure 4 A bottom view of an integrated ceramic tube shell provided for an embodiment of this application;

[0043] In the picture:

[0044] 10. Outer shell; 11. Upper shell; 12. Lower shell;

[0045] 20. First ceramic substrate; 21. First lead bonding area; 22. Second lead bonding area; 23. Through hole; 24. Slot; 201. First copper pillar; 202. Second copper pillar;

[0046] 30. Second ceramic substrate; 31. Third lead bonding area; 32. Fourth lead bonding area; 33. Protrusion; 301. Third copper pillar; 302. Fourth copper pillar;

[0047] 40. Cold finger; 41. Support column; 42. Connecting column;

[0048] 50. Dewar;

[0049] 60. Getter holder; 61. Getter;

[0050] 70. Ceramic substrate;

[0051] 80. Chip. Detailed Implementation

[0052] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments in this application specification, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection claimed in this application.

[0053] In the description of the embodiments of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0054] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a replaceable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0055] Please see Figures 1 to 4In the first aspect of this application, an integrated ceramic tube shell is provided, including: an outer shell 10, a first ceramic substrate 20, and a second ceramic substrate 30.

[0056] The outer shell 10 is used to connect the Dewar 50. In this embodiment, the outer shell 10 has a ring structure; the middle of the outer shell 10 is through. For ease of explanation, in the embodiment provided in this application, the direction in which the middle of the outer shell 10 is through is the vertical direction.

[0057] The first ceramic substrate 20 is disposed on the inner side of the outer shell 10; the first ceramic substrate 20 is embedded with a first pin bonding area 21 and a second pin bonding area 22; the second ceramic substrate 30 is disposed on the outer side of the outer shell 10; the second ceramic substrate 30 is embedded with a third pin bonding area 31 and a fourth pin bonding area 32.

[0058] In this embodiment, the first pin bonding area 21, the second pin bonding area 22, the third pin bonding area 31 and the fourth pin bonding area 32 are all embedded pins, that is, the pins are embedded in the substrate, rather than the pins being completely exposed to the outside of the component as in existing ceramic tubes. This makes the pins physically and structurally tightly integrated with the substrate package.

[0059] Compared to structures with exposed pins, the integrated ceramic housing provided in this embodiment is more convenient to connect with structures such as the Dewar shell 50, ceramic substrate 60, chip 80, and signal output terminals. Furthermore, the pin structure in this solution is less prone to damage during transportation. In summary, the pin structure in this solution is physically more robust and less susceptible to bending or breakage due to external impacts or vibrations, thus ensuring signal transmission stability, reducing the risk of signal interruption or abnormalities caused by pin damage, and providing higher connection stability. This effectively improves the ease of installation, processing, and transportation.

[0060] In one embodiment, the first ceramic substrate 20 and the second ceramic substrate 30 are integrally connected.

[0061] In this embodiment, the first ceramic substrate 20 and the second ceramic substrate 30 constitute a ceramic substrate, which can further improve the convenience of assembly and manufacturing. During the manufacturing process, the outer shell can penetrate the ceramic substrate to form an integrated ceramic tube shell.

[0062] In one embodiment, the outer shell 10 includes an upper shell 11 and a lower shell 12; the upper shell 11 is disposed above the first ceramic substrate 20 and the second ceramic substrate 30; the lower shell 12 is disposed below the first ceramic substrate 20 and the second ceramic substrate 30.

[0063] The upper shell 11 and the lower shell 12 may have the same inner diameter or different inner diameters.

[0064] In applications, the upper shell 11 and the lower shell 12 often need to be connected to different structures. For example, setting them independently can facilitate the assembly of the outer shell 10 onto the ceramic substrate, and also allow the connection of components of different sizes.

[0065] In one embodiment, see Figure 1 The second ceramic substrate 30 extends radially outward from the outer shell 10 to form a protrusion 33; the third pin bonding area 31 is disposed on the top surface of the protrusion 33; and the fourth pin bonding area 32 is disposed on the bottom surface of the protrusion 33.

[0066] In the embodiments provided in this application, the first pin bonding area 21 and the second pin bonding area 22 are located inside the housing 10 and can be used to connect structures such as the chip 80. The third pin bonding area 31 and the fourth pin bonding area 32 are located outside the housing 10 and can be used to connect external structures such as signal output ports.

[0067] Furthermore, in this embodiment, both the third pin bonding area 31 and the fourth pin bonding area 32 are disposed on the protrusion 33, so that the signal output terminal can be connected to the third pin bonding area 31 and the fourth pin bonding area 32 by plugging in, which has higher installation convenience and facilitates later maintenance and disassembly.

[0068] In one embodiment, a through hole 23 is provided in the middle of the first ceramic substrate 20, making the first ceramic substrate 20 a through structure, thus avoiding interference between the first ceramic substrate 20 and the mounting of other structures. The first pin bonding area 21 and the second pin bonding area 22 are arranged around the outer periphery of the through hole 23.

[0069] In one embodiment, see Figure 2 A plurality of slots 24 are provided on the first ceramic substrate 20 around the perforation 23; the slots 24 are used for the support column 41 of the cooling finger 40 to be inserted. In this embodiment, there are four slots 24, which are symmetrically arranged about the perforation 23.

[0070] It should be noted that the cold finger 41 is a structure used to cool specific components or samples. The ceramic substrate 70 for mounting the chip 80 can be disposed on the cold finger 40.

[0071] In this embodiment, by setting the card slot 24, the stability of the cold finger 40 after installation can be improved, thereby improving the installation stability of the chip 80.

[0072] Please see Figures 1 to 4A second aspect of this application provides a Dewar assembly, comprising: a Dewar 50 and an integrated ceramic housing as described above; wherein, in the integrated ceramic housing, the bottom of the outer casing 10 is connected to the top of the Dewar 50. In this embodiment, the detector element may be disposed within the Dewar 50 and the outer casing 10.

[0073] In a more specific embodiment, a first copper pillar 201 and a second copper pillar 202 are provided at the bottom of the first ceramic substrate 20; a third copper pillar 301 and a fourth copper pillar 302 are provided at the bottom of the second ceramic substrate 30; the first copper pillar 201 and the third copper pillar 301 are electrically connected to the outer shell 10; the second copper pillar 202 and the fourth copper pillar 302 are electrically connected to each other.

[0074] In this embodiment, the outer shell 10 is made of Kovar alloy, which is conductive and has a coefficient of thermal expansion that matches the Dewar material. When the Dewar 50 experiences temperature changes, the expansion and contraction of the Kovar alloy shell and the Dewar are similar, which can effectively reduce the stress caused by the difference in thermal expansion and prevent problems such as loosening and leakage at the connection between the shell and the Dewar. This maintains the integrity and sealing of the Dewar structure and ensures its low-temperature storage and thermal insulation performance.

[0075] Meanwhile, in this embodiment, the first copper pillar 201, the third copper pillar 301, and the outer casing 10 conductors ground the entire Dewar. The grounded Kovar alloy casing can promptly conduct static electricity generated during Dewar operation to the ground, preventing static electricity accumulation from damaging the electronic components and measuring instruments inside the Dewar, such as component damage or signal interference caused by electrostatic discharge. Simultaneously, the grounded outer casing 10 also provides a certain degree of electromagnetic shielding, reducing interference from external electromagnetic fields to the Dewar's interior, ensuring the normal operation of the electrical equipment inside the Dewar, and improving measurement accuracy and signal transmission precision.

[0076] The second copper pillar 202 and the fourth copper pillar 302 are electrically connected to each other, and can be used to provide electrical connection between the internal components of the Dewar 50 and external devices.

[0077] In one embodiment, a getter holder 60 is also included; the getter holder 60 is disposed within the Dewar 50; the getter holder 60 is electrically connected to the second copper post 202.

[0078] A getter 61 is disposed within the getter holder 60. Getter 61 is a material capable of adsorbing gas molecules. Even though a large amount of gas has been extracted from the Dewar system using methods such as vacuum pumps, a small amount of gas molecules may still remain inside. Getter 61 can absorb these residual gases through physical adsorption (such as van der Waals force adsorption) and chemical adsorption (such as chemical reactions). The getter prevents residual gases from corroding or oxidizing the internal structure and materials of the Dewar.

[0079] In this embodiment, the getter holder 60 serves as an electrically activated structure. After being electrically connected to an external source via the second copper pillar 202 and the fourth copper pillar 302, it can activate the getter through electrical activation. By using the electrical activation method of the getter holder 60, the inhalation rate and efficiency can be controlled to adapt to different working conditions.

[0080] In one embodiment, the Dewar assembly further includes: a ceramic substrate 70 and a cold finger 40; the cold finger 40 covers the bottom of the Dewar 50; a connecting post 42 is disposed in the middle of the cold finger 40; the top end of the connecting post 42 passes through the Dewar 50 and the housing 10 and is disposed on the top of the ceramic substrate 70, and the ceramic substrate 70 is electrically connected to the first pin bonding area 21 and the second pin bonding area 22.

[0081] In this embodiment, chip 80 is mounted on and electrically connected to ceramic substrate 70. Ceramic substrate 70 is electrically connected to first ceramic substrate 20. Signal output terminal is electrically connected to second ceramic substrate 30. The connection structure between ceramic substrate 70 and the aforementioned signal output terminal will not interfere with each other.

[0082] In the manufacturing and assembly process of the Dewar assembly provided in this application, the embedded pins on the ceramic substrate can be integrally formed with the ceramic substrate, reducing the steps of separately manufacturing and installing the pins, thereby improving production efficiency and reducing manufacturing costs. Furthermore, during assembly, the signal output terminal can be connected to the second ceramic substrate 30 in a plug-in manner, facilitating large-scale production and automated assembly, further reducing production costs.

[0083] At the same time, since the pins are embedded inside the housing, they do not restrict the external space layout of the Dewar 50, providing greater flexibility for the installation and wiring of other components.

[0084] The above are merely preferred embodiments of this application and are not intended to limit the present invention. Although the present application has been described in detail with reference to examples, those skilled in the art can still modify the technical solutions described in the foregoing examples or make equivalent substitutions for some of the technical features. However, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An integrated ceramic package, characterized by, The integrated ceramic package comprises: an outer shell (10), a first ceramic base (20) and a second ceramic base (30); the outer shell (10) is used to connect a dewar (50); the first ceramic base (20) is arranged on the inner side of the outer shell (10); the first ceramic base (20) is embedded with a first pin bonding area (21) and a second pin bonding area (22); the second ceramic base (30) is arranged on the outer side of the outer shell (10); the second ceramic base (30) is embedded with a third pin bonding area (31) and a fourth pin bonding area (32).

2. The integrated ceramic package of claim 1, wherein, The first ceramic base (20) and the second ceramic base (30) are integrally connected.

3. The integrated ceramic package of claim 2, wherein, The outer shell (10) comprises an upper shell (11) and a lower shell (12); the upper shell (11) is arranged above the first ceramic base (20) and the second ceramic base (30); the lower shell (12) is arranged below the first ceramic base (20) and the second ceramic base (30).

4. The integrated ceramic package of claim 1, wherein, The second ceramic base (30) extends to the outer side of the outer shell (10) to form a protruding part (33); the third pin bonding area (31) is arranged on the top surface of the protruding part (33); the fourth pin bonding area (32) is arranged on the bottom surface of the protruding part (33).

5. The integrated ceramic package of claim 1, wherein, The middle part of the first ceramic base (20) is provided with a through hole (23); the first pin bonding area (21) and the second pin bonding area (22) are arranged around the outer periphery of the through hole (23).

6. The integrated ceramic package of claim 5, wherein, The first ceramic base (20) is provided with a plurality of clamping grooves (24) around the outer periphery of the through hole (23); the clamping grooves (24) are used for clamping the supporting column (41) of the cold finger (40).

7. A dewar assembly characterized by, The integrated ceramic package comprises: a dewar (50) and the integrated ceramic package according to any one of claims 1 to 6; in the integrated ceramic package, the bottom of the outer shell (10) is connected to the top of the dewar (50).

8. The dewar assembly of claim 7, wherein, In the integrated ceramic package, the bottom of the first ceramic base (20) is provided with a first copper column (201) and a second copper column (202); the bottom of the second ceramic base (30) is provided with a third copper column (301) and a fourth copper column (302); the first copper column (201), the third copper column (301) and the outer shell (10) are electrically connected to each other; the second copper column (202) and the fourth copper column (302) are electrically connected to each other.

9. The dewar assembly of claim 8, wherein, Further comprising a getter support (60); the getter support (60) is arranged in the dewar (50); the getter support (60) and the second copper column (202) are electrically connected to each other.

10. The dewar assembly of claim 7, wherein, Further comprising: a ceramic substrate (70) and a cold finger (40); the cold finger (40) covers the bottom of the dewar (50); the middle part of the cold finger (40) is provided with a connecting column (42); the top end of the connecting column (42) penetrates through the dewar (50) and the outer shell (10) the ceramic substrate (70) is arranged on the top of the connecting column (42), and the ceramic substrate (70) is electrically connected to the first pin bonding area (21) and the second pin bonding area (22).

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