Device for blocking transmission and reception of electromagnetic interference at optical transmission component, and optical transmission device

Abstract

The utility model relates to an apparatus for blocking transmission and reception of electromagnetic interference at an optical transmit assembly and an optical transmit device. An example apparatus and an optical emitting device for preventing electromagnetic radiation from being transmitted to and from a target electrical component of an electronic device are provided. The example apparatus may include an optical transmitting assembly electrically connected to the target electrical portion and configured to produce an optical output. The example apparatus may also include a wire-bonded electromagnetic interference cage configured to block electromagnetic emissions from passing therethrough. The wire-bonded electromagnetic interference cage may include a plurality of bonding wires, where each bonding wire is electrically coupled to an electrical ground, and where the wire-bonded electromagnetic interference cage overlies at least a portion of the target electrical portion. In addition, the wire-bonded electromagnetic interference cage may also define an electromagnetic interference cage opening through which the optical output passes.

Description

Technical Field

[0001] Embodiments of this disclosure generally relate to electromagnetic interference (EMI) shielding, and more specifically to EMI shielding of a cage including an electrically grounded junction wire. Background Technology

[0002] Various example embodiments address technical problems associated with preventing electromagnetic radiation emitted from and from electrical components of various electronic devices in electronic systems. Electronic systems may include numerous electronic devices that radiate electromagnetic waves and / or are affected by electromagnetic radiation. Exposure to EMI can cause electrical equipment to malfunction when processing and / or transmitting data, or even cease operation.

[0003] The applicant has identified numerous technical challenges and difficulties associated with EMI shielding in electronic systems. Through efforts, ingenuity, and innovation, the applicant has solved the problems related to EMI shielding in electronic systems by developing solutions implemented in this disclosure, which are described in detail below. Utility Model Content

[0004] Various embodiments relate to example devices and optical emitting devices for preventing electromagnetic radiation from being emitted to and from electrical components of electronic devices. In some embodiments, an example device may include an optical emitting component electrically connected to a target electrical part and configured to generate optical output. The example device may also include a wire-jointed electromagnetic interference cage configured to block the passage of electromagnetic emissions. The wire-jointed electromagnetic interference cage includes a plurality of joint wires, each of which is electrically coupled to electrical ground, and wherein the wire-jointed electromagnetic interference cage covers at least a portion of the target electrical part. Furthermore, the wire-jointed electromagnetic interference cage may define an opening through which the optical output passes.

[0005] In some embodiments, the optical emitting assembly further includes a first side and a second side opposite to the first side, wherein each of the plurality of bonding wires is electrically connected to electrical ground at a first bonding wire end on the first side of the optical emitting assembly, wherein each of the plurality of bonding wires is electrically connected to electrical ground at a second bonding wire end on the second side of the optical emitting assembly, such that each bonding wire extends over a portion of the optical emitting assembly, and wherein each bonding wire extends to the maximum wire-bonded electromagnetic interference cage height.

[0006] In some embodiments, the device further includes a second plurality of bonding wires, wherein the optical emitting assembly includes a first end and a second end, wherein each of the second plurality of bonding wires is electrically connected to electrical ground at the first end of the optical emitting assembly, and wherein each of the second plurality of bonding wires is electrically connected to electrical ground at the second end of the optical emitting assembly, such that each of the second plurality of bonding wires extends over a portion of the optical emitting assembly perpendicular to the plurality of bonding wires.

[0007] In some embodiments, the multiple bonding lines are parallel.

[0008] In some embodiments, the maximum wire-jointed electromagnetic interference cage height is the distance from the top of the optical emitting assembly to the joint wire among the multiple joint wires.

[0009] In some embodiments, the maximum wire-jointed electromagnetic interference cage height is between 0.050 mm and 0.160 mm.

[0010] In some embodiments, the plurality of bonding wires includes at least a first bonding wire and a second bonding wire, wherein the first bonding wire and the second bonding wire intersect.

[0011] In some embodiments, the wire-jointed electromagnetic interference cage includes a first gap corresponding to the distance between each of the plurality of joint wires, wherein the wire-jointed electromagnetic interference cage further includes a second gap defining an opening of the electromagnetic interference cage, and wherein the first gap is smaller than the second gap.

[0012] In some embodiments, the first gap is less than or equal to 0.6 mm.

[0013] In some embodiments, the first end of each of the plurality of bonding wires is attached to the electrical ground using a ball joint, and the second end of each of the plurality of bonding wires is attached to the electrical ground using a ball joint or a wedge joint.

[0014] In some embodiments, the optical emission assembly includes a vertical cavity surface-emitting laser.

[0015] In some embodiments, the target electrical components are susceptible to electromagnetic interference.

[0016] In some embodiments, the wire-coupled electromagnetic interference cage blocks electromagnetic interference from external electromagnetic interference sources from being transmitted to the target electrical component.

[0017] In some embodiments, the target electrical component generates electromagnetic interference.

[0018] In some embodiments, the wire-connected electromagnetic interference cage blocks the transmission of electromagnetic interference from the target electrical component.

[0019] In some embodiments, the wire-jointed electromagnetic interference cage is configured to block electromagnetic emissions up to 10 GHz.

[0020] Example optical emitting devices are also provided. In some embodiments, the example optical emitting device includes a device housing. Furthermore, the example optical emitting device may also include one or more electrical components deployed on a substrate within the device housing. In some embodiments, the one or more electrical components include an optical emitting component that is at least electrically connected to a target electrical portion and configured to generate optical output. In some embodiments, the one or more electrical components may also include a wire-joined electromagnetic interference cage deployed within the device housing and configured to block the passage of electromagnetic emissions. In some embodiments, the wire-joined electromagnetic interference cage includes a plurality of joining wires, wherein each of the plurality of joining wires is electrically coupled to electrical ground, wherein the wire-joined electromagnetic interference cage covers at least a portion of the target electrical portion, and wherein the wire-joined electromagnetic interference cage defines an electromagnetic interference cage opening through which optical output passes.

[0021] In some embodiments, the device housing also includes an optical emission opening aligned with the optical emission assembly and configured to allow optical output to exit the device housing.

[0022] In some embodiments, the optical emission opening is larger than the electromagnetic interference cage opening.

[0023] In some embodiments, the optical emitting assembly further includes a first side and a second side opposite to the first side, wherein each of the plurality of bonding wires is electrically connected to electrical ground at a first bonding wire end on the first side of the optical emitting assembly, wherein each of the plurality of bonding wires is electrically connected to electrical ground at a second bonding wire end on the second side of the optical emitting assembly, such that each bonding wire extends over a portion of the optical emitting assembly, and wherein each bonding wire extends to the maximum wire-bonded electromagnetic interference cage height. Attached Figure Description

[0024] Referring now to the accompanying drawings. The components shown in the drawings may be present in some embodiments described herein, or may not be present. Based on exemplary embodiments of this disclosure, some embodiments may include fewer (or more) components than those shown in the drawings.

[0025] Figure 1A – Figure 1B The illustration shows an example of a prior art metal can EMI shielding for the exterior of an electronic device housing.

[0026] Figure 2A – Figure 2B The illustration shows a perspective view of an example optical emitting device including a device housing according to an example embodiment of the present disclosure.

[0027] Figure 3The illustration shows a perspective view of an example line-joined EMI cage according to an exemplary embodiment of the present disclosure.

[0028] Figure 4 The illustration shows a perspective view of an example wire-joint EMI cage covering a target electrical portion of an optical emitting assembly, according to an example embodiment of the present disclosure.

[0029] Figure 5 The illustration shows a perspective view of an example line-joined EMI cage surrounding an example optical emission assembly according to an example embodiment of the present disclosure.

[0030] Figure 6 The illustration shows a perspective view of an example wire-jointed EMI cage according to an exemplary embodiment of the present disclosure, the wire-jointed EMI cage defining an EMI cage opening that allows the transmission of optical output.

[0031] Figure 7 The illustration shows a top view of an example EMI cage opening in an example line-joined EMI cage according to an example embodiment of the present disclosure.

[0032] Figure 8A – Figure 8B The illustration shows a side view of an example optical emission assembly protected by a wire-jointed EMI cage according to an example embodiment of the present disclosure, compared with an example metal can EMI shield. The example wire-jointed EMI cage defines an EMI cage opening, thereby allowing the transmission of optical output.

[0033] Figure 9 The illustration shows a perspective view of an example electrical component protected by an example wire-jointed EMI cage according to an example embodiment of the present disclosure.

[0034] Figure 10 The illustration shows a perspective view of an example line-bonded EMI cage covering a substrate trace according to an exemplary embodiment of the present disclosure.

[0035] Figure 11A – Figure 11B Further example embodiments of a wire-jointed EMI cage according to exemplary embodiments of the present disclosure are illustrated. Detailed Implementation

[0036] Example embodiments will be described more fully below with reference to the accompanying drawings, which illustrate some, but not all, embodiments of the present disclosure. In fact, embodiments of the present disclosure may be implemented in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present disclosure may meet applicable legal requirements. Similar reference numerals throughout refer to similar elements.

[0037] Various example embodiments address technical problems associated with preventing the transmission of destructive electromagnetic radiation to / receiving of destructive electromagnetic radiation from electrical components contained within various electronic devices of an electronic system. As those skilled in the art to which this disclosure pertains will understand, there are numerous example scenarios in which it may be necessary to block electromagnetic radiation from being transmitted from electrical components and / or prevent electrical components from receiving electromagnetic radiation.

[0038] For example, electronic systems may include numerous electrical components that radiate electromagnetic radiation and / or are affected by electromagnetic radiation. As electronic systems shrink in size and electrical equipment moves closer together, errors due to EMI may be exacerbated. EMI problems are further aggravated by the expectation of higher power electrical equipment in electronic systems. With increased power, the adverse effects on electrical components in high-power electronic devices also increase. Furthermore, higher communication frequencies (e.g., 4G to 5G mobile phones transmit at frequencies between 900 MHz and 5 GHz) may make communication equipment more susceptible to errors due to EMI. The combination of closer proximity of higher-power electrical components and high-frequency communication can lead to unwanted crosstalk, coupling, and / or mixing, resulting in performance degradation in electronic equipment.

[0039] In some examples, metal can EMI shields are created by stamping stainless steel sheets to create a conductive envelope around the housing of an electronic device that includes one or more electrical components. These metal can EMI shields are typically positioned outside the electrical component package and attached to the host circuit board to which the electrical component package is attached.

[0040] like Figure 1A As shown, due to manufacturing process limitations, the example metal can EMI shield 104 cannot fit snugly to the shape of the underlying electronic device. For example, stamping or drawing processes prevent the manufacture of a metal can EMI shield 104 with sharp corners. These limitations in forming the metal can EMI shield 104 result in it occupying additional space 106 around the electronic device 102. Therefore, the introduction of the metal can EMI shield 104 increases the overall profile of the existing electronic component 102 by requiring additional space 106, and may prevent device manufacturers from further reducing the space occupied by the existing electronic device 102 in electronic systems (e.g., mobile phones, tablets, laptops, etc.). Thus, a metal can EMI shield 104 comprising a stamped stainless steel sheet utilizes more space on the host circuit board of the electronic system.

[0041] In addition, such as Figure 1BAs depicted, the lack of flexibility in manufacturing the metal can EMI shield 104 prevents it from conforming to the topology and / or shape of the underlying electronic device 108 with a more complex profile. To provide electromagnetic radiation protection in such cases, manufacturers may piece together multiple metal can EMI shields 104, 104b. Piecing together multiple metal can EMI shields 104, 104b may result in gaps 110 in the protective shielding provided by the metal can EMI shields 104, 104b. Gap 110 may allow destructive electromagnetic radiation to escape and / or enter, especially higher frequency EM waves that are more capable of penetrating smaller shielding openings (e.g., gap 110).

[0042] Further problems have led to attempts to isolate or protect optical emitting devices, such as optical rangefinders, from transmitting and / or receiving electromagnetic radiation. Optical rangefinders generally require an optical emitting area (e.g., an aperture or opening) through which optical output can be emitted. Therefore, any EMI shielding must also provide an opening through which the optical output can pass unobstructed. EMI shielding outside the electrical equipment housing is located at a greater distance from the optical emitting area of ​​the optical emitting device. EMI shielding located at a greater distance from the optical emitting area of ​​the optical emitting device (e.g., metal can EMI shield 104) must be larger to allow the entire optical field of the optical output to pass through. Larger openings in the EMI shielding allow the transmission and reception of electromagnetic waves, thereby interfering with the operation of vulnerable electrical components.

[0043] The various example embodiments described herein utilize various techniques to create wire-bonded EMI cages for optical emission devices, using bonding wires to create Faraday cages to prevent electromagnetic radiation from being transmitted through grounded wire-bonded EMI cages, while simultaneously enabling the emission of optical output.

[0044] For example, in some embodiments, established wire bonding techniques can be used to form a wire-bonded EMI cage. In such embodiments, bonding wires may be connected to one or more ground pads to provide electrical grounding within the substrate of the electronic device. The bonding wires then cross one or more target electrical portions of the electrical component and bond to the substrate on the opposite side of the electronic device. This process is repeated until multiple bonding wires form a cage around one or more target electrical portions of the electrical component. This wire-bonded EMI cage allows substrate and package design engineers to protect EM emission sources or EM-sensitive target electrical portions within the device housing of the electronic device.

[0045] In some embodiments, a wire-bonded EMI cage can be configured to protect an optical emitting device that generates optical output. The wire-bonded EMI cage may also provide an EMI cage opening aligned with the optical emitting area of ​​the optical emitting component. The EMI cage opening allows light output from the optical emitting device to pass through while preventing electromagnetic radiation from being sent to and received from the target electrical component. Creating a wire-bonded EMI cage with an EMI cage opening using a bonding wire allows optical output to pass through the wire-bonded EMI cage without the wire-bonded EMI cage interfering with the optical field. Because the wire-bonded EMI cage is very close to the optical emitting component, the EMI cage opening can be smaller than that of a previous metal can EMI shield using a stamped metal shield (e.g., metal can EMI shield 104). Stamped metal can EMI shields are placed outside the electronic device housing, away from the optical emitting component, thus requiring a larger opening to allow the light field of the optical output to pass through.

[0046] Furthermore, due to the flexibility in forming various wire-bonded EMI cage shapes, wire-bonded EMI cages can conform to the topology of the underlying optical emitting components. For example, a wire-bonded EMI cage can be designed to conform to the contours of the target electrical portion of the underlying optical emitting component to further prevent the transmission and / or reception of electromagnetic radiation. This flexibility in forming various wire-bonded EMI cages also allows for the adjustment of the size and shape of the EMI cage openings based on the underlying optical emitting component and the desired optical output.

[0047] As further described herein, in some embodiments, wire-bonded EMI cages can be used to prevent the transmission and reception of electromagnetic radiation to and from other electrical components within an electronic system. For example, any electrical component identified as a source of electromagnetic radiation can be enclosed in a wire-bonded EMI cage to prevent electromagnetic radiation from interfering with other components in the electronic system. Similarly, any electrical component identified as susceptible to external electromagnetic transmission interference can be shielded by a wire-bonded EMI cage enclosing that component. Such electrical components can include any surface mount technology (SMT) electrical components, substrate traces, or other electrical components.

[0048] As a result of the exemplary embodiments described herein, and in some examples, the effectiveness of EMI protection shielding around optical emission components can be significantly improved. Furthermore, the space required to implement protective EMI shielding can be greatly reduced.

[0049] Now for reference Figure 2A – Figure 2B An example optical emission device is shown. (e.g.) Figure 2B As depicted, the example optical emitting device 200 includes a substrate 220 that electrically interconnects a plurality of electrical components 222. Figure 2BAs further depicted, electrical component 222 is electrically connected to substrate 220 via wire connection 224. Example optical emitting device 200 also includes device housing 202.

[0050] like Figure 2A As depicted, the device housing 202 of the example optical emitting device 200 is configured to be attached to the substrate 220 to protect the internal electrical components 222 of the optical emitting device 200. Figure 2A As further depicted, the device housing 202 includes an optical emission opening 226 aligned with the optical emission region of the optical emission assembly to allow the transmission of optical output. The device housing 202 also includes a receiver opening 228 configured to receive optical input into the internal photosensor.

[0051] like Figure 2A – Figure 2B As depicted herein, optical emitting device 200 is any device and its associated circuitry configured to generate optical output (e.g., laser, light, etc.). Optical emitting device 200 includes one or more optical emitting components (e.g., regarding...). Figure 4 – The optical emitting assemblies 440, 540, 640, 740, and 840 shown in Figure 8 include optical emitting regions configured to guide optical output. In some embodiments, the optical emitting device 200 may include a vertical-cavity surface-emitting laser (VCSEL) configured to output laser optical output.

[0052] The optical emitting device 200 also includes a plurality of electrical components 222. An electrical component 222 is any discrete physical entity that receives electrical input and applies functionality to the received electrical input. Electrical components 222 may include, but are not limited to, wires, switches, capacitors, resistors, inductors, diodes, transistors, bridges, or any combination thereof. In some embodiments, electrical components 222 may include surface mount technology (SMT) stand-alone components. SMT electrical components 222 are directly mounted to conductive pads on the surface of substrate 220.

[0053] In some embodiments, electrical component 222 may be electrically connected to substrate 220 using wire bonding 224. Wire bonding is a method for creating an electrical connection between a conductive portion (e.g., pad) on substrate 220 (e.g., a printed circuit board) and an electrical input and / or output of electrical component 222. Wire bonding may include aluminum, copper, silver, gold, or other similar conductive materials. In some embodiments, wire bonding 224 may be created using a ball bonding technique (e.g., ball joint), wherein a ball at the end of wire bonding 224 is soldered to the surface of substrate 220 using a combination of pressure, heat, and ultrasonic energy. In some embodiments, wire bonding 224 may be created using a wedge bonding technique (e.g., wedge joint), wherein wire bonding 224 is created in an oriented manner by applying pressure to pads on substrate 220.

[0054] In some embodiments, the optical emitting device 200 can connect to electrical components 222 via substrate traces within the substrate 220. Substrate traces are conductive conduits created within the substrate 220 material to provide electrical connections between the electrical components 222 of the optical emitting device 200. In some embodiments, the substrate traces can be routed beneath a solder mask on the substrate 220.

[0055] In some embodiments, the optical emitting device 200 may further include a photosensitive receiving electrical component configured to receive reflected optical output. For example, the optical emitting device may include a proximity sensor or a similar device configured to emit optical output toward a target, receive optical output reflected from the target, and determine one or more distances based on the received optical output.

[0056] like Figure 2A – Figure 2B As further depicted, the optical emitting device 200 includes a device housing 202. The device housing 202 can be any encapsulation, lid, container, or other covering configured to protect the internal electrical components 222 of the optical emitting device 200. In some embodiments, the device housing 202 may also include conductive pins and / or conductive pads to provide electrical connection to the internal electrical components 222. The device housing 202 may comprise plastic, ceramic, or other protective non-conductive materials.

[0057] like Figure 2A – Figure 2BAs further depicted, the device housing 202 includes an optical emission opening 226 and a receiver opening 228. The openings in the device housing 202 allow optical signals to flow into and out of the optical emission device 200. For example, the optical emission opening 226 can be aligned with the optical emission region of an optical emission assembly. Optical output from the optical emission assembly can pass through the optical emission opening 226 toward a desired target. Similarly, the receiver opening 228 allows optical signals to be received in the optical emission device 200, for example, by a photosensitizing receiver and analyzed by a processor or other device.

[0058] Now for reference Figure 3 Example wire coupling EMI cage 300 is provided. Figure 3 As depicted, the example wire-bonded EMI cage 300 includes one or more grounded bonding wires 330. The grounded bonding wires 330 at least partially surround the electrical component 322 and are attached using wire bonding techniques. The bonding wires may include aluminum, copper, silver, gold, or other similar conductive materials. In some embodiments, the grounded bonding wires 330 may be attached using a ball bonding technique, wherein a ball at the end of the grounded bonding wire 330 is soldered to the surface of the substrate 320 or ground plane 332 using a combination of pressure, heat, and ultrasonic energy. In some embodiments, a wedge bonding technique may be used to create the grounded bonding wires 330, wherein a wire bond 224 is created in an oriented manner by applying pressure to pads on the substrate 320 or ground plane 332.

[0059] In some embodiments, a grounded bonding wire 330 is attached to the substrate 320 at a ground plane 332 (e.g., electrical ground) on a first side of the electrical component 322 and extends across the electrical component 322 to attach to a ground plane 332 on a second side of the electrical component 322. One or more grounded bonding wires 330 form a Faraday cage around the electrical component 322, preventing internal electromagnetic emissions 338 from being transmitted to the outside of the wire-bonded EMI cage 300 and preventing external electromagnetic emissions 336 from entering the wire-bonded EMI cage 300.

[0060] like Figure 3 As depicted, the example wire-joint EMI cage 300 is configured to enclose one or more electrical components 322. In some embodiments, the electrical components 322 may be susceptible to interference from external electromagnetic emissions 336. For example, the electrical component 322 may be configured to transmit and receive data. External electromagnetic emissions 336 may corrupt data during processing or transmission, or may even cause the electrical component 322 to cease operation. An example electrical component 322 susceptible to interference from external electromagnetic emissions 336 is a communication antenna. Furthermore, as communication frequency rates and data rates increase, communication antennas become more susceptible to errors caused by external electromagnetic emissions 336.

[0061] The wire-joint EMI cage 300 can be configured to envelop electrical components 322 susceptible to external electromagnetic emissions 336, protecting them from the effects of the external electromagnetic emissions 336. The external electromagnetic emissions 336 can be any electromagnetic radiation and / or electromagnetic field waves propagating through space. In some embodiments, the external electromagnetic emissions 336 can originate from various electrical components within the same electronic device (e.g., optical emitting device 200) or electronic system. In some embodiments, the external electromagnetic emissions 336 may originate from sources outside the electronic system.

[0062] In some embodiments, electronic component 322 can be identified as an electromagnetic radiation emitting component. This electronic component 322 can emit internal electromagnetic emissions 338. The internal electromagnetic emissions 338 may interfere with the operation of other electrical components.

[0063] Therefore, the wire-connected EMI cage 300 can be configured to enclose the electrical component 322 identified as generating internal electromagnetic emissions 338. In this configuration, the wire-connected EMI cage 300 can prevent the internal electromagnetic emissions 338 from escaping the wire-connected EMI cage 300.

[0064] like Figure 3 As depicted, a grounded bonding wire 330, comprising a wire-bonded EMI cage 300, forms a Faraday cage. A Faraday cage is a continuous covering comprising a conductive material configured to prevent the transmission of electromagnetic radiation through the cage. The Faraday cage effectively cancels the effects of incoming or outgoing electric fields by distributing the charge of the electric field within the conductive material comprising the cage (e.g., the grounded bonding wire 330). The conductive material comprising the Faraday cage is grounded to dissipate any current generated by the electric field, thereby blocking the transmission of electromagnetic radiation through the Faraday cage.

[0065] Now for reference Figure 4 An example optical emission assembly 440 is provided, protected by an example wire-jointed EMI cage 400. (Example image / image) Figure 4 As depicted, the example wire-joint EMI cage 400 includes multiple grounded joint wires 430, each of which is mounted at its end to a ground plane 432 and covers the target electrical portion 442. The example optical emission assembly 440 also includes an optical emission area 444 not covered by the wire-joint EMI cage 400. Figure 4 As further depicted, the optical emission assembly 440 is attached to the substrate 420.

[0066] like Figure 4As depicted, the example optical emitting assembly 440 includes an optical emitting region 444 and a target electrical portion 442. The optical emitting region 444 is any hole, gap, slit, aperture, or other opening configured to guide the optical output from the optical emitting assembly 440. In some embodiments, the optical emitting region 444 may be accompanied by a lens or other optical device configured to help guide the optical output of the optical emitting assembly 440. The space above the optical emitting region 444 is not covered by any wire-jointed EMI cage 400, cover, shield, or device housing, thereby allowing the optical output to exit the optical emitting device unobstructed.

[0067] like Figure 4 As further depicted, the example optical emitting assembly 440 includes a target electrical portion 442. The target electrical portion 442 is any part of any electrical assembly (e.g., the optical emitting assembly 440) that is identified as emitting destructive electromagnetic radiation and / or susceptible to external electromagnetic interference. In some embodiments, the target electrical portion 442 can be identified as a source of destructive electromagnetic radiation and / or susceptible to electromagnetic interference through simulation and / or testing. Non-limiting examples of the target electrical portion 442 identified as a source of destructive electromagnetic radiation include... Figure 4 The power transmission junction lines shown are used to provide the necessary power to the optical output generation circuitry of the optical transmitting assembly. As the data rate and power of the optical output generation circuitry increase, the amount of destructive electromagnetic radiation emitted from the power-providing wires may also increase. Other examples of sources of destructive electromagnetic radiation may include any high-power or high-data-rate SMT electrical components, power and / or data transmission wires, substrate traces, and other similar electrical components. Non-limiting examples of electrical components susceptible to interference from external electromagnetic radiation may include transceiver antenna electrical components, SMT electrical components, data transmission substrate traces, and other similar electrical components.

[0068] like Figure 4 As further described, the example wire-jointed EMI cage 400 includes multiple grounded joint wires 430. (See also: Regarding...) Figure 3 As described, the grounding connection wire 430 is any wire including aluminum, copper, silver, gold, or other similar conductive materials, and is attached to the surface of the substrate 420 or ground plane 432 using wire bonding technology. The grounding connection wire 430 is configured to at least partially surround the target electrical part 442. Furthermore, the location of the grounding connection wire 430 does not interfere with the optical output of the optical emitting assembly 440.

[0069] One or more grounded junction wires 430 form a Faraday cage around the target electrical part 442, thereby preventing electromagnetic radiation from being transmitted into or out of the junction EMI cage 400 through the junction EMI cage 400.

[0070] Now for reference Figure 5 Example wire-joint EMI cage 500 is provided. Figure 5 As depicted, the example wire-bonded EMI cage 500 includes multiple grounded bonding wires 530 attached to a ground plane 532 and extending over a portion of the optical emitting assembly 540. The wire-bonded EMI cage 500 also defines an EMI cage opening 550 adjacent to and aligned with an optical emitting region 544 of the optical emitting assembly 540, allowing optical output to pass through the EMI cage opening 550. The optical emitting assembly also includes a target electrical section 542. Figure 5 As further described, the optical emitting component 540 is attached to the substrate 520.

[0071] like Figure 5 As depicted, the example wire-jointed EMI cage 500 defines an EMI cage opening 550. The EMI cage opening 550 is any hole, gap, or window positioned adjacent to and aligned with the optical emission region 544 of the optical emission assembly 540 so that the optical output of the optical emission assembly 540 can exit the wire-jointed EMI cage 500 unobstructed. (The remaining text appears to be unrelated and possibly machine-generated gibberish.) Figure 6 – Figure 8 further illustrates the EMI cage opening 550.

[0072] like Figure 5 As further depicted, the wire-bonded EMI cage 500 is positioned at a wire-bonded EMI cage height 546, which is measured from the top surface of the optical emission region 544 of the optical emission assembly 540 to the bottom surface of the nearest grounded bonding wire 530. As the wire-bonded EMI cage height 546 decreases, the size of the EMI cage opening 550 may also decrease. With a smaller EMI cage opening 550, less electromagnetic radiation is allowed to pass through the wire-bonded EMI cage 500 to reach the target electrical part 542 and less to escape from the target electrical part 542. In some embodiments, the wire-bonded EMI cage height 546 may be influenced by a maximum wire-bonded EMI cage height to limit the size of the EMI cage opening 550 and prevent electromagnetic radiation from entering and leaving the wire-bonded EMI cage 500. In some embodiments, the wire-bonded EMI cage height is routed between 0.050 mm and 0.160 mm above the shielded assembly.

[0073] Now for reference Figure 6 Example wire-joint EMI cage 600 is provided. Figure 6 As depicted, the example wire-bonded EMI cage 600 includes multiple grounded bonding wires 630 configured to prevent electromagnetic radiation from being transmitted to or from a target electrical portion 642 of the optical emitting assembly 640. Furthermore, the wire-bonded EMI cage 600 defines an EMI cage opening 650 positioned to allow unobstructed passage of the optical output 660 through the wire-bonded EMI cage 600. Figure 6 As further described, each grounding connection wire 630 of the wire-connected EMI cage 600 is attached to the grounding plate 632. (See also...) Figure 6 As further described, the optical emitting component 640 is attached to the substrate 620.

[0074] like Figure 6 As depicted, the wire-joint EMI cage 600 includes an EMI cage opening 650, allowing an optical output 660 to pass through it. The optical output 660 can be any illumination output, such as visible light, ultraviolet light, infrared light, a laser beam, or other optical illumination. The optical output 660 can be guided by an optical emission area 644, a lens, or the geometry of other optical devices configured to direct the optical output 660 toward a target. Furthermore, various physical characteristics of the optical output 660 can be adjusted; for example, the frequency / wavelength and power or amplitude can be adjusted based on the intended use of the optical output 660.

[0075] Furthermore, the optical output 660 may include an illumination field 662. The illumination field 662 is the area illuminated by the optical output 660, defined by the divergence angle between the optical output 660 and the optical emission region 644. For example, in some embodiments, the illumination field 662 may be 31 degrees, meaning that the optical output 660 diverges from the optical emission region 644 at an angle of 31 degrees in one or more directions. Therefore, as the optical output 660 travels further from the optical emission region 644, the cross-sectional area of ​​the optical output 660 increases, meaning that the farther the EMI cage opening 650 is from the optical emission region 644, the larger the EMI cage opening 650 must be to allow the entire illumination field 662 of the optical output 660 to pass through unobstructed. In some embodiments, the illumination field 662 may include a non-circular shape. In this embodiment, the divergence angle varies in different directions.

[0076] Now for reference Figure 7 The image depicts a top view of an example line-joined EMI cage 700. (See attached image.) Figure 7 As shown, the example wire-bonded EMI cage 700 includes multiple grounded bonding wires 730a, 730b that enclose portions of the underlying optical emitting assembly 740, including the target electrical portion 742 of the optical emitting assembly 740. Figure 7 As further depicted, the wire-bonded EMI cage 700 defines an EMI cage opening 750 aligned with the optical emission region 744 of the optical emission assembly 740. The EMI cage opening 750 is defined by an EMI cage opening gap height 770 between the second set of grounded bonding wires 730b and an EMI cage opening gap width 772 between the first set of grounded bonding wires 730a, each dimension of which is greater than the EMI cage gap 774 of the wire-bonded EMI cage 700.

[0077] like Figure 7 As depicted, the optical emitting assembly 740 has a first dimension (e.g., length 776) and a second dimension (e.g., width 778). The wire-bonded EMI cage 700 includes a first set of grounded bonding wires 730a (e.g., multiple bonding wires) configured to attach to a ground plane 732 and cover the optical emitting assembly 740 parallel to its width 778. Furthermore, the wire-bonded EMI cage 700 includes a second set of grounded bonding wires 730b (e.g., a second set of multiple bonding wires) configured to attach to the ground plane 732 and cover the optical emitting assembly 740 parallel to its length 776. Therefore, the second set of grounded bonding wires 730b intersects the first set of grounded bonding wires 730a perpendicularly, thereby closing a potential gap through which electromagnetic radiation can escape or enter the wire-bonded EMI cage 700 structure.

[0078] like Figure 7 As further described, the first set of grounded connection wires 730a of the wire-connected EMI cage 700 is attached parallel to adjacent grounded connection wires 730a and spaced apart according to the EMI cage gap 774. To prevent the transmission of electromagnetic radiation through the wire-connected EMI cage 700, the EMI cage gap 774 is configured based on the frequency and / or wavelength of the electromagnetic radiation to be blocked. For example, the EMI cage gap 774 is at least smaller than the wavelength of the electromagnetic radiation to be blocked. Therefore, for electromagnetic radiation with a frequency of 10 GHz and a wavelength of 30 mm, the EMI cage gap 774 can be less than 30 mm to prevent electromagnetic radiation of 10 GHz or lower from passing through the wire-connected EMI cage 700.

[0079] However, for effective shielding, in some embodiments, the EMI cage gap 774 can be 1 / 50 of the highest frequency wavelength of the electromagnetic radiation to be blocked, where 1 / 50 is a general rule of thumb that can vary based on shielding design objectives. Returning to our example for 10 GHz electromagnetic radiation, 1 / 50 of the wavelength of a 10 GHz wave is approximately 0.6 mm. Therefore, in some embodiments, for effective shielding of 10 GHz electromagnetic radiation, the EMI cage gap 774 can be 0.6 mm or smaller.

[0080] like Figure 7As further depicted, the EMI cage opening 750 is defined by an EMI cage opening gap height 770 and an EMI cage opening gap width 772. Both the EMI cage opening gap height 770 and the EMI cage opening gap width 772 are greater than the EMI cage gap 774 defined between the first set of grounded bonding wires 730a. The larger EMI cage opening gap height 770 and EMI cage opening gap width 772 allow the illumination field of the optical output (e.g., optical output 660) to pass unobstructed through the wire-bonded EMI cage 700. In some embodiments, the distances between the EMI cage opening gap height 770 and the EMI cage opening gap width 772 may be equal.

[0081] Now for reference Figure 8A and Figure 8B Compared to, for example, the metal can EMI shield 804 described with respect to FIG1, a wire-joint EMI cage 800 positioned within the device housing 802 is shown.

[0082] like Figure 8A As depicted, the wire-bonded EMI cage 800 includes multiple grounded bonding wires 830 attached to a substrate 820 and covering the optical emitting assembly 840. The wire-bonded EMI cage 800 includes an EMI cage opening 850 aligned with the optical emitting region 844 of the optical emitting assembly 840, thereby allowing the entire illumination field 862 to pass unobstructed through the wire-bonded EMI cage 800. Figure 8A As depicted, the wire-bonded EMI cage 800 is positioned within the equipment housing 802 of the optical emitting device, thereby making the EMI cage opening gap 882 in the wire-bonded EMI cage 800 smaller.

[0083] like Figure 8B As depicted, the metal can EMI shield 804 is positioned outside the equipment housing 802 of the optical emitting device. Therefore, in order to allow the entire illumination field 862 to pass unobstructed through the metal can EMI shield 804, the metal can opening gap 884 of the metal can opening 880 may be larger than when it is placed inside the equipment housing 802.

[0084] like Figure 8A and Figure 8B As depicted, the optical output 860 of the optical emitting assembly 840 is emitted at an angle from the optical emitting region 844 of the optical emitting assembly 840, thereby creating an illumination field 862 that widens with increasing distance from the optical emitting region 844. An EMI cage 800 (such as...) is positioned within the device housing 802 and engages with the wires. Figure 8A Compared to (as shown), the metal canister EMI shield 804 positioned outside the device housing 802 (as shown) Figure 8B(As shown) is further away from the optical emission region 844. Therefore, in order to allow the entire illumination field 862 to pass through unobstructed, the metal can opening gap 884 of the metal can EMI shield 804 may be larger than the EMI cage opening gap 882 of the wire-joint EMI cage 800, assuming the same optical output 860.

[0085] Now for reference Figure 9 This depicts an example wire-joint EMI cage 900 covering an example SMT electrical component 990 (e.g., a target electrical part). Figure 9 As depicted, the example wire-joint EMI cage 900 includes multiple grounded joint wires 930, which are arranged in a non-linear configuration, attached to a ground plane 932 and extending above the surface of the SMT electrical component 990. Figure 9 As further depicted, a nearby electromagnetic emission electrical component 992 is emitting an external electromagnetic emission 936. The SMT electrical component 990 and the electromagnetic emission electrical component 992 are further shown attached to a substrate 920.

[0086] like Figure 9 The design flexibility of the wire-connected EMI cage 900, as depicted, including the grounding connection wire 930, allows it to be placed around electrical components of various shapes, sizes, and types. For example... Figure 9 As depicted, the wire-bonded EMI cage 900 can be designed with a non-linear pattern of grounded bonding wires 930 with various heights, allowing the wire-bonded EMI cage 900 to closely match the contours of underlying electrical components (e.g., SMT electrical components 990). This close matching to the contours of the underlying electrical components reduces the space occupied by the wire-bonded EMI cage 900 and provides better protection against the penetration of external electromagnetic emissions 936. While in Figure 9 The non-linear line-joined EMI cage 900, which is depicted as covering the SMT electrical component 990 but matches the contour of the underlying electrical component, can be used on any electrical component identified as emitting destructive electromagnetic radiation and / or susceptible to interference from external electromagnetic radiation (e.g., external electromagnetic emission 936).

[0087] Now for reference Figure 10 An example wire-bonded EMI cage 1000 is provided, which includes multiple grounded bonding wires 1030 attached to a ground plane 1032 in a substrate 1020 of an electronic device. For example... Figure 10 As depicted, the grounded bonding line 1030 extends over the substrate trace 1010 (e.g., the target electrical portion) to prevent electromagnetic radiation from entering or leaving the wire-bonded EMI cage 1000.

[0088] like Figure 10The wire-bonded EMI cage 1000, as depicted, including a grounded bonding wire 1030, can be used to protect electrical components within the substrate 1020 of an electronic device, such as substrate traces 1010. Electrical components within the substrate 1020 of the electronic device can be identified by simulation, testing, or other means as emitting destructive electromagnetic radiation and / or susceptible to interference from external electromagnetic radiation. The wire-bonded EMI cage 1000 can be positioned to cover such electrical components. Identifying electrical components that are sources of electromagnetic radiation or susceptible to interference from electromagnetic radiation and placing the wire-bonded EMI cage 1000 directly near these electrical components can reduce the space occupied by EMI shielding configured to protect the entire electrical device.

[0089] Now for reference Figure 11A An example wire-joint EMI cage 1100a, including a non-parallel grounded junction wire 1130, is provided. (Example:) Figure 11A As depicted, multiple grounding junction wires 1130 are attached to the grounding plate 1132 and extend over the target electrical portion 1142 of the optical emitting assembly 1140, intersecting with a portion of the multiple grounding junction wires 1130.

[0090] like Figure 11A The wire-jointed EMI cages depicted, including the joining lines, enable the definition of wire-jointed EMI cages with various patterns. For example, crossing one or more grounded joining lines 1130 can close the gaps in the wire-jointed EMI cage 1100a exposed by parallel joining lines. Furthermore, crossing the joining lines allows the wire-jointed EMI cage 1100a to closely match the profile of the optical emission assembly 1140, thereby reducing the space occupied by the wire-jointed EMI cage 1100a. Although in Figure 11A The EMI cage 1100a is depicted as primarily covering the target electrical portion 1142, but the wire-jointed EMI cage 1100a can be extended to create EMI cage openings (e.g., EMI cage openings 550, 650, 750, 850) around the optical emission area of ​​the optical emission assembly 1140.

[0091] Now for reference Figure 11B Example wire-joint EMI cage 1100b is provided, including grounding junction wires 1130 with different heights. For example... Figure 11B As depicted, multiple grounding connection wires 1130 are attached to the ground plane 1132 and extend over the target electrical portion 1142 of the optical emitting assembly 1140. The height of each grounding connection wire 1130 is configured to match the profile of the optical emitting assembly 1140.

[0092] like Figure 11BThe wire-bonded EMI cages described herein, including the bonding wires, enable the creation of various wire-bonded EMI cages with different heights. For example, adjusting the height of the individual grounding bonding wires 1130 to match the profile of the underlying optical emitting assembly can close the gaps in the wire-bonded EMI cage 1100b exposed by bonding wires with uniform heights. Furthermore, changing the height of the bonding wires including the wire-bonded EMI cage 1100a to closely match the profile of the optical emitting assembly 1140 can reduce the space occupied by the wire-bonded EMI cage 1100b. Although in Figure 11B The EMI cage 1100b is depicted as primarily covering the target electrical portion 1142, but the wire-jointed EMI cage 1100b can be extended to create EMI cage openings (e.g., EMI cage openings 550, 650, 750, 850) around the optical emission area of ​​the optical emission assembly 1140.

[0093] While this detailed description has illustrated some embodiments of the present disclosure, the appended claims cover other embodiments of the present disclosure that differ from the described embodiments according to various modifications and improvements. For example, those skilled in the art will recognize that these principles can be applied to any electronic component that emits electromagnetic radiation and / or is susceptible to interference from external electromagnetic radiation.

[0094] In the appended claims, unless the specific terms “component for…” or “step for…” are used in a given claim, the claims are not intended to be interpreted in accordance with paragraph 6 of 35 USC 112.

[0095] The use of broader terms such as “comprising,” “including,” and “having” should be understood to support narrower terms such as “consisting of,” “substantially consisting of,” and “essentially consisting of.” The use of terms such as “optionally,” “may,” “perhaps,” and “possibly” with respect to any element of the embodiments means that the element is not essential, or alternatively, that the element is essential, both of which are within the scope of the embodiments(s). Furthermore, references to examples are for illustrative purposes only and are not intended to be exclusive.

Claims

1. An apparatus for blocking transmission and reception of electromagnetic interference at an optical transmitting assembly, characterized by, comprises: the optical emission component configured to produce an optical output, wherein the optical emission component is electrically connected to a target electrical portion; and a wire-bonded electromagnetic interference cage configured to block electromagnetic emissions from passing through, comprising: a plurality of bond wires, wherein each of the plurality of bond wires is electrically coupled to an electrical ground; wherein the wire-bonded electromagnetic interference cage overlies at least a portion of the target electrical portion, and wherein the wire-bonded electromagnetic interference cage defines an electromagnetic interference cage opening through which the optical output passes.

2. The apparatus of claim 1, wherein, the optical emission component further comprises a first side and a second side opposite the first side, wherein each of the plurality of bond wires is electrically connected to the electrical ground at a first bond wire end on the first side of the optical emission component, wherein each of the plurality of bond wires is electrically connected to the electrical ground at a second bond wire end on the second side of the optical emission component, such that each bond wire passes over a portion of the optical emission component, and wherein each bond wire extends to a maximum wire-bonded electromagnetic interference cage height.

3. The apparatus of claim 2, wherein, further comprising: a second plurality of bond wires, wherein the optical emission component comprises a first end and a second end, wherein each of the second plurality of bond wires is electrically connected to the electrical ground on the first end of the optical emission component, and wherein each of the second plurality of bond wires is electrically connected to the electrical ground on the second end of the optical emission component, such that each of the second plurality of bond wires passes over a portion of the optical emission component perpendicular to the plurality of bond wires.

4. The apparatus of claim 2, wherein, the plurality of bond wires are parallel.

5. The apparatus of claim 2, wherein, the maximum wire-bonded electromagnetic interference cage height is a distance from a top of the optical emission component to a bond wire of the plurality of bond wires.

6. The apparatus of claim 5, wherein, the maximum wire-bonded electromagnetic interference cage height is between 0.050 millimeters and 0.160 millimeters.

7. The apparatus of claim 2, wherein, the plurality of bond wires comprises at least a first bond wire and a second bond wire, and wherein the first bond wire crosses the second bond wire.

8. The apparatus of claim 2, wherein, the wire-bonded electromagnetic interference cage comprises a first gap corresponding to a distance between each of the plurality of bond wires, wherein the wire-bonded electromagnetic interference cage further comprises a second gap defining the electromagnetic interference cage opening, and wherein the first gap is smaller than the second gap.

9. The apparatus of claim 8, wherein, the second gap is less than or equal to 0.6 millimeters.

10. The apparatus of claim 2, wherein, the first bond wire end of each of the plurality of bond wires is attached to the electrical ground with a ball bond, and the second bond wire end of each of the plurality of bond wires is attached to the electrical ground with a ball bond or a wedge bond.

11. The apparatus of claim 1, wherein, the optical emission component comprises a vertical cavity surface emitting laser.

12. The apparatus of claim 1, wherein, the target electrical portion is susceptible to electromagnetic interference.

13. The apparatus of claim 12, wherein, the wire-bonded electromagnetic interference cage blocks transmission of electromagnetic interference from an external electromagnetic interference source to the target electrical portion.

14. The apparatus of claim 1, wherein, the target electrical portion produces electromagnetic interference.

15. The apparatus of claim 14, wherein, the wire-bonded electromagnetic interference cage blocks transmission of electromagnetic interference from the target electrical portion.

16. The apparatus of claim 1, wherein, the wire-bonded electromagnetic interference cage is configured to block electromagnetic emissions up to 135 gigahertz.

17. An optical transmitting device, characterized by comprises: a device housing; one or more electrical components disposed on a substrate within the device housing, the one or more electrical components comprising at least: an optical emission component configured to produce an optical output, wherein the optical emission component is electrically connected to a target electrical portion; and a wire-bonded electromagnetic interference cage disposed within the device housing and configured to block passage of electromagnetic emissions, comprising: a plurality of bond wires, wherein each of the plurality of bond wires is electrically coupled to an electrical ground; wherein the wire-bonded electromagnetic interference cage overlies at least a portion of the target electrical portion, and wherein the wire-bonded electromagnetic interference cage defines an electromagnetic interference cage opening through which the optical output passes.

18. The optical transmitting device of claim 17, wherein, the device housing further comprises an optical emission opening aligned with the optical emission component and configured to allow the optical output to pass out of the device housing.

19. The optical transmitting device of claim 18, wherein, the optical emission opening is larger than the electromagnetic interference cage opening.

20. The optical transmitting device of claim 17, wherein, the optical emission component further comprises a first side and a second side opposite the first side, wherein each of the plurality of bond wires is electrically connected to the electrical ground at a first bond wire end on the first side of the optical emission component, wherein each of the plurality of bond wires is electrically connected to the electrical ground at a second bond wire end on the second side of the optical emission component, such that each bond wire passes over a portion of the optical emission component, and wherein each bond wire extends to a maximum wire-bonded electromagnetic interference cage height.

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