Chip adsorption material taking device
By designing a chip adsorption and picking device, and utilizing negative pressure technology and a dust removal fan to remove dust from the chip carrier, the problem of positional displacement during chip disassembly was solved, thereby improving the efficiency of automated production and the chip production qualification rate.
Patent Information
- Application Number
- CN202520096066.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-16
- Publication Date
- 2026-01-06
- Estimated Expiration
- 2035-01-16
AI Technical Summary
During chip disassembly, due to the small size of the chip, it is easy for its position to shift, which can affect subsequent automated production processes.
Design a chip adsorption and pick-up device, including a negative pressure box with an open top and an anti-slip shell. The device uses a dust removal fan to generate negative pressure, draws airflow through a telescopic hose to remove dust from the chip carrier, and adsorbs the chip onto the carrier through negative pressure to prevent positional displacement.
This effectively prevents chip misalignment during disassembly, improves the reliability of automated production and the yield rate of chip production, and reduces production costs.
Smart Images
Figure CN223772450U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to chip material taking technical field, especially, relate to a chip adsorption material taking device. BACKGROUND
[0002] All semiconductor processes begin with a grain of sand, because the silicon contained in the sand is the raw material needed to produce wafers, and wafers are circular thin sheets cut from a single crystal column of silicon or gallium arsenide. High-purity silicon material needs to be extracted using silica sand, which is the main raw material for making wafers.
[0003] Chip processing is a highly complex and delicate process that involves multiple steps and hundreds of workers, each of which requires precise control and high-quality materials to ensure the performance and reliability of the final product. However, in the prior art, during the process of disassembling the chip, due to the small size of the chip, position deviation may occur during disassembly, affecting subsequent automated production and processing. INNOVATION CONTENT
[0004] The utility model provides a kind of chip adsorption material taking device, to solve the problem of position deviation in the prior art during the process of disassembling the chip due to the small size of the chip during disassembly.
[0005] The utility model is implemented as follows: a chip adsorption material taking device includes a negative pressure box with an open top and an anti-slip shell. A grid plate is placed on the top of the negative pressure box. A breathable chip carrier plate with a surface-adhesive protective film is placed on the upper surface of the grid plate. A flexible hose is connected to the surface of the negative pressure box.
[0006] A dust removal fan is arranged in the inner cavity of the anti-slip shell. The other end of the flexible hose extends into the inner cavity of the anti-slip shell and is in communication with the air inlet of the dust removal fan. An exhaust pipe is connected to the air outlet of the dust removal fan. The other end of the exhaust pipe extends to the outside of the anti-slip shell, and a dust removal cloth bag is detachably arranged.
[0007] Preferably, a foot switch is further included, which is electrically connected to the dust removal fan through wiring.
[0008] Preferably, a plurality of anti-slip protrusions are fixedly connected to the bottom of the negative pressure box. The anti-slip protrusions are evenly and spacedly arranged along the bottom of the negative pressure box.
[0009] Preferably, a connecting pipe is connected to the side wall of the negative pressure box. Connection discs are arranged at the other end of the connecting pipe and one end of the flexible hose. The two connection discs are detachably connected by a plurality of bolts.
[0010] Preferably, a maintenance cover plate is detachably arranged on the side wall of the anti-slip shell by a plurality of screws.
[0011] Preferably, a clamp is detachably provided on the surface of the exhaust pipe, and the clamp is fitted onto the overlap between the exhaust pipe and the dust collector bag.
[0012] Beneficial effects
[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: The chip adsorption and material handling device of this utility model, after the dust removal fan operates, can draw airflow from inside the negative pressure box through a telescopic flexible hose, creating negative pressure inside the box. After removing the grid plate, the chip carrier can be placed on top of the negative pressure box to absorb and remove dust from the chip carrier. After absorption, the chip carrier is flipped over to clean impurities and dust from both sides. After cleaning, the grid plate is placed on top of the negative pressure box, and the chip carrier is placed on the upper surface of the grid plate. The negative pressure then adsorbs the chip onto the carrier, allowing the operator to peel off the protective film. This avoids chip displacement during film removal, facilitating subsequent automated production and processing, reducing chip production costs, and improving chip yield. Attached Figure Description
[0014] Fig. 1 This is a front structural diagram of the present invention;
[0015] Fig. 2 This is a schematic diagram of the anti-slip shell and dust removal fan in this utility model;
[0016] Fig. 3 This is a schematic diagram of the anti-slip shell and dust collector bag in this utility model.
[0017] In the diagram: 1. Negative pressure box; 2. Grille; 3. Anti-slip protrusions; 4. Connecting pipe; 5. Telescopic hose; 6. Connecting plate; 7. Anti-slip shell; 8. Dust collector fan; 9. Exhaust pipe; 10. Dust collector bag; 11. Clamp; 12. Foot switch; 13. Wiring; 14. Screw; 15. Inspection cover. Detailed Implementation
[0018] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.
[0019] Please see Figs. 1-3 This utility model provides a technical solution: a chip adsorption and material handling device, including a negative pressure box 1 with an open top and an anti-slip shell 7. A grid plate 2 is placed on the top of the negative pressure box 1, and a breathable chip carrier plate with a protective film attached to its surface is placed on the upper surface of the grid plate 2. A telescopic hose 5 is connected to the surface of the negative pressure box 1.
[0020] The inner cavity of the anti-slip shell 7 is equipped with a dust removal fan 8. The other end of the telescopic hose 5 extends into the inner cavity of the anti-slip shell 7 and is connected to the air inlet of the dust removal fan 8. The air outlet of the dust removal fan 8 is connected to an exhaust pipe 9. The other end of the exhaust pipe 9 extends to the outside of the anti-slip shell 7 and is equipped with a detachable dust removal bag 10.
[0021] After the dust removal fan 8 starts working, it can draw airflow from inside the negative pressure box 1 through the telescopic hose 5, so that negative pressure is generated inside the negative pressure box 1. After removing the grid plate 2, the chip carrier can be placed on the top of the negative pressure box 1, and the dust on the chip carrier can be sucked and removed. After sucking, the chip carrier is flipped over, and the impurities and dust on both sides of the chip carrier are cleaned.
[0022] After cleaning, place the grid plate 2 on top of the negative pressure box 1, and then place the chip carrier on the upper surface of the grid plate 2. The chip can be adsorbed onto the carrier by negative pressure, and the staff can then peel off the protective film. This avoids the chip shifting when the protective film is peeled off, which is conducive to subsequent automated production and processing, reduces chip production costs, and improves the chip production qualification rate.
[0023] Furthermore, it also includes a foot switch 12, which is electrically connected to the dust removal fan 8 via wiring 13.
[0024] In this embodiment, the operator can control the operating status of the dust removal fan 8 by stepping on the foot switch 12, which is beneficial for controlling the negative pressure state inside the negative pressure box 1.
[0025] Furthermore, several anti-slip protrusions 3 are fixedly connected to the bottom of the negative pressure box 1, and the multiple anti-slip protrusions 3 are evenly spaced and distributed along the bottom of the negative pressure box 1.
[0026] In this embodiment, multiple anti-slip bumps 3 improve the anti-slip properties of the negative pressure box 1 when placed on the workbench, thereby improving the stability during the placement process.
[0027] Furthermore, the side wall of the negative pressure box 1 is connected to a connecting pipe 4, and the other end of the connecting pipe 4 and one end of the telescopic hose 5 are both provided with a connecting plate 6. The two connecting plates 6 are connected by several bolts.
[0028] In this embodiment, the negative pressure box 1 can be removed after disassembling multiple bolts, which facilitates subsequent inspection and maintenance operations.
[0029] Furthermore, the side wall of the anti-slip shell 7 is equipped with a maintenance cover 15 by means of several screws 14. After removing the maintenance cover 15, the dust removal fan 8 can be inspected and maintained.
[0030] Furthermore, a clamp 11 is detachably installed on the surface of the exhaust pipe 9, and the clamp 11 is fitted onto the overlap between the exhaust pipe 9 and the dust collector bag 10.
[0031] In this embodiment, after removing the clamp 11, the dust collector bag 10 can be removed, which facilitates the centralized treatment of the dust and impurities collected inside the dust collector bag 10.
[0032] The working principle and usage process of this utility model are as follows: After the utility model is installed, the dust removal fan 8 will work to draw airflow from the inside of the negative pressure box 1 through the telescopic hose 5, creating negative pressure inside the negative pressure box 1. After removing the grid plate 2, the chip carrier can be placed on top of the negative pressure box 1 to remove dust from the chip carrier. After removal, the chip carrier is flipped over to clean impurities and dust on both sides of the chip carrier. After cleaning, the grid plate 2 is placed on top of the negative pressure box 1, and the chip carrier is placed on the upper surface of the grid plate 2. The chip can be adsorbed onto the carrier by the negative pressure, and the operator can then peel off the protective film. This avoids the chip shifting when peeling off the protective film, which is beneficial for subsequent automated production processing.
[0033] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A chip adsorption and taking device, comprising a top-open negative pressure box (1) and an anti-skid shell (7), characterized in that: The top of the negative pressure box (1) is placed with a grid plate (2), the upper surface of the grid plate (2) is placed with a breathable chip carrier board with a surface-mounted protective film, and the surface of the negative pressure box (1) is communicated with a flexible hose (5); The inner cavity of the anti-skid shell (7) is provided with a dust removal fan (8), the other end of the flexible hose (5) extends to the inner cavity of the anti-skid shell (7), and is communicated with the air inlet of the dust removal fan (8), the air outlet of the dust removal fan (8) is communicated with an exhaust pipe (9), the other end of the exhaust pipe (9) extends to the outside of the anti-skid shell (7), and a dust removal cloth bag (10) is detachably arranged.
2. The chip suction and picking device according to claim 1, characterized in that: A foot switch (12) is further included, which is electrically connected to the dust removal fan (8) through a wire (13).
3. The chip suction and picking device according to claim 1, wherein: The bottom of the negative pressure box (1) is fixedly connected with a plurality of anti-skid protrusions (3), and a plurality of the anti-skid protrusions (3) are uniformly and spacedly arranged along the bottom of the negative pressure box (1).
4. The chip suction and picking device according to claim 1, wherein: The side wall of the negative pressure box (1) is communicated with a connecting pipe (4), one end of the connecting pipe (4) is provided with a connecting disc (6), and the other end of the connecting pipe (4) is provided with a connecting disc (6).
5. The chip suction and picking device according to claim 1, wherein: The side wall of the anti-skid shell (7) is detachably provided with an inspection cover plate (15) through a plurality of screws (14).
6. The chip suction and picking device according to claim 1, wherein: The surface of the exhaust pipe (9) is detachably provided with a clamp (11), and the clamp (11) is sleeved on the overlapping part of the exhaust pipe (9) and the dust removal cloth bag (10).