MCP wafer vacuum coating device

Abstract

The MCP wafer vacuum coating device comprises a vacuum coating machine main body, a plating pot is rotationally connected in the vacuum coating machine main body; the plating pot is provided with a silicon wafer groove for placing a silicon wafer, and the plating pot also comprises a wafer fixing assembly which can be fixed in the silicon wafer groove; the wafer fixing assembly comprises an MCP wafer base, an MCP wafer upper cover plate and an MCP wafer inner clamp spring; the MCP wafer base is provided with a wafer clamping groove used for fixing an MCP wafer. The diameter of the wafer clamping groove is smaller than that of the silicon wafer groove; the MCP wafer is placed in the wafer clamping groove and covered with the MCP wafer upper cover plate, and the MCP wafer inner clamping spring is placed between the MCP wafer upper cover plate and the MCP wafer. According to the utility model, the evaporation of the MCP wafer is added while the original plating pot is not changed, so that the cost for reprocessing the plating pot is saved.

Description

Technical Field

[0001] This utility model relates to a coating device, specifically to a vacuum coating device for MCP wafers. Background Technology

[0002] A vacuum coating machine is a type of coating equipment. Vacuum coating machines mainly refer to a type of coating that needs to be carried out under high vacuum conditions. Specifically, there are many types, including vacuum resistance heating evaporation, electron gun heating evaporation, magnetron sputtering, MBE molecular beam epitaxy, PLD laser sputtering deposition, ion beam sputtering, and many others. The main approach is to divide them into two types: evaporation and sputtering.

[0003] Existing vacuum coating machines place the raw material for evaporation in the lower part of the working chamber. The raw material is bombarded by a high-voltage electron beam and evaporates upwards into the chamber. The coating pot at the top of the chamber can uniformly receive the evaporated material, thereby forming a uniform film layer on the silicon wafer. The silicon wafer slots on the existing coating pots can generally only hold silicon wafers of the same diameter (for example, an 8-inch silicon wafer slot can only be used to fix 8-inch silicon wafers). Therefore, it can only coat silicon wafers of that diameter, which has poor applicability. When it is necessary to coat smaller wafers, such as 2-inch MCP wafers, the coating pot must be replaced. Utility Model Content

[0004] The present invention aims to solve the technical problem of providing a vacuum coating device for MCP wafers with smaller diameters that can still coat MCP wafers without changing the coating pot.

[0005] To solve the above-mentioned technical problems, the technical solution of this utility model for an MCP wafer vacuum coating device is as follows:

[0006] The system includes a vacuum coating machine body; a coating pot is rotatably connected inside the vacuum coating machine body; the coating pot has a silicon wafer slot for placing silicon wafers, and also includes a wafer fixing assembly that can be fixed in the silicon wafer slot; the wafer fixing assembly includes an MCP wafer base, an MCP wafer top cover plate, and an MCP wafer inner retaining spring; the MCP wafer base has a wafer retaining slot for fixing the MCP wafer; the diameter of the wafer retaining slot is smaller than the diameter of the silicon wafer slot; the MCP wafer is placed in the wafer retaining slot and covered with the MCP wafer top cover plate, and the MCP wafer inner retaining spring is placed between the MCP wafer top cover plate and the MCP wafer.

[0007] The silicon wafer slot is an 8-inch slot for placing 8-inch silicon wafers; the wafer holder is a 2-inch slot for placing 2-inch MCP wafers; the MCP wafer base has 19 wafer holders.

[0008] The MCP wafer base has an MCP wafer clearance groove on the inner ring of the wafer slot.

[0009] The MCP wafer cover plate has holes corresponding to the wafer slots.

[0010] The MCP wafer cover plate has multiple limiting blocks connected inside its holes, which are rotatably distributed around the axis of the holes.

[0011] The MCP wafer cover plate has three evenly distributed limiting blocks that rotate around the axis of the hole.

[0012] The technical effects achieved by this invention are as follows: This invention uses a wafer fixing component to clamp MCP wafers, and the design of the internal retaining spring of the MCP wafer facilitates clamping and ensures that the MCP wafers remain stable during the rotation of the plating pot; another 8-inch silicon wafer tank can deposit 19 MCP wafers at a time. This invention can simultaneously accommodate the plating of 8-inch silicon wafers and MCP wafers, increasing the plating capacity of MCP wafers without changing the original plating pot, saving the cost of reprocessing the plating pot. For large-scale vacuum coating machines, the time cost saved from frequent plating pot replacements is also considerable; in processes where MCP wafers are not required, the wafer fixing component in the slot can be removed and replaced with the original 8-inch silicon wafer cover plate without changing the function of the original plating pot. Attached Figure Description

[0013] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments:

[0014] Figure 1 This is a schematic diagram of the structure of an MCP wafer vacuum coating device according to the present invention;

[0015] Figure 2 This is a schematic diagram of the structure of the wafer fixing assembly;

[0016] Figure 3 yes Figure 2 Enlarged view of part A;

[0017] Figure 4 This is a cross-sectional view of the wafer fixing assembly;

[0018] Figure 5 yes Figure 4 Enlarged view of part B;

[0019] Figure 6 This is an exploded view of the chip fixing assembly. Detailed Implementation

[0020] The present invention will now be described in further detail with reference to the accompanying drawings.

[0021] See Figures 1 to 6 .

[0022] A vacuum coating apparatus for MCP wafers includes a vacuum coating machine body 1; a coating pot 2 is rotatably connected inside the vacuum coating machine body 1, and a silicon wafer slot 3 is provided on the coating pot 2 for placing silicon wafers. Specifically, the silicon wafer slot 3 is an 8-inch slot for placing 8-inch silicon wafers; Reference Figure 1 The lower part of the main body 1 of the vacuum coating machine contains the raw material for vapor deposition. The raw material is evaporated upwards by being bombarded by a high-pressure electron beam. The coating pot 2 at the top of the cavity can uniformly receive the evaporated material, thereby forming a uniform film layer. The coating pot 2 at the top is connected to an external rotary motor, which can keep the coating pot 2 in a rotating state during operation to ensure its uniformity. The coating pot 2 is used to hold the 8-inch silicon wafers to be processed. This utility model has five 8-inch silicon wafer slots 3. Currently, there are standard wafer slots of 2-12 inch size in the industry, which are not compatible with other specifications of wafers, and there are no corresponding MCP wafer mounting slots.

[0023] This utility model also includes a wafer fixing assembly that can be fixed in the silicon wafer slot 3. The wafer fixing assembly includes an MCP wafer base 4, an MCP wafer top cover 6, and an MCP wafer inner retaining spring 7. The MCP wafer base 4 has wafer slots 5 for fixing the MCP wafer 8. The diameter of the wafer slots 5 is smaller than the diameter of the silicon wafer slot 3. Specifically, the wafer slots 5 are 2-inch slots for placing 2-inch MCP wafers. The MCP wafer base 4 has 19 wafer slots 5. The MCP wafer 8 is placed in the wafer slots 5 and covered with the MCP wafer top cover 6. The MCP wafer inner retaining spring 7 is placed between the MCP wafer top cover 6 and the MCP wafer 8.

[0024] Specifically, the MCP chip base 4 has an MCP chip clearance groove 9 in the inner ring of its chip slot 5; the MCP chip base 4 is designed with 19 chip slots 5 for fixing the MCP chip 8, and the chip slots 5 have MCP chip clearance grooves 9 in the inner ring to prevent the MCP chip 8 from directly contacting the back of the MCP chip 8 during placement and causing contamination.

[0025] On the MCP wafer cover plate 6, there are holes 11 corresponding to the wafer slot 5. After installation, the holes 11 face the vaporization direction of the evaporated coating material, providing a channel for the vaporized particles to grow smoothly to the surface of the MCP wafer 8 through the opening, thereby forming a film layer of uniform thickness. At the same time, the outer diameter of the MCP wafer cover plate 6 is designed to be consistent with the 8-inch silicon wafer slot 3 of the vacuum coating machine's coating pot 2, so that it can be inserted into the silicon wafer slot 3 of the coating pot 2.

[0026] Specifically, the inner retaining spring 7 of the MCP chip is the fixing structure of the MCP chip 8. It is inserted into the opening of the upper cover plate 6 of the MCP chip by the inner retaining clamp. After the upper cover plate 6 of the MCP chip is fastened to the base plate 4 of the MCP chip, it plays the role of limiting the upper and lower position of the MCP chip 8, thus ensuring the fixation of the MCP chip 8 in the up, down, left, right and front and back.

[0027] The upper cover plate 6 of the MCP wafer has a hole 11 in which multiple limiting blocks 12 are connected and rotated around the axis of the hole 11; more specifically, the upper cover plate 6 of the MCP wafer has a hole 11 in which three limiting blocks 12 are connected and rotated evenly around the axis of the hole 11, and the limiting blocks 12 limit the snap ring 7 inside the MCP wafer.

[0028] This invention has an 8-inch silicon wafer slot 3 on the original plating pan 2. This design adds a slot for the MCP wafer 8 without changing the original design, and also utilizes the original limiting spring clip's spring-pressing fixing method.

[0029] Regarding the design for fixing the MCP wafer 8: This utility model adopts the design of fixing the MCP wafer 8 with an internal retaining spring 7, which can be adapted to the assembly of MCP wafers 8 of various thicknesses, and the fixing is precise and without gaps.

[0030] According to the design of this utility model, the MCP wafer 8 is clamped securely, and the design of the internal retaining spring 7 of the MCP wafer facilitates clamping and ensures that the MCP wafer 8 remains stable during the rotation of the plating pot 2. Another 8-inch silicon wafer tank 3 can deposit 19 MCP wafers at a time, simultaneously accommodating both 8-inch silicon wafers and MCP wafers. It increases the deposition of MCP wafers 8 without altering the original plating pot 2, saving the cost of reprocessing the plating pot 2. For large-scale vacuum coating machines, the time cost saved from frequent pot replacements is considerable. In processes where the MCP wafer 8 is not required, the wafer fixing assembly of the silicon wafer tank 3 can be removed and replaced with the original 8-inch silicon wafer cover plate, without changing the function of the original plating pot 2.

Claims

1. A vacuum coating apparatus for MCP wafers, comprising a vacuum coating machine body (1); a coating pot (2) is rotatably connected inside the vacuum coating machine body (1); a silicon wafer groove (3) for placing silicon wafers is provided on the coating pot (2), characterized in that: It also includes a wafer fixing assembly that can be fixed in the silicon wafer slot (3); the wafer fixing assembly includes an MCP wafer base (4), an MCP wafer top cover plate (6) and an MCP wafer inner retaining spring (7); the MCP wafer base (4) is provided with a wafer slot (5) for fixing the MCP wafer (8); the diameter of the wafer slot (5) is smaller than the diameter of the silicon wafer slot (3); the MCP wafer (8) is placed in the wafer slot (5) and covered with the MCP wafer top cover plate (6), and the MCP wafer inner retaining spring (7) is placed between the MCP wafer top cover plate (6) and the MCP wafer (8).

2. The MCP wafer vacuum coating apparatus according to claim 1, characterized in that: The silicon wafer slot (3) is an 8-inch slot for placing 8-inch silicon wafers; the wafer slot (5) is a 2-inch slot for placing 2-inch MCP wafers; the MCP wafer base (4) has 19 wafer slots (5).

3. The MCP wafer vacuum coating apparatus according to claim 1 or 2, characterized in that: The MCP wafer base (4) has an MCP wafer clearance groove (9) on the inner ring of its wafer slot (5).

4. The MCP wafer vacuum coating apparatus according to claim 1, characterized in that: The MCP wafer cover plate (6) has holes (11) corresponding to the wafer slot (5).

5. The MCP wafer vacuum coating apparatus according to claim 4, characterized in that: The MCP wafer cover plate (6) has a plurality of limiting blocks (12) connected inside its hole (11), which are rotatably distributed around the axis of the hole (11).

6. The MCP wafer vacuum coating apparatus according to claim 5, characterized in that: The MCP wafer cover plate (6) has three limiting blocks (12) that are evenly distributed and rotate around the axis of the hole (11) connected inside its hole (11).

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