Heat dissipation module of camera and three-dimensional scanner

Abstract

The utility model discloses a heat dissipation module of a camera and a three-dimensional scanner. The heat dissipation module comprises a skeleton, a camera seat, a lens and a main circuit board, the camera seat is fixedly arranged on the framework and is provided with a first side and a second side which are opposite to each other; the lens is mounted on a first side of the camera seat, and the main circuit board provided with a camera chip is mounted on a second side of the camera seat; the main circuit board is provided with at least one through hole, and the hole is located at the camera chip. The camera further comprises a heat dissipation block and heat conduction silica gel. The heat dissipation block is fixed to the camera base or the framework. Heat dissipation pins are arranged on the heat dissipation block, when the heat dissipation block is installed on the camera seat, the heat dissipation pins extend into the opening from the heat dissipation block, and first gaps are reserved between the heat dissipation pins and the inner wall of the opening and between the heat dissipation pins and the camera chip; and the heat-conducting silica gel is filled in the first gap. The heat dissipation efficiency of the camera chip is improved, and the purpose of improving the scanning precision and stability of equipment is achieved; and moreover, the engine heating time of the equipment is shortened, and the convenience and usability of the equipment are improved.

Description

Technical Field

[0001] This utility model relates to the field of camera heat dissipation technology, specifically to a camera heat dissipation module and a 3D scanner. Background Technology

[0002] Existing heat dissipation solutions for camera chips and main circuit boards, such as Figure 1 As shown, by setting exposed copper areas on the main circuit board, heat is conducted to the camera mount through contact between the exposed copper areas and the camera mount. The heat is then dissipated from the camera mount to the frame, achieving the purpose of camera heat dissipation. The above solution basically meets the heat dissipation requirements of low frame rate and low resolution cameras. However, with the iterative upgrades in product accuracy requirements and scanning speeds, the heat generation of the camera chip and main circuit board of high-performance scanners has increased dramatically, and the existing heat dissipation solutions can no longer meet the heat dissipation requirements of the camera chip. Utility Model Content

[0003] To address the aforementioned shortcomings of existing technologies, a heat dissipation module for a camera and a 3D scanner are provided, which improves the heat dissipation efficiency of the camera chip, thereby enhancing the scanning accuracy and stability of the device; and also shortens the warm-up time of the device, increasing its convenience and ease of use.

[0004] The technical solution adopted by this utility model to solve the above-mentioned technical problems is as follows:

[0005] The camera's heat dissipation module includes a frame, camera mount, lens, and main circuit board; the camera mount is fixedly mounted on the frame, and the lens and the main circuit board containing the camera chip are mounted on the camera mount;

[0006] The main circuit board has at least one through-hole located at the camera chip; it also includes a heat sink and thermally conductive silicone, the heat sink is fixed to the camera mount or frame; the heat sink has heat dissipation feet, when the heat sink is installed on the camera mount, the heat dissipation feet extend from the heat sink to the opening, and a first gap is left between the heat dissipation feet and the inner wall of the opening, and between the heat dissipation feet and the camera chip; the thermally conductive silicone fills the first gap.

[0007] According to the above technical solution, the heat sink includes a fixed part and a first cantilever part. The fixed part is fixed to the camera mount or frame, and the first cantilever part is connected to the fixed part. The first cantilever part extends to the side of the main circuit board away from the camera mount, and a second gap is left between the first cantilever part and the main circuit board. The heat sink foot is provided on the first cantilever part.

[0008] According to the above technical solution, the first cantilever part adopts a plate-like structure, and thermally conductive silicone is also filled in the second gap.

[0009] According to the above technical solution, the size of the first cantilever part matches the size of the main circuit board.

[0010] According to the above technical solution, a second cantilever is provided on the heat sink, and a third gap is left between the second cantilever and the frame, and thermal grease is filled in the third gap.

[0011] According to the above technical solution, the heat sink is fixedly installed on the camera mount. The heat sink includes a second cantilevered part, a fixed part, and a first cantilevered part in sequence from the middle of the frame to the camera mount. A third gap is left between the second cantilevered part and the frame, and a second gap is left between the first cantilevered part and the main circuit board.

[0012] According to the above technical solution, a positioning hole is provided on the camera mount, and a positioning pin is provided on the heat sink; when the positioning pin is placed in the positioning hole, the heat sink foot is placed in the opening; the heat sink is fixedly installed on the camera mount by a second fastener.

[0013] According to the above technical solution, a through hole is provided on the camera mount, the end of the lens away from the object is mounted on the first side of the camera mount where the through hole is located, and the main circuit board is mounted on the second side of the camera mount where the through hole is located; the mounting point of the heat sink on the camera mount is located on the side of the through hole near the end of the frame.

[0014] According to the above technical solution, an exposed copper area is provided on the side of the through hole on the main circuit board, and the exposed copper area is attached to the camera mount.

[0015] According to the above technical solution, the camera mount and the frame are designed as an integrated unit; or, the camera mount and the frame are designed as separate units, and the camera mount is connected to the frame by a third fastener.

[0016] Secondly, a 3D scanner, including a heat dissipation module for the camera as described in any of the above.

[0017] This utility model has the following beneficial effects:

[0018] 1. An opening is provided on the main circuit board, and the heat generated by the camera chip is directly transferred to the heat sink using the heat dissipation pins on the heat sink. The camera chip and the heat sink are connected by thermal grease and heat dissipation pins. Compared with the existing technology, this adds a heat dissipation path of "camera chip - thermal grease - heat dissipation pins - heat sink", which improves the heat dissipation efficiency of the camera, increases the service life of the device and the stability of components, and enables the scanner device to be equipped with higher performance camera chips.

[0019] 2. A fixing part is provided, and a first cantilever part is fixedly installed on the fixing part. A second gap is left between the first cantilever part and the main circuit board, so that the first cantilever part is set as a cantilever. One end of the heat dissipation foot is fixed to the first cantilever part, and the other end of the heat dissipation foot extends into the opening. The above structural arrangement ensures that the fixing part, the first cantilever part, and the heat dissipation foot do not contact the main circuit board, ensuring that the installation stress of the heat dissipation foot, the first cantilever part, and the fixing part only acts on the frame or camera mount, avoiding the influence of the heat dissipation foot, the first cantilever part, and the fixing part on the main circuit board, and ensuring the accuracy and stability of the equipment.

[0020] 3. The first cantilever section adopts a plate-like structure, and its dimensions match the dimensions of the main circuit board. Thermally conductive silicone is also filled within the second gap. This adds a heat dissipation path of "camera chip - main circuit board - thermally conductive silicone - heat sink," meeting auxiliary heat dissipation requirements and further improving heat dissipation efficiency. Furthermore, the second gap, filled with sealant, increases the contact area between the main circuit board and the heat sink, further accelerating heat dissipation from the main circuit board.

[0021] 4. Connect the heat sink and the frame with thermal grease to create a heat dissipation path of "heat sink-thermal grease-frame" between the heat sink and the frame. This improves the heat dissipation efficiency of the camera, further reduces the overall temperature rise of the scanner, reduces thermal deformation of the equipment, and increases the scanning accuracy and stability of the equipment.

[0022] 5. During the process of fixing the heat sink to the camera mount with the second fastener, the positioning hole and positioning pin are used to limit the movement, making it easy to insert the heat sink foot into the opening on the main circuit board; and by controlling the depth of the positioning hole and the length of the positioning pin, the depth of the heat sink foot inserted into the opening is controlled, ensuring the accurate installation of the heat sink foot in the opening.

[0023] 6. The 3D scanner uses a camera heat dissipation module with multiple internal heat dissipation paths; in particular, the heat dissipation path of "camera chip - thermal conductive silicone - heat dissipation foot - heat dissipation block - thermal conductive silicone grease of the second cantilever part - skeleton" is a better heat transfer path, which conducts the heat on the main circuit board to the skeleton, so that the scanner can reach a thermally stable state more quickly, which can reduce the warm-up time of the device and increase the convenience and ease of use of the device.

[0024] The above description is merely an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it according to the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings. The specific implementation methods of this utility model are given in detail in the following embodiments and their accompanying drawings. Attached Figure Description

[0025] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and are used to explain the present invention, but do not constitute an undue limitation of the present invention.

[0026] Figure 1 This is a schematic diagram of the existing structure provided in the embodiments of this utility model;

[0027] Figure 2 This is a schematic diagram of the structure of an embodiment provided by this utility model. Figure 1 ;

[0028] Figure 3 This is a schematic diagram of the structure of an embodiment provided by this utility model. Figure 2 ;

[0029] Figure 4 This is an exploded view of the camera mount and the components mounted on the camera mount according to an embodiment of the present invention;

[0030] Figure 5 This is a schematic diagram of the positioning hole and positioning pin provided in an embodiment of this utility model;

[0031] Figure 6 This is a cross-sectional view of an embodiment provided by this utility model;

[0032] Figure 7 This is a partial schematic diagram of an embodiment provided by this utility model;

[0033] In the diagram, 1. Frame; 2. Camera mount; 2-1. First side; 2-2. Second side; 3. Lens; 4. Main circuit board; 4-1. Camera chip; 5. Opening; 6. Heat sink; 6-1. Fixing part; 6-2. First cantilever part; 6-3. Second cantilever part; 7. Heat sink foot; 8. Positioning hole; 9. Positioning pin; 10. Through hole; 11. Exposed copper area; 12. First gap; 13. Second gap; 14. Third gap. Detailed Implementation

[0034] The following is in conjunction with the appendix Figure 2-7 The principles and features of this utility model are described below. The examples given are for illustrative purposes only and are not intended to limit the scope of this utility model. The utility model is described more specifically in the following paragraphs by way of example with reference to the accompanying drawings. The advantages and features of this utility model will become clearer from the following description and claims. It should be noted that the drawings are in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of this utility model.

[0035] It should be noted that when a component is described as "fixed to" another component, it can be directly on the other component or may have a component in between. When a component is considered "connected to" another component, it can be directly connected to the other component or may have a component in between. When a component is considered "set on" another component, it can be directly set on the other component or may have a component in between. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0037] Reference Figures 2-7 As shown, this utility model provides a heat dissipation module for a camera.

[0038] Example 1

[0039] It includes a frame 1, a camera mount 2, a lens 3, and a main circuit board 4; the camera mount is fixedly mounted on the frame, and the camera mount has a first side 2-1 and a second side 2-2 facing each other; the lens is mounted on the first side of the camera mount, and the main circuit board with a camera chip 4-1 is mounted on the second side of the camera mount by a first fastener.

[0040] The main circuit board has at least one through-hole 5 located at the camera chip; it also includes a heat sink 6 and thermally conductive silicone, the heat sink is fixed to the camera mount or frame; the heat sink has a heat sink foot 7, when the heat sink is installed on the camera mount, the heat sink foot extends from the heat sink to the opening, and a first gap 12 is left between the heat sink foot and the inner wall of the opening, and between the heat sink foot and the camera chip; the thermally conductive silicone fills the first gap.

[0041] Based on this, openings are provided on the main circuit board, and the heat generated by the camera chip is directly transferred to the heat sink using the heat dissipation pins on the heat sink. The camera chip and the heat sink are connected by thermal grease and heat dissipation pins. Compared with the prior art, this adds a heat dissipation path of "camera chip - thermal grease - heat dissipation pin - heat sink", which improves the heat dissipation efficiency of the camera, increases the service life of the device and the stability of components, and enables the scanner device to be equipped with higher performance camera chips.

[0042] Example 2

[0043] The structure and principle of Example 2 are similar to those of Example 1, except that a preferred structure for the heat sink is provided, as detailed below:

[0044] Reference Figures 2-7 As shown, the heat sink includes a fixed part 6-1 and a first cantilever part 6-2. The fixed part is fixed to the camera mount or frame, and the first cantilever part is connected to the fixed part. The first cantilever part extends to the side of the main circuit board away from the camera mount. A second gap 13 is left between the first cantilever part and the main circuit board. The heat sink foot is provided on the first cantilever part.

[0045] In Embodiment 2, a fixing part is provided, and a first cantilever part is provided on the fixing part. A second gap is left between the first cantilever part and the main circuit board, so that the first cantilever part is set as a cantilever. One end of the heat dissipation foot is fixed to the first cantilever part, and the other end of the heat dissipation foot extends into the opening. The above structural arrangement ensures that the fixing part, the first cantilever part, and the heat dissipation foot do not contact the main circuit board, ensuring that the installation stress of the heat dissipation foot, the first cantilever part, and the fixing part only acts on the frame or camera mount, avoiding the influence of the heat dissipation foot, the first cantilever part, and the fixing part on the main circuit board, and ensuring the accuracy and stability of the equipment.

[0046] In Example 2, as Figure 2-4 As shown, the first cantilever can be a plate-like structure; or it can be a strut or other irregular structure.

[0047] Example 3

[0048] The structure and principle of Example 3 are similar to those of Example 2, except that: (Refer to...) Figures 2-7 As shown, the first cantilever section adopts a plate-like structure, and its dimensions match the dimensions of the main circuit board. Thermally conductive silicone is also filled within the second gap. Based on Embodiment 1, a heat dissipation path of "camera chip - main circuit board - thermally conductive silicone - heat sink" is added to meet the needs of auxiliary heat dissipation and further improve heat dissipation efficiency. Furthermore, the second gap, filled with sealant, increases the contact area between the main circuit board and the heat sink, further accelerating heat dissipation from the main circuit board.

[0049] Example 4

[0050] The structure and principle of Example 4 are similar to those of Examples 1-3, except that in Examples 1-3, heat is concentrated on the heat sink via both the "camera chip - thermally conductive silicone - heat sink pin - heat sink" and "camera chip - main circuit board - thermally conductive silicone - heat sink pin - heat sink" heat sink paths. Since the heat sink is fixed to the camera mount, heat is transferred along the "heat sink - camera mount - frame" direction, but its heat transfer efficiency is low.

[0051] To improve the heat dissipation efficiency from the heat sink to the frame, refer to Figures 5-7 As shown, a second cantilever 6-3 is provided on the heat sink, and a third gap 14 is left between the second cantilever and the frame, which is filled with thermally conductive silicone grease. The heat sink and the frame are connected by thermally conductive silicone grease, and a heat dissipation path of "heat sink-thermally conductive silicone grease-frame" is constructed between the heat sink and the frame, which improves the heat dissipation efficiency of the camera, further reduces the overall temperature rise of the scanner, reduces the thermal deformation of the equipment, and can increase the scanning accuracy and stability of the equipment.

[0052] In embodiments 1-4, there are various methods for fixing the heat sink to the frame or camera mount; for example, the heat sink and camera mount are integrated, or the heat sink and frame are integrated, or the heat sink is fixed to the frame with bolts. (Combined with...) Figure 5 As shown, a preferred connection method between the heat sink and the camera mount is presented. Details are as follows:

[0053] The heat sink is fixedly mounted on the camera mount. From the middle of the frame towards the camera mount, the heat sink sequentially includes a second cantilever, a fixing part, and a first cantilever. A third gap is left between the second cantilever and the frame, and a second gap is left between the first cantilever and the main circuit board. To ensure that the heat sink feet and the openings on the main circuit board align, a positioning hole 8 is provided on the camera mount, and a positioning pin 9 is provided on the heat sink. When the positioning pin is placed in the positioning hole, the heat sink feet are placed in the opening. The heat sink is fixedly mounted on the camera mount by a second fastener. The first fastener uses a fixing method similar to a detachable bolt connection.

[0054] In the above structure, during the process of fixing the heat sink to the camera mount by the second fastener, the positioning hole and positioning pin cooperate to limit the insertion of the heat sink foot into the opening on the main circuit board; and by controlling the depth of the positioning hole and the length of the positioning pin, the depth of the heat sink foot inserted into the opening can be controlled to ensure the accurate installation of the heat sink foot in the opening.

[0055] like Figure 2-3 As shown, a through hole 10 is provided on the camera mount. The end of the lens away from the object is mounted on the first side of the through hole located on the camera mount, and the main circuit board is mounted on the second side of the through hole located on the camera mount. The mounting point of the heat sink on the camera mount is located on the side of the through hole near the end of the frame.

[0056] In the above embodiment, to further improve the heat dissipation effect of the main circuit board, an exposed copper area 11 is provided on the side of the main circuit board located at the through hole, and the exposed copper area is attached to the camera mount. The side of the main circuit board near the camera mount conducts heat to the camera mount through the exposed copper area, thereby achieving heat dissipation of the main circuit board and further reducing the temperature of the camera.

[0057] In the above embodiments, the camera mount and the frame are designed as an integral unit; or, the camera mount and the frame are designed as separate units, and the camera mount is connected to the frame by a third fastener.

[0058] Preferably, the heat sink is made of metal plate, and the fasteners can all be bolt assemblies.

[0059] This utility model also provides a 3D scanner, including a heat dissipation module for the camera as described above. The 3D scanner employing the camera's heat dissipation module incorporates multiple heat dissipation paths; particularly the "camera chip - thermally conductive silicone - heat dissipation feet - heat dissipation block - thermally conductive grease for the second cantilever - frame" heat dissipation path, which provides a superior heat transfer path, transferring heat from the main circuit board to the frame. This allows the scanner to reach thermal stability more quickly, reducing warm-up time and increasing the device's convenience and ease of use.

[0060] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any way. Those skilled in the art can readily implement this utility model based on the accompanying drawings and the above description. However, any modifications, alterations, or variations made by those skilled in the art without departing from the scope of the utility model's technical solution, utilizing the disclosed technical content, are equivalent embodiments of this utility model. Furthermore, any equivalent changes, alterations, or variations made to the above embodiments based on the essential technology of this utility model are still within the protection scope of this utility model's technical solution.

Claims

1. A heat dissipation module for a camera, including a frame, a camera mount, a lens, and a main circuit board; the camera mount is fixedly mounted on the frame, and the lens and the main circuit board containing the camera chip are mounted on the camera mount; Its features are: The main circuit board has at least one through-hole located at the camera chip; it also includes a heat sink and thermally conductive silicone, the heat sink is fixed to the camera mount or frame; the heat sink has heat dissipation feet, when the heat sink is installed on the camera mount, the heat dissipation feet extend from the heat sink into the opening, and a first gap is left between the heat dissipation feet and the inner wall of the opening, and between the heat dissipation feet and the camera chip. Thermally conductive silicone fills the first gap.

2. The heat dissipation module for the camera according to claim 1, characterized in that: The heat sink includes a fixed part and a first cantilever part. The fixed part is fixed to the camera mount or frame, and the first cantilever part is connected to the fixed part and extends to the side of the main circuit board away from the camera mount. A second gap is left between the first cantilever part and the main circuit board. The heat sink foot is provided on the first cantilever part.

3. The heat dissipation module for the camera according to claim 2, characterized in that: The first cantilever section adopts a plate-like structure, and thermally conductive silicone is also filled in the second gap.

4. The heat dissipation module for the camera according to claim 3, characterized in that: The dimensions of the first cantilever section match the dimensions of the main circuit board.

5. The heat dissipation module for a camera according to any one of claims 1-4, characterized in that: A second cantilever is provided on the heat sink, and a third gap is left between the second cantilever and the frame, and thermal grease is filled in the third gap.

6. The heat dissipation module for the camera according to claim 1, characterized in that: The heat sink is fixedly installed on the camera mount. The heat sink includes a second cantilever, a fixed part, and a first cantilever in sequence from the middle of the frame to the camera mount. A third gap is left between the second cantilever and the frame, and a second gap is left between the first cantilever and the main circuit board.

7. The heat dissipation module for a camera according to claim 5, characterized in that: The camera mount has a positioning hole, and the heat sink has a positioning pin; when the positioning pin is placed in the positioning hole, the heat sink foot is placed in the opening; the heat sink is fixedly installed on the camera mount by a second fastener.

8. The heat dissipation module for the camera according to claim 1, characterized in that: The camera mount has a through hole, and the lens is mounted on the first side of the camera mount with the through hole located away from the object. The main circuit board is mounted on the second side of the camera mount with the through hole located. The heat sink is mounted on the side of the camera mount with the through hole located near the end of the frame.

9. The heat dissipation module for the camera according to claim 1, characterized in that: The main circuit board has an exposed copper area on the through-hole side, which is attached to the camera mount.

10. The heat dissipation module for a camera according to claim 6, characterized in that: The camera mount and frame are designed as an integrated unit; or the camera mount and frame are designed as separate units, with the camera mount connected to the frame via a third fastener.

11. A 3D scanner, characterized in that: Includes the heat dissipation module of the camera as described in any one of claims 1-10.

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