Circuit board thermocuring and cooling circulation device

Abstract

The utility model discloses a circuit board thermocuring and cooling circulation device. The device comprises a workbench; the clamping mechanism is arranged on the workbench, and the two ends of the clamping mechanism can move close to or away from each other so as to be suitable for clamping a circuit board; the heating mechanism is rotationally arranged on the workbench and can rotate by 90 degrees on the workbench so as to be suitable for rotating to the top and the side face of the workbench; the cooling mechanism is rotationally arranged on the workbench, the cooling mechanism and the heating mechanism are coaxially arranged, and the cooling mechanism can rotate by 90 degrees on the workbench so as to be suitable for rotating to the top and the side face of the workbench; and the driving assembly is arranged at the bottom of the workbench and is in transmission connection with the heating mechanism and the cooling mechanism.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing technology, specifically to a circuit board thermosetting and cooling circulation device. Background Technology

[0002] Circuit board names include: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin circuit board, printed circuit board (copper etching technology), etc.

[0003] During the manufacturing process, circuit boards may be coated with adhesives, paints, powders, and other materials. These materials require specific temperature and time conditions to undergo physical or chemical changes to achieve a curing effect. After heating and curing, the circuit board and the materials on it reach high temperatures. If cooling is not performed, the circuit board may overheat and be damaged, or the performance of the electronic components on the circuit board may be affected.

[0004] Existing equipment is usually an assembly line operation. After heating and curing, the circuit board is placed on a conveyor belt and transported to the cooling station. This results in the equipment occupying too much space, and the heated circuit board is quite tall, which poses a risk of injury if it is handled manually. Utility Model Content

[0005] This utility model aims to at least partially solve one of the technical problems in related technologies. Therefore, one objective of this utility model is to provide a circuit board thermosetting and cooling circulation device, comprising:

[0006] Workbench;

[0007] A clamping mechanism is provided on the worktable, and the two ends of the clamping mechanism can move closer or further apart to be suitable for clamping the circuit board.

[0008] A heating mechanism is rotatably mounted on the worktable and can rotate 90° on the worktable to be adapted to rotate to the top and side of the worktable;

[0009] A cooling mechanism is rotatably mounted on the worktable and coaxially arranged with the heating mechanism. The cooling mechanism can rotate 90° on the worktable to be adapted to rotate to the top and side of the worktable.

[0010] A drive assembly is located at the bottom of the worktable and is connected in transmission to the heating mechanism and the cooling mechanism;

[0011] Two padding assemblies are respectively located at both ends of the bottom of the worktable. The two padding assemblies are elastically movable and correspond to the heating mechanism and the cooling mechanism, respectively.

[0012] Preferably, the clamping mechanism includes:

[0013] Two fixed seats are spaced apart on the worktable;

[0014] Two cylinders are respectively mounted on two fixed seats, and the two cylinders are arranged opposite to each other;

[0015] Two clamping plates are respectively connected to the transmission ends of the two cylinders, and the two clamping plates are arranged in an L-shape.

[0016] Preferably, the heating mechanism includes:

[0017] A first rotating shaft is rotatably disposed on one side of the worktable;

[0018] The second rotating shaft is rotatably located on the other side of the worktable;

[0019] The first gear is located at the end of the first rotating shaft;

[0020] A fixed shaft is fixedly disposed on the side of the first gear;

[0021] The first semi-circular ring has one end sleeved on the first end of the fixed shaft and the other end sleeved on the first end of the second rotating shaft;

[0022] A hot air blower is located in the middle of the first semi-circular ring.

[0023] Preferably, the cooling mechanism includes:

[0024] The second semi-circular ring has one end sleeved on the second end of the fixed shaft and the other end sleeved on the second end of the second rotating shaft;

[0025] A cold air blower is located in the middle of the second semi-circular ring.

[0026] Preferably, the driving component includes:

[0027] An electric motor is located at the bottom of the worktable;

[0028] The second gear is connected to the drive shaft of the motor and meshes with the first gear.

[0029] Preferably, the padding assembly includes:

[0030] A fixing frame is provided at the bottom of the workbench;

[0031] Multiple springs are equally spaced on the fixing frame;

[0032] A cushioning pad is disposed on one or more of the springs.

[0033] Preferably, the first semicircular ring and the second semicircular ring are placed at a 90° angle.

[0034] The above-described solution of this utility model has at least the following beneficial effects:

[0035] During operation, the circuit board to be heated and cured is placed between the clamping mechanisms. Then, both ends of the clamping mechanisms move closer to the circuit board and clamp it to prevent the circuit board from moving during heating and curing or cooling.

[0036] After the clamping mechanism clamps the circuit board, the heating mechanism begins to heat and cure the circuit board. Once the circuit board has been heated and cured, the drive assembly drives the cooling mechanism to rotate 90° so that the cooling mechanism is located on top of the circuit board, while the heating mechanism simultaneously rotates 90° to the side of the worktable. After the circuit board has cooled down, the operator can remove it.

[0037] The heating and cooling mechanisms are integrated on the same workbench, which reduces the footprint of the equipment and allows it to be cooled immediately after heating and curing, eliminating the need for manual removal and placement in a separate cooling device.

[0038] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0040] Figure 1 This is a schematic diagram of the circuit board thermosetting and cooling circulation device provided in this embodiment of the utility model;

[0041] Figure 2 yes Figure 1 A schematic diagram of the AA cross-sectional structure;

[0042] Figure 3 yes Figure 1 Enlarged view of part B.

[0043] Explanation of icon numbers:

[0044] 1. Worktable; 2. Clamping mechanism; 3. Heating mechanism; 4. Cooling mechanism; 5. Drive assembly; 6. Pad assembly;

[0045] 201. Fixing base; 202. Cylinder; 203. Clamping plate;

[0046] 301, First rotating shaft; 302, Second rotating shaft; 303, First gear; 304, Fixed shaft; 305, First semi-circular ring; 306, Hot air blower;

[0047] 401. Second semi-circular ring; 402. Air cooler;

[0048] 501. Motor; 502. Second gear;

[0049] 601. Fixture; 602. Spring; 603. Buffer pad.

[0050] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0051] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0052] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "circumferential", "radial", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0053] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0054] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0055] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0056] The circuit board thermosetting and cooling circulation device of this utility model embodiment is described in detail below with reference to the accompanying drawings.

[0057] Please see Figures 1-3 In this embodiment, the system includes: a worktable 1; a clamping mechanism 2, which is disposed on the worktable 1 and whose two ends can move closer to or further away from each other to clamp the circuit board; a heating mechanism 3, which is rotatably disposed on the worktable 1 and can rotate 90° on the worktable 1 to be suitable for rotating to the top and side of the worktable 1; a cooling mechanism 4, which is rotatably disposed on the worktable 1 and coaxially arranged with the heating mechanism 3, and can rotate 90° on the worktable 1 to be suitable for rotating to the top and side of the worktable 1; a driving assembly 5, which is disposed at the bottom of the worktable 1 and is connected to the heating mechanism 3 and the cooling mechanism 4; and two padding assemblies 6, which are respectively disposed at both ends of the bottom of the worktable 1, and are elastically movable, and correspond to the heating mechanism 3 and the cooling mechanism 4 respectively.

[0058] During operation, the circuit board to be heated and cured is placed between the clamping mechanisms 2, and then both ends of the clamping mechanisms 2 move closer to and clamp the circuit board towards the circuit board at the same time, so that the circuit board will not move during heating and curing or cooling.

[0059] After the clamping mechanism 2 clamps the circuit board, the heating mechanism 3 begins to heat and cure the circuit board. After the circuit board is heated and cured, the driving component 5 drives the cooling mechanism 4 to rotate 90° so that the cooling mechanism 4 is located on top of the circuit board, while the heating mechanism 3 rotates 90° to the side of the workbench 1. After the circuit board has cooled down, the staff can remove the circuit board.

[0060] The heating mechanism 3 and the cooling mechanism 4 are integrated on the same workbench 1 to make the equipment occupy a smaller area, and the equipment can be cooled immediately after heating and curing, without having to be manually removed and placed in another cooling device.

[0061] In this embodiment, the clamping mechanism 2 includes: two fixed seats 201, which are spaced apart on the workbench 1; two cylinders 202, which are respectively mounted on the two fixed seats 201 and are arranged opposite to each other; and two clamping plates 203, which are respectively connected to the transmission ends of the two cylinders 202 and are arranged in an L-shape. The circuit board that needs to be heated, cured and cooled is placed between the two clamping plates 203. Then, the two cylinders 202 simultaneously push the two clamping plates 203 to move towards the circuit board so that the two clamping plates 203 clamp the circuit board, so that the circuit board will not move during heating, curing and cooling. After cooling is completed, the two cylinders 202 drive the two clamping plates 203 to move and reset so that the operator can remove the circuit board.

[0062] In this embodiment, the heating mechanism 3 includes: a first rotating shaft 301, rotatably disposed on one side of the worktable 1; a second rotating shaft 302, rotatably disposed on the other side of the worktable 1; a first gear 303, disposed at the end of the first rotating shaft 301; a fixed shaft 304, fixedly disposed on the side of the first gear 303; and a first semicircular ring 305, one end of which is sleeved on the first end of the fixed shaft 304, and the other end of which is sleeved on the first end of the second rotating shaft 302. One end; hot air blower 306, which is located in the middle of the first semi-circular ring 305; drive assembly 5 is connected to the first gear 303. When drive assembly 5 drives the first gear 303 to rotate, the first gear 303 drives the fixed shaft 304 to rotate, and the first semi-circular ring 305 on the fixed shaft 304 also rotates, so that the hot air blower 306 rotates to the top of the circuit board or to the side of the workbench 1; when the hot air blower 306 rotates to the top of the workbench 1, it begins to heat and cure the circuit board.

[0063] In this embodiment, the cooling mechanism 4 includes: a second semi-circular ring 401, one end of which is sleeved on the second end of the fixed shaft 304, and the other end of which is sleeved on the second end of the second rotating shaft 302; a first semi-circular ring 305 is placed at a 90° angle to the second semi-circular ring 401; a cooler 402 is located in the middle of the second semi-circular ring 401; when the first semi-circular ring 305 rotates to the top of the worktable 1, the second semi-circular ring 401 is located on the side of the worktable 1; when the second semi-circular ring 401 rotates to the top of the worktable 1, the second semi-circular ring 401 is located on the side of the worktable 1; when the second semi-circular ring 401 rotates to the top of the worktable 1, the cooler 402 cools the circuit board.

[0064] In this embodiment, the drive assembly 5 includes: a motor 501, which is located at the bottom of the workbench 1; a second gear 502, which is connected to the drive shaft of the motor 501 and meshes with the first gear 303; when the first semi-circular ring 305 and the second semi-circular ring 401 need to be rotated, the motor 501 drives the second gear 502 to rotate, so that the second gear 502 meshes with the first gear 303, thereby causing the first gear 303 to drive the fixed shaft 304 to rotate, and the fixed shaft 304 to drive the first semi-circular ring 305 and the second semi-circular ring 401 to rotate.

[0065] In this embodiment, the padding assembly 6 includes: a fixed frame 601, which is disposed at the bottom of the workbench 1; multiple springs 602, which are equally spaced on the fixed frame 601; and a buffer pad 603, which is disposed on the multiple springs 602. When the hot air blower 306 or the cold air blower 402 rotates to the side of the workbench 1, the hot air blower 306 or the cold air blower 402 can abut against the corresponding buffer pads 603 on both sides, so that the hot air blower 306 or the cold air blower 402 has external support force, thereby extending the service life of the first gear 303.

[0066] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0067] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A circuit board thermosetting and cooling circulation device, characterized in that, include: Workbench; A clamping mechanism is provided on the worktable, and the two ends of the clamping mechanism can move closer or further apart to be suitable for clamping the circuit board. A heating mechanism is rotatably mounted on the worktable and can rotate 90° on the worktable to be adapted to rotate to the top and side of the worktable; A cooling mechanism is rotatably mounted on the worktable and coaxially arranged with the heating mechanism. The cooling mechanism can rotate 90° on the worktable to be adapted to rotate to the top and side of the worktable. A drive assembly is located at the bottom of the worktable and is connected in transmission to the heating mechanism and the cooling mechanism; Two padding assemblies are respectively located at both ends of the bottom of the worktable. The two padding assemblies are elastically movable and correspond to the heating mechanism and the cooling mechanism, respectively.

2. The circuit board thermosetting and cooling circulation device according to claim 1, characterized in that, The clamping mechanism includes: Two fixed seats are spaced apart on the worktable; Two cylinders are respectively mounted on two fixed seats, and the two cylinders are arranged opposite to each other; Two clamping plates are respectively connected to the transmission ends of the two cylinders, and the two clamping plates are arranged in an L-shape.

3. The circuit board thermosetting and cooling circulation device according to claim 1, characterized in that, The heating mechanism includes: A first rotating shaft is rotatably disposed on one side of the worktable; The second rotating shaft is rotatably disposed on the other side of the worktable; The first gear is located at the end of the first rotating shaft; A fixed shaft is fixedly disposed on the side of the first gear; The first semicircular ring has one end sleeved on the first end of the fixed shaft and the other end sleeved on the first end of the second rotating shaft; A hot air blower is located in the middle of the first semi-circular ring.

4. The circuit board thermosetting and cooling circulation device according to claim 3, characterized in that, The cooling mechanism includes: The second semi-circular ring has one end sleeved on the second end of the fixed shaft and the other end sleeved on the second end of the second rotating shaft; A cold air blower is located in the middle of the second semi-circular ring.

5. The circuit board thermosetting and cooling circulation device according to claim 3, characterized in that, The driving component includes: An electric motor is located at the bottom of the worktable; The second gear is connected to the drive shaft of the motor and meshes with the first gear.

6. The circuit board thermosetting and cooling cycle device according to claim 3, characterized in that, The padding assembly includes: A fixing frame is provided at the bottom of the workbench; Multiple springs are equally spaced on the fixing frame; A cushioning pad is disposed on one or more of the springs.

7. The circuit board thermosetting and cooling circulation device according to claim 4, characterized in that, The first semicircular ring and the second semicircular ring are placed at a 90° angle.

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