Semiconductor silicon epitaxial wafer resistivity testing device

Abstract

The utility model discloses a semiconductor silicon epitaxial wafer resistivity testing device, which relates to the field of semiconductor silicon epitaxial wafer resistivity testing and comprises a testing mounting table, an automatic testing mounting assembly is arranged above the testing mounting table, and an automatic feeding and discharging assembly is arranged on one side of the automatic testing mounting assembly. According to the semiconductor silicon epitaxial wafer resistivity testing device, the prior art is improved, in actual use, the semiconductor silicon epitaxial wafer resistivity can be automatically tested through the automatic testing installation assembly, the problem that a traditional testing method and device gradually expose a plurality of problems is solved, and the testing efficiency is improved. For example, the positions of probes need to be manually adjusted in the whole testing process, operation is tedious, and testing efficiency is low.

Description

Technical Field

[0001] This utility model relates to the field of resistivity testing of semiconductor silicon epitaxial wafers, and more specifically, to a resistivity testing device for semiconductor silicon epitaxial wafers. Background Technology

[0002] In the semiconductor industry, the resistivity of silicon epitaxial wafers is a critical parameter. It directly affects the performance and yield of subsequent devices. With the continuous advancement of semiconductor technology, the requirements for the accuracy and efficiency of silicon epitaxial wafer resistivity testing are becoming increasingly stringent.

[0003] Currently, the semiconductor industry has an increasing demand for resistivity testing of silicon epitaxial wafers. Traditional testing methods and devices are gradually revealing many problems, such as the need to manually adjust the probe position throughout the testing process, which is cumbersome and has low testing efficiency. Utility Model Content

[0004] In view of the problems in the related technologies, this utility model proposes a semiconductor silicon epitaxial wafer resistivity testing device to overcome the above-mentioned technical problems existing in the existing related technologies.

[0005] Therefore, the specific technical solution adopted by this utility model is as follows:

[0006] A resistivity testing device for semiconductor silicon epitaxial wafers includes a test mounting platform, an automatic test mounting assembly above the test mounting platform, an automatic feeding and discharging assembly on one side of the automatic test mounting assembly, and a material conveying assembly on one side of the automatic feeding and discharging assembly.

[0007] To achieve automated testing and installation, the automated testing and installation component includes a material inlet plate, which is symmetrically installed above the testing and installation platform. A baffle trigger plate is located on one side of the material inlet plate, and a trigger switch is installed inside the baffle trigger plate. A lifting electric actuator is connected above the baffle trigger plate, and a actuator mounting bracket is connected to the periphery of the lifting electric actuator. The actuator mounting bracket is connected to the testing and installation platform. A detection mounting bracket is located on one side of the actuator mounting bracket, and is connected to the testing and installation platform. A detection electric actuator is installed inside the detection mounting bracket, and the output end of the detection electric actuator is connected to a detection mounting plate. A detection probe is installed below the detection mounting plate.

[0008] Furthermore, a PLC controller is installed on one side of the test mounting platform.

[0009] Furthermore, the trigger switch, lifting electric actuator, and detection electric actuator are electrically connected to the PLC controller.

[0010] Furthermore, in order to achieve the function of automatic feeding and discharging, the automatic feeding and discharging component includes a feeding fixture, which is connected to the test mounting platform. The feeding fixture is equipped with multi-stage electric actuators, and the output end of the multi-stage electric actuators is connected to a push plate.

[0011] Furthermore, the multi-stage electric actuators are electrically connected to the PLC controller.

[0012] Furthermore, in order to achieve the function of material conveying, the material conveying component includes a material conveying mounting frame, inside which drive rollers are symmetrically and movably installed. One end of the drive roller is connected to a stepper motor, the housing of the stepper motor is connected to the material conveying mounting frame, and a drive belt is fitted around the drive roller.

[0013] Furthermore, the stepper motor is electrically connected to the PLC controller via a stepper driver.

[0014] The beneficial effects of this utility model are as follows:

[0015] (1) This utility model has made improvements to the existing technology. In actual use, the resistivity of semiconductor silicon epitaxial wafers can be automatically tested by the automatic test installation component, which solves the problems that traditional test methods and devices have gradually exposed, such as the need to manually adjust the probe position during the entire test process, which is cumbersome and has low test efficiency.

[0016] (2) In actual use, by setting a stepper motor, the stepper motor receives the PLC pulse signal through the stepper driver and drives the transmission roller to run at a speed of 0.5-2.0 r / min, thereby enabling the transmission belt to intermittently transport the epitaxial wafer. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the main structure of a semiconductor silicon epitaxial wafer resistivity testing device according to an embodiment of the present utility model;

[0019] Figure 2 This is a perspective view of a semiconductor silicon epitaxial wafer resistivity testing device according to an embodiment of the present utility model;

[0020] Figure 3 This is a schematic diagram of the structure of an automatic test mounting component in a semiconductor silicon epitaxial wafer resistivity testing device according to an embodiment of the present invention;

[0021] Figure 4 This is a schematic diagram of the automatic feeding and discharging assembly in a semiconductor silicon epitaxial wafer resistivity testing device according to an embodiment of the present invention.

[0022] In the picture:

[0023] 1. Test mounting platform; 2. Automatic test mounting assembly; 201. Material inlet plate; 202. Material stop trigger plate; 203. Trigger switch; 204. Lifting electric actuator; 205. Actuator fixing frame; 206. Detection probe; 207. Detection mounting frame; 208. Detection electric actuator; 209. Detection mounting plate; 3. Automatic feeding and discharging assembly; 301. Feed fixing frame; 302. Multi-stage electric actuator; 303. Push plate; 4. Material conveying assembly; 401. Material conveying mounting frame; 402. Transmission roller; 403. Stepper motor; 404. Transmission belt; 5. PLC controller. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] According to an embodiment of the present invention, a resistivity testing device for semiconductor silicon epitaxial wafers is provided, including a test mounting platform 1, an automatic test mounting component 2 above the test mounting platform 1, an automatic feeding and discharging component 3 on one side of the automatic test mounting component 2, and a material conveying component 4 on one side of the automatic feeding and discharging component 3.

[0026] like Figure 1-4 As shown, in the semiconductor silicon epitaxial wafer resistivity testing device according to an embodiment of the present invention, the automatic test mounting assembly 2 includes a material inlet plate 201, which is symmetrically mounted above the test mounting platform 1. A material stop trigger plate 202 is provided on one side of the material inlet plate 201, and a trigger switch 203 is installed inside the material stop trigger plate 202. A lifting electric push rod 204 is connected above the material stop trigger plate 202, and a push rod fixing frame 205 is connected around the lifting electric push rod 204. The push rod fixing frame 205 is connected to the test mounting platform 1. The test mounting platform 1 is connected to the test mounting platform 1. A test mounting bracket 207 is provided on one side of the push rod fixing bracket 205. The test mounting bracket 207 is connected to the test mounting platform 1. A test electric push rod 208 is installed inside the test mounting bracket 207. The output end of the test electric push rod 208 is connected to a test mounting plate 209. A test probe 206 is installed below the test mounting plate 209. A PLC controller 5 is installed on one side of the test mounting platform 1. The trigger switch 203, the lifting electric push rod 204 and the test electric push rod 208 are electrically connected to the PLC controller 5 respectively.

[0027] Through the above technical solution, the silicon epitaxial wafer is conveyed to the testing station via the material inlet plate 201, triggering the trigger switch 203 in the material stop trigger plate 202, which sends a position signal to the PLC controller 5. The PLC controller 5 drives the detection mounting plate 209 to move downward via the detection push rod 208, so that the detection probe 206 contacts the surface of the epitaxial wafer (probe spacing 1.0±0.01mm, conforming to the four-probe method standard). The PLC controller 5 controls the detection probe 206 to apply a constant current (adjustable from 1mA to 10mA), measures the voltage and calculates the resistivity (formula reference GB / T 6616-2009 standard), and then the PLC controller 5 transmits the test information to the external host computer.

[0028] like Figure 1-4 As shown, in the semiconductor silicon epitaxial wafer resistivity testing device according to the embodiment of the present utility model, the automatic feeding and discharging assembly 3 includes a feeding fixing frame 301, which is connected to the test mounting platform 1. The feeding fixing frame 301 is equipped with multi-stage electric push rods 302, and the output end of the multi-stage electric push rods 302 is connected to a push plate 303. The multi-stage electric push rods 302 are electrically connected to the PLC controller 5 respectively.

[0029] Through the above technical solution, by setting up a multi-stage electric push rod 302, the multi-stage electric push rod 302 receives instructions from the PLC controller 5, and the multi-stage electric push rod 302 drives the push plate 303 to push the epitaxial wafer into the test station. After the test is completed by the automatic test installation component 2, the PLC controller 5 controls the lifting electric push rod 204 to drive the stop trigger plate 202 to rise under the fixation of the push rod fixing frame 205. Then the multi-stage electric push rod 302 pushes out the tested epitaxial wafer.

[0030] like Figure 1-4 As shown, in the semiconductor silicon epitaxial wafer resistivity testing device according to an embodiment of the present invention, the material conveying component 4 includes a material conveying mounting frame 401. A transmission roller 402 is symmetrically and movably mounted inside the material conveying mounting frame 401. One end of the transmission roller 402 is connected to a stepper motor 403. The housing of the stepper motor 403 is connected to the material conveying mounting frame 401. A transmission belt 404 is fitted around the transmission roller 402. The stepper motor 403 is electrically connected to the PLC controller 5 through a stepper driver.

[0031] Through the above technical solution, by setting a stepper motor 403, the stepper motor 403 receives the PLC pulse signal through the stepper driver and drives the transmission roller 402 to run at a speed of 0.5-2.0r / min, thereby enabling the transmission belt 404 to drive the epitaxial wafer to be transported intermittently.

[0032] To facilitate understanding of the above-mentioned technical solutions of this utility model, the working principle or operation method of this utility model in actual process will be described in detail below.

[0033] In summary, using the above-described technical solution of this utility model, the silicon epitaxial wafer is conveyed to the testing station via the material inlet plate 201, triggering the trigger switch 203 within the material stop trigger plate 202, which sends a position signal to the PLC controller 5. The PLC controller 5 drives the detection mounting plate 209 downward via the detection push rod 208, causing the detection probe 206 to contact the surface of the epitaxial wafer (probe spacing 1.0±0.01mm, conforming to the four-probe method standard). The PLC controller 5 controls the detection probe 206 to apply a constant current (adjustable from 1mA to 10mA), measures the voltage, and calculates the resistivity (formula reference GB / T 6616-2009 standard). Afterward, the PLC controller 5 transmits the test information to an external host computer.

[0034] By setting up a multi-stage electric push rod 302, the multi-stage electric push rod 302 receives instructions from the PLC controller 5. The multi-stage electric push rod 302 drives the push plate 303 to push the epitaxial wafer into the test station. After the test is completed by the automatic test installation component 2, the PLC controller 5 controls the lifting electric push rod 204 to drive the stop trigger plate 202 to rise under the fixation of the push rod fixing frame 205. Then the multi-stage electric push rod 302 pushes out the tested epitaxial wafer.

[0035] By setting a stepper motor 403, the stepper motor 403 receives a PLC pulse signal through a stepper driver and drives the transmission roller 402 to run at a speed of 0.5-2.0 r / min, thereby causing the transmission belt 404 to drive the epitaxial wafer to be transported intermittently.

[0036] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A semiconductor silicon epitaxial wafer resistivity testing apparatus, characterized by, Including test installation platform (1), the automatic test installation assembly (2) is equipped above the test installation platform (1), one side of the automatic test installation assembly (2) is equipped with automatic feeding and discharging assembly (3), one side of the automatic feeding and discharging assembly (3) is equipped with material conveying assembly (4); The automatic test installation assembly (2) includes material entering plate (201), the material entering plate (201) is symmetrically installed above the test installation platform (1), one side of the material entering plate (201) is equipped with material blocking trigger plate (202), the trigger switch (203) is installed inside the material blocking trigger plate (202), the lifting electric push rod (204) is connected above the material blocking trigger plate (202), the push rod fixing frame (205) is connected outside the lifting electric push rod (204), the push rod fixing frame (205) is connected with the test installation platform (1), one side of the push rod fixing frame (205) is equipped with detection mounting bracket (207), the detection mounting bracket (207) is connected with the test installation platform (1), the detection electric push rod (208) is installed inside the detection mounting bracket (207), the detection mounting plate (209) is connected at the output end of the detection electric push rod (208), the detection probe (206) is installed below the detection mounting plate (209).

2. The apparatus for testing the resistivity of a semiconductor silicon epitaxial wafer of claim 1, wherein, One side of the test installation platform (1) is provided with PLC controller (5).

3. A semiconductor silicon epiresistor sheet resistivity testing apparatus as set forth in claim 2 wherein, The trigger switch (203), lifting electric push rod (204) and detection electric push rod (208) are electrically connected with the PLC controller (5) respectively.

4. The apparatus for testing the resistivity of a semiconductor silicon epitaxial sheet as claimed in claim 3, wherein The automatic feeding and discharging assembly (3) includes feeding fixing frame (301), the feeding fixing frame (301) is connected with the test installation platform (1), the multi-stage electric push rod (302) is installed inside the feeding fixing frame (301), the push plate (303) is connected at the output end of the multi-stage electric push rod (302).

5. A semiconductor silicon epiresistor sheet resistivity testing apparatus as claimed in claim 4, wherein, The multi-stage electric push rod (302) is electrically connected with the PLC controller (5) respectively.

6. A semiconductor silicon epitaxial wafer resistivity testing apparatus according to claim 5, wherein The material conveying assembly (4) includes material conveying mounting bracket (401), the transmission wheel roller (402) is movably installed inside the material conveying mounting bracket (401) symmetrically, one end of the transmission wheel roller (402) is connected with the step motor (403), the housing of the step motor (403) is connected with the material conveying mounting bracket (401), the transmission belt (404) is matched outside the transmission wheel roller (402).

7. A semiconductor silicon epiresistor sheet resistivity testing apparatus as claimed in claim 6, wherein, The step motor (403) is electrically connected with the PLC controller (5) through the step drive.

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