PCB pressing device

Abstract

The utility model relates to the technical field of PCB processing, in particular to a PCB pressing device which comprises a pressing bed and an air cylinder fixedly installed at the top of the pressing bed, the bottom of the air cylinder movably penetrates through the pressing bed and extends into the pressing bed, an upper pressing die is fixedly installed at the bottom of the air cylinder, a sliding rail is fixedly installed at the bottom of an inner cavity of the pressing bed, and a lower pressing die is fixedly installed at the bottom of the inner cavity of the pressing bed. A lower pressing die is slidably mounted on the surface of the sliding rail; the driving piece is arranged between the upper press-fit die and the lower press-fit die, the lower press-fit die can be driven to move in the vertical press-fit movement process of the upper press-fit die, workers can conveniently and safely carry out feeding and discharging work, the overall structure is simple, the use and maintenance cost is low in the actual use process, and the practicability is high. And the surface of the PCB can be uniformly cooled through the combined fan, so that the problems that the processing quality is influenced due to deformation and upwarp of the PCB caused by untimely cooling and the like can be avoided.

Description

Technical Field

[0001] This utility model relates to the field of PCB board processing technology, and specifically to a PCB board pressing device. Background Technology

[0002] PCB lamination refers to the process of heating and pressurizing a multilayer printed circuit board to solidify the insulating materials, such as resin materials, between the layers and firmly connect the circuits and holes of each layer together. This process usually includes lamination, heating, and cooling steps to ensure the structural stability and electrical performance of the circuit board. Because the PCB board needs to be heated and pressurized during the processing, it may be inconvenient to directly load and unload the PCB board in the lamination area to ensure safety during the loading process. Furthermore, if the PCB board is not cooled in time after lamination, the high temperature generated by the lamination heating may cause the PCB board to deform or warp.

[0003] In view of this, we propose a PCB board pressing device. Utility Model Content

[0004] In view of the above-mentioned shortcomings of the existing technology, the present invention provides a PCB board pressing device, which can effectively solve the problems that the existing technology is inconvenient to directly perform loading and unloading work in the pressing area, and the high temperature generated by pressing and heating may cause the PCB board to deform and warp.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] This utility model provides a PCB board pressing device, including a pressing bed and a cylinder fixedly installed on the top of the pressing bed. The bottom of the cylinder moves through the pressing bed and extends into the interior of the pressing bed, and an upper pressing mold is fixedly installed on the bottom of the cylinder.

[0007] A slide rail is fixedly installed at the bottom of the inner cavity of the pressing bed, and a lower pressing mold is slidably installed on the surface of the slide rail;

[0008] A combined fan is also fixedly installed at the bottom of the inner cavity of the pressing bed, and the combined fan is located above the lower pressing mold;

[0009] A driving component is provided between the upper and lower pressing molds, and the driving component is located inside the pressing bed.

[0010] Furthermore, the driving component includes side lugs fixedly installed on both sides of the upper pressing mold, and connecting rods are rotatably installed on the side of each set of side lugs away from the upper pressing mold.

[0011] Furthermore, each of the two sets of connecting rods has a slide bar rotatably mounted at the end away from the side lug block, and a sliding frame is slidably connected to the surface of each set of slide bars, with the bottom of each set of sliding frames fixedly installed at the bottom of the inner cavity of the pressing bed.

[0012] Furthermore, each of the two sets of slide bars is fixedly connected to a side fixing block on the side near the lower pressing mold, and a telescopic rod is fixedly installed on one side of each of the two sets of side fixing blocks.

[0013] Furthermore, baffles are fixedly installed at the ends of the two sets of telescopic rods away from the side fixing blocks, and the sides of the two sets of baffles that are close to each other are fixedly installed on the surface of the lower pressing mold.

[0014] Furthermore, springs are fixedly installed on the surfaces of both sets of telescopic rods, and the other ends of both sets of springs are fixedly installed on one side of the baffle.

[0015] The technical solution provided by this utility model has the following advantages compared with the known public technology:

[0016] This invention utilizes a driving component positioned between the upper and lower pressing molds. During the up-and-down movement of the upper pressing mold, the lower pressing mold moves accordingly. When the upper pressing mold moves upwards to reset, the lower pressing mold can move out of the pressing area, facilitating safe loading and unloading operations for workers. Conversely, when the upper pressing mold moves downwards for pressing, the lower pressing mold can move into the pressing area. The overall structure is simple, and the maintenance cost is relatively low in actual use. Furthermore, after the PCB board pressing is completed, when the lower pressing mold moves the PCB board out of the pressing area, a combined fan can evenly cool the PCB board surface, preventing deformation and warping caused by insufficient cooling, which could affect processing quality. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a first-view structural diagram of the present invention;

[0019] Figure 2 This is a partial cross-sectional structural diagram of the pressing bed of this utility model;

[0020] Figure 3 This is a partial structural diagram of the telescopic rod, spring, and related components of this utility model.

[0021] The labels in the diagram represent: 1. Pressing bed; 2. Cylinder; 3. Slide rail; 4. Lower pressing mold; 5. Sliding frame; 6. Slide bar; 7. Combined fan; 8. Upper pressing mold; 9. Side lug; 10. Connecting rod; 11. Side fixing block; 12. Baffle; 13. Telescopic rod; 14. Spring. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0023] The present invention will be further described below with reference to the embodiments.

[0024] A PCB board pressing device includes a pressing bed 1 and a cylinder 2 fixedly installed on the top of the pressing bed 1. The bottom of the cylinder 2 extends through the pressing bed 1 into the interior of the pressing bed 1. An upper pressing mold 8 is fixedly installed on the bottom of the cylinder 2. A slide rail 3 is fixedly installed on the bottom of the inner cavity of the pressing bed 1. A lower pressing mold 4 is slidably installed on the surface of the slide rail 3. A combined fan 7 is also fixedly installed on the bottom of the inner cavity of the pressing bed 1 and is located above the lower pressing mold 4. A driving component is provided between the upper pressing mold 8 and the lower pressing mold 4 and is located inside the pressing bed 1.

[0025] Specifically, the driving component includes side lugs 9 fixedly installed on both sides of the upper pressing mold 8, connecting rods 10 rotatably installed on the side of the two sets of side lugs 9 away from the upper pressing mold 8, slide bars 6 rotatably installed on the end of the two sets of connecting rods 10 away from the side lugs 9, sliding frames 5 slidably connected to the surface of the two sets of slide bars 6, and the bottom of the two sets of sliding frames 5 is fixedly installed at the bottom of the inner cavity of the pressing bed 1;

[0026] Specifically, the PCB board to be laminated is first placed into the lower lamination mold 4, which is slidably mounted on the surface of the slide rail 3. Then, the upper lamination mold 8 is moved downwards by the cylinder 2 fixedly mounted on the top of the lamination bed 1. Because the two sets of slide bars 6 are limited and guided by the sliding frame 5, the connecting rods 10 rotatably mounted on the two sets of side lugs 9 can rotate when the upper lamination mold 8 moves downwards, thereby pushing the slide bars 6 in the sliding frame 5 to move linearly. This can accurately move the lower lamination mold 4, with the PCB board placed on it, to below the upper lamination mold 8, thus accurately lamination the PCB board. The PCB is pressed together. Conversely, after pressing is completed, the cylinder 2 contracts, which moves the upper pressing mold 8 upward. The lower pressing mold 4 is then moved and reset via two sets of connecting rods 10 and other components. During the reset and movement, the PCB passes under the combined fan 7. The combined fan 7 can evenly blow air to cool the surface of the PCB after pressing, effectively cooling the PCB and preventing it from warping or deforming due to excessive temperature. After the PCB is completely moved out of the pressing area, the workers can safely carry out unloading and secondary loading operations.

[0027] Furthermore, each of the two sets of slide bars 6 is fixedly connected to a side fixing block 11 on the side near the lower pressing mold 4. Each of the two sets of side fixing blocks 11 is fixedly installed with a telescopic rod 13 on one side. Each of the two sets of telescopic rods 13 is fixedly installed with a baffle 12 on the end away from the side fixing block 11. The sides of the two sets of baffles 12 that are close to each other are fixedly installed on the surface of the lower pressing mold 4. Each of the two sets of telescopic rods 13 is fixedly installed with a spring 14 on the surface. The other end of each set of springs 14 is fixedly installed on one side of the baffle 12.

[0028] Specifically, when the two sets of connecting rods 10 drive the slide bar 6 to move, the telescopic rod 13 fixed between the side fixing block 11 and the baffle 12 can drive the lower pressing mold 4 to move. The slide rail 3 can accurately position the lower pressing mold 4 to prevent it from moving out of the pressing area. When the lower pressing mold 4 has completely moved into the pressing area, the upper pressing mold 8 is still moving downward. At this time, the connecting rod 10 drives the slide bar 6 to continue moving. At this time, the telescopic rod 13 retracts and compresses the spring 14. When the lower pressing mold 4 moves out of the pressing area, the upper pressing mold 8 rises. At this time, the slide bar 6 moves and the telescopic rod 13 extends. Through the elastic action of the spring 14, a relative pressure can be applied to the lower pressing mold 4, so that when the upper pressing mold 8 starts to move upward, the lower pressing mold 4 will not move immediately. When the upper pressing mold 8 continues to rise, after the telescopic distance of the telescopic rod 13 and the elastic distance of the spring 14 reach the corresponding limits, the slide bar 6 can drive the lower pressing mold 4 to move and reset.

[0029] The working principle of this utility model is as follows: First, the PCB board to be pressed can be placed in the lower pressing mold 4, which is slidably mounted on the surface of the slide rail 3. Then, the upper pressing mold 8 can be moved downward by the cylinder 2 fixedly mounted on the top of the pressing bed 1. Because the two sets of slide bars 6 are limited and guided by the sliding frame 5, the connecting rods 10 of the two sets of side lugs 9 can rotate when the upper pressing mold 8 moves downward, thereby pushing the slide bars 6 in the sliding frame 5 to move linearly. The lower pressing mold 4 can be moved by the telescopic rod 13 fixedly mounted between the side fixing block 11 and the baffle 12. The slide rail 3 can accurately position the lower pressing mold 4 to prevent it from moving out of the pressing area. When the lower pressing mold 4 has completely moved into the pressing area, the upper pressing mold 8 is still moving downward. At this time, the connecting rod 10 drives the slide bar 6 to continue moving. At this time, the telescopic rod 13 retracts and compresses the spring 14, thereby accurately pressing the PCB board. The pressing process is performed by retracting the cylinder 2, which moves the upper pressing mold 8 upward. As the upper pressing mold 8 rises, the slide bar 6 moves and the telescopic rod 13 extends. Through the elastic action of the spring 14, a relative pressure can be applied to the lower pressing mold 4, so that when the upper pressing mold 8 starts to move upward, the lower pressing mold 4 will not move immediately. When the upper pressing mold 8 continues to rise, and the telescopic distance of the telescopic rod 13 and the elastic distance of the spring 14 reach the corresponding limits, the slide bar 6 can drive the lower pressing mold 4 to move and reset. During the reset and movement, it can pass under the combined fan 7. The combined fan 7 can blow air evenly to dissipate heat on the surface of the PCB board after pressing, effectively cooling the PCB board and preventing it from warping or deforming due to excessive temperature. After the lower pressing mold 4 has completely moved out of the pressing area, the workers can safely carry out the unloading and secondary loading work.

[0030] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of this utility model.

Claims

1. A PCB board laminating device, characterized in that, include: A pressing bed (1) and a cylinder (2) fixedly installed on the top of the pressing bed (1). The bottom of the cylinder (2) moves through the pressing bed (1) and extends into the interior of the pressing bed (1). An upper pressing mold (8) is fixedly installed on the bottom of the cylinder (2). A slide rail (3) is fixedly installed at the bottom of the inner cavity of the pressing bed (1), and a lower pressing mold (4) is slidably installed on the surface of the slide rail (3); A combined fan (7) is also fixedly installed at the bottom of the inner cavity of the pressing bed (1), and the combined fan (7) is located above the lower pressing mold (4); A driving component is provided between the upper pressing mold (8) and the lower pressing mold (4), and the driving component is located inside the pressing bed (1).

2. The PCB board laminating device according to claim 1, characterized in that, The driving component includes side lugs (9) that are fixedly installed on both sides of the upper pressing mold (8), and connecting rods (10) are rotatably installed on the side of the two sets of side lugs (9) away from the upper pressing mold (8).

3. The PCB board laminating device according to claim 2, characterized in that, Both sets of connecting rods (10) have slide bars (6) rotatably installed at the ends away from the side lugs (9). The surfaces of both sets of slide bars (6) are slidably connected to sliding frames (5), and the bottoms of both sets of sliding frames (5) are fixedly installed at the bottom of the inner cavity of the pressing bed (1).

4. The PCB board laminating device according to claim 3, characterized in that, Both sets of slide bars (6) are fixedly connected to side fixing blocks (11) on the side near the lower pressing mold (4), and telescopic rods (13) are fixedly installed on one side of both sets of side fixing blocks (11).

5. A PCB board laminating device according to claim 4, characterized in that, Both sets of telescopic rods (13) have baffles (12) fixedly installed at the ends away from the side fixing blocks (11), and the sides of the two sets of baffles (12) that are close to each other are fixedly installed on the surface of the lower pressing mold (4).

6. The PCB board laminating device according to claim 5, characterized in that, Springs (14) are fixedly installed on the surface of both sets of telescopic rods (13), and the other end of each set of springs (14) is fixedly installed on one side of the baffle (12).

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