Flip chip sorting mechanism and equipment

By cooperating with the top part and BIN island of the flip chip sorting mechanism, the flipping and sorting of the chips is completed automatically, which solves the problem of manual flipping of flip products, realizes automated flipping, reduces costs and improves product quality.

CN223801018UActive Publication Date: 2026-01-16JIANGXI ZHAO CHI SEMICON CO LTD +1
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202423074984.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-12
Publication Date
2026-01-16
Estimated Expiration
2034-12-12

AI Technical Summary

Technical Problem

In current LED chip manufacturing, the sorting process for flip-chip products requires manual film casting, which increases labor costs, production costs, and pollution risks, and does not meet shipping requirements.

Method used

The flip chip sorting mechanism utilizes the cooperation of the ejector and the BIN island to automatically complete the flip film sorting of the chips. The ejector pin ejects the chip and moves the BIN island to drive the second blue film to attach to the chip, thereby realizing the automatic flipping of the chip orientation.

Benefits of technology

No manual casting is required, reducing labor costs, avoiding grain scratches and contamination, meeting shipping requirements, reducing production costs and improving product quality.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223801018U_ABST
    Figure CN223801018U_ABST
Patent Text Reader

Abstract

The utility model provides a flip chip sorting mechanism and flip chip sorting equipment. The flip chip sorting mechanism comprises an ejection part, the first blue film is arranged on one side of the ejection end of the ejection part, and a plurality of crystal grains are adhered to the first blue film; the BIN island is arranged on the side, away from the ejection part, of the first blue film, and a second blue film is arranged on the side, close to the first blue film, of the BIN island; wherein the ejection part is used for ejecting the crystal grains on the first blue film, and moving the BIN island to eject the second blue film and attach the crystal grains on the first blue film so as to attach the crystal grains on the first blue film to the second blue film. According to the utility model, the crystal grains on the first blue film are ejected out through the ejection part, and then the BIN island is moved to move the second blue film to the attached and adsorbed crystal grains, so that the inverted film sorting of the crystal grains is completed, manual inverted film is not needed, the labor cost is effectively reduced, and the crystal grains are prevented from being scratched and polluted.
Need to check novelty before this filing date? Find Prior Art

Description

TECHNICAL FIELD

[0001] The utility model relates to LED chip manufacturing technical field, especially a flip chip sorting mechanism and equipment. BACKGROUND

[0002] In the field of LED chip manufacturing, the wafer is sorted after the chip back section wafer is tested by the grain photoelectricity and appearance, the same type of grain is sorted on a blue film, and the delivery is pasted on the release paper. The sorting method now, the grain direction is consistent after sorting (the grain electrode surface faces up), and the light emitting surface is required to face up for the flip product, which does not meet the delivery requirements. Therefore, manual film turning is required, the grains sorted on the blue film are turned on a new blue film, and the release paper is pasted, which meets the requirement of the light emitting surface of the grain facing up and meets the delivery standard.

[0003] In the prior art, the grain direction is consistent after sorting and the grain electrode surface faces up, which does not meet the delivery requirement, manual film turning is required, the labor cost is increased, manual film turning exists film loss, the production cost is increased, additional blue film, release paper, acetone and other materials are used in the film turning operation, and the production cost is increased. There are risks such as pollution and scratching in the film turning process. UTILITY MODEL CONTENTS

[0004] Therefore, the utility model aims at providing a flip chip sorting mechanism and equipment to solve the above problems in the prior art.

[0005] In the first aspect, the utility model provides a flip chip sorting mechanism, which comprises:

[0006] an ejection part;

[0007] a first blue film arranged on one side of the ejection end of the ejection part, and a plurality of grains are adhered on the first blue film;

[0008] a BIN island arranged on one side of the first blue film away from the ejection part, and a second blue film is arranged on one side of the BIN island close to the first blue film;

[0009] The ejection part is used to eject the grains on the first blue film, the BIN island is moved to eject and adhere the second blue film on the grains on the first blue film, and the grains on the first blue film are adhered to the second blue film.

[0010] Compared with the prior art, the utility model has the advantages that the grains on the first blue film are ejected by the ejection part, then the BIN island is moved to move the second blue film to the adhered grains, the film turning and sorting of the grains are completed, manual film turning is not required, the labor cost is effectively reduced, and the grains are not scratched and polluted.

[0011] Further, the ejection part is an ejector pin.

[0012] Further, an end of the ejector pin away from the first blue film is connected with a driving cylinder, an output end of the driving cylinder is connected with the ejector pin, and the driving cylinder is used for driving the ejector pin to eject.

[0013] Further, an end of the ejector pin close to the driving cylinder is provided in a rectangular structure.

[0014] Further, an end of the ejector pin close to the driving cylinder is provided in a rectangular structure.

[0015] Further, an end of the ejector pin close to the driving cylinder is provided in a rectangular structure.

[0016] Further, an end of the ejector pin close to the driving cylinder is provided in a rectangular structure.

[0017] In a second aspect, the utility model provides a flip chip sorting equipment, including the flip chip sorting mechanism. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a structure schematic view of the flip chip sorting mechanism in the utility model embodiment.

[0019] Explanation of main element symbols:

[0020] 1, ejector pin; 11, driving cylinder;

[0021] 2, first blue film;

[0022] 3, second blue film;

[0023] 4, die;

[0024] 7, BIN island; 71, driving part.

[0025] The following specific embodiments will further illustrate the utility model in conjunction with the above drawings. Specific embodiments

[0026] In order to facilitate understanding of the utility model, the utility model will be described more fully below with reference to the relevant drawings. The drawings show several embodiments of the utility model. However, the utility model can be realized in many different forms, and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive.

[0027] It should be understood that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. In addition, it should be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can also be present. As used herein the terms "vertical", "horizontal", "left", "right" and the like are merely used for the purpose of illustration and are not intended to be limiting.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0029] Referring to Figure 1 , the first embodiment of the flip chip sorting mechanism of the present application is shown, which comprises an ejecting part 1, a first blue film 2 and a BIN island 7.

[0030] The first blue film 2 is arranged on one side of the ejecting end of the ejecting part 1, and a plurality of crystal grains 4 are adhered to the first blue film 2. The BIN island 7 is arranged on the side of the first blue film 2 away from the ejecting part 1, and a second blue film 3 is arranged on the side of the BIN island 7 close to the first blue film 2. The ejecting part 1 is used to eject the crystal grains 4 on the first blue film 2, and the BIN island 7 is moved to eject the second blue film 3 and adhere to the crystal grains 4 on the first blue film 2, so as to adhere the crystal grains 4 on the first blue film 2 to the second blue film 3.

[0031] It can be understood that the first blue film 2 is pierced by the ejecting part 1, and the crystal grains 4 on the first blue film 2 are ejected, so that the crystal grains 4 are no longer adhered to the first blue film 2. At this time, the BIN island 7 is moved to eject the second blue film 3, drive the second blue film 3 to move close to the first blue film 2, and make the second blue film 3 adhere to the ejected crystal grains 4, so as to complete the sorting of the crystal grains 4.

[0032] Specifically, in the present embodiment, the ejecting part 1 is a ejecting pin, and a driving cylinder 11 is connected to the end of the ejecting pin 1 away from the first blue film 2. The output end of the driving cylinder 11 is connected to the ejecting pin, and is used to eject the ejecting pin. The end of the ejecting pin close to the driving cylinder 11 is arranged in a rectangular structure. The ejecting pin is driven by the driving cylinder 11, so that the ejecting pin can pierce the first blue film 2 and eject the crystal grains 4 on the first blue film 2.

[0033] It should be noted that by setting one end of the ejector pin in a rectangular structure, the one end of the ejector pin can better bear the force of the driving cylinder 11, so that the driving cylinder 11 can better drive the ejector pin, and the ejector pin can eject the die 4 adhered to the first blue film 2.

[0034] Further, in the embodiment, the BIN island 7 is provided with a driving part 71 away from one side of the second blue film 3, and the output end of the driving part 71 is connected to one side of the BIN island 7 and used to drive the BIN island 7 to move, so that the BIN island 7 drives the second blue film 3 to adhere to the die 4.

[0035] It should be noted that in the embodiment, the driving part 71 is a cylinder, and in specific implementation, the driving part 71 drives the BIN island 7 to move, so that the BIN island 7 drives the second blue film 3 to move, so that the second blue film 3 can adhere to the die on the suction nozzle 5, and then the sorting of the die 4 is completed.

[0036] Further, the output end of the driving part 71 is connected to the middle of the side wall of the BIN island 7. It can be understood that the output end of the driving part 71 is connected to the middle of the side wall of the BIN island 7, so that the driving part 71 can stably drive the BIN island 7 to move, avoiding the problems of unstable movement and shaking, so that the BIN island 7 can stably drive the second blue film 3 to move.

[0037] In the embodiment, the second blue film 3 is attached to the side wall of the BIN island 7. It can be understood that the second blue film 3 is attached to the surface of the BIN island 7 in a flat manner. After the die 4 is ejected from the surface of the first blue film 2 by the ejecting part 1, the flat second blue film 3 can better adhere to the ejected die 4, so as to complete the sorting of the die.

[0038] It is worth mentioning that the direction of the crystal grain 4 after sorting is opposite to that before sorting, which meets the delivery requirement, eliminates the manual film reversing operation, reduces the labor cost, eliminates the film reversing loss existing in the manual film reversing, reduces the production cost, eliminates the use of additional blue film, release paper, acetone and other materials, reduces the production cost, and also reduces the pollution and scratches existing in the film reversing process. Therefore, the electrode surface of the crystal grain after sorting faces upward, meets the delivery requirement, eliminates the manual film reversing operation, and eliminates the film reversing loss after sorting. At the same time, the consumption of the blue film, release paper, acetone and other materials used in the film reversing operation is eliminated, the pollution and scratches in the film reversing process are avoided, and the product quality is ensured to a certain extent. While meeting the delivery requirement, the step of the manual film reversing is eliminated. Therefore, the consumption of the blue film, release paper, acetone and other materials used in the film reversing operation is eliminated, the contact with the labor is reduced, and the pollution risk and loss of the crystal grain after sorting are reduced. In addition, the action of the suction nozzle for grabbing the crystal grain is eliminated, so that the use of the suction nozzle material is eliminated, and the production cost is further reduced.

[0039] The utility model discloses still propose a flip chip sorting equipment, including above-mentioned flip chip sorting mechanism.

[0040] In conclusion, the flip chip sorting mechanism in the above-mentioned embodiment of the utility model, the crystal grain 4 on the first blue film 2 is ejected through the ejecting part 1, then the BIN island 7 is moved to make the BIN island 7 move the second blue film 3 to the crystal grain 4 adhered and adsorbed, so as to complete the film reversing sorting of the crystal grain 4, without manual film reversing, effectively reduce the labor cost, and avoid scratching the crystal grain and polluting the crystal grain.

[0041] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0042] The above-mentioned embodiments only express several implementation manners of the utility model, the description is more specific and detailed, but it cannot be understood as the limitation of the utility model patent scope. It should be pointed out that for ordinary skilled persons in the art, without departing from the concept of the utility model, a number of modifications and improvements can be made, which belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent should be subject to the appended claims.

Claims

1. A flip chip singulation mechanism, comprising: The device comprises: an ejection part; a first blue film arranged on one side of an ejection end of the ejection part, a plurality of crystal grains being adhered to the first blue film; a BIN island arranged on a side of the first blue film away from the ejection part, the BIN island being provided with a second blue film on a side close to the first blue film; wherein the ejection part is a ejector pin, an end of the ejector pin away from the first blue film is connected with a driving cylinder, an output end of the driving cylinder is connected with the ejector pin and is used for ejecting the ejector pin, and an end of the ejector pin close to the driving cylinder is provided in a rectangular structure; wherein the ejection part is used for ejecting the crystal grains on the first blue film, moving the BIN island to eject and adhere the second blue film to the crystal grains on the first blue film, and adhering the crystal grains on the first blue film to the second blue film.

2. The flip chip singulation mechanism of claim 1, wherein, a driving part is arranged on a side of the BIN island away from the second blue film, an output end of the driving part is connected with one side of the BIN island and is used for driving the BIN island to move, so that the BIN island drives the second blue film to adhere to the crystal grains.

3. The flip chip singulation mechanism of claim 2, wherein, The output end of the driving part is connected in a middle part of a side wall of the BIN island.

4. The flip chip singulation mechanism of claim 1, wherein, The second blue film is adhered to the side wall of the BIN island.

5. A flip chip singulation apparatus, characterized by, The device comprises the flip chip sorting mechanism according to any one of claims 1 to 4.