Wafer stress inspection equipment

Abstract

A mounting plate is fixedly connected to the top end of a base to form a light source chamber with the base, and a light source assembly is arranged on the mounting plate, so that the light source assembly can provide a light source for a wafer; the first side plate, the back plate, the second side plate, the top plate and the mounting plate jointly form an observation chamber for observing a wafer, so that only one side surface of the observation chamber is in an open state, the wafer enters and exits the observation chamber for stress inspection, the first side plate, the back plate, the second side plate and the top plate are used for shading, interference of an external light source on the wafer is reduced, and the wafer quality is improved. An operator can conveniently carry out stress inspection under the light source provided by the light source assembly, and the wafer stress inspection effect is improved; the top plate is provided with the observation assembly used for observing the wafer, and the included angle is formed between the top plate and the base, so that an operator can carry out stress inspection on the wafer in a comfortable posture, the operator can better carry out observation, and the wafer stress inspection effect is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of silicon carbide wafer material preparation, and more particularly to a wafer stress inspection device. BACKGROUND

[0002] Silicon carbide wafers will generate defects during growth and processing, therefore, the wafers need to be inspected after production to ensure wafer quality; at present, stress meters, X-ray diffractometers and the like are usually used to inspect the stress of the wafers, however, the above-mentioned devices are inconvenient for operators to inspect the stress of the wafers, resulting in poor stress inspection effect of the wafers.

[0003] To sum up, how to improve the convenience of wafer stress inspection to improve the wafer stress inspection effect is a problem to be solved by the technical personnel in the field at present. CONTENT OF THE INVENTION

[0004] Therefore, the purpose of the present application is to provide a wafer stress inspection device to improve the convenience of wafer stress inspection and improve the wafer stress inspection effect.

[0005] In order to achieve the above-mentioned purpose, the present application provides the following technical solutions:

[0006] A wafer stress inspection device, comprising: a base, a mounting plate, a first side plate, a second side plate, a back plate and a top plate; wherein the mounting plate is fixedly connected to the top end of the base, the mounting plate and the base form a light source chamber, the mounting plate is provided with a light source assembly, and the light source assembly is located in the light source chamber; the side surface of the mounting plate is sequentially fixedly connected with the first side plate, the back plate and the second side plate, the top ends of the first side plate, the back plate and the second side plate are fixedly connected with the top plate, the top plate, the first side plate, the back plate, the second side plate and the mounting plate form an observation chamber with only one side opening, and the observation chamber is used for observing the wafer; the top plate is provided with an observation assembly, and the top plate and the base have an included angle therebetween.

[0007] In some embodiments, the included angle between the top plate and the base is 20°-40°.

[0008] In some embodiments, the included angle between the top plate and the base is 30°.

[0009] In some embodiments, the mounting plate and the base have an included angle therebetween, and the mounting plate and the top plate are arranged in parallel.

[0010] In some embodiments, the mounting plate is provided with a first mounting hole;

[0011] The light source assembly comprises a panel lamp mounted on the bottom surface of the mounting plate, the lamp surface of the panel lamp is arranged in parallel with the bottom surface of the mounting plate, and there is a gap between the lamp surface of the panel lamp and the bottom surface of the mounting plate; and a first polarized light sheet movably connected to the inside of the first mounting hole.

[0012] In some embodiments, the inner ring of the first mounting hole is provided with a damping ring, and the first polarized light sheet is arranged in abutment with the damping ring.

[0013] In some embodiments, the panel lamp is clamped with the mounting plate.

[0014] In some embodiments, the top plate is provided with a second mounting hole.

[0015] The observation assembly comprises a shell clamped in the inside of the second mounting hole, an observation mirror rotationally connected to the inside of the shell, and a second polarized light sheet fixedly connected to the inside of the observation mirror.

[0016] In some embodiments, one of the shell and the observation mirror is provided with a sliding rail, and the other is provided with a sliding strip slidingly matched with the sliding rail, so that the observation mirror is rotationally matched with the shell.

[0017] In some embodiments, the second polarized light sheet is located at the bottom end of the lens of the observation mirror, and the second polarized light sheet is arranged in parallel with the lens of the observation mirror.

[0018] The wafer stress test device provided by the application forms a light source chamber by fixedly connecting the mounting plate to the top end of the base, the mounting plate is provided with a light source assembly, and the light source assembly is located in the light source chamber, so that the light source assembly can provide light source for wafer stress test; the side surface of the mounting plate is sequentially fixedly connected with a first side plate, a back plate and a second side plate, and the top ends of the first side plate, the back plate and the second side plate are fixedly connected with a top plate and form an observation chamber with the mounting plate for observing the wafer, so that only one side surface of the observation chamber is in an open state, the wafer can enter and exit the observation chamber through the open side surface for stress test, and the first side plate, the back plate, the second side plate and the top plate can block light, reducing the interference of external light source on the wafer, facilitating the operator to perform stress test under the light source provided by the light source assembly, and improving the effect of wafer stress test; the top plate is provided with an observation assembly for observing the wafer, the wafer in the observation chamber can be observed and tested through the observation assembly, and the top plate and the base have an included angle, so that the operator can perform wafer stress test in a comfortable posture, improve the convenience of wafer stress test, and make the operator better observe, and improve the effect of wafer stress test. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the accompanying drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced. Obviously, the accompanying drawings in the following description only only the embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor on the basis of the provided drawings.

[0020] Figure 1 The structural schematic diagram of the wafer stress inspection device provided by the embodiments of the present application is shown in the figure.

[0021] Figure 2 The structural schematic diagram of the light source assembly provided by the embodiments of the present application is shown in the figure.

[0022] Figure 3 The structural schematic diagram of the first polarized light sheet provided by the embodiments of the present application is shown in the figure.

[0023] Figure 4 The assembly schematic diagram of the light source assembly and the mounting plate provided by the embodiments of the present application is shown in the figure.

[0024] Figure 5 The structural schematic diagram of the observation assembly provided by the embodiments of the present application is shown in the figure.

[0025] Figure 6 The assembly schematic diagram of the observation assembly and the top plate provided by the embodiments of the present application is shown in the figure.

[0026] Explanation of reference signs:

[0027] 10-base, 11-mounting plate, 111-first mounting hole, 1110-damping ring, 12-first side plate, 13-second side plate, 14-back plate, 15-top plate, 151-second mounting hole;

[0028] 21-panel light, 22-first polarized light sheet;

[0029] 31-viewing mirror, 32-second polarized light sheet, 33-outer shell. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. The terminology used in the following embodiments is for the purpose of describing specific embodiments only and is not intended to be a limitation of this application. As used in the specification and appended claims of this application, the singular expressions "a," "an," "the," "the," "the," and "this" are intended to also include expressions such as "one or more," unless the context clearly indicates otherwise.

[0032] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0033] The "multiple" mentioned in the embodiments of this application refers to two or more. It should be noted that in the description of the embodiments of this application, terms such as "first" and "second" are used only for the purpose of distinguishing descriptions and should not be construed as indicating or implying relative importance, nor should they be construed as indicating or implying order.

[0034] The terms "parallel" and "perpendicular" used in this application refer to "basically parallel" and "basically perpendicular" in practical operation. "Basically parallel" can be understood as parallelism with a certain degree of error, and similarly, "basically perpendicular" can be understood as perpendicularity with a certain degree of error.

[0035] like Figure 1 As shown, the wafer stress testing equipment provided in this application embodiment includes a base 10, a mounting plate 11, a first side plate 12, a second side plate 13, a back plate 14, and a top plate 15. The mounting plate 11 is fixedly connected to the top of the base 10, forming a light source chamber between the mounting plate 11 and the base 10. A light source assembly is disposed on the mounting plate 11 and located within the light source chamber, enabling the light source assembly to provide light from the light source chamber to the wafer for stress testing.

[0036] The side of the mounting plate 11 is sequentially fixedly connected with the first side plate 12, the back plate 14 and the second side plate 13, and the top ends of the first side plate 12, the back plate 14 and the second side plate 13 are commonly fixedly connected with the top plate 15, so that the top plate 15, the first side plate 12, the back plate 14, the second side plate 13 and the mounting plate 11 commonly form an observation chamber for observing the wafer, and the observation chamber has only one side in an open state, so that the wafer can enter and exit the observation chamber through the open side for stress testing. In this way, the light is shielded through the first side plate 12, the back plate 14, the second side plate 13 and the top plate 15, the interference of external light sources on the wafer is reduced, the operator can perform stress testing under the light source provided by the light source assembly, and the effect of wafer stress testing is improved.

[0037] The observation assembly for observing the wafer is arranged on the top plate 15, so that the wafer in the observation chamber is observed and tested through the observation assembly, and the top plate 15 and the base 10 have an included angle, so that the operator can perform stress testing on the wafer in a more comfortable posture, the convenience of wafer stress testing is improved, the operator can better observe, and the effect of wafer stress testing is improved.

[0038] The wafer stress testing device provided by the embodiment of the application is composed of multiple panels, a light source assembly and an observation assembly, so that the overall size of the device is small, the weight is light, the movement and operation of the device are convenient, and the convenience of wafer stress testing is further improved.

[0039] It should be noted that in the case of needing to perform stress testing on the wafer, the operator can directly hold the wafer into the observation chamber, and adjust the wafer as needed, so as to observe and test the specified position of the wafer, and improve the effect of stress testing on the wafer.

[0040] In some embodiments, the included angle between the top plate 15 and the base 10 is 20°-40°, so as to adapt to the observation angle of the operator, and the operator can better observe.

[0041] For example, the included angle between the top plate 15 and the base 10 can be 30°, so as to further improve the comfort of the operator in performing stress testing on the wafer, and further improve the effect of wafer stress testing.

[0042] Since the top plate 15 and the base 10 have an included angle, in order to ensure the intensity of the light source provided by the light source assembly to the wafer, as shown in Figure 1 The mounting plate 11 and the base 10 also have an included angle, and the mounting plate 11 is arranged in parallel with the top plate 15, so that the light source of the light source assembly can be more directly provided to the wafer, the intensity of the light source provided by the light source assembly to the wafer is ensured, and the effect of wafer stress testing is further improved.

[0043] Exemplarily, the included angle between the mounting plate 11 and the bottom plate 10 is also 30°, so that the light source assembly can correspond to the observation assembly, further improving the convenience of the operator to perform stress inspection of the wafer.

[0044] As shown in Figures 1-4 , the mounting plate 11 is provided with a first mounting hole 111, and the light source assembly includes a panel lamp 21 and a first polarized light sheet 22.

[0045] The panel lamp 21 is mounted on the bottom surface of the mounting plate 11, and the lamp surface of the panel lamp 21 is arranged parallel to the bottom surface of the mounting plate 11, so that the light source of the panel lamp 21 can be directly provided to the wafer, and the lamp surface of the panel lamp 21 and the bottom surface of the mounting plate 11 have a gap; the first polarized light sheet 22 is movably connected to the inside of the first mounting hole 111, and the gap between the lamp surface of the panel lamp 21 and the mounting plate 11 provides a movement space for the first polarized light sheet 22, so that in the process of stress inspection of the wafer, after the panel lamp 21 provides the light source, the angle of the first polarized light sheet 22 can be adjusted to make the light source concentrate on the part of the wafer that needs to be observed, improving the effect of stress inspection of the wafer.

[0046] It should be noted that the panel lamp 21 includes its lamp panel, power supply, driver and other components, and it can be understood that the panel lamp 21 can operate normally, which will not be described here.

[0047] In order to facilitate the adjustment of the first polarized light sheet 22, as shown in Figure 4 , the inner circle of the first mounting hole 111 is provided with a damping ring 1110, and through the abutment of the first polarized light sheet 22 and the damping ring 1110, the first polarized light sheet 22 can be adjusted horizontally and vertically. Angle, and under the action of the damping ring 1110, the first polarized light sheet 22 can be fixed at a specified angle, so as to facilitate the first polarized light sheet 22 to filter and concentrate the light source of the panel lamp 21.

[0048] In some embodiments, the damping ring 1110 can be made of rubber, polyurethane or other materials that can provide damping force, and the embodiments of the present application do not limit this.

[0049] In some embodiments, the panel lamp 21 is connected with the mounting plate 11, so as to facilitate the disassembly and replacement of the panel lamp 21, so as to ensure the effect of the light source provided to the wafer.

[0050] As shown in Figure 1 , Figures 5-6 , the top plate 15 is provided with a second mounting hole 151, and the observation assembly includes an observation mirror 31, a second polarized light sheet 32 and a shell 33.

[0051] The shell 33 is clamped in the second mounting hole 151, the viewing mirror 31 is rotationally connected to the inside of the shell 33, and the second polarized light sheet 32 is fixedly connected to the inside of the viewing mirror 31, so that by rotating the viewing mirror 31, the second polarized light sheet 32 can be rotated, so that the second polarized light sheet 32 can correspond to the light source provided by the light source assembly through different polarized light parts on the circumference to improve the clarity of wafer observation by adjusting the second polarized light sheet 32, and further improve the effect of stress testing of the wafer.

[0052] It should be noted that the circumference of the polarized light sheet is distributed with different polarized light parts, which can be rotated by rotating the second polarized light sheet 32 to filter the light source of the light source assembly, and better observe the wafer, and more clearly observe the specified position of the wafer.

[0053] As shown in Figure 6 , the second polarized light sheet 32 is located at the bottom end of the lens of the viewing mirror 31, so that the wafer filtered by the second polarized light sheet 32 can be observed through the lens, and the second polarized light sheet 32 is arranged in parallel with the lens of the viewing mirror 31, so that the circumferential corresponding position of the second polarized light sheet 32 and the light source can be adjusted by rotating the viewing mirror 31.

[0054] In order to realize the rotation cooperation of the viewing mirror 31 and the shell 33, one of the shell 33 and the viewing mirror 31 is provided with a sliding rail, and the other is provided with a sliding bar in sliding cooperation with the sliding rail, so that the viewing mirror 31 and the shell 33 are rotationally cooperated.

[0055] As shown in Figure 6 , the inner ring of the shell 33 is provided with a sliding rail, and the outer ring of the viewing mirror 31 is provided with a sliding bar in cooperation with the sliding rail, so that the viewing mirror 31 and the shell 33 are rotationally cooperated.

[0056] In the wafer stress testing device provided in the embodiment of the present application, first, the panel light 21 is turned on, and the first polarized light sheet 22 is adjusted to a preset angle, then the operator places the wafer into the observation chamber by hand, and performs stress testing on the wafer in the observation chamber through the viewing mirror 31, and in the observation process, the first polarized light sheet 22 and the second polarized light sheet 32 can be adjusted to enable the operator to observe the specified position of the wafer, thereby improving the effect of stress testing of the wafer.

[0057] The foregoing description of embodiments of the application has been presented for the purposes of illustration and description. It is not intended to be exhaustive or to limit the application to the precise form disclosed. Many modifications and variations are possible in light of the above teaching. It is intended that the scope of the application be limited not with this detailed description, but rather by the claims appended hereto.

Claims

1. A wafer stress inspection apparatus, characterized by, Include: Base (10), mounting plate (11), first side plate (12), second side plate (13), back plate (14) and top plate (15); Wherein, the mounting plate (11) is fixedly connected to the top end of the base (10), the mounting plate (11) and the base (10) form a light source chamber, the mounting plate (11) is provided with a light source assembly, and the light source assembly is located in the light source chamber; The side of the mounting plate (11) is sequentially fixedly connected with the first side plate (12), the back plate (14) and the second side plate (13), the top end of the first side plate (12), the back plate (14) and the second side plate (13) are fixedly connected with the top plate (15), the top plate (15), the first side plate (12), the back plate (14), the second side plate (13) and the mounting plate (11) form an observation chamber with only one side opening, and the observation chamber is used for observing wafer; The top plate (15) is provided with an observation assembly, and the top plate (15) and the base (10) have an included angle.

2. The wafer stress inspection apparatus of claim 1, wherein The included angle between the top plate (15) and the base (10) is 20°-40°.

3. The wafer stress inspection apparatus of claim 2, wherein The included angle between the top plate (15) and the base (10) is 30°.

4. The wafer stress inspection apparatus of claim 2, wherein The mounting plate (11) and the base (10) have an included angle, and the mounting plate (11) is arranged in parallel with the top plate (15).

5. The wafer stress inspection apparatus of claim 1, wherein The mounting plate (11) is provided with a first mounting hole (111); The light source assembly comprises: Panel light (21), the panel light (21) is installed on the bottom surface of the mounting plate (11), the lamp surface of the panel light (21) is arranged in parallel with the bottom surface of the mounting plate (11), and there is a gap between the lamp surface of the panel light (21) and the bottom surface of the mounting plate (11); First polarized light sheet (22), the first polarized light sheet (22) is movably connected in the inside of the first mounting hole (111).

6. The wafer stress inspection apparatus of claim 5, wherein The inner ring of the first mounting hole (111) is provided with a damping ring (1110), and the first polarized light sheet (22) is arranged in abutment with the damping ring (1110).

7. The wafer stress inspection apparatus of claim 5, wherein The panel light (21) is clamped with the mounting plate (11).

8. The wafer stress inspection apparatus of claim 1, wherein, The top plate (15) is provided with a second mounting hole (151); The observation assembly comprises: Housing (33), the housing (33) is clamped in the inside of the second mounting hole (151); Observation mirror (31), the observation mirror (31) is rotatably connected in the inside of the housing (33); Second polarized light sheet (32), the second polarized light sheet (32) is fixedly connected in the inside of the observation mirror (31).

9. The wafer stress inspection apparatus of claim 8, wherein, One of the housing (33) and the observation mirror (31) is provided with a sliding rail, and the other is provided with a sliding strip matched with the sliding rail, so that the observation mirror (31) and the housing (33) are rotatably matched.

10. The wafer stress inspection apparatus of claim 8, wherein, The second polarized light sheet (32) is located at the bottom end of the lens of the observation mirror (31), and the second polarized light sheet (32) is arranged in parallel with the lens of the observation mirror (31).

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