Liquid cooling heat dissipation device and system

Abstract

The utility model relates to a liquid cooling heat dissipation device and system. The liquid cooling heat dissipation device comprises a shell, a plurality of cooling fins, a liquid inlet pipe, a liquid outlet pipe, a cold source, a recovery part and a power part. In actual installation and use of the liquid cooling heat dissipation device and system, a plurality of positioning grooves are formed in the inner wall of the shell according to needs and an actual structure, a plurality of heat dissipation fins are inserted into the positioning grooves according to the positions of the positioning grooves and then are directly connected with the shell, one side of the shell is attached to electronic equipment, and the heat dissipation efficiency is greatly improved. A cooling agent of a cold source is introduced into the shell through the inlet hole, the cooling agent makes contact with the shell and the cooling fins, the cooling agent discharged from the outlet hole is recycled to the liquid return part through the liquid outlet pipe and used for providing power for flowing of the cooling agent, and due to the existence of the cooling fins, the contact area of the shell and the cooling agent is increased, so that the cooling speed is increased, and the service life of the cooling agent is prolonged. Under the condition that personalized customization of the cooling fins is achieved, the cooling fins are positioned and pre-fixed by arranging the positioning grooves, connection of the cooling fins and the shell is facilitated, and the manufacturing efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of refrigeration, in particular to a liquid cooling heat dissipation device and system. BACKGROUND

[0002] The heat dissipation of high-power chips is an important technical problem. The traditional solution is to use copper / aluminum heat sinks and fans for active heat dissipation. However, this heat dissipation method cannot meet the heat dissipation needs of high-power chips, and also has problems such as high noise and large size.

[0003] Liquid cooling heat sinks are components used for heat dissipation of electronic equipment. Compared with traditional heat dissipation fans, liquid cooling heat sinks use water or other non-volatile liquids to transfer heat, and have higher heat dissipation efficiency and lower noise level. Liquid cooling heat sinks are composed of high-thermal-conductivity metal materials and channels, and heat is carried away by a liquid cooling circulation system to cool the equipment. Liquid cooling heat sinks are mainly used in large computers, servers, high-performance gaming computers and other electronic equipment with high load requirements.

[0004] In the processing of conventional heat sink fins, irregular-shaped fins or fins made of special materials are installed on the heat sink by welding process. Although welding can achieve personalized customization of the fins, the processing precision is high during the welding process, and therefore it is difficult to control the positioning accuracy of the fins relative to the heat sink. Practical new type content

[0005] Therefore, it is necessary to provide a liquid cooling heat dissipation device and system to solve the problem that in the processing of conventional heat sink fins, irregular-shaped fins or fins made of special materials are installed on the heat sink by welding process. Although welding can achieve personalized customization of the fins, the processing precision is high during the welding process, and therefore it is difficult to control the positioning accuracy of the fins relative to the heat sink.

[0006] A liquid cooling heat dissipation device, comprising:

[0007] A housing enclosing a receiving cavity; a plurality of positioning grooves are formed on the inner surface of the housing;

[0008] A plurality of fins are arranged one by one in the plurality of positioning grooves, and one side of the outer surface of the housing is used to be attached to an electronic equipment;

[0009] A through-in hole and a through-out hole are formed on the housing and communicate with the receiving cavity, and the through-in hole and the through-out hole are used to pass in and out of the coolant, respectively.

[0010] The liquid cooling heat dissipation device has multiple positioning grooves on the inner wall of the shell according to needs and actual structures, and then multiple cooling fins are inserted into the positioning grooves and directly connected with the shell, which can be clamped, interference fitted or welded, one side of the shell is attached to the electronic device, the coolant of the cold source is introduced into the interior of the shell through the inlet hole, the coolant contacts the shell and the cooling fins, the coolant discharged through the outlet hole is recycled to the liquid return part through the outlet pipe, and the power part is connected to any part of the inlet pipe, the outlet pipe and the shell, and is used for providing power for the flow of the coolant. Due to the existence of the cooling fins, the contact area of the shell and the coolant is increased, and the cooling speed is accelerated. In the case of realizing personalized customization of the cooling fins, the cooling fins are positioned and pre-fixed by setting the positioning grooves, the connection of the cooling fins and the shell is facilitated, and the manufacturing efficiency is improved.

[0011] In an embodiment, the shell comprises a containing part and a cold plate;

[0012] The containing part is provided with a cooling groove, the cold plate covers the cooling groove and is connected with the containing part, and the bottom wall of the cooling groove is provided with the inlet hole and the outlet hole;

[0013] Multiple positioning grooves are arranged on the side wall of the cold plate close to the containing part, the cooling fins are partially located in the cooling groove, and one side of the cold plate away from the containing part is attached to the electronic device.

[0014] In an embodiment, along the first direction, two adjacent positioning grooves are staggered and uniformly spaced;

[0015] Along the second direction, two adjacent positioning grooves are uniformly arranged;

[0016] The first direction is perpendicular to the second direction, and the side wall of the cold plate close to the containing part is parallel to the first direction and the second direction.

[0017] In an embodiment, the bottom wall of the positioning groove is provided with a layout groove for placing solder to connect the cooling fin and the cold plate.

[0018] In an embodiment, multiple cooling fins arranged along the second direction form a folded fin.

[0019] In an embodiment, the cooling fin comprises a positioning fin, two cooling fins and two connecting fins.

[0020] Two ends of two adjacent cooling fins are connected with two ends of the positioning fin respectively, one end of the two cooling fins extending out of the positioning groove is connected with two connecting fins respectively, the extending directions of the two connecting fins are away from each other along the second direction, two adjacent cooling fins are connected through two connecting fins adjacent to each other, the positioning fin is matched with the positioning groove, and the positioning fin is connected with the cold plate.

[0021] In an embodiment, the liquid cooling heat dissipation device further comprises a first baffle and a second baffle.

[0022] The first baffle covers the inlet hole, the first baffle is provided with a first strip-shaped hole, and the first strip-shaped hole partially covers the inlet hole.

[0023] The second baffle covers the outlet hole, the second baffle is provided with a second strip-shaped hole, and the second strip-shaped hole partially covers the outlet hole.

[0024] In an embodiment, the bottom wall of the cooling groove is provided with a first liquid passage and a second liquid passage.

[0025] The first liquid passage is in communication with the inlet hole, the first baffle covers the first liquid passage, and the first strip-shaped hole is in communication with the first liquid passage.

[0026] The second liquid passage is in communication with the outlet hole, the second baffle covers the second liquid passage, and the second strip-shaped hole is in communication with the second liquid passage.

[0027] In an embodiment, the liquid cooling heat dissipation device further comprises a plurality of first fasteners, the cold plate is provided with a first fastening hole, the outer side wall of the accommodating portion is provided with a plurality of avoiding through grooves, the plurality of first fasteners, the plurality of first fastening holes and the plurality of avoiding through grooves are one-to-one corresponding, the first fastener is partially located in the avoiding through groove, and the first fastener is arranged in the first fastening hole for fixing the shell to the electronic equipment.

[0028] An embodiment of the present application further provides a liquid cooling heat dissipation system, which comprises a liquid inlet pipe, a liquid outlet pipe, a cold source, a liquid return portion, a power portion and the liquid cooling heat dissipation device.

[0029] One end of the liquid inlet pipe is in communication with the cold source, and the other end is in communication with the inlet hole.

[0030] One end of the liquid outlet pipe is in communication with the liquid return portion, and the other end is in communication with the outlet hole.

[0031] The power portion is connected to any one of the liquid inlet pipe, the liquid outlet pipe and the shell, and is used for providing power for the flow of the coolant.

[0032] In actual installation and use, the aforementioned liquid cooling system involves creating multiple positioning slots on the inner wall of the housing according to requirements and the actual structure. Multiple heat sinks are then inserted into these slots and directly connected to the housing via snap-fit, interference fit, or welding. One side of the housing is flush with the electronic equipment. Coolant from the cold source is introduced into the housing through an inlet hole, contacting both the housing and the heat sinks. Coolant exiting through the outlet hole is returned to the return section via an outlet pipe. The power unit is connected to the inlet pipe, outlet pipe, or housing at any point, providing power for the coolant flow. The presence of the heat sinks increases the contact area between the housing and the coolant, thereby accelerating the cooling rate. This application, in achieving customized heat sink design, uses positioning slots to position and pre-fix the heat sinks, facilitating the connection between the heat sinks and the housing and improving manufacturing efficiency. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of a liquid cooling heat dissipation device according to an embodiment.

[0034] Figure 2 for Figure 1 Exploded view.

[0035] Figure 3 for Figure 1 A sectional view.

[0036] Figure 4 This is an exploded view of the receiving portion, the first baffle, and the second baffle according to one embodiment.

[0037] Figure 5 This is a schematic diagram of a cold plate, a first baffle, and a second baffle according to one embodiment.

[0038] Figure 6 This is a schematic diagram of a cold plate and heat sink according to one embodiment.

[0039] Figure 7 for Figure 6 Enlarged view of point A in the middle.

[0040] Explanation of icon numbers:

[0041] 100 - Liquid cooling heat dissipation device;

[0042] 110 - Housing; 111 - Heat sink; 112 - Inlet hole; 113 - Outlet hole; 114 - Positioning plate; 115 - Cooling plate; 116 - Connecting plate;

[0043] 120 - Receiving section; 121 - Cooling tank; 122 - Clearance channel;

[0044] 130 - Cold-rolled steel plate; 131 - Positioning groove;

[0045] 140 - first baffle; 141 - first strip hole; 142 - first clamping groove; 143 - first liquid passage groove;

[0046] 150 - second baffle; 151 - second strip hole; 152 - second clamping groove; 153 - second liquid passage groove;

[0047] 160 - sealing ring; 161 - strip groove;

[0048] 170 - first fastener; 171 - second fastener;

[0049] 180 - first fastening hole; 181 - second fastening hole; 182 - third fastening hole;

[0050] OX - first direction; OY - second direction. DETAILED DESCRIPTION

[0051] In order to make the above objectives, features and advantages of the present application more apparent, the specific embodiments of the present application will be described in detail below with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, it will be apparent to one skilled in the art that the present application can be practiced in a variety of ways beyond those specifically disclosed in the present application, and that the present application can be practiced with modifications and alterations without departing from the spirit and scope of the present application, and therefore the present application is not limited to the specific embodiments disclosed below.

[0052] In the description of the present application, it should be understood that if these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0053] In addition, if these terms "first", "second" appear, these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, if the term "multiple" appears, the meaning of "multiple" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0054] In the present application, unless specifically defined and limited otherwise, if there is a description of "mounting", "connecting", "connecting", "fixing" and the like, these terms should be broadly understood. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0055] In the present application, unless specifically defined and limited otherwise, if there is a description of "mounting", "connecting", "connecting", "fixing" and the like, these terms should be broadly understood. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0056] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on another element or there can be a middle element. If an element is considered to be "connected" to another element, it can be directly connected to another element or there can be a middle element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the present application are for illustrative purposes only and are not the only embodiment.

[0057] Referring to Figure 1 , a structural schematic diagram of a liquid cooling heat dissipation device 100 in an embodiment of the present application is shown. The liquid cooling heat dissipation device 100 provided in the embodiment of the present application includes a shell 110 and a plurality of heat dissipation fins 111.

[0058] Referring to Figure 1 , Figure 2 and Figure 7 In the above liquid cooling heat dissipation device 100, the shell forms a containing cavity, the inner surface of the shell 110 is provided with a plurality of positioning grooves 131, and the plurality of heat dissipation fins 111 are correspondingly arranged in the plurality of positioning grooves 131. One side of the outer surface of the shell 110 is used to be attached to an electronic device, the shell 110 is provided with an inlet hole 112 and an outlet hole 113 which communicate with the containing cavity, and the inlet hole 112 and the outlet hole 113 are used for inlet and outlet of the coolant, respectively.

[0059] The liquid cooling heat dissipation device 100 described above is provided with a plurality of positioning grooves 131 on the inner wall of the shell 110 according to the actual structure and needs, and then the plurality of cooling fins 111 are inserted into the positioning grooves 131 according to the positions of the positioning grooves 131, and then the cooling fins 111 are directly connected with the shell 110, which can be clamped, can be interference fit, and can also be welded. One side of the shell 110 is attached to the electronic device, the coolant of the cold source is introduced into the inside of the shell 110 through the inlet hole 112, the coolant is in contact with the shell 110 and the cooling fins 111, the coolant discharged through the outlet hole 113 is recycled to the liquid return part through the outlet pipe. The power part is connected to any part of the inlet pipe, the outlet pipe and the shell 110, and is used to provide power for the flow of the coolant. Due to the existence of the cooling fins 111, the contact area between the shell 110 and the coolant is increased, and the cooling speed is accelerated. In the case of realizing the personalized customization of the cooling fins 111, the cooling fins 111 are positioned and pre-fixed by setting the positioning grooves 131, which facilitates the connection of the cooling fins 111 and the shell 110 and improves the manufacturing efficiency.

[0060] Specifically, the position of the inlet hole 112 is lower than that of the outlet hole 113, and the outlet hole 113 is higher than the height of all the cooling fins 111, so that the coolant introduced through the inlet hole 112 increases the filling amount, and the liquid level of the coolant is constantly raised until it is in contact with all the cooling fins 111 and is discharged from the inside of the shell 110 through the outlet hole 113, so that all the cooling fins 111 can be in contact with the coolant, and the heat dissipation efficiency is improved.

[0061] Referring to Figure 2 and Figure 3 In an embodiment, the shell 110 includes a containing part 120 and a cold plate 130. The containing part 120 is provided with a cooling groove 121, the cold plate 130 covers the cooling groove 121 and is connected with the containing part 120, and the bottom wall of the cooling groove 121 is provided with an inlet hole 112 and an outlet hole 113. A plurality of positioning grooves 131 are arranged on the side wall of the cold plate 130 close to the containing part 120, and the part of the cooling fins 111 extending out of the positioning grooves 131 is located in the cooling groove 121. The coolant enters the cooling groove 121 from the inlet hole 112, contacts the cold plate 130 and the cooling fins 111, and then is discharged from the cooling groove 121 through the outlet hole 113. The side of the cold plate 130 away from the containing part 120 is attached to the electronic device, so that the density of the cooling fins 111 can be set to increase the contact area between the cold plate 130 and the coolant, thereby improving the heat dissipation efficiency.

[0062] Referring to Figure 6 and Figure 7In an embodiment, along the first direction, two adjacent positioning grooves 131 are arranged staggered and uniformly spaced; along the second direction, two adjacent positioning grooves 131 are arranged uniformly; the first direction is perpendicular to the second direction, and the side wall of the cold plate 130 close to the accommodating portion 120 is parallel to the first direction and the second direction. Thus, the cooling liquid from the inlet hole 112 can be uniformly dispersed along the second direction and then flow along the first direction to the outlet hole 113. Since two adjacent positioning grooves 131 arranged along the first direction are arranged staggered and uniformly spaced, the fins 111 arranged along the first direction are also arranged staggered and uniformly spaced. Thus, the cooling liquid can contact more surfaces of the fins 111 and increase the length of the flow path during the flow to the outlet hole 113, and the time of the cooling liquid in the shell 110 is increased, so that the electronic device can be sufficiently cooled, and the cooling effect is improved.

[0063] In an embodiment, the bottom wall of the positioning groove 131 is provided with a layout groove (not shown in the figure) for placing solder to connect the fin 111 and the cold plate 130. In this embodiment, the solder can be placed in the layout groove first, then the fin 111 is inserted into the positioning groove 131 and contacts the solder, and then the temperature is increased to weld the fin 111 in the positioning groove 131 by the solder.

[0064] Preferably, the fin 111 is welded in the positioning groove 131 by medium-temperature brazing.

[0065] In an embodiment, a plurality of fins 111 arranged along the second direction form a folded fin.

[0066] Referring to Figure 7 Specifically, the fin 111 includes a positioning piece 114, two cooling pieces 115, and two connecting pieces 116. One end of each of the two adjacent cooling pieces 115 is connected to two ends of the positioning piece 114, and the other end of each of the two cooling pieces 115 extends out of the positioning groove 131 and is connected to the two connecting pieces 116, respectively. The extension directions of the two connecting pieces 116 are away from each other along the second direction. The two adjacent fins 111 are connected by the two connecting pieces 116 adjacent to each other. The positioning piece 114 is adapted to the positioning groove 131 and connected to the cold plate 130, thereby forming a folded fin. After a plurality of fins 111 arranged along the second direction form a folded fin, a plurality of folded fins arranged along the first direction are arranged staggered. Thus, when the cooling liquid flows from the inlet hole 112 to the outlet hole 113 and passes through the middle of the two cooling pieces 115 of a folded fin to the next fin 111, the cooling liquid is divided to the two sides by one cooling piece 115 of the next folded fin. The cooling effect of the cooling liquid on the plurality of fins 111 is improved, and the heat dissipation efficiency of the electronic device is improved, thereby effectively solving the heat dissipation problem of the high-power electronic device.

[0067] Referring to Figure 2and Figure 4 In an embodiment, the liquid cooling heat dissipation device 100 further comprises a first baffle 140 and a second baffle 150. The first baffle 140 covers the inlet hole 112, and the first baffle 140 is provided with a first strip-shaped hole 141 that partially covers the inlet hole 112. The second baffle 150 covers the outlet hole 113, and the second baffle 150 is provided with a second strip-shaped hole 151 that partially covers the outlet hole 113.

[0068] In this embodiment, the coolant first needs to flow through the first strip-shaped hole 141 after passing through the inlet hole 112, and then enters the cooling groove 121. After the coolant flows through the second strip-shaped hole 151, it can flow out of the strip-shaped groove 161 through the inlet hole 112, so that the width of the coolant flowing through is the length of the first strip-shaped hole 141 and the second strip-shaped hole 151, thereby increasing the area of the coolant flowing through and improving the heat dissipation efficiency.

[0069] Referring to Figure 2 and Figure 4 In an embodiment, the bottom wall of the cooling groove 121 is provided with a first clamping groove 142 and a second clamping groove 152. The first clamping groove 142 is in communication with the inlet hole 112, and the first baffle 140 is located in the first clamping groove 142 and fits with the first clamping groove 142. The second clamping groove 152 is in communication with the outlet hole 113, and the second baffle 150 is located in the second clamping groove 152 and fits with the second clamping groove 152, so that the first baffle 140 can be limited in the first clamping groove 142, and the second baffle 150 can be limited in the second clamping groove 152.

[0070] In an embodiment, the bottom wall of the cooling groove 121 is provided with a first liquid passage 143 and a second liquid passage 153. The first liquid passage 143 is in communication with the inlet hole 112, the first baffle 140 covers the first liquid passage 143, and the first strip-shaped hole 141 is in communication with the first liquid passage 143. The second liquid passage 153 is in communication with the outlet hole 113, the second baffle 150 covers the second liquid passage 153, and the second strip-shaped hole 151 is in communication with the second liquid passage 153. Preferably, referring to Figs. 1 and 2, the bottom wall of the first clamping groove 142 is provided with the first liquid passage 143, the first liquid passage 143 is in communication with the inlet hole 112, the first baffle 140 covers the first liquid passage 143, and the first strip-shaped hole 141 is in communication with the first liquid passage 143. The bottom wall of the second clamping groove 152 is provided with the second liquid passage 153, the second liquid passage 153 is in communication with the outlet hole 113, the second baffle 150 covers the second liquid passage 153, and the second strip-shaped hole 151 is in communication with the second liquid passage 153.

[0071] In this embodiment, the coolant first enters the first liquid passage 143 through the inlet hole 112. Since the first strip hole 141 is in communication with the first liquid passage 143, the coolant in the first liquid passage 143 is blocked by the first baffle 140 and must pass through the first strip hole 141 to enter the cooling groove 121. The coolant is blocked by the second baffle 150 during the process of flowing out of the cooling groove 121 and must pass through the second strip hole 151 to enter the second liquid passage 153. Finally, the coolant flows out of the strip groove 161 through the inlet hole 112, so that the width of the coolant flowing through is the length of the first strip hole 141 and the second strip hole 151, thereby increasing the area of the coolant flowing through and improving the heat dissipation efficiency.

[0072] Referring to Figure 2 and Figure 4 In an embodiment, the axes of the inlet hole 112 and the outlet hole 113 are arranged along a first direction OX. The first strip hole 141 and the second strip hole 151 both extend along a second direction OY. The first strip hole 141 and the second strip hole 151 are arranged along the first direction OX, and the first direction OX is perpendicular to the second direction OY.

[0073] In this embodiment, it is assumed that the first direction OX is the vertical direction and the second direction OY is the horizontal direction. The inlet hole 112 is lower than the outlet hole 113. The coolant first enters the first liquid passage 143 through the inlet hole 112. Since the first strip hole 141 is in communication with the first liquid passage 143, the coolant in the first liquid passage 143 is blocked by the first baffle 140 and must pass through the first strip hole 141 along the second direction OY to enter the cooling groove 121, thereby accelerating the formation of the horizontal liquid level and steadily rising upward until reaching the second baffle 150. The coolant is blocked by the second baffle 150 during the process of flowing out of the cooling groove 121 and must pass through the second strip hole 151 along the second direction OY to enter the second liquid passage 153. Finally, the coolant flows out of the second liquid passage 153 through the inlet hole 112, so that the width of the coolant flowing through is the length of the first strip hole 141 and the second strip hole 151, thereby increasing the area of the coolant flowing through and improving the heat dissipation efficiency.

[0074] Referring to Figures 3-5 Specifically, one end of the first baffle 140 away from the inlet hole 112 abuts against one end of the cooling fin 111 away from the cold plate 130, and one end of the second baffle 150 away from the outlet hole 113 abuts against one end of the cooling fin 111 away from the cold plate 130, thereby ensuring that the first baffle 140 is stably positioned in the first clamping groove 142 and the second baffle 150 is stably positioned in the second clamping groove 152.

[0075] Referring to Figure 4 and Figure 5In one embodiment, along the first direction OX, the width of the first baffle 140 along the second direction OY tapers in a direction close to the second baffle 150, and the cross section of the first liquid passage 143 is similar to the first baffle 140. Along the first direction OX, the width of the second baffle 150 along the second direction OY tapers in a direction close to the first baffle 140, and the cross section of the second liquid passage 153 is similar to the second baffle 150.

[0076] In this embodiment, since the width of the first baffle 140 along the second direction OY tapers in a direction close to the second baffle 150, and the cross section of the first liquid passage 143 is similar to the first baffle 140, the width of the first liquid passage 143 along the second direction OY tapers in a direction close to the second liquid passage 153, so that if the flow rate of the coolant is too fast after entering the first liquid passage 143 through the inlet hole 112, the coolant will accumulate in the first liquid passage 143, collide with the side wall of the first liquid passage 143 inclined to the first direction OX, and the flow rate will be offset, and the coolant will be stabilized by the side wall of the first liquid passage 143, so that the flow rate of the liquid entering the first slot hole 141 is more stable. Similarly, when too much coolant passes through the second slot hole 151 and enters the second liquid passage 153, it will accumulate in the second liquid passage 153, collide with the side wall of the second liquid passage 153 inclined to the first direction OX, and the flow rate will be offset, and the coolant will be stabilized by the side wall of the second liquid passage 153, so that the flow rate of the liquid flowing out of the outlet hole 113 is more stable.

[0077] Specifically, the inlet hole 112 is communicated with one end of the first liquid passage 143 along the first direction OX close to the second liquid passage 153, the first strip hole 141 is communicated with one end of the first liquid passage along the first direction OX away from the second liquid passage 153, the outlet hole 113 is communicated with one end of the second liquid passage 153 along the first direction OX close to the first liquid passage 143, and the second strip hole 151 is communicated with one end of the second liquid passage along the first direction OX away from the first liquid passage 143. If the first direction OX is a vertical direction, the second direction OY is a horizontal direction, and the inlet hole 112 is lower than the outlet hole 113, the coolant enters the first liquid passage 143 first after passing through the inlet hole 112, and the coolant in the first liquid passage 143 is blocked by the first baffle 140, the side wall of the first liquid passage 143 inclined to the first direction OX realizes the function of diffusing the coolant along the second direction OY, and the coolant must pass through the first strip hole 141 along the second direction OY to enter the cooling tank 121, thereby accelerating the formation of the horizontal liquid level, and the horizontal liquid level steadily rises until reaching the second baffle 150. The coolant is blocked by the second baffle 150 during flowing out of the cooling tank 121, and must flow through the second strip hole 151 along the second direction OY before entering the second liquid passage 153, and is gathered by the side wall of the first liquid passage 143 inclined to the first direction OX, so that the coolant flows out of the outlet hole 113, thereby making the width of the coolant flowing through the length of the first strip hole 141 and the second strip hole 151, so that the coolant can fully contact the heat dissipation fin 111, thereby improving the heat dissipation efficiency.

[0078] Specifically, the inlet hole 112 and the outlet hole 113 are circular, and the side wall connection of the first liquid passage 143, the second liquid passage 153, the first clamping groove 142 and the second clamping groove 152 is chamfered, so that the flow of the liquid is smoother, and the unstable turbulent flow of the liquid at the sharp corner is prevented.

[0079] Referring to Figure 2 and Figure 3 In an embodiment, the liquid cooling heat dissipation device 100 further comprises a sealing ring 160, the plane where the containing part 120 contacts the cold plate 130 is provided with a strip groove 161, the sealing ring 160 is partially located in the strip groove 161, and the sealing ring 160 is located between the bottom wall of the strip groove 161 and the cold plate 130, thereby realizing the sealing of the cooling tank 121 and preventing liquid leakage, and the sealing ring 160 is also positioned.

[0080] Referring to Figure 2 and Figure 5In an embodiment, the liquid cooling heat dissipation device 100 further comprises a plurality of first fasteners 170, the cold plate 130 is provided with a plurality of first fastening holes 180, the outer side wall of the accommodating portion 120 is provided with a plurality of avoiding through grooves 122, the plurality of first fasteners 170, the plurality of first fastening holes 180 and the plurality of avoiding through grooves 122 are one-to-one corresponding, the first fastener 170 is partially located in the avoiding through groove 122 and is arranged through the first fastening hole 180 for fixing the shell 110 to the electronic device.

[0081] Preferably, the bottom wall of the through groove is arc-shaped for avoiding the head of the first fastener 170 and facilitating the rotation fastening or loosening of the first fastener 170 by a tool.

[0082] Referring to Figure 2 and Figure 5 In particular, the liquid cooling heat dissipation device 100 further comprises a plurality of second fasteners 171, the accommodating portion 120 is provided with a plurality of second fastening holes 181 near one side of the cold plate 130, the cold plate 130 is provided with a plurality of third fastening holes 182 near one side of the accommodating portion 120, the plurality of second fastening holes 181 are uniformly arranged around the circumferential direction of the cooling groove 121, the plurality of second fasteners 171, the plurality of second fastening holes 181 and the plurality of third fastening holes 182 are one-to-one corresponding, the second fastener 171 is arranged through the second fastening hole 181 and the third fastening hole 182 for connecting the cold plate 130 and the accommodating portion 120.

[0083] An embodiment of the present application further provides a liquid cooling heat dissipation system, which comprises a liquid inlet pipe (not shown in the figure), a liquid outlet pipe (not shown in the figure), a cold source (not shown in the figure), a liquid return portion (not shown in the figure), a power portion (not shown in the figure) and the liquid cooling heat dissipation device 100. One end of the liquid inlet pipe is communicated with the cold source and the other end is communicated with the inlet hole 112. One end of the liquid outlet pipe is communicated with the liquid return portion and the other end is communicated with the outlet hole 113. The power portion is connected to any one of the liquid inlet pipe, the liquid outlet pipe and the shell 110 for providing power for the flow of the coolant.

[0084] In actual installation and use of the liquid cooling heat dissipation system, multiple positioning grooves 131 are opened on the inner wall of the shell 110 according to needs and actual structure, then multiple heat dissipation fins 111 are inserted into the positioning grooves 131 according to the positions of the positioning grooves 131, and then the heat dissipation fins 111 are directly connected with the shell 110, which can be clamped, can be interference fit, or can be welded. One side of the shell 110 is attached to the electronic device, the coolant of the cold source is introduced into the inside of the shell 110 through the inlet hole 112, the coolant contacts the shell 110 and the heat dissipation fins 111, and the coolant discharged through the outlet hole 113 is recycled to the liquid return part through the liquid outlet pipe. The power part is connected to any position of the liquid inlet pipe, the liquid outlet pipe and the shell 110, and is used to provide power for the flow of the coolant. Due to the presence of the heat dissipation fins 111, the contact area between the shell 110 and the coolant is increased, and the cooling speed is increased. In the case of realizing personalized customization of the heat dissipation fins 111, the heat dissipation fins 111 are positioned and pre-fixed by setting the positioning grooves 131, which facilitates the connection of the heat dissipation fins 111 and the shell 110 and improves the manufacturing efficiency.

[0085] Specifically, the power part can be a pump or a rotating blade that can make the liquid flow, as long as it can provide power for the flow of the coolant. The above-mentioned embodiments can be combined in any way. In order to make the description simple, all possible combinations of each technical feature in the above-mentioned embodiments are not described, but as long as the combination of these technical features does not exist contradictory, it should be considered as the scope of the present application.

[0086] The above-mentioned embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the patent scope of the application. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, several modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A liquid cooling heat sink, comprising: The liquid cooling heat dissipation device comprises: a shell, which encloses a receiving cavity; an inner surface of the shell is provided with a plurality of positioning grooves; a plurality of heat dissipation fins are correspondingly arranged in the plurality of positioning grooves, and one side of an outer surface of the shell is used to be attached to an electronic device; the shell is provided with an inlet hole and an outlet hole which are in communication with the receiving cavity, and the inlet hole and the outlet hole are respectively used to pass in and pass out a coolant.

2. The liquid cooling heat sink of claim 1, wherein, The shell comprises a receiving part and a cold plate; the receiving part is provided with a cooling groove, the cold plate covers the cooling groove and is connected with the receiving part, a bottom wall of the cooling groove is provided with the inlet hole and the outlet hole; a plurality of positioning grooves are arranged on a side wall of the cold plate close to the receiving part, the heat dissipation fins are partially located in the cooling groove, and one side of the cold plate away from the receiving part is attached to the electronic device.

3. The liquid cooling heat dissipation device according to claim 2, wherein, in a first direction, two adjacent positioning grooves are staggered and uniformly spaced apart; in a second direction, two adjacent positioning grooves are uniformly arranged; the first direction is perpendicular to the second direction, and the side wall of the cold plate close to the receiving part is parallel to the first direction and the second direction.

4. The liquid cooling heat sink of claim 2, wherein, A bottom wall of the positioning groove is provided with a layout groove for placing solder to connect the heat dissipation fin and the cold plate.

5. The liquid cooling heat sink of claim 3, wherein, A plurality of heat dissipation fins arranged along the second direction form a folded fin.

6. The liquid cooling heat sink of claim 5, wherein, The heat dissipation fin comprises a positioning fin, two cooling fins and two connecting fins; one end of two adjacent cooling fins is respectively connected with two ends of the positioning fin, one end of two cooling fins extending out of the positioning groove is respectively connected with two connecting fins, the extension directions of two connecting fins are away from each other along the second direction, two adjacent heat dissipation fins are connected through two connecting fins adjacent to each other, the positioning fin is matched with the positioning groove, and the positioning fin is connected with the cold plate.

7. The liquid cooling heat sink of claim 2, wherein, The liquid cooling heat dissipation device further comprises a first baffle and a second baffle; the first baffle covers the inlet hole, the first baffle is provided with a first slot, and the first slot partially covers the inlet hole; the second baffle covers the outlet hole, the second baffle is provided with a second slot, and the second slot partially covers the outlet hole.

8. The liquid cooling heat sink of claim 7, wherein, A bottom wall of the cooling groove is provided with a first liquid passage and a second liquid passage; the first liquid passage is in communication with the inlet hole, the first baffle covers the first liquid passage, the first slot is in communication with the first liquid passage; the second liquid passage is in communication with the outlet hole, the second baffle covers the second liquid passage, and the second slot is in communication with the second liquid passage.

9. The liquid cooling heat sink of claim 2, wherein, The liquid cooling heat dissipation device further comprises a plurality of first fasteners, the cold plate is provided with a first fastening hole, an outer side wall of the receiving part is provided with a plurality of avoiding through grooves, the plurality of first fasteners, the plurality of first fastening holes and the plurality of avoiding through grooves are one-to-one corresponding, the first fastener is partially located in the avoiding through groove, and the first fastener is arranged in the first fastening hole for fixing the shell to the electronic device.

10. A liquid cooling heat dissipation system, characterized in that, The liquid cooling heat dissipation system comprises an inlet pipe, an outlet pipe, a cold source, a liquid return part, a power part and the liquid cooling heat dissipation device of any one of claims 1-9. One end of the inlet pipe is communicated with the cold source and the other end is communicated with the inlet hole. One end of the outlet pipe is communicated with the liquid return part and the other end is communicated with the outlet hole. The power part is connected to any one of the inlet pipe, the outlet pipe and the shell for providing power for the flow of the coolant.

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