Packaging structure of switching power supply

Abstract

The utility model provides a switching power supply, which comprises a shell and a circuit board arranged in the shell, the shell comprises an upper cover and a base, the base is square and is provided with a heat dissipation boss, and the circuit board is limited and fixed through a stud arranged on the base. According to the utility model, the upper cover base which is simply opened is matched with the glue filling plug auxiliary structural member, so that a glue filling process is realized. According to the utility model, the encapsulation of the shell is realized with the fewest structural members, a better heat dissipation condition is provided for the power device on the circuit board, meanwhile, the glue pouring part of the circuit board can achieve solid insulation, the working reliability of a product is improved, and the circuit board can adapt to more severe environmental conditions.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of switching power supply, especially relates to a switching power supply's packaging structure of glue can be filled. BACKGROUND

[0002] With switching power supply widely used in various fields of life such as railway, rail transit etc. Especially in the use scene of harsh environment and higher reliability requirement, usually make the power supply into a module, the module is filled with glue after completing debugging, only the input, output pin is drawn for user use. Such setting requires that the power supply radiates heat well, can be used for a long time in harsh environment. Usually, the power module power device is attached to the reverse side of the circuit board, and the power device is contacted with the base to realize heat dissipation by increasing ceramic sheet or heat pad. However, the heat dissipation effect of these heat dissipation modes in the prior art is poor, and the assembly is time-consuming. SUMMARY

[0003] Therefore, the utility model aims at providing a switching power supply's packaging structure, which has good heat dissipation performance, low assembly time, can adapt to relatively harsh working environment conditions, and can support the power shell structure filled with glue.

[0004] To solve the above technical problems, the technical scheme provided by the utility model is as follows:

[0005] A switching power supply's packaging structure is suitable for the switching power supply of the circuit board with large power devices, which comprises a square shell and a circuit board arranged in the shell, the shell comprises an upper cover covering the circuit board from the pin face and a base assembled on the other side of the circuit board, the base is made of aluminum alloy, the circuit board has magnetic devices and a plurality of power devices, and the plurality of power devices on the circuit board form a sheet-shaped area in a concentrated layout manner. The inner surface of the base is provided with a heat dissipation boss at the position corresponding to the sheet-shaped area on the circuit board, so that when the base is assembled on the circuit board, the inner surface of the base abuts against the surface of the magnetic device, and the heat dissipation boss of the base abuts against the top of the power device of the sheet-shaped area.

[0006] Further, the heat dissipation boss on the base is in the shape of "convex" character, which is the shape of two "convex" characters connected horizontally.

[0007] Further, the heat dissipation boss of the base has two, one heat dissipation boss is square, and the other heat dissipation boss is in the shape of two "convex" characters connected horizontally.

[0008] Further, the upper cover is provided with a glue pouring hole, and the circuit board is provided with a glue passing hole corresponding to the glue pouring hole of the upper cover, so that a glue pouring channel is formed in the packaging cavity of the circuit board surrounded by the upper cover and the base and connected with the front and back spaces of the circuit board, so that the glue can flow in the whole packaging cavity when the switching power supply is glued and packaged.

[0009] Further, the upper cover is provided with a glue pouring hole, and the circuit board is provided with a glue passing hole corresponding to the glue pouring hole of the upper cover, so that a glue pouring channel is formed in the packaging cavity of the circuit board surrounded by the upper cover and the base and connected with the front and back spaces of the circuit board, so that the glue can flow in the whole packaging cavity when the switching power supply is glued and packaged.

[0010] Further, when the glue passing hole on the circuit board is arranged along the edge of the circuit board, the glue passing hole is in the shape of a U-shaped opening outwardly formed by cutting off the edge of the circuit board.

[0011] Further, the base is provided with a limiting groove on each side, and the upper cover is provided with a boss at a position corresponding to the limiting groove of the base.

[0012] Further, the base is provided with a step on each side, and the opening edge of the upper cover is buckled on the step of the base.

[0013] Further, the upper cover, the circuit board and the base are fixedly connected in a threaded manner through a stud passing through stud hole seats of the upper cover, the circuit board and the base.

[0014] The utility model also provides a switching power supply, be applicable to the switching power supply of the circuit board with the power device of relatively large heat output, including shell and the circuit board in the shell inside, the shell includes base, installs upper cover in base upper, the base is square, includes the positioning stud of fixed circuit board, provides the heat dissipation boss of power device heat dissipation, provides the limiting groove of upper cover cover body stable connection.

[0015] Further, the base is made of aluminum alloy, and a plurality of heat dissipation bosses are arranged above the base body.

[0016] Further, the upper cover opening edge is provided with a boss, the base is provided with a limiting groove on each side, and the limiting groove on each side of the base is matched with the boss of the upper cover for use, so as to provide the limiting and fixing effects of the shell and make the product assembly joint surface flat.

[0017] Compared with the prior art, the packaging structure of the switching power supply has the following beneficial effects:

[0018] 1. The switching power supply shell is sealed and assembled into a closed cavity by the upper cover and the base, so that the purpose of glue pouring is achieved conveniently, and the complex assembly process of multiple structural members is reduced.

[0019] 2. The utility model discloses a switch power supply base is with the heat dissipation boss of power device heat dissipation on the circuit board, and the heat conductivity coefficient of metal aluminum alloy material is higher than that of ceramic sheet and heat conduction pad, and the heat dissipation effect is good, and the product reliability is increased.

[0020] 3. The base is provided with a heat dissipation boss and stud for fixing the circuit board, and the number of assembly parts is small, the assembly process is simple, and the manufacturing cost is low. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is the explosion map of the packaging structure of the utility model discloses switch power supply,

[0022] Figure 2 It is the finished product perspective drawing of the packaging structure of the utility model discloses switch power supply.

[0023] In the above drawing, the reference signs in the drawing are explained as follows:

[0024] Upper cover 10, glue pouring hole 11, boss 12, base 20, heat dissipation boss 21, heat dissipation boss 25, stud hole seat 22, recess 23, step 24, circuit board 30, pin terminal 31, stud via 32, magnetic device 33, power device 34, glue pouring port 35, glue pouring plug 40. DETAILED DESCRIPTION

[0025] Please refer to Figure 1 And Figure 2 , Figure 1 It is the explosion map of the packaging structure of the utility model discloses switch power supply, Figure 2 It is the finished product perspective drawing of the packaging structure of the utility model discloses switch power supply, a kind of packaging structure of switch power supply, it is applicable to the switch power supply of circuit board with the power device of relatively large heat output, including shell and the circuit board 30 being located in the shell interior, shell includes from pin face cover on the circuit board upper cover 10 and the base 20 of assembly in the other side of circuit board, base 20 is aluminum alloy material, and circuit board 30 has magnetic device 33 and several power devices 34, and several power devices 34 on circuit board 30 form sheet area in the way of centralized layout;The inner surface of base 20 is provided with heat dissipation boss 21 at the position corresponding to the sheet area on circuit board, so that when base 20 is assembled on circuit board 30, the inner surface of base 20 is against the surface of magnetic device 33, and the heat dissipation boss 21 of base is against the top of power device 34 of sheet area.

[0026] Preferably, the heat dissipation bosses 21 on the base are in the shape of a "convex" character, which is formed by horizontally connecting two "convex" characters. There can be 2 heat dissipation bosses on the base. One heat dissipation boss 25 is square, and the other heat dissipation boss 21 is in the shape formed by horizontally connecting two "convex" characters. There is a glue injection hole 11 on the upper cover 10, and a glue passing port 35 is provided at the position corresponding to the glue injection hole on the upper cover on the circuit board 30, so as to form a glue injection channel connecting the front and back spaces of the circuit board at the edge position in the encapsulation cavity of the circuit board surrounded by the upper cover 10 and the base 20, so that the glue can flow in the entire encapsulation cavity when the switching power supply is encapsulated with glue. There is a glue injection hole 11 on the upper cover 10, and a glue passing port 35 is provided on the board surface of the circuit board that does not cover electronic devices, so as to flexibly form a glue injection channel connecting the front and back spaces of the circuit board in the encapsulation cavity of the circuit board surrounded by the upper cover 10 and the base 20, so that the glue can flow in the entire encapsulation cavity when the switching power supply is encapsulated with glue. When the glue passing port 35 on the circuit board is arranged along the edge of the circuit board, its shape is a U shape with an opening facing outwards formed by breaking the edge of the circuit board. There are limit grooves 23 on the four sides of the base 20, and there are bosses 12 at the position of the opening edge of the upper cover 10 corresponding to the limit grooves 23 of the base. There are steps 24 recessed on the four sides of the base, and the opening edge of the upper cover 10 is buckled on the steps 24 of the base. The upper cover 10, the circuit board 30 and the base 20 are fixedly connected by screwing through the stud holes of the upper cover 10, the circuit board 30 and the stud hole seats 22 of the base.

[0027] The utility model provides a switching power supply, which includes a housing and a circuit board 30 arranged inside the housing. The housing includes an upper cover 10 and a base 20. The base 20 is square and has heat dissipation bosses 21, 25, and the circuit board 30 is limited and fixed through the stud hole seats 22 provided on the base 20. The utility model realizes the glue injection process through the cooperation of the upper cover and the base with simple mold opening and the glue injection plug auxiliary structure. The utility model realizes the encapsulation of the housing with the fewest structural parts, provides better heat dissipation conditions for the power devices on the circuit board, and at the same time makes the glue injection part of the circuit board solidly insulated, improves the working reliability of the product, and can adapt to more severe environmental conditions.

[0028] Specifically, a switching power supply includes a housing and a circuit board 30 arranged inside the housing. The housing includes an upper cover 10 and a base 20. The upper cover 10 and the base 20 are assembled into a closed cavity through a sealing glue. The pin terminals of the circuit board 30 are led out from both ends of this closed cavity.

[0029] The base 20 is square, and has heat dissipation bosses 21, 25, grooves 23 at the four side positions and riveting stud hole seats 22 at the four corner positions. The circuit board 30 is pre-positioned for assembly through the stud hole seats 22 at the four corner positions of the base. The heat dissipation bosses 21, 25 on the base 20 are aligned with and in close contact with the power devices on the back of the circuit board, which is convenient for heat dissipation.

[0030] The base 20 is provided with steps 24 on four sides, facilitating the sealing of sealant, and preventing the upper cover 10 from being assembled out of position by the pin terminals 31 on the circuit board 30. The base 20 is provided with grooves 23 to effectively limit the upper cover 10, preventing the appearance from being poor due to assembly errors.

[0031] The base 20 is made of aluminum alloy.

[0032] The assembly process of the switch power supply is as follows:

[0033] The circuit board 30 is assembled and positioned by the stud hole seats 22 at the four corner positions of the base, and the heat dissipation boss on the base 20 is aligned with and in close contact with the power device on the back of the circuit board.

[0034] The sealant is applied on the steps 24 on the four sides of the base 20 with the circuit board 30 assembled.

[0035] The upper cover 10 is assembled on the base 20 with the circuit board 30 assembled, the upper cover 10 is prevented from being assembled out of position by the pin terminals 31 on the circuit board 30, and finally the assembly is completed by assembling and filling the glue plug 40, as shown in the finished product perspective view of the switch power supply. Figure 2

[0036] The packaging structure of the switch power supply realizes the glue filling process by simple mold opening of the upper cover and the base structure, realizes the glue filling of the shell at the lowest structure opening cost, provides better heat dissipation conditions for the power device on the circuit board, and at the same time makes the glue filling part of the circuit board solid insulation, improves the reliability of product work, and can adapt to more severe environmental conditions.

[0037] The above examples are only used to help understand the method and core idea of the utility model, and for ordinary skilled persons in the technical field, other equivalent application schemes and several improvements and modifications of the utility model can be naturally thought of through the above description and examples without departing from the principle of the utility model, and all fall within the protection scope of the claims of the utility model.​

Claims

1. A packaging structure of a switching power supply, which is suitable for a switching power supply with a circuit board having a large amount of heat generating power devices, comprising a square shell and a circuit board arranged in the shell, the shell comprising an upper cover covering the circuit board from a pin mask and a base assembled on the other side of the circuit board, the base being made of aluminum alloy, and the circuit board having magnetic devices and a plurality of power devices, characterized in that: the plurality of power devices on the circuit board are arranged in a concentrated layout to form a sheet-shaped area; the inner surface of the base is provided with a heat dissipation boss at the position corresponding to the sheet-shaped area on the circuit board, so that when the base is assembled on the circuit board, the inner surface of the base abuts against the surface of the magnetic devices, and the heat dissipation boss of the base abuts against the top of the power devices in the sheet-shaped area. The heat dissipation boss on the base is in the shape of a "convex" character, which is formed by connecting two "convex" characters horizontally.

2. The packaging structure of a switching power supply according to claim 1, wherein: The heat dissipation boss of the base has two, one is square, and the other is in the shape of two "convex" characters connected horizontally.

3. The package structure of a switching power supply according to claim 1, wherein: The upper cover is provided with a glue pouring hole, and the circuit board is provided with a glue passing hole at the position corresponding to the glue pouring hole of the upper cover, so as to form a glue pouring channel connecting the front and back spaces of the circuit board in the packaging cavity of the circuit board surrounded by the upper cover and the base, so that the glue can flow in the entire packaging cavity when the switching power supply is glued and packaged.

4. The package structure of a switching power supply according to claim 1, wherein: The upper cover is provided with a glue pouring hole, and the circuit board is provided with a glue passing hole at the position corresponding to the glue pouring hole of the upper cover, so as to form a glue pouring channel connecting the front and back spaces of the circuit board in the packaging cavity of the circuit board surrounded by the upper cover and the base, so that the glue can flow in the entire packaging cavity when the switching power supply is glued and packaged.

5. The package structure of a switching power supply according to claim 1, wherein: When the glue passing hole on the circuit board is arranged along the edge of the circuit board, the shape is a U-shaped opening outwardly formed by breaking the edge of the circuit board.

6. The package structure of a switching power supply according to claim 4 or 5, characterized in that: The four edges of the base are provided with limiting grooves, and the open edge of the upper cover is provided with bosses at the positions corresponding to the limiting grooves of the base.

7. The package structure of a switching power supply according to claim 1, wherein: The four edges of the base are recessed with steps, and the open edge of the upper cover is snap-fitted on the steps of the base.

8. The package structure of a switching power supply according to claim 1, wherein: The upper cover, the circuit board and the base are threadedly fixed and connected through studs passing through stud hole seats of the upper cover, the circuit board and the base.

9. The package structure of a switching power supply according to claim 1, wherein: The shell comprises a base and an upper cover mounted above the base, the base is square, comprising positioning studs for fixing the circuit board, heat dissipation bosses for dissipating heat of the power devices, and limiting grooves for stably connecting the cover body of the upper cover.

10. A switching power supply for a circuit board with a large amount of heat generating power devices, comprising a housing and a circuit board provided in the interior of the housing, characterized by: The base is made of aluminum alloy, and a plurality of heat dissipation bosses are arranged above the main body of the base.

11. The switching power supply of claim 10, wherein: The open edge of the upper cover is provided with bosses, and the four edges of the base are provided with limiting grooves, which are used in cooperation with the bosses of the upper cover to provide limiting and fixing functions of the shell, so that the assembly joint surface of the product is flat.

12. The switching power supply of claim 10, wherein: ​

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