Device for generating resonant frequency and electronic equipment

Abstract

The utility model provides a device for generating resonant frequency and electronic equipment. The device comprises a resonant unit, a base for packaging the resonant unit, an upper cover located at the top of the base, and a temperature processing device located in a cavity between the base and the upper cover. Wherein the temperature processing device comprises a temperature measuring device and / or a heating device. The resonance unit is used for generating resonance frequency, and the temperature measuring device is used for measuring the temperature of the resonance unit. The heating device is used for heating so as to adjust the temperature of the resonance unit. In the application, the temperature of the resonance unit is measured by using the temperature measuring device located in the cavity between the base and the upper cover, the measured temperature is more accurate, and the temperature frequency offset is reduced. Similarly, the heating device is located in the cavity, so that the temperature of the resonance unit can be controlled more accurately by using the heating device, and the temperature frequency offset is effectively reduced.

Description

[0001] The present application claims priority to the Chinese Patent Application No. 202411382588.1, filed on September 27, 2024, and entitled "A Crystal Device and a Preparation Method of a Crystal Device", and the Chinese Patent Application No. 202422383192.0, filed on September 27, 2024, and entitled "A Crystal Device", both of which are hereby incorporated by reference in their entirety. TECHNICAL FIELD

[0002] The present application relates to the electronic field, and in particular to a device for generating a resonant frequency and an electronic device. BACKGROUND

[0003] Both the resonator and the oscillator can generate a resonant frequency. The resonator can be made based on the piezoelectric effect of a piezoelectric material, for example. After a voltage is applied to the piezoelectric material, the piezoelectric material resonates to generate a resonant frequency. The oscillator further includes an integrated circuit (IC) on the basis of the resonator. After the resonator is connected to the IC, the frequency output by the IC is the output frequency of the oscillator.

[0004] Generally, there is a difference between the output frequency of the resonator or the oscillator and the target frequency that it is expected to output. That is, the output frequency of the resonator or the oscillator has a frequency offset, which can be referred to as frequency deviation. The temperature of the piezoelectric material is one of the factors that causes the frequency offset of the output frequency of the resonator or the oscillator. The frequency offset caused by the temperature of the piezoelectric material can be referred to as temperature frequency deviation.

[0005] How to effectively reduce the temperature frequency deviation is a problem to be solved at present. CONTENT OF THE UTILITY MODEL

[0006] The present application provides a device for generating a resonant frequency and an electronic device, which can effectively reduce the temperature frequency deviation.

[0007] In a first aspect, the present application provides a device for generating a resonant frequency, the device comprising: a resonant unit, a base for packaging the resonant unit, an upper cover on top of the base, and a temperature processing device inside a cavity between the base and the upper cover. The temperature processing device comprises a temperature measuring device and / or a heating device. The resonant unit is used to generate a resonant frequency, the temperature measuring device is used to measure the temperature of the resonant unit, and the heating device is used to heat to adjust the temperature of the resonant unit. In the present application, since the temperature measuring device is located inside the cavity between the base and the upper cover, the temperature measuring device is closer to the resonant unit in position compared to when the temperature measuring device is located outside the base, so that the temperature measured by the temperature measuring device is closer to the actual temperature of the resonant unit. In other words, the temperature measured by the temperature measuring device located inside the cavity between the base and the upper cover is more accurate, which is beneficial to reduce the temperature frequency offset. Similarly, since the heating device is located inside the cavity, the temperature of the resonant unit can be more accurately controlled by using the heating device, thereby effectively reducing the temperature frequency offset.

[0008] In a possible implementation, the temperature measuring device is located on the resonant unit, and specifically, can be located in a non-oscillation area of the resonant unit. In this way, on the one hand, the temperature of the resonant unit can be accurately measured, and on the other hand, the resonant frequency output by the resonant unit can also not be affected, thereby ensuring the performance of the resonant unit.

[0009] In a possible implementation, the temperature measuring device is located on the inner base of the base, so that the temperature measuring device and the resonant unit are no longer separated by the base made of ceramic material, thereby making the temperature measured by the temperature measuring device more accurate.

[0010] In a possible implementation, the temperature measuring device is located on the inner base of the base, so that the temperature measuring device and the resonant unit are no longer separated by the base made of ceramic material, thereby making the temperature measured by the temperature measuring device more accurate.

[0011] In a possible implementation, the temperature measuring device can be a device with a temperature measuring function, such as a thermistor, a pyroelectric, a thermocouple, or a thermopile, to realize the temperature measurement of the resonant unit.

[0012] In a possible implementation, if a thermistor is used as the temperature measuring device, in one example, a negative temperature coefficient (NTC) thermistor can be used as the temperature measuring device. In another example, a positive temperature coefficient (PTC) thermistor can be used as the temperature measuring device.

[0013] In a possible implementation, the shape of the temperature measuring device can be flexibly set, for example, the shape of the temperature measuring device can be a strip shape or a curved shape. By flexibly setting the shape of the temperature measuring device, multi-point temperature measurement can be achieved, and the temperature finally output by the temperature measuring device can be determined based on the result of the multi-point temperature measurement, so that the temperature measured by the temperature measuring device is more stable and accurate.

[0014] In a possible implementation, the heating device is located on the resonant unit, specifically, can be located in a non-oscillation area of the resonant unit. In this way, on the one hand, the temperature of the resonant unit can be adjusted with reduced power of the heating device, and on the other hand, the resonant frequency output by the resonant unit can also not be affected, thereby guaranteeing the performance of the resonant unit.

[0015] In a possible implementation, the heating device is located on the inner base of the base, so that the heating device and the resonant unit are no longer separated by the base made of ceramic material, thereby reducing the power of the heating device.

[0016] In a possible implementation, the heating device is located on the inner side of the upper cover, so that the heating device and the resonant unit are no longer separated by the base made of ceramic material, thereby reducing the power of the heating device.

[0017] In a possible implementation, considering that a resistance will generate heat after being powered on, the device with resistance has a heating function after being powered on. Therefore, the heating device can be a device with resistance.

[0018] In a possible implementation, considering that a resistance, a diode, and a device made of metal, metal oxide, alloy, and semiconductor compound all have certain resistance, the device with resistance includes a resistance, a diode, and a device made of metal, metal oxide, alloy, and semiconductor compound. In other words, the heating device can include a resistance, or a diode, or a device made of metal, metal oxide, alloy, and semiconductor compound.

[0019] In a possible implementation, the shape of the heating device can be flexibly set, for example, the shape of the heating device can be a strip shape or a curved shape. By flexibly setting the shape of the heating device, multi-point heating can be achieved, thereby improving the efficiency of adjusting the temperature of the resonant unit.

[0020] In a possible implementation, the device for generating a resonant frequency further includes a first pin and a second pin, and the first pin and the second pin are both used to connect the temperature measuring device outside the base. The first pin and the second pin can be used to power the temperature measuring device, so that the temperature measuring device is in an operating state.

[0021] In a possible implementation, the device for generating a resonant frequency further includes a first electrode and a second electrode, the first electrode is used to connect the temperature measuring device and the first pin, in particular, the first electrode is used to connect a first end of the temperature measuring device and the first pin. The second electrode is used to connect the temperature measuring device and the second pin, in particular, the second electrode is used to connect a second end of the temperature measuring device and the second pin.

[0022] In a possible implementation, the material of the first electrode and the material of the second electrode both include gold, or the material of the first electrode and the material of the second electrode both include silver.

[0023] In a possible implementation, the material of the first pin and the material of the second pin both include gold, or the material of the first pin and the material of the second pin both include silver.

[0024] In a possible implementation, the device for generating a resonant frequency further includes a third pin and a fourth pin, and the third pin and the fourth pin are both used to connect the heating device outside the base. The third pin and the fourth pin can be used to power the heating device, so that the heating device is in an operating state.

[0025] In a possible implementation, the device for generating a resonant frequency further includes a third electrode and a fourth electrode, the third electrode is used to connect the heating device and the third pin, in particular, the third electrode is used to connect a first end of the heating device and the third pin. The fourth electrode is used to connect the heating device and the fourth pin, in particular, the fourth electrode is used to connect a second end of the heating device and the fourth pin.

[0026] In a possible implementation, the material of the third electrode and the material of the fourth electrode both include gold, or the material of the third electrode and the material of the fourth electrode both include silver.

[0027] In a possible implementation, the material of the third pin and the fourth pin both includes gold, or the material of the third pin and the fourth pin both includes silver.

[0028] In a possible implementation, the device for generating a resonant frequency can be an oscillator, for example, a temperature-compensated oscillator, or a constant-temperature oscillator. The temperature-compensated oscillator includes a temperature-compensated crystal oscillator, or a temperature-compensated micro-electro-mechanical system oscillator, or a temperature-compensated bulk acoustic wave oscillator, or a temperature-compensated surface acoustic wave oscillator. The constant-temperature oscillator includes a constant-temperature crystal oscillator, or a constant-temperature micro-electro-mechanical system oscillator, or a constant-temperature bulk acoustic wave oscillator, or a constant-temperature surface acoustic wave oscillator.

[0029] In a possible implementation, the device for generating a resonant frequency can be a resonator, for example, a temperature-compensated resonator, or a constant-temperature resonator. The temperature-compensated resonator includes a temperature-compensated crystal resonator, or a temperature-compensated micro-electro-mechanical system resonator, or a temperature-compensated bulk acoustic wave resonator, or a temperature-compensated surface acoustic wave resonator. The constant-temperature resonator includes a constant-temperature crystal resonator, or a constant-temperature micro-electro-mechanical system resonator, or a constant-temperature bulk acoustic wave resonator, or a constant-temperature surface acoustic wave resonator.

[0030] In a possible implementation, the device for generating a resonant frequency can be an oscillator. In this case, the oscillator further includes a temperature compensation device configured to perform a temperature compensation measure based on the temperature measured by the temperature measuring device. Since the temperature measuring device is located inside the cavity between the base and the upper cover, the temperature measured by the temperature measuring device is more accurate, and accordingly, the temperature compensation device performs a corresponding temperature compensation measure based on the temperature measured by the temperature measuring device, which can effectively reduce the temperature frequency deviation of the crystal oscillator.

[0031] In a possible implementation, if the device for generating a resonant frequency is a temperature-compensated oscillator, the temperature compensation device can include a first IC configured to perform a frequency compensation on the frequency output by the resonant unit based on the temperature measured by the temperature measuring device, to obtain the frequency output by the temperature-compensated oscillator, thereby effectively reducing the temperature frequency deviation.

[0032] In a possible implementation, if the device for generating a resonant frequency is a constant-temperature oscillator, the temperature compensation device can include a second IC. The second IC is configured to perform a temperature compensation on the heating device based on the temperature measured by the temperature measuring device, so that the temperature of the resonant unit is at a certain constant temperature.

[0033] In a possible implementation, the resonant unit adopts a piezoelectric material, the piezoelectric material has a piezoelectric effect, and the piezoelectric material generates a resonant frequency after being electrified. In a possible implementation, the piezoelectric material includes a piezoelectric crystal or a piezoelectric ceramic.

[0034] In a possible implementation, in the case where the piezoelectric material includes a piezoelectric crystal, the resonant unit includes a quartz wafer.

[0035] In a second aspect, the present application provides an electronic device, including the device of the above first aspect and any one of the above first aspect.

[0036] In a possible implementation, the electronic device is a communication device or a network device or a terminal device. BRIEF DESCRIPTION OF DRAWINGS

[0037] Figure 1a A schematic diagram of a temperature-compensated oscillator is shown;

[0038] Figure 1b A schematic diagram of a temperature-frequency offset curve is shown;

[0039] Figure 1c A schematic diagram of a compensated frequency offset curve is shown;

[0040] Figure 1d A schematic diagram of a temperature-frequency offset of a temperature-compensated oscillator output frequency is shown;

[0041] Figure 1e A schematic diagram of a constant-temperature oscillator is shown;

[0042] Figure 2a A schematic diagram of a resonator structure provided by an embodiment of the present application is shown;

[0043] Figure 2b A schematic diagram of a temperature-compensated oscillator structure provided by an embodiment of the present application is shown;

[0044] Figure 2c A schematic diagram of a constant-temperature oscillator structure provided by an embodiment of the present application is shown;

[0045] Figure 2d A schematic diagram of a resonator structure provided by an embodiment of the present application is shown;

[0046] Figure 2e A schematic diagram of a temperature-compensated oscillator structure provided by an embodiment of the present application is shown;

[0047] Figure 2f A schematic diagram of a constant-temperature oscillator structure provided by an embodiment of the present application is shown;

[0048] Figure 2g A structure diagram of a resonator provided for an embodiment of the present application;

[0049] Figure 2h A structure diagram of a temperature compensated oscillator provided for an embodiment of the present application;

[0050] Figure 2i A structure diagram of a constant temperature oscillator provided for an embodiment of the present application;

[0051] Figure 3a A structure diagram of a resonator provided for an embodiment of the present application;

[0052] Figure 3b A structure diagram of a temperature compensated oscillator provided for an embodiment of the present application;

[0053] Figure 3c A structure diagram of a constant temperature oscillator provided for an embodiment of the present application;

[0054] Figure 3d A structure diagram of a resonator provided for an embodiment of the present application;

[0055] Figure 3e A structure diagram of a temperature compensated oscillator provided for an embodiment of the present application;

[0056] Figure 3f A structure diagram of a constant temperature oscillator provided for an embodiment of the present application;

[0057] Figure 3g A structure diagram of a resonator provided for an embodiment of the present application;

[0058] Figure 3h A structure diagram of a temperature compensated oscillator provided for an embodiment of the present application;

[0059] Figure 3i A structure diagram of a constant temperature oscillator provided for an embodiment of the present application;

[0060] Figure 4a A shape diagram provided for an embodiment of the present application;

[0061] Figure 4b Another shape diagram provided for an embodiment of the present application;

[0062] Figure 4c Another shape diagram provided for an embodiment of the present application;

[0063] Figure 5a A structure diagram of a resonator provided for an embodiment of the present application;

[0064] Figure 5b A cross-sectional view of the resonant unit along the y direction is provided for the embodiments of the present application. DETAILED DESCRIPTION

[0065] The present application provides a device for generating a resonant frequency, which can effectively reduce temperature frequency deviation. Currently, temperature-compensated resonators, temperature-compensated oscillators, constant-temperature resonators, and constant-temperature oscillators all have the function of reducing temperature frequency deviation. Among them:

[0066] The temperature-compensated resonators at least include four types of resonators: temperature-compensated crystal resonators, temperature-compensated micro-electro-mechanical systems resonators, temperature-compensated bulk acoustic wave resonators, and temperature-compensated surface acoustic wave resonators.

[0067] The main difference between the four types of temperature-compensated resonators is that the piezoelectric materials used in the resonant units for generating a resonant frequency are different. Among them, the piezoelectric material used in the resonant unit of the temperature-compensated crystal resonator is a piezoelectric crystal, and the piezoelectric materials used in the resonant units of the other three types of temperature-compensated crystal resonators are piezoelectric ceramics. In a specific example, the piezoelectric material used in the resonant unit of the temperature-compensated micro-electro-mechanical systems resonator is silicon; for the temperature-compensated bulk acoustic wave resonator and the temperature-compensated surface acoustic wave resonator, the piezoelectric materials used in the resonant units of both are aluminum nitride.

[0068] The temperature-compensated oscillators at least include four types of oscillators: temperature-compensated crystal oscillators (TCXO), temperature-compensated micro-electro-mechanical systems oscillators (TCXO), temperature-compensated bulk acoustic wave oscillators (TCBO), and temperature-compensated surface acoustic wave oscillators (TCSO).

[0069] The temperature-compensated crystal oscillator can be prepared on the basis of the temperature-compensated crystal resonator. Specifically, an IC can be added on the basis of the temperature-compensated crystal resonator to obtain the temperature-compensated crystal oscillator.

[0070] The temperature-compensated micro-electro-mechanical system oscillator can be prepared on the basis of the temperature-compensated micro-electro-mechanical system resonator, and specifically, an IC can be added on the basis of the temperature-compensated micro-electro-mechanical system resonator, so as to obtain the temperature-compensated micro-electro-mechanical system oscillator.

[0071] The temperature-compensated bulk acoustic wave oscillator can be prepared on the basis of the temperature-compensated bulk acoustic wave resonator, and specifically, an IC can be added on the basis of the temperature-compensated bulk acoustic wave resonator, so as to obtain the temperature-compensated bulk acoustic wave oscillator.

[0072] The temperature-compensated surface acoustic wave oscillator can be prepared on the basis of the temperature-compensated surface acoustic wave resonator, and specifically, an IC can be added on the basis of the temperature-compensated surface acoustic wave resonator, so as to obtain the temperature-compensated surface acoustic wave oscillator.

[0073] The working principles of the four types of temperature-compensated oscillators are basically the same, and the main difference lies in the piezoelectric materials used by the resonant units for generating resonant frequencies. The piezoelectric materials used by the resonant units of the four types of temperature-compensated oscillators can be referred to the related description in the foregoing, which will not be described herein.

[0074] The thermostatic resonator at least includes four types of resonators, i.e., a thermostatic crystal resonator, a thermostatic micro-electro-mechanical system resonator, a thermostatic bulk acoustic wave resonator, and a thermostatic surface acoustic wave resonator.

[0075] The main difference among the four types of thermostatic resonators lies in the piezoelectric materials used by the resonant units for generating resonant frequencies. Specifically, the piezoelectric material used by the resonant unit of the thermostatic crystal resonator is a piezoelectric crystal, and the piezoelectric materials used by the resonant units of the other three types of thermostatic crystal resonators are piezoelectric ceramics. In one specific example, the piezoelectric material used by the resonant unit of the thermostatic micro-electro-mechanical system resonator is silicon; for the thermostatic bulk acoustic wave resonator and the thermostatic surface acoustic wave resonator, the piezoelectric materials used by the resonant units of the two are both aluminum nitride.

[0076] The oven controlled crystal oscillator (OCXO), the oven controlled micro-electro-mechanical systems oscillator (OCXO), the oven controlled bulk acoustic wave oscillator (OCBO), and the oven controlled surface acoustic wave oscillator (OCSO) are four types of oven controlled oscillators.

[0077] The oven controlled crystal oscillator can be prepared on the basis of an oven controlled crystal resonator, and specifically, an IC can be added on the basis of the oven controlled crystal resonator to obtain the oven controlled crystal oscillator.

[0078] The oven controlled micro-electro-mechanical systems oscillator can be prepared on the basis of an oven controlled micro-electro-mechanical systems resonator, and specifically, an IC can be added on the basis of the oven controlled micro-electro-mechanical systems resonator to obtain the oven controlled micro-electro-mechanical systems oscillator.

[0079] The oven controlled bulk acoustic wave oscillator can be prepared on the basis of an oven controlled bulk acoustic wave resonator, and specifically, an IC can be added on the basis of the oven controlled bulk acoustic wave resonator to obtain the oven controlled bulk acoustic wave oscillator.

[0080] The oven controlled surface acoustic wave oscillator can be prepared on the basis of an oven controlled surface acoustic wave resonator, and specifically, an IC can be added on the basis of the oven controlled surface acoustic wave resonator to obtain the oven controlled surface acoustic wave oscillator.

[0081] The four types of oven controlled oscillators have basically the same working principle, and the main difference lies in the piezoelectric material used in the resonant unit for generating a resonant frequency. The piezoelectric material used in the resonant unit of the four types of oven controlled oscillators can be referred to the related description in the foregoing, which will not be described herein.

[0082] Next, the working principle of the current temperature compensated oscillator and the working principle of the oven controlled oscillator are briefly introduced.

[0083] 1. Temperature compensated oscillator

[0084] The temperature compensated oscillator has a temperature frequency offset compensation function, and can compensate the temperature frequency offset, so that the output frequency of the temperature compensated oscillator is more accurate. Specifically, it can be understood with reference to Figure 1a Figure 1a ​A schematic diagram of a temperature compensated oscillator is shown. As Figure 1a It can be known that the temperature compensated oscillator comprises a resonant unit, a base for packaging the resonant unit, an upper cover on the top of the base, a temperature compensation IC and a temperature sensor on the outside of the base. The working principle of the temperature compensated oscillator is that after the temperature compensated oscillator is prepared, temperature test is carried out. Specifically, a temperature box is used to control the temperature of the resonant unit, and the output frequency of the resonant unit is measured at the temperature, and a curve of the change of the temperature frequency offset with the temperature is drawn. Specifically, a plurality of temperature boxes (for example, 5) can be used to control the resonant unit to be at 5 different temperatures, and the curve fitting is carried out based on the output frequency of the resonant unit at the 5 temperatures, so as to obtain the curve of the change of the temperature frequency offset with the temperature. The curve can be as shown in Figure 1b Figure 1b A schematic diagram of a curve of the change of the temperature frequency offset with the temperature is shown. According to the measured curve, the compensation frequency offset curve of the temperature compensation IC is obtained by fitting or lookup table, and the compensation frequency offset curve is burned into the temperature compensation IC. Correspondingly, the temperature compensation IC can query the compensation frequency offset curve based on the temperature measured by the temperature sensor, so as to obtain the corresponding compensation frequency offset, and further compensate the frequency of the resonant unit output based on the compensation frequency offset, so as to obtain the frequency of the temperature compensated oscillator output, thereby effectively reducing the temperature frequency offset of the frequency of the temperature compensated oscillator output. In one example, Figure 1b The curve shown in Figure 1c The compensation frequency offset curve is fitted, and the temperature frequency offset of the frequency output by the temperature compensation IC can be as shown in Figure 1d The dashed curve in Figure 1d The curve of the change of the temperature frequency offset with the temperature is shown. After the output frequency is adjusted based on the compensation frequency offset as shown in Figure 1d The temperature frequency offset of the frequency output by the temperature compensated oscillator is effectively reduced.

[0085] In addition, although not shown in Figure 1a The temperature compensated oscillator can also comprise an IC for outputting frequency, and the frequency output by the IC for outputting frequency is the frequency output by the temperature compensated oscillator. The IC for outputting frequency is located outside the base. In addition, the IC for outputting frequency and the temperature compensation IC in Figure 1a The IC for outputting frequency and the temperature compensation IC in

[0086] 2. Ovenized oscillator

[0087] ​The constant temperature oscillator is an oscillator that uses a constant temperature assembly to keep the temperature of a resonant unit in the constant temperature oscillator constant, thereby minimizing the temperature frequency deviation caused by changes in ambient temperature. Specifically, reference can be made to Figure 1e It is understood that Figure 1e A schematic diagram of a constant temperature oscillator is shown. As Figure 1e It is known that the constant temperature oscillator includes a resonant unit, a base that encapsulates the resonant unit, an upper cover on top of the base, a heating device on the outside of the base, a temperature compensation IC and a temperature sensor on the outside of the base. The constant temperature assembly includes the heating device on the outside of the base. The working principle of the constant temperature oscillator is to test the temperature of the resonant unit using the temperature sensor, determine the heating power of the heating device based on the temperature measured by the temperature measuring device, and keep the temperature of the resonant unit at a certain constant temperature by heating the heating device. Since the temperature of the resonant unit is always kept at a certain constant temperature, the change in ambient temperature will have little effect on the temperature of the resonant unit, and accordingly, the change in ambient temperature will hardly cause additional temperature frequency deviation.

[0088] Similarly, although Figure 1e The constant temperature oscillator can also include an IC for outputting a frequency, which is the frequency output by the constant temperature oscillator. The IC for outputting a frequency is located outside the base. In addition, the IC for outputting a frequency and the temperature compensation IC in Figure 1e The IC for outputting a frequency and the temperature compensation IC in

[0089] However, since the temperature sensor is located outside the base, it is separated from the resonant unit by at least one layer of ceramic base plate material, about 0.4 mm thick. When the ambient temperature is constant or changes very slowly, it can be considered that the temperatures of the ceramic base and the resonant unit are basically the same, and accordingly, the temperature frequency deviation of the oscillator output frequency is also small. However, when the ambient temperature changes rapidly, the external temperature can respond quickly to the change, but heat transfer takes time, so the temperature change of the resonant unit will be slower than the outside. Experimental data shows that when the ambient temperature rises or falls suddenly, for example, when the ambient temperature rises or falls at a rate of 0.3°C per second, the temperature of the resonant unit lags behind the temperature on the outside of the base by 0.21°C. This results in that the temperature measured by the temperature sensor is not accurate as the temperature of the resonant unit.

[0090] Correspondingly, for the temperature compensation oscillator, the temperature measured by the temperature sensor is used to compensate the temperature frequency deviation, and the error is large, which results in a large temperature frequency deviation of the frequency output by the temperature compensation oscillator. For the constant temperature oscillator, when the ambient temperature changes rapidly, the temperature of the resonant unit cannot be kept constant, which results in a large temperature frequency deviation of the frequency output by the constant temperature oscillator.

[0091] In addition, for the temperature compensation oscillator, a plurality of temperature boxes are used to control the temperature of the resonant unit, so as to obtain the aforementioned compensation frequency deviation curve. Therefore, the accuracy of the aforementioned compensation frequency deviation curve is greatly affected by the number of temperature boxes used to control the temperature of the resonant unit. When the number of temperature boxes is small (for example, 5), the accuracy of the aforementioned compensation frequency deviation curve is low, and in order to improve the accuracy of the compensation frequency deviation curve, more temperature boxes are needed, but too many temperature boxes will result in a high cost of obtaining the aforementioned compensation frequency deviation curve. For the constant temperature oscillator, the heating device is located outside the base, and since it is separated from the resonant unit by at least one base plate made of ceramic material, if the resonant unit is to be controlled at a certain constant temperature, the power consumption of the heating device is also high.

[0092] In view of this, the present application provides a device for generating a resonant frequency, which can effectively reduce the temperature frequency deviation. Next, the device for generating a resonant frequency provided by the present application will be described in conjunction with the accompanying drawings.

[0093] The device for generating a resonant frequency provided by the present application comprises a resonant unit, a base for packaging the resonant unit, an upper cover located at the top of the base, and a temperature processing device, wherein the temperature processing device comprises a temperature measuring device and / or a heating device. The resonant unit is used to generate a resonant frequency, the temperature measuring device is used to measure the temperature of the resonant unit, and the heating device is used to heat to adjust the temperature of the resonant unit. The base and the upper cover form a cavity, and the temperature processing device is located inside the cavity.

[0094] In an implementation manner of the present application, the resonant unit adopts piezoelectric material, wherein the piezoelectric material has piezoelectric effect, and after a voltage is applied to the piezoelectric material, the piezoelectric material generates a resonant frequency when it resonates. The piezoelectric material can be piezoelectric crystal or piezoelectric ceramic, and the piezoelectric ceramic includes silicon, aluminum nitride, etc. When the piezoelectric material adopted by the resonant unit is piezoelectric crystal, the resonant unit can be a quartz wafer.

[0095] Of course, the resonant unit can also adopt other materials instead of piezoelectric material, as long as the material can generate a resonant frequency, and the present application does not make specific limitation.

[0096] In one example, the device generating the resonant frequency can be a resonator. The resonator can serve as a component for preparing an oscillator. In this case, the resonator can be a constant temperature resonator or a temperature compensated resonator. As described above, the constant temperature resonator can include a constant temperature crystal resonator, or a constant temperature micro-electro-mechanical system resonator, or a constant temperature bulk acoustic wave resonator, or a constant temperature surface acoustic wave resonator. The temperature compensated resonator can include a temperature compensated crystal resonator, or a temperature compensated micro-electro-mechanical system resonator, or a temperature compensated bulk acoustic wave resonator, or a temperature compensated surface acoustic wave resonator. In this case:

[0097] When the device generating the resonant frequency is a constant temperature crystal resonator or a temperature compensated crystal resonator, the piezoelectric material used by the resonant unit can be a piezoelectric crystal. When the device generating the resonant frequency is a constant temperature micro-electro-mechanical system resonator or a temperature compensated micro-electro-mechanical system resonator, the piezoelectric material used by the resonant unit can be silicon. When the device generating the resonant frequency is a constant temperature bulk acoustic wave resonator, a temperature compensated bulk acoustic wave resonator, a constant temperature surface acoustic wave resonator, or a temperature compensated surface acoustic wave resonator, the piezoelectric material used by the resonant unit can be aluminum nitride.

[0098] In another example, the device generating the resonant frequency can be an oscillator. In this case, the oscillator can be a constant temperature oscillator or a temperature compensated oscillator. As described above, the constant temperature oscillator can include a constant temperature crystal oscillator, or a constant temperature micro-electro-mechanical system oscillator, or a constant temperature bulk acoustic wave oscillator, or a constant temperature surface acoustic wave oscillator. The temperature compensated oscillator can include a temperature compensated crystal oscillator, or a temperature compensated micro-electro-mechanical system oscillator, or a temperature compensated bulk acoustic wave oscillator, or a temperature compensated surface acoustic wave oscillator. In this case:

[0099] When the device generating the resonant frequency is a constant temperature crystal oscillator or a temperature compensated crystal oscillator, the piezoelectric material used by the resonant unit can be a piezoelectric crystal. When the device generating the resonant frequency is a constant temperature micro-electro-mechanical system oscillator or a temperature compensated micro-electro-mechanical system oscillator, the piezoelectric material used by the resonant unit can be silicon. When the device generating the resonant frequency is a constant temperature bulk acoustic wave oscillator, a temperature compensated bulk acoustic wave oscillator, a constant temperature surface acoustic wave oscillator, or a temperature compensated surface acoustic wave oscillator, the piezoelectric material used by the resonant unit can be aluminum nitride.

[0100] If the resonant frequency generating device is an oscillator, in one example, the resonant frequency generating device further comprises a temperature compensation device configured to perform temperature compensation based on the temperature measured by the temperature measuring device. In one example, the temperature measuring device and the temperature compensation device can be two independent devices. In another example, the temperature measuring device and the temperature compensation device can also be integrated into one device, which is not limited in the embodiments of the present application. In addition, the oscillator can further comprise an IC for outputting frequency.

[0101] In the present application, in order to reduce the temperature frequency offset of the oscillator, the temperature measuring device is inside the cavity. In this way, the temperature measuring device and the resonant unit are both inside the cavity, and there is no ceramic base plate between them. That is, compared with the temperature sensor of the oscillator in the prior art, the temperature measuring device in the present application is closer to the resonant unit in position, so that the temperature of the resonant unit can be accurately measured by the temperature measuring device, and accordingly, the temperature compensation device of the oscillator can effectively reduce the temperature frequency offset of the crystal oscillator based on the temperature measured by the temperature measuring device.

[0102] In the present application, the position of the IC for outputting frequency included in the oscillator is not limited, which can be outside the base as in the prior art, or inside the cavity.

[0103] The temperature measuring device in the embodiments of the present application refers to a device with temperature measuring function. In one example, the temperature measuring device can be a temperature sensor. In another example, considering that thermistors, pyroelectricity, thermocouples or thermopiles can all be used to measure temperature, the temperature measuring device can also be a thermistor, pyroelectricity, thermocouple or thermopile. Among them, the process of thermistor is relatively simple, so in some embodiments, the thermistor can be preferred as the temperature measuring device. The thermistor can include positive temperature coefficient thermistors and negative temperature coefficient thermistors, wherein the positive temperature coefficient thermistor has the characteristic of resistance increasing with temperature, and the negative temperature coefficient thermistor has the characteristic of resistance decreasing with temperature.

[0104] In the present application, in order to accurately adjust the temperature of the resonant unit, the heating device is inside the cavity. In this way, the heating device and the resonant unit are both inside the cavity, and there is no ceramic base plate between them. That is, the heating device is closer in position to the resonant unit, so that the heating device can accurately adjust the temperature of the resonant unit, and the power consumption of the heating device can be reduced. In this way, for a temperature-compensated resonator or a temperature-compensated oscillator, the heating device can be used to adjust the temperature of the resonant unit, for example, using the heating device to adjust the temperature of the resonant unit to tens or even dozens of temperatures, and measuring the frequency output by the resonant unit at these dozens of temperatures, so as to accurately obtain the aforementioned compensation frequency deviation curve. Correspondingly, based on the compensation frequency deviation curve, frequency deviation compensation can effectively reduce temperature frequency deviation. For a constant-temperature resonator or a constant-temperature oscillator, using the heating device, the resonant unit can be controlled to be at a certain constant temperature with less power consumption, thereby effectively reducing the temperature frequency deviation.

[0105] The heating device in the embodiments of the present application refers to a device with a specific heating function. In one example, considering that a resistor generates heat after being powered on, therefore, the device with resistance has a heating function after being powered on. Therefore, the heating device can be a device with resistance. As a specific example, considering that a resistor, a diode, a device with a material including metal, metal oxide, alloy, and semiconductor compound all have a certain resistance, therefore, the device with resistance includes a resistor, a diode, and a device with a material including metal, metal oxide, alloy, and semiconductor compound. In other words, the heating device can include a resistor, or a diode, or a device with a material including metal, metal oxide, alloy, and semiconductor compound.

[0106] In one example, the oscillator provided by the embodiments of the present application can be a temperature-compensated oscillator. For this case, the aforementioned temperature compensation device can include a first IC for performing frequency compensation on the frequency output by the resonant unit based on the temperature measured by the temperature measurement device to obtain the frequency output by the oscillator, and further, the frequency obtained by performing frequency compensation can be output by the IC for outputting frequency. For the specific implementation of the first IC performing frequency compensation on the frequency output by the resonant unit based on the temperature measured by the temperature measurement device, reference can be made to the related description of the working principle of the temperature-compensated oscillator in the foregoing, which will not be described here.

[0107] As described above, the temperature measuring device and the temperature compensation device can be two independent devices, or can be integrated into one device. If the temperature measuring device and the temperature compensation device are two independent devices, the position of the first IC is not limited in the embodiments of the present application, which can be located outside the base or inside the cavity. If the temperature measuring device and the temperature compensation device are integrated into one device, since the temperature measuring device is located inside the cavity, the first IC is also located inside the cavity.

[0108] In another example, the oscillator provided by the embodiments of the present application can be a constant temperature oscillator. In this case, the temperature compensation device can include a second IC and the aforementioned heating device. The second IC is used to compensate the heating device based on the temperature measured by the temperature measuring device, and specifically, the heating power of the heating device can be determined based on the temperature measured by the temperature measuring device, so that the temperature of the resonant unit is kept at a certain constant temperature by heating the heating device.

[0109] As described above, the temperature measuring device and the temperature compensation device can be two independent devices, or can be integrated into one device. If the temperature measuring device and the temperature compensation device are two independent devices, the position of the second IC is not limited in the embodiments of the present application, which can be located outside the base or inside the cavity. If the temperature measuring device and the temperature compensation device are integrated into one device, since the temperature measuring device is located inside the cavity, the second IC is also located inside the cavity.

[0110] In the present application, the positions of the temperature measuring device and the heating device can be flexibly designed, which can be located inside the cavity.

[0111] In a specific example, the aforementioned temperature measuring device can be located on the resonant unit. The resonant unit includes a resonant region and a non-resonant region, and the resonant region of the resonant unit is used to resonate to generate a resonant frequency. If the temperature measuring device is located in the resonant region, it will affect the resonant frequency output by the resonant unit, thereby affecting the performance of the resonant unit. Therefore, the temperature measuring device can be located in the non-resonant region of the resonant unit. Of course, it can be understood that if the problem of placing the temperature measuring device in the resonant region affecting the resonant frequency output by the resonant unit can be solved, the temperature measuring device can also be located in the resonant region of the resonant unit.

[0112] Referring to Figure 2a FIG. 1 is a structural schematic diagram of a resonator provided by an embodiment of the present application. As shown in FIG. 1, the resonator includes a base 1, a cavity 2, a resonant unit 3, a temperature measuring device 4, a temperature compensation device 5, and a first IC 6. Figure 2aAs shown, the resonator includes: a resonant unit, a base, a top cover, and a temperature measuring device, wherein the resonant unit is located in the cavity between the base and the top cover, and the temperature measuring device is located in the non-resonant region of the resonant unit.

[0113] See also Figure 2b The figure is a schematic diagram of the structure of a temperature-compensated oscillator provided in an embodiment of this application. Figure 2b As shown, the temperature-compensated oscillator includes: a resonant unit, a base, a top cover, a temperature measuring device, and a temperature compensation device. The resonant unit is located in the cavity between the base and the top cover, and the temperature measuring device is located in the non-resonant region of the resonant unit.

[0114] exist Figure 2b In this example, the temperature compensation device is located on the outside of the base. In another example, the temperature compensation device may also be located inside the cavity, which will not be described in detail here.

[0115] See also Figure 2c The figure is a schematic diagram of the structure of a temperature-controlled oscillator provided in an embodiment of this application. Figure 2c As shown, the constant temperature oscillator includes: a resonant unit, a base, a top cover, a heating device, a temperature measuring device, and a temperature compensation device. The resonant unit is located in the cavity between the base and the top cover, and the temperature measuring device is located in the non-resonant region of the resonant unit.

[0116] exist Figure 2c In this example, the temperature compensation device is located on the outside of the base. In another example, the temperature compensation device may also be located inside the cavity, which will not be described in detail here.

[0117] In addition, Figure 2c In this example, the heating device is located on the outside of the base. In another example, the heating device may also be located inside the cavity, which will not be described in detail here.

[0118] In a specific example, the aforementioned temperature measuring device may be located on the inner base of the base.

[0119] See also Figure 2d This figure is a schematic diagram of the structure of a resonator provided in an embodiment of this application. Figure 2d As shown, the resonator includes: a resonant unit, a base, a top cover, and a temperature measuring device, wherein the resonant unit is located in the cavity between the base and the top cover, and the temperature measuring device is located on the inner base of the base.

[0120] See also Figure 2e The figure is a schematic diagram of the structure of a temperature-compensated oscillator provided in an embodiment of this application. Figure 2eAs shown in the figure, the temperature-compensated oscillator comprises a resonant unit, a base, an upper cover, a temperature measuring device and a temperature compensation device, wherein the resonant unit is in a cavity between the base and the upper cover, and the temperature measuring device is on an inner base of the base.

[0121] In Figure 2e , the temperature compensation device is located outside the base as an example. In another example, the temperature compensation device can also be located inside the cavity (for example, on the inner base), which is not described in detail here.

[0122] Referring to Figure 2f , the figure is a structural schematic diagram of a constant-temperature oscillator provided by an embodiment of the present application. As shown in the figure, Figure 2f the constant-temperature oscillator comprises a resonant unit, a base, an upper cover, a heating device, a temperature measuring device and a temperature compensation device, wherein the resonant unit is in a cavity between the base and the upper cover, and the temperature measuring device is on an inner base of the base.

[0123] In Figure 2f , the temperature compensation device is located outside the base as an example. In another example, the temperature compensation device can also be located inside the cavity (for example, on the inner base), which is not described in detail here.

[0124] In addition, in Figure 2f , the heating device is located outside the base as an example. In another example, the heating device can also be located inside the cavity, which is not described in detail here.

[0125] In a specific example, the aforementioned temperature measuring device can be located on the inner side of the upper cover.

[0126] Referring to Figure 2g , the figure is a structural schematic diagram of a resonator provided by an embodiment of the present application. As shown in the figure, Figure 2g the resonator comprises a resonant unit, a base, an upper cover and a temperature measuring device, wherein the resonant unit is in a cavity between the base and the upper cover, and the temperature measuring device is on the inner side of the upper cover.

[0127] Referring to Figure 2h , the figure is a structural schematic diagram of a temperature-compensated oscillator provided by an embodiment of the present application. As shown in the figure, Figure 2h the temperature-compensated oscillator comprises a resonant unit, a base, an upper cover, a temperature measuring device and a temperature compensation device, wherein the resonant unit is in a cavity between the base and the upper cover, and the temperature measuring device is on the inner side of the upper cover.

[0128] In Figure 2hIn an example, the temperature compensation device is located outside the base. In another example, the temperature compensation device can also be located inside the cavity (e.g. on the inner bottom base), which is not described in detail herein.

[0129] Referring to FIG. 1, which is a structural schematic diagram of a temperature compensated oscillator according to an embodiment of the present application. As shown in the figure, the temperature compensated oscillator comprises a resonant unit, a base, an upper cover, a heating device, a temperature measuring device and a temperature compensation device. The resonant unit is located inside a cavity between the base and the upper cover, and the temperature measuring device is located inside the upper cover. Figure 2i Figure 2i In an example, the temperature compensation device is located outside the base. In another example, the temperature compensation device can also be located inside the cavity (e.g. on the inner bottom base), which is not described in detail herein.

[0130] In an example, the heating device is located outside the base. In another example, the heating device can also be located inside the cavity, which is not described in detail herein. Figure 2i In addition, in an example, the heating device is located outside the base. In another example, the heating device can also be located inside the cavity, which is not described in detail herein.

[0131] Figure 2i In a specific example, the aforementioned heating device can be located on the resonant unit. The resonant unit comprises a resonant region and a non-resonant region. The resonant region of the resonant unit is used for resonance to generate a resonant frequency. If the heating device is located in the resonant region, it will affect the resonant frequency output by the resonant unit, thereby affecting the performance of the resonant unit. Therefore, the heating device can be located in the non-resonant region of the resonant unit. Of course, it can be understood that if the problem of the heating device placed in the resonant region affecting the resonant frequency output by the resonant unit can be solved, the heating device can also be located in the resonant region of the resonant unit.

[0132] Referring to FIG. 1, which is a structural schematic diagram of a temperature compensated oscillator according to an embodiment of the present application. As shown in the figure, the temperature compensated oscillator comprises a resonant unit, a base, an upper cover, a heating device, a temperature measuring device and a temperature compensation device. The resonant unit is located inside a cavity between the base and the upper cover, and the temperature measuring device is located inside the upper cover.

[0133] Referring to FIG. 1, which is a structural schematic diagram of a temperature compensated oscillator according to an embodiment of the present application. As shown in the figure, the temperature compensated oscillator comprises a resonant unit, a base, an upper cover, a heating device, a temperature measuring device and a temperature compensation device. The resonant unit is located inside a cavity between the base and the upper cover, and the temperature measuring device is located inside the upper cover. Figure 3a Figure 3a Referring to FIG. 1, which is a structural schematic diagram of a temperature compensated oscillator according to an embodiment of the present application. As shown in the figure, the temperature compensated oscillator comprises a resonant unit, a base, an upper cover, a heating device, a temperature measuring device and a temperature compensation device. The resonant unit is located inside a cavity between the base and the upper cover, and the temperature measuring device is located inside the upper cover.

[0134] Referring to FIG. 1, which is a structural schematic diagram of a temperature compensated oscillator according to an embodiment of the present application. As shown in the figure, the temperature compensated oscillator comprises a resonant unit, a base, an upper cover, a heating device, a temperature measuring device and a temperature compensation device. The resonant unit is located inside a cavity between the base and the upper cover, and the temperature measuring device is located inside the upper cover. Figure 3b Figure 3b Referring to FIG. 1, which is a structural schematic diagram of a temperature compensated oscillator according to an embodiment of the present application. As shown in the figure, the temperature compensated oscillator comprises a resonant unit, a base, an upper cover, a heating device, a temperature measuring device and a temperature compensation device. The resonant unit is located inside a cavity between the base and the upper cover, and the temperature measuring device is located inside the upper cover.

[0135] In​​​​Figure 3b In an embodiment, the temperature compensation device is located outside the base. In another embodiment, the temperature compensation device can also be located inside the cavity, which is not described in detail herein.

[0136] Referring to FIG. 1, which is a structural schematic diagram of a constant-temperature oscillator according to an embodiment of the present application. As shown in the figure, the constant-temperature oscillator comprises a resonant unit, a base, an upper cover, a heating device, and a temperature compensation device, wherein the resonant unit is located in a cavity between the base and the upper cover, and the heating device is located in a non-resonant area of the resonant unit. Figure 3c Figure 3c In an embodiment, the temperature compensation device is located outside the base. In another embodiment, the temperature compensation device can also be located inside the cavity, which is not described in detail herein.

[0137] In an embodiment, the temperature compensation device is located outside the base. In another embodiment, the temperature compensation device can also be located inside the cavity, which is not described in detail herein. Figure 3c

[0138] Referring to FIG. 1, which is a structural schematic diagram of a constant-temperature oscillator according to an embodiment of the present application. As shown in the figure, the constant-temperature oscillator comprises a resonant unit, a base, an upper cover, a heating device, and a temperature compensation device, wherein the resonant unit is located in a cavity between the base and the upper cover, and the heating device is located in a non-resonant area of the resonant unit. Figure 3d Figure 3d In an embodiment, the temperature compensation device is located outside the base. In another embodiment, the temperature compensation device can also be located inside the cavity, which is not described in detail herein.

[0139] Referring to FIG. 1, which is a structural schematic diagram of a constant-temperature oscillator according to an embodiment of the present application. As shown in the figure, the constant-temperature oscillator comprises a resonant unit, a base, an upper cover, a heating device, and a temperature compensation device, wherein the resonant unit is located in a cavity between the base and the upper cover, and the heating device is located in a non-resonant area of the resonant unit. Figure 3e Figure 3e In an embodiment, the temperature compensation device is located outside the base. In another embodiment, the temperature compensation device can also be located inside the cavity, which is not described in detail herein.

[0140] In an embodiment, the temperature compensation device is located outside the base. In another embodiment, the temperature compensation device can also be located inside the cavity, which is not described in detail herein. Figure 3e Referring to FIG. 1, which is a structural schematic diagram of a constant-temperature oscillator according to an embodiment of the present application. As shown in the figure, the constant-temperature oscillator comprises a resonant unit, a base, an upper cover, a heating device, and a temperature compensation device, wherein the resonant unit is located in a cavity between the base and the upper cover, and the heating device is located in a non-resonant area of the resonant unit.

[0141] Figure 3f In an embodiment, the temperature compensation device is located outside the base. In another embodiment, the temperature compensation device can also be located inside the cavity, which is not described in detail herein. Figure 3f In an embodiment, the temperature compensation device is located outside the base. In another embodiment, the temperature compensation device can also be located inside the cavity, which is not described in detail herein.

[0142] Figure 3f ​​​​​​In this example, the temperature compensation device is located on the outside of the base. In another example, the temperature compensation device may also be located inside the cavity (e.g., on the inner base), which will not be described in detail here.

[0143] See also Figure 3g This figure is a schematic diagram of the structure of a resonator provided in an embodiment of this application. Figure 3g As shown, the resonator includes: a resonant unit, a base, a top cover, and a heating device, wherein the resonant unit is located in the cavity between the base and the top cover, and the heating device is located inside the top cover.

[0144] See also Figure 3h The figure is a schematic diagram of the structure of a temperature-compensated oscillator provided in an embodiment of this application. Figure 3h As shown, the temperature-compensated oscillator includes: a resonant unit, a base, a top cover, a heating device, and a temperature compensation device, wherein the resonant unit is located in the cavity between the base and the top cover, and the heating device is located inside the top cover.

[0145] exist Figure 3h In this example, the temperature compensation device is located on the outside of the base. In another example, the temperature compensation device may also be located inside the cavity (e.g., inside the top cover), which will not be described in detail here.

[0146] See also Figure 3i The figure is a schematic diagram of the structure of a temperature-controlled oscillator provided in an embodiment of this application. Figure 3i As shown, the constant temperature oscillator includes: a resonant unit, a base, a top cover, a heating device, and a temperature compensation device, wherein the resonant unit is located in the cavity between the base and the top cover, and the heating device is located inside the top cover.

[0147] exist Figure 3i In this example, the temperature compensation device is located on the outside of the base. In another example, the temperature compensation device may also be located inside the cavity (e.g., on the inner base), which will not be described in detail here.

[0148] In addition, although Figures 3a to 3i Not shown in the image, however, Figures 3a to 3i The device shown may also include a temperature measuring device for measuring the temperature of the resonant unit. The temperature measuring device may be located inside the cavity between the base and the top cover. The temperature measuring device may also be located in the non-oscillation region of the aforementioned resonant unit. Alternatively, the temperature measuring device may be located on the inner base of the base or on the inner side of the top cover. This will not be repeated here.

[0149] In this application, the shape of the temperature measuring device (e.g., a thermistor) can also be flexibly set. For example, the shape of the temperature measuring device can be as follows: Figure 4a The shape shown is strip-shaped, or the shape of the temperature measuring device can be curved, wherein: the curved shape can be, for example, as shown in the figure. Figure 4b The U-shape shown, or the curved shape, can also be like this. Figure 4c The serpentine shape shown, or the curved shape, can also be a ring. By flexibly setting the shape of the temperature measuring device, multi-point temperature measurement can be achieved, and the final output temperature of the temperature measuring device can be determined based on the results of multi-point temperature measurement, thus making the temperature measured by the temperature measuring device more stable and accurate.

[0150] In this application, the shape of the heating device (e.g., a resistor) can also be flexibly set. For example, the shape of the heating device can be as follows: Figure 4a The heating device can be in the shape of a strip, or it can be in a curved shape (e.g., ...). Figure 4b The U-shape shown, or, Figure 4c (As shown in the serpentine or ring shape). By flexibly setting the shape of the heating device, multi-point heating can be achieved, thereby improving the efficiency of regulating the temperature of the resonant unit.

[0151] In one example, the device for generating a resonant frequency provided in this application further includes a first pin and a second pin, both of which are used to connect the temperature measuring device to the outside of the base. The first and second pins can be used to power the temperature measuring device, enabling it to operate. In one example, both the first and second pins can be made of gold; in another example, both can be made of silver.

[0152] In one example, the device for generating a resonant frequency provided in this application embodiment further includes a first electrode and a second electrode. The first electrode is used to connect the temperature measuring device and the first pin; specifically, the first electrode is used to connect the first end of the temperature measuring device and the first pin. The second electrode is used to connect the temperature measuring device and the second pin; specifically, the second electrode is used to connect the second end of the temperature measuring device and the second pin. In one example, both the first electrode and the second electrode may be made of gold; in another example, both the first electrode and the second electrode may be made of silver. In a specific example, the first pin, the second pin, the first electrode, and the second electrode are made of the same material.

[0153] In one specific example, if the temperature measuring device is in the non-oscillation region of the resonant unit, the first pin, the second pin, the first electrode and the second electrode can also be located in the non-oscillation region of the resonant unit.

[0154] In one example, the device for generating resonant frequency provided by the present application further comprises a third pin and a fourth pin, both of which are used to connect the heating device outside the base. The third pin and the fourth pin can be used to power the heating device so that the heating device is in working condition. In one example, the material of the third pin and the fourth pin can both be gold, and in another example, the material of the third pin and the fourth pin can both be silver.

[0155] In one example, the device for generating resonant frequency provided by the present application further comprises a third electrode and a fourth electrode. The third electrode is used to connect the heating device and the third pin, specifically, the third electrode is used to connect the first end of the heating device and the third pin. The fourth electrode is used to connect the heating device and the fourth pin, specifically, the fourth electrode is used to connect the second end of the heating device and the fourth pin. In one example, the material of the third electrode and the fourth electrode can both be gold, and in another example, the material of the third electrode and the fourth electrode can both be silver. In one specific example, the material of the third pin, the fourth pin, the third electrode and the fourth electrode is the same.

[0156] In one specific example, if the heating device is in the non-oscillation region of the resonant unit, the third pin, the fourth pin, the third electrode and the fourth electrode can also be located in the non-oscillation region of the resonant unit.

[0157] In one example, if the aforementioned temperature treatment device comprises both a temperature measuring device and a heating device, and both the temperature measuring device and the heating device are inside the cavity, then for this case:

[0158] If the device for generating a resonant frequency provided by the present application is a temperature-compensated resonator or a temperature-compensated oscillator, the temperature of the resonant unit can be adjusted by using the heating device. In this case, the resonant unit can be at different temperatures by adjusting the power of the heating device, and the frequency generated by the resonant unit at the different temperatures is measured. Thus, the aforementioned compensation frequency deviation curve can be accurately obtained. Therefore, the aforementioned compensation frequency deviation curve can be accurately obtained by a method which is less costly than using a temperature box to control the temperature of the resonant unit. In addition, the temperature of the resonant unit can be accurately measured by using the temperature measuring device inside the cavity. Thus, the frequency output by the resonant unit can be compensated based on the measured temperature and the compensation frequency deviation curve obtained by adjusting the temperature of the resonant unit by using the heating device, thereby effectively reducing the temperature frequency deviation.

[0159] If the device for generating a resonant frequency provided by the present application is a temperature-compensated resonator or a temperature-compensated oscillator, the temperature of the resonant unit can be accurately measured by using the temperature measuring device inside the cavity. Accordingly, the heating power of the heating device can be controlled based on the measured temperature of the resonant unit, so that the resonant unit is at a certain constant temperature, thereby effectively reducing the temperature frequency deviation. In addition, since the heating device is inside the cavity, the power consumption of the heating device can be effectively reduced when the resonant unit is at a certain constant temperature by using the heating device.

[0160] In the case where the temperature processing device includes a heating device and a temperature measuring device, and the heating device and the temperature measuring device are both located in the non-oscillation area of the resonant unit, the structure of the resonant unit can be as shown in Figure 5a Figure 5a The present application provides a structure diagram of a resonant unit. As shown in Figure 5a The structure diagram of the upper surface and the lower surface of the resonant unit is shown in Figure 5a In the structure diagram, the A surface represents the upper surface of the resonant unit, and the B surface represents the lower surface of the resonant unit. In the structure diagram, Figure 5a

[0161] 1 represents the resonant unit, which is usually rectangular in shape.

[0162] 2 and 2' represent the oscillation area of the resonant unit, on which the electrodes are added to achieve resonance. The height of the oscillation area can be the same as or different from the height of the resonant unit 1. For example, Figure 5b The cross-sectional view of the resonant unit along the y direction is shown in Figure 5b (1) and (2) in the cross-sectional view show that the height of the oscillation area is higher than the height of the resonant unit 1, Figure 5b (3) and (4) in the cross-sectional view show that the height of the oscillation area is lower than the height of the resonant unit 1,​​Figure 5b (5) in FIG. 1 shows that the height of the oscillation region is the same as the height of the resonant unit 1.

[0163] 3 and 3' represent the main electrodes of the oscillation region, the electrode shape is usually rectangular or circular, the electrode material is usually gold or silver, and the thickness is about one hundred nanometers, which generates resonance on the resonant unit after voltage is applied.

[0164] 4 and 4' represent the third pins to which the main electrodes are connected to the outside, the material is usually gold or silver, which is used to connect to the base to further connect to the outside of the base to apply power to the main electrodes of the oscillation region.

[0165] 5 and 5' represent the auxiliary electrodes connected to the third pins, the material is usually gold or silver, which serves to connect the main electrodes to the third pins.

[0166] 6 represents the temperature measuring device, when the temperature measuring device is a thermistor, the material is usually a semiconductor metal oxide such as manganese, nickel, cobalt, vanadium, etc. The resistance value changes with temperature. The temperature measuring device does not contact the electrode traces (3 and 3', 4 and 4', and 5 and 5') of the oscillator.

[0167] 7 and 8 represent the first pin and the second pin to which the temperature measuring device is connected to the outside, which is used to connect to the base to further connect to the outside of the base to apply power to the temperature measuring device.

[0168] 9 represents the first electrode connected to the first pin 7 of the temperature measuring device 6.

[0169] 10 represents the second electrode connected to the first pin 8 of the temperature measuring device 6.

[0170] 11 and 12 represent the two vertices of the resonant unit, which serve to identify the upper and lower surfaces.

[0171] 13 represents the cross section along the y direction.

[0172] 14 represents the heating device, for example, a resistor.

[0173] 15 and 16 represent the third pin and the fourth pin to which the heating device is connected to the outside, which is used to connect to the base to further connect to the outside of the base to apply power to the heating device.

[0174] 17 represents the third electrode connected to the third pin 15 of the heating device 14.

[0175] 18 represents the fourth electrode connected to the fourth pin 16 of the heating device 14.

[0176] Although in Figure 5aIn the above description, the temperature measuring device is located on the upper surface of the resonant unit, and the heating device is located on the lower surface of the resonant unit. However, in actual applications, the temperature measuring device and the heating device can be located on the upper surface of the resonant unit, or the temperature measuring device and the heating device can be located on the lower surface of the resonant unit, or the temperature measuring device is located on the lower surface of the resonant unit, and the heating device is located on the upper surface of the resonant unit. In this way, the electrode traces of each component (for example, the temperature measuring device and the heating device) can not be electrically connected to other components.

[0177] The electronic device includes, but is not limited to, a network device or a terminal device. In addition to the device for generating a resonant frequency provided in the above embodiments, the electronic device can further include other devices. For example, the electronic device further includes a power supply module and a processor such as a central processing unit (CPU). The above embodiments are not listed one by one. Among them:

[0178] The network device mentioned in the embodiments of the present application includes, but is not limited to, a router, a switch, a base station, or a clock source device. The clock source device can be a server, for example. The clock source device can obtain high-precision time from a satellite antenna, and provide the high-precision time to other devices.

[0179] The terminal device mentioned in the embodiments of the present application includes, but is not limited to, a mobile phone, a tablet computer, or a wearable smart device. The terminal device can also be a personal computer or a server. The above embodiments are not listed one by one.

Claims

1. A device for generating a resonant frequency, characterized by The device comprises: a resonant unit, a base for packaging the resonant unit, an upper cover on top of the base, and a temperature processing device inside a cavity between the base and the upper cover, the temperature processing device comprising: a temperature measuring device and / or a heating device, the resonant unit for generating a resonant frequency, the temperature measuring device for measuring the temperature of the resonant unit, and the heating device for heating to adjust the temperature of the resonant unit.

2. The device of claim 1, wherein, The temperature measuring device is located in a non-oscillation area of the resonant unit, or the temperature measuring device is located on an inner base of the base, or the temperature measuring device is located on the inner side of the upper cover.

3. The device according to claim 1 or 2, characterized in that The temperature measuring device comprises: a thermistor, a pyroelectric, a thermocouple, or a thermopile.

4. The device of claim 3, wherein, The thermistor comprises: a negative temperature coefficient (NTC) thermistor, or a positive temperature coefficient (PTC) thermistor.

5. The device according to any of claims 1-4, characterized in that The temperature measuring device has a shape of: a strip or a curved shape.

6. The device according to any one of claims 1 to 5, characterized in that The heating device is located in a non-oscillation area of the resonant unit, or the heating device is located on an inner base of the base, or the heating device is located on the inner side of the upper cover.

7. The device according to any one of claims 1 to 6, characterized in that The heating device comprises: a device with resistance.

8. The device of claim 7, wherein, The device with resistance comprises: a resistor, or a diode, or a device with a material including metal, metal oxide, alloy, or semiconductor compound.

9. The device according to any of claims 1-8, characterized in that The heating device has a shape of: a strip or a curved shape.

10. The device according to any of claims 1-9, characterized in that The device further comprises: The temperature measuring device is connected to a first pin outside the base, and the temperature measuring device is connected to a second pin outside the base, the first pin and the second pin being used to power the temperature measuring device.

11. The device of claim 10, wherein, The device further comprises: a first electrode for connecting the temperature measuring device and the first pin, and a second electrode for connecting the temperature measuring device and the second pin.

12. The device of claim 11, wherein, The material of the first electrode and the material of the second electrode both include gold, or the material of the first electrode and the material of the second electrode both include silver.

13. The device according to any of claims 10-12, characterized in that The material of the first pin and the material of the second pin both include gold, or the material of the first pin and the material of the second pin both include silver.

14. The device of any of claims 1-13, wherein, The device further comprises: The heating device is connected to a third pin outside the base, and the heating device is connected to a fourth pin outside the base, the third pin and the fourth pin being used to power the heating device.

15. The device of claim 14, wherein, The device further comprises: a third electrode for connecting the heating device and the third pin, and a fourth electrode for connecting the heating device and the fourth pin.

16. The device of claim 15, wherein, The material of the third electrode and the material of the fourth electrode both include gold, or the material of the third electrode and the material of the fourth electrode both include silver.

17. The device of any of claims 14-16, wherein, The material of the third pin and the material of the fourth pin both include gold, or the material of the third pin and the material of the fourth pin both include silver.

18. The device of any of claims 1-17, wherein, The device comprises: an oscillator, or a resonator.

19. The device of claim 18, wherein, The oscillator is: a temperature compensated oscillator, or a constant temperature oscillator.

20. The device of claim 19, wherein, The temperature compensated oscillator comprises: temperature-compensated crystal oscillator, or, temperature-compensated micro-electro-mechanical system oscillator, or, temperature-compensated bulk acoustic oscillator, or, temperature-compensated surface acoustic oscillator.

21. The device of claim 19, wherein, The ovenized oscillator comprises: ovenized crystal oscillator, or, ovenized micro-electro-mechanical system oscillator, or, ovenized bulk acoustic oscillator, or, ovenized surface acoustic oscillator.

22. The device of claim 18, wherein, The resonator is: temperature-compensated resonator, or, ovenized resonator.

23. The device of claim 22, wherein, The temperature-compensated resonator comprises: temperature-compensated crystal resonator, or, temperature-compensated micro-electro-mechanical system resonator, or, temperature-compensated bulk acoustic resonator, or, temperature-compensated surface acoustic resonator.

24. The device of claim 22, wherein, The ovenized resonator comprises: ovenized crystal resonator, or, ovenized micro-electro-mechanical system resonator, or, ovenized bulk acoustic resonator, or, ovenized surface acoustic resonator.

25. The device of any of claims 18-24, wherein, If the device is the oscillator, the oscillator further comprises temperature compensation means for performing temperature compensation measures based on the temperature measured by the temperature measuring means.

26. The device of claim 25, wherein, If the oscillator is a temperature-compensated oscillator, the temperature compensation means comprise a first integrated circuit for performing frequency compensation of the frequency output by the resonating unit based on the temperature measured by the temperature measuring means to obtain the frequency output by the temperature-compensated oscillator.

27. The device of claim 25, wherein, If the oscillator is an ovenized oscillator, the temperature compensation means comprise a second integrated circuit for performing temperature compensation of the heating means based on the temperature measured by the temperature measuring means.

28. The device of any of claims 1-27, wherein, The resonating unit employs a piezoelectric material.

29. The device of claim 28, wherein, The piezoelectric material comprises: piezoelectric crystal, or, piezoelectric ceramic.

30. The device of claim 29, wherein, In case the piezoelectric material comprises a piezoelectric crystal, the resonating unit comprises a quartz crystal wafer.

31. An electronic device, comprising: The electronic device comprises the device of any one of claims 1-30.

32. The electronic device of claim 31, wherein, The electronic device comprises: network device or terminal device.

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