Thrust testing machine tool for wafer
By designing a wafer push tester carrier and utilizing the cooperation of indexing pin components and abutment components, the problem of wafer misalignment during placement was solved, ensuring the accuracy of identification points, reducing the cost of changing carriers, and improving production efficiency.
Patent Information
- Application Number
- CN202520007885.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-03
- Publication Date
- 2026-01-20
- Estimated Expiration
- 2035-01-03
AI Technical Summary
Existing thrust testing machines are prone to wafer misalignment due to equipment vibration or operator error when placing wafers, leading to identification point failure. Furthermore, replacing the carrier is costly and affects production efficiency.
A wafer push tester carrier was designed, including a disk, an indexing pin assembly, a stop assembly, and a second stop. Through the cooperation of the elastic structure and the indexing pin assembly, the wafer is ensured not to shift during placement, and is further fixed by adsorption holes and suction channels, adapting to wafers of different sizes.
It effectively prevents wafers from shifting during placement, avoids identification point failures, reduces the cost of changing carriers, and improves production efficiency.
Smart Images
Figure CN223815283U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor, especially relate to a wafer's push force test machine carrier. BACKGROUND
[0002] In the semiconductor industry, the wafer needs to test the adhesion of the electrode after plating the metal electrode, the first step is to weld the silver wire through the automatic welding equipment, and the push force test is carried out through the professional push force machine after welding, so as to test or prove that the electrode of the wafer has sufficient adhesion, and the principle of the push force test machine is based on the mechanical principle, that is, the relationship between force and displacement.
[0003] The push force test machine applies push force to the wafer and measures the displacement caused by the force on the wafer, so as to determine the strength and durability of the wafer, so as to ensure the quality and safety of the product, in addition, the new product development also needs to be verified on the machine, and the design performance of the product is evaluated, the data collected by the push force can be used for real-time monitoring on the production line to ensure the quality of the product in the production process, because the wafer has more than ten thousand core particles, so only the fixed point is tested during testing, and the test point is positioned through the pre-set identification point.
[0004] In the prior art, the operator of the existing push force test machine is easy to cause the wafer to deviate due to equipment vibration or his own operation during placing the wafer, which causes the identification of the identification point of the wafer to fail, and the existing push force test machine needs to replace the carrier to test the wafers with different positioning edge lengths, but the cost of customizing the carrier is high, and the replacement of the carrier affects the production efficiency. UTILITY MODEL CONTENTS
[0005] Therefore, the utility model aims at providing a wafer's push force test machine carrier, which can effectively solve the above problems in the prior art.
[0006] A wafer's push force test machine carrier, comprising a disc body, a dividing pin assembly threadedly connected to one side of the disc body, a key groove provided at the bottom of the disc body and facing one side of the dividing pin assembly, and a abutting assembly hinged in the key groove and pushed by the dividing pin assembly.
[0007] The disc body comprises a placing position arranged at the top of the disc body for placing a wafer and a first abutting member arranged on the outer circle of the placing position for abutting against the positioning edge of the wafer, a through hole is arranged at one end of the key groove and communicates with the outer circle of the placing position, the abutting assembly comprises an abutting structure hinged at the end of the key groove away from the through hole, a second abutting member for abutting against the wafer is arranged at the end of the abutting structure facing the through hole, the second abutting member is movably arranged in the through hole, a push-pull structure is arranged at the top of the abutting structure away from the second abutting member, an abutting surface for abutting against the index pin assembly is arranged at the side of the push-pull structure facing the index pin assembly, and the angle between the abutting surface and the index pin assembly is equal to 90° when the index pin assembly has the maximum stroke, and an elastic structure elastically connected with the key groove is arranged at the side of the push-pull structure away from the index pin assembly.
[0008] The utility model discloses beneficial effects are: through setting up abutting assembly, index pin assembly and second abutting member, so that the wafer does not deviate during the operation personnel places the wafer, specifically, by pulling the index pin assembly, when the index pin assembly and the abutting surface do not contact, the tension of the elastic structure makes the push-pull structure move away from the placing position, and simultaneously drives the second abutting member to move away from the placing position, until the side of the second abutting member abuts on the inner wall of the through hole, at this time, the wafer is placed into the placing position, and the positioning edge of the wafer faces the first abutting member, then the index pin assembly is loosened, the index pin assembly abuts on the abutting surface and pushes the push-pull structure to move towards the placing position, simultaneously drives the second abutting member to move towards the placing position, until the side of the second abutting member abuts on the side of the wafer, further makes the wafer be fixed by the first abutting member and the second abutting member, solves the problem that the wafer deviates because of equipment vibration or own skill problem, avoids the identification point identification failure of the wafer because of the wafer cheap.
[0009] Further, the index pin assembly comprises an index pin structure and a handle structure connected to the end of the index pin structure away from the disc body.
[0010] Further, a positioning groove is arranged at the end of the index pin structure facing the handle structure, and a limiting member matched with the positioning groove is arranged at the end of the handle structure facing the index pin structure.
[0011] Further, the outer circle of the placing position is a slope, and a mounting groove for adapting to the positioning edges of wafers of different sizes is further arranged on the placing position, the mounting groove is used for mounting the first abutting member, and the mounting groove is arranged at the side of the first abutting member facing the placing position.
[0012] Further, an adsorption hole is arranged on the top of the placing position, and an air suction passage for connecting the adsorption equipment is arranged on the disc body and communicates with the adsorption hole, and the air suction passage is arranged on the side of the first abutting member away from the placing position.
[0013] Further, a cleaning hole for cleaning the air suction passage is arranged on the bottom of the disc body and is arranged below the placing position.
[0014] Further, a foolproof hole for taking out the disc body is arranged on the bottom of the disc body and is arranged on the side of the placing position towards the first abutting member and the side of the placing position away from the first abutting member.
[0015] Further, a taking and placing hole for taking and placing the wafer is arranged on the top of the disc body and is arranged on the side of the placing position away from the index pin assembly.
[0016] Further, a third abutting member for abutting the wafer is arranged on the outer circle of the placing position and is arranged on the two sides of the taking and placing hole.
[0017] Further, a maintenance hole for maintaining the abutting assembly is arranged on the bottom of the disc body and is arranged on the key groove. BRIEF DESCRIPTION OF DRAWINGS
[0018] Fig. 1 FIG. 1 is a schematic diagram of the overall structure of a wafer thrust test machine carrier according to an embodiment of the present application;
[0019] Fig. 2 FIG. 2 is a schematic diagram of the bottom view of a wafer thrust test machine carrier according to an embodiment of the present application;
[0020] Fig. 3 FIG. 3 is a schematic diagram of a partial structure of a wafer thrust test machine carrier according to an embodiment of the present application;
[0021] Fig. 4 FIG. 4 is a schematic diagram of the overall structure of an abutting assembly according to an embodiment of the present application;
[0022] MAIN ELEMENT SYMBOL EXPLANATION
[0023]
[0024]
[0025] The following specific embodiments will further illustrate the present application in combination with the above-mentioned drawings. DETAILED DESCRIPTION
[0026] For the purpose of facilitating the understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. Several embodiments of the present application are shown in the drawings. However, the present application can be realized in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.
[0027] It should be noted that when an element is referred to as being "fixed" to another element, it can be directly on the other element or there can be an intervening element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can be present. The terms "vertical", "horizontal", "left", "right", and the like as used herein are for purposes of illustration only and are not intended to limit the present application.
[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.
[0029] Please refer to Figs. 1 to 4 The wafer thrust test machine carrier in the embodiment of the present application comprises a disc body 10, a dividing pin assembly 30 threadedly connected to one side of the disc body 10, a key groove 11 arranged at the bottom of the disc body 10 and facing one side of the dividing pin assembly 30, and a abutting assembly 40 hingedly arranged in the key groove 11 and pushed by the dividing pin assembly 30.
[0030] The disc body 10 includes a placement position 12 arranged on the top of the disc body 10 for placing a wafer and a first abutting member 13 arranged on the outer circle of the placement position 12 for abutting against the positioning edge of the wafer, a through hole 14 penetrating through the disc body 10 and communicating to the outer circle of the placement position 12 is arranged at one end of the key groove 11, the abutting assembly 40 includes an abutting structure 41 hinged at the end of the key groove 11 away from the through hole 14, a second abutting member 42 for abutting against the wafer is arranged at the end of the abutting structure 41 facing the through hole 14, the second abutting member 42 is movably arranged in the through hole 14, a push-pull structure 43 is arranged on the top of the abutting structure 41 away from the side of the second abutting member 42, an abutting surface 44 for abutting against the index pin assembly 30 is arranged on the side of the push-pull structure 43 facing the index pin assembly 30, the angle between the abutting surface 44 and the index pin assembly 30 is equal to 90° when the index pin assembly 30 reaches the maximum stroke, and an elastic structure 45 elastically connected with the key groove 11 is arranged on the side of the push-pull structure 43 away from the index pin assembly 30.
[0031] It can be understood that by pulling the index pin assembly 30, when the index pin assembly 30 is not in contact with the abutting surface 44, the tension of the elastic structure 45 makes the push-pull structure 43 move away from the placement position 12, and at the same time drives the second abutting member 42 to move away from the placement position 12, until one side of the second abutting member 42 abuts against the inner wall of the through hole 14, at this time the wafer is placed in the placement position 12 and the positioning edge of the wafer faces the first abutting member 13, then the index pin assembly 30 is released, the index pin assembly 30 abuts against the abutting surface 44 and pushes the push-pull structure 43 to move towards the placement position 12, at the same time drives the second abutting member 42 to move towards the placement position 12, until one side of the second abutting member 42 abuts against one side of the wafer, thereby fixing the wafer by the first abutting member 13 and the second abutting member 42, solving the problem of wafer deviation caused by equipment vibration or improper handling, and avoiding the recognition failure of the recognition point of the wafer due to the cheapness of the wafer.
[0032] Further, the index pin assembly 30 includes an index pin structure 31 and a handle structure 32 connected to the end of the index pin structure 31 away from the disc body 10.
[0033] Further, a positioning groove 33 is arranged at the end of the index pin structure 31 facing the handle structure 32, and a limiting member 34 matched with the positioning groove 33 is arranged at the end of the handle structure 32 facing the index pin structure 31.
[0034] It can be understood that by setting the handle structure 32, the operator can more conveniently pull the index pin structure 31, by setting the positioning groove 33 and the limiting piece 34, the operator can fix the handle structure 32 through the limiting piece 34 after pulling out the index pin structure 31 through the handle structure 32, and the handle structure 32 is avoided from rebounding.
[0035] Further, the outer circle of the placement site 12 is a slope, and a mounting groove 15 for adapting to different sizes of wafer positioning edges is arranged on the placement site 12, the mounting groove 15 is used for mounting the first abutting piece 13, and the mounting groove 15 is arranged on the side of the first abutting piece 13 facing the placement site 12.
[0036] It can be understood that by setting the outer circle of the placement site 12 as a slope, when the wafer is placed into the placement site 12, the offset side of the wafer moves towards the center of the placement site 12, and by setting the mounting groove 15, the utility model can be applied to wafers with different lengths of positioning edges.
[0037] Further, the top of the placement site 12 is further provided with a suction hole 16, and the disc body 10 is provided with a suction passage 17 communicating with the suction hole 16 and used for connecting a suction device, and the suction passage 17 is arranged on the side of the first abutting piece 13 away from the placement site 12.
[0038] Further, the bottom of the disc body 10 is further provided with a cleaning opening 18 facilitating cleaning of the suction passage 17, and the cleaning opening 18 is arranged below the placement site 12.
[0039] It can be understood that by setting the suction hole 16 and the suction passage 17, the wafer can be further fixed on the placement site 12, and by setting the cleaning opening 18, dirt entering the suction passage 17 through the suction hole 16 can be cleaned through the cleaning opening 18.
[0040] Further, the bottom of the disc body 10 is further provided with a foolproof opening 19 facilitating taking out of the disc body 10, and the foolproof opening 19 is arranged on the side of the placement site 12 facing the first abutting piece 13 and the side of the placement site 12 away from the first abutting piece 13.
[0041] It can be understood that by setting the foolproof opening 19, the utility model will not be stuck during installation or disassembly.
[0042] Further, the top of the disc body 10 is further provided with a taking and placing opening 20 facilitating taking and placing of wafers, and the taking and placing opening 20 is arranged on the side of the placement site 12 away from the index pin assembly 30.
[0043] Further, a third abutting part 21 for abutting against the wafer is arranged on the outer ring of the placing position 12, and the third abutting part 21 is arranged on both sides of the taking and placing opening 20.
[0044] It can be understood that the wafer is generally moved by a vacuum suction pen, and the taking and placing opening 20 is arranged so that the vacuum suction pen can be taken out through the taking and placing opening 20, and the third abutting part 21 is arranged so that the wafer can be further fixed on the placing position 12.
[0045] Further, a maintenance opening 22 for facilitating maintenance of the abutting assembly 40 is arranged on the bottom of the disc body 10, and the maintenance opening 22 is arranged on the key groove 11.
[0046] In summary, the wafer thrust test machine carrier in the above-mentioned embodiments of the utility model is arranged with the abutting assembly, the index pin assembly and the second abutting part, so that the wafer will not be offset during the operation of placing the wafer by the operator, and specifically, the index pin assembly is pulled, when the index pin assembly is not in contact with the abutting surface, the tension of the elastic structure makes the push-pull structure move away from the placing position, and at the same time, the second abutting part is driven to move away from the placing position, until the side of the second abutting part abuts against the inner wall of the through hole, at this time, the wafer is placed in the placing position, and the positioning edge of the wafer faces the first abutting part, and then the index pin assembly is released, the index pin assembly abuts against the abutting surface and pushes the push-pull structure to move towards the placing position, at the same time, the second abutting part is driven to move towards the placing position, until the side of the second abutting part abuts against the side of the wafer, so that the wafer is fixed by the first abutting part and the second abutting part, and the problem that the wafer is offset due to the vibration of the equipment or the operation method of the operator is solved, and the problem that the identification point of the wafer is not recognized due to the wafer being cheap is avoided.
[0047] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the utility model. In the present specification, the illustrative description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0048] The above-described embodiments only express several implementation manners of the utility model, the description is more specific and detailed, but can not therefore be understood as the limitation of the utility model patent range. It should be pointed out that for ordinary skilled person in the art, without departing from the utility model concept, several deformations and improvements can be made, which belong to the protection range of the utility model. Therefore, the protection range of the utility model patent should be subject to the appended claims.
Claims
1. A wafer push force tester vehicle, comprising: The disc body, the indexing pin assembly connected with the disc body, the keyway arranged on the bottom of the disc body and the abutting assembly hinged in the keyway and pushed by the indexing pin assembly; The disc body includes a placement position arranged on the top of the disc body for placing a wafer and a first abutting piece arranged on the outer circle of the placement position for abutting the positioning edge of the wafer, a through hole is arranged at one end of the keyway and communicates with the outer circle of the placement position, the abutting assembly includes an abutting structure hinged at the end of the keyway away from the through hole, a second abutting piece for abutting the wafer is arranged on the end of the abutting structure facing the through hole, the second abutting piece is movably arranged in the through hole, a push-pull structure is arranged on the top of the abutting structure away from the second abutting piece, an abutting surface for abutting the indexing pin assembly is arranged on the side of the push-pull structure facing the indexing pin assembly, the angle between the abutting surface and the indexing pin assembly is equal to 90° when the indexing pin assembly reaches the maximum stroke, and an elastic structure elastically connected with the keyway is arranged on the side of the push-pull structure away from the indexing pin assembly.
2. The wafer push force test vehicle of claim 1, wherein, The indexing pin assembly includes an indexing pin structure and a handle structure connected with the end of the indexing pin structure away from the disc body.
3. The wafer push force test vehicle of claim 2, wherein, A positioning groove is arranged on the end of the indexing pin structure facing the handle structure, and a limiting piece matched with the positioning groove is arranged on the end of the handle structure facing the indexing pin structure.
4. The wafer push force test vehicle of claim 1, wherein, The outer circle of the placement position is a slope, and a mounting groove for adapting to the positioning edges of wafers with different sizes is further arranged on the placement position, the mounting groove is used for mounting the first abutting piece, and the mounting groove is arranged on the side of the first abutting piece facing the placement position.
5. The wafer push force test vehicle of claim 1, wherein, An adsorption hole is further arranged on the top of the placement position, and a suction passage for connecting a suction device and communicating with the adsorption hole is arranged on the disc body, the suction passage is arranged on the side of the first abutting piece away from the placement position.
6. The wafer push force test vehicle of claim 5, wherein, A cleaning port for facilitating cleaning of the suction passage is further arranged on the bottom of the disc body, and the cleaning port is arranged below the placement position.
7. The wafer push force test vehicle of claim 1, wherein, A foolproof port for facilitating taking out of the disc body is further arranged on the bottom of the disc body, and the foolproof port is arranged on the side of the placement position facing the first abutting piece and the side of the placement position away from the first abutting piece.
8. The wafer push force test vehicle of claim 1, wherein, A taking and placing port for facilitating taking and placing of the wafer is further arranged on the top of the disc body, and the taking and placing port is arranged on the side of the placement position away from the indexing pin assembly.
9. The wafer push force test vehicle of claim 8, wherein, A third abutting piece for abutting the wafer is further arranged on the outer circle of the placement position, and the third abutting piece is arranged on both sides of the taking and placing port.
10. The wafer push force test vehicle of claim 1, wherein, A maintenance port for facilitating maintenance of the abutting assembly is further arranged on the bottom of the disc body, and the maintenance port is arranged on the keyway.