Heat dissipation module of interchange structure

Abstract

The utility model relates to a heat dissipation module of an interchange structure, which belongs to the technical field of heat dissipation of notebook computers and comprises a heat dissipation fin, and a heat conduction assembly which extends out of the heat dissipation fin and can smoothly take away heat of the heat dissipation fin is arranged at the top of the heat dissipation fin. Heat dissipation assemblies for dissipating heat of the heat conduction assembly are arranged on the inner side of the heat conduction assembly and located on the left side and the right side of the cooling fins. According to the heat dissipation module of the overpass structure, the upper heat pipe and the lower heat pipe on the heat conduction assembly are arranged on the upper side and the lower side of the heat dissipation fins respectively to form an overpass shape, the width of the heat dissipation fins can be effectively reduced, a notebook computer is lighter, meanwhile, the upper heat pipe and the lower heat pipe are arranged on the tops and the bottoms of the heat dissipation fins respectively, and heat is dissipated to the heat dissipation fins in the process of conducting heat to the heat dissipation fins. Heat can be conducted from the upper sides and the lower sides of the heat dissipation fins to the middles at the same time, heat conduction is accelerated, heat dissipation efficiency is improved, the overall heat dissipation effect of the notebook computer is improved, the heat dissipation fins are in a multi-piece type, and the heat dissipation effect can be improved while smooth air circulation is guaranteed.

Description

TECHNICAL FIELD

[0001] The utility model relates to notebook computer heat dissipation technical field, concretely is a heat dissipation module of vertical structure. BACKGROUND

[0002] The heat dissipation module is important to the performance, stability, service life and user experience of the notebook computer, and the CPU, GPU and other core hardware of the notebook computer generate a large amount of heat during operation, if the heat is not dissipated in time, the operation speed of the notebook computer will be slowed down, and the response will be sluggish, therefore, the heat dissipation structure is needed to help the notebook computer to continuously operate.

[0003] The conventional notebook computer heat dissipation scheme at present is mainly that the heat pipes are arranged above the heat dissipation fins, and the heat dissipation fin area is occupied, the heat can be dissipated by the heat dissipation fins in time through the cooperation of the heat dissipation fins and the heat pipes, and the heat dissipation fins and the heat pipes form a cooperative heat dissipation system.

[0004] However, the heat dissipation effect of the above scheme is not good enough, because the heat conducted to the heat dissipation fins by the heat pipes cannot be rapidly conducted to the lower side of the heat dissipation fins, and the heat is accumulated, so that the heat cannot be rapidly dissipated, and therefore the heat dissipation module of vertical structure is proposed to solve the above problems. UTILITY MODEL CONTENTS

[0005] In view of the defects of the prior art, the utility model provides a heat dissipation module of vertical structure, which has the advantages of good heat dissipation effect, and solves the problem of poor heat dissipation effect of the heat dissipation module.

[0006] To achieve the above object, the utility model provides the following technical scheme: a heat dissipation module of vertical structure, comprising a heat dissipation fin, the top of the heat dissipation fin is provided with a heat conduction assembly extending to the outside of the heat dissipation fin and capable of smoothly taking away the heat of the heat dissipation fin, the inner side of the heat conduction assembly and located on the left and right sides of the heat dissipation fin is provided with a heat dissipation assembly for dissipating heat of the heat conduction assembly.

[0007] The heat conduction assembly comprises an upper heat pipe fixed with the bottom of the heat dissipation fin and extending to the outside of the heat dissipation fin, and the bottom of the heat dissipation fin is fixed with a lower heat pipe extending to the outside of the heat dissipation fin.

[0008] Further, the lower heat pipe and the upper heat pipe are both in the shape of arch, and the upper heat pipe and the lower heat pipe are both made of copper.

[0009] Further, the top of the heat dissipation fin and located on the front and rear sides of the heat conduction assembly is fixed with a stable plate, and each stable plate extends to the outside of the heat dissipation fin.

[0010] Further, the left and right sides of the stable plate located on the rear side and located on the outside of the heat dissipation fin are both provided with a stable hole, and the mounting hole is formed in the stable plate located on the front side.

[0011] Further, each of the heat dissipation assemblies comprises heat dissipation fins fixed with the bottom of the upper heat pipe, and the rear side of each of the heat dissipation fins is provided with a heat dissipation fan.

[0012] Further, each of the heat dissipation fans comprises a fan shell fixed with the rear side of the heat dissipation fin, and each of the fan shells is provided with an electric fan.

[0013] Further, the bottom of each of the heat dissipation fins is fixed with the lower heat pipe, and the heat dissipation fins are made of aluminum.

[0014] Further, the connection between the heat dissipation fin and the upper heat pipe is in an upward convex shape, and the connection between the heat dissipation fin and the lower heat pipe is in a downward concave shape.

[0015] Compared with the prior art, the technical scheme has the following beneficial effects:

[0016] The heat dissipation module of the overpass structure, the upper heat pipe and the lower heat pipe on the heat conduction assembly are arranged on the upper and lower sides of the heat dissipation fin respectively, forming an overpass shape, which can effectively reduce the width of the heat dissipation fin, making the notebook more portable, and meanwhile, the upper heat pipe and the lower heat pipe are respectively arranged at the top and the bottom of the heat dissipation fin, so that the heat can be simultaneously conducted from the upper and lower sides of the heat dissipation fin to the middle during the heat conduction to the heat dissipation fin, accelerating the heat conduction and improving the heat dissipation efficiency and the overall heat dissipation effect of the notebook. BRIEF DESCRIPTION OF DRAWINGS

[0017] Fig. 1 It is a structural schematic view of the utility model;

[0018] Fig. 2 It is a connection relationship view of the heat conduction assembly and the heat dissipation fin of the utility model;

[0019] Fig. 3 It is a connection relationship view of the heat conduction assembly and the heat dissipation fin of the utility model.

[0020] In the drawing: 1 heat dissipation fin, 2 heat conduction assembly, 201 upper heat pipe, 202 lower heat pipe, 3 heat dissipation assembly, 301 heat dissipation fan, 302 heat dissipation fin. DETAILED DESCRIPTION

[0021] The technical scheme in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all the other embodiments obtained by the ordinary skilled in the art without creative labor belong to the scope of protection of the utility model.

[0022] Please refer to Figs. 1 to 3The heat dissipation module of the overpass structure in the embodiment comprises a heat dissipation fin 1, the top of the heat dissipation fin 1 is provided with a heat conduction component 2 extending to the outside of the heat dissipation fin 1 and capable of smoothly taking away the heat of the heat dissipation fin 1, and the inner side of the heat conduction component 2 and located at the left and right sides of the heat dissipation fin 1 is provided with a heat dissipation component 3 for dissipating the heat of the heat conduction component 2.

[0023] It needs to be further explained that the heat conduction component 2 comprises an upper heat pipe 201 fixed with the bottom of the heat dissipation fin 1 and extending to the outside of the heat dissipation fin 1, the upper heat pipe 201 can take out the heat at the bottom of the heat dissipation fin 1, and the lower heat pipe 202 can quickly take out the heat at the top of the heat dissipation fin 1, and the bottom of the heat dissipation fin 1 is fixed with the lower heat pipe 202 extending to the outside of the heat dissipation fin 1.

[0024] In addition, the lower heat pipe 202 and the upper heat pipe 201 are both in the shape of an arch, the arch-shaped upper heat pipe 201 and the lower heat pipe 202 can improve the space utilization rate and leave enough space for other elements of the notebook computer, the upper heat pipe 201 and the lower heat pipe 202 are both made of copper, copper has a very high thermal conductivity and ranks first among common metals, which means that the copper heat pipe can quickly transfer the heat generated by the heat sources such as the CPU and GPU of the notebook computer to the heat dissipation component 3 and efficiently complete the heat conduction task, thereby effectively reducing the hardware temperature and ensuring the performance stability of the notebook computer under high load, at the same time, copper has good flexibility and ductility, which makes the copper heat pipe more easily bent and wired in the complex space structure inside the notebook computer and adapt to different heat dissipation module design requirements, and the shape of the copper heat pipe can be flexibly adjusted according to the layout inside the notebook computer, better fit the heat generating elements and the heat dissipation components, and ensure the efficiency of heat transfer, the top of the heat dissipation fin 1 and located at the front and back of the heat conduction component 2 are both fixed with a stable plate, each stable plate extends to the outside of the heat dissipation fin 1, the stable plate plays a fixing role and can improve the stability of the whole heat dissipation fin 1.

[0025] It can be known that the left and right sides of the stable plate located at the rear side and outside the heat dissipation fin 1 are both provided with a stable hole, and the front side of the stable plate is provided with a mounting hole, the stable hole and the mounting hole can be smoothly passed through by the bolt, so as to fix the stable plate through the stable hole and the mounting hole and further indirectly fix the heat dissipation fin 1, the connection between the heat dissipation fin 1 and the upper heat pipe 201 is in the shape of upward protrusion, and the connection between the heat dissipation fin 1 and the lower heat pipe 202 is in the shape of downward concave, the inner concave part and the upward protruding part of the heat dissipation fin 1 are respectively used to provide space for the lower heat pipe 202 and the upper heat pipe 201.

[0026] In the embodiment, the upper heat pipe 201 and the lower heat pipe 202 are arranged on the upper and lower sides of the heat dissipation component 3 respectively, forming a “viaduct” shape, which can effectively save space and at the same time speed up the heat transfer speed on the heat dissipation component 3, further improving the heat dissipation effect.

[0027] Please refer to Figs. 1 to 3In order to ensure that the heat is smoothly dissipated, each heat dissipation assembly 3 in the embodiment includes heat dissipation fins 302 fixed with the bottom of the upper heat pipe 201, and the rear side of each heat dissipation fin 302 is provided with a heat dissipation fan 301. When the heat dissipation fan 301 is started, the air with relatively low temperature flows through the heat dissipation fin 302, so that the heat on the heat dissipation fin 302 is smoothly taken away, and the cooling effect is realized.

[0028] It can be understood that each heat dissipation fan 301 includes a fan shell fixed with the rear side of the heat dissipation fin 302, the fan shell provides space for the air to flow through the heat dissipation fin 302, and the fan shell is fixedly communicated with the heat dissipation fin 302. When the electric fan is started, the electric fan sucks in the air, the air flows into the heat dissipation fin 302 through the fan shell, and the heat dissipation fin 302 is effectively cooled. Each fan shell is provided with an electric fan, the bottom of the two heat dissipation fins 302 is fixed with the lower heat pipe 202, the heat dissipation fin 302 is made of aluminum, the heat conduction performance of aluminum is good, and is still at a relatively high level among common metals. The aluminum can quickly absorb and conduct the heat transferred from the heat pipe. The aluminum is easy to react with oxygen in the air and form a dense aluminum oxide film on the surface. The oxide film can prevent the internal aluminum from being further oxidized, so that the aluminum has good corrosion resistance and can maintain stable performance in different use environments, prolong the service life of the heat dissipation fin 302, ensure that the heat dissipation system works stably for a long time, and the heat dissipation fin 302 is in a plurality of pieces.

[0029] In the embodiment, the heat dissipation fin 302 is composed of a plurality of single pieces. In order to make the air flow of the fan smoothly pass through the heat dissipation fin 302 and take away the heat, the heat dissipation fan 301 can provide a stable and smooth channel for the air flow, and the heat dissipation is facilitated.

[0030] It can be understood that the upper heat pipe 201 and the lower heat pipe 202 are alternately arranged on the upper and lower sides of the heat dissipation fin 1, fully absorb the heat on the heat dissipation fin 1, and then simultaneously transfer the heat to the upper and lower sides of the heat dissipation fin 302. The heat is quickly taken away through the heat dissipation fin 302. This mode can shorten the area of the heat dissipation fin 302, improve the space utilization rate, and at the same time improve the heat dissipation effect.

[0031] The electric elements in the embodiment are electrically connected with the controller and the power supply. The control mode of the utility model is controlled by the controller. The control circuit of the controller can be realized by simple programming of the person skilled in the art. The power supply also belongs to the common knowledge in the art. And the utility model is mainly used for protecting mechanical devices, so the control mode and the circuit connection are not explained in detail.

[0032] The working principle of the above embodiment is as follows:

[0033] When used, the computer chip contacts the heat dissipation fin 1, and the heat is transmitted from the computer chip to the heat dissipation fin 1, and due to the fixed relationship between the heat dissipation fin 1 and the upper heat pipe 201 and the lower heat pipe 202, the heat is transmitted to the upper and lower sides of the two heat dissipation fins 302 through the upper heat pipe 201 and the lower heat pipe 202, and the heat on the heat dissipation fins 302 can be quickly taken away by the rotation of the heat dissipation fan 301, thereby indirectly dissipating heat for the computer chip, and the heat dissipation module conducts the heat of the computer chip to the heat dissipation fin 1, conducts the heat to the heat conduction assembly 2 through the heat dissipation fin 1, conducts the heat of the heat conduction assembly 2 to the heat dissipation fins 302, and finally blows out the heat through the heat dissipation fan 301, and the heat conduction assembly 2 is in a “viaduct” structure, which can effectively shorten the width of the heat dissipation fins 302, promote the light weight of the notebook computer, and improve the heat dissipation effect.

[0034] It should be noted that, in this document, the terms such as first and second are used merely to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply there is any such actual relationship or order between these entities or operations. Moreover, the terms “comprising”, “including” or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such a process, method, article or equipment. Without more limitations, the element defined by the statement “comprising a” does not exclude the presence of additional identical elements in the process, method, article or equipment including the element.

[0035] Although the embodiments of the present application have been shown and described, it is understood that those of ordinary skill in the art can make various changes, modifications, replacements and variations to these embodiments without departing from the principles and spirits of the present application.

Claims

1. A heat dissipation module for overpass structure, comprising a heat dissipation fin (1), characterized in that: The top of the fin (1) is provided with a heat conduction assembly (2) extending to the outside of the fin (1) and capable of smoothly taking away the heat of the fin (1), the inner side of the heat conduction assembly (2) and located on the left and right sides of the fin (1) is provided with a heat dissipation assembly (3) for dissipating heat of the heat conduction assembly (2); The heat conduction assembly (2) comprises an upper heat pipe (201) fixed with the bottom of the fin (1) and extending to the outside of the fin (1), and the bottom of the fin (1) is fixed with a lower heat pipe (202) extending to the outside of the fin (1).

2. The heat dissipation module of a grade separation structure according to claim 1, characterized in that: The lower heat pipe (202) and the upper heat pipe (201) are both in the shape of arch, and the upper heat pipe (201) and the lower heat pipe (202) are both made of copper.

3. The heat dissipation module of claim 1, wherein: The top of the fin (1) and located on the front and rear sides of the heat conduction assembly (2) is fixed with a stable plate, and each stable plate extends to the outside of the fin (1).

4. The heat dissipation module of a grade separation structure according to claim 3, characterized in that: The left and right sides of the stable plate located on the rear side and located outside the fin (1) are both provided with a stable hole, and the mounting hole is provided on the stable plate located on the front side.

5. The heat dissipation module of claim 1, wherein: Each heat dissipation assembly (3) comprises a heat dissipation fin (302) fixed with the bottom of the upper heat pipe (201), and the rear side of each heat dissipation fin (302) is provided with a heat dissipation fan (301).

6. The heat dissipation module of a grade separation structure according to claim 5, wherein: Each heat dissipation fan (301) comprises a fan shell fixed with the rear side of the heat dissipation fin (302), and each fan shell is provided with an electric fan.

7. The heat dissipation module of claim 5, wherein: The bottom of the two heat dissipation fins (302) is fixed with the lower heat pipe (202), and the heat dissipation fin (302) is made of aluminum.

8. The heat dissipation module of claim 1, wherein: The connection between the fin (1) and the upper heat pipe (201) is in the shape of upward protrusion, and the connection between the fin (1) and the lower heat pipe (202) is in the shape of downward concave.

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