LED packaging structure

Abstract

The utility model discloses an LED packaging structure which comprises a substrate, an LED wafer is arranged on the substrate, a fluorescent diaphragm is arranged on the top surface of the LED wafer, a white wall colloid is further arranged on the substrate, a first hole is formed in the bottom of the white wall colloid, a second hole communicated with the first hole is formed in the top of the white wall colloid, and the first hole is communicated with the second hole. A first hole and a second hole are formed in the LED wafer, a step surface is formed at the boundary of the first hole and the second hole, the first hole is matched with the LED wafer, a transparent protection layer covering the fluorescent diaphragm is arranged in the second hole, the transparent protection layer is connected with the white wall colloid in a sealing manner, and the fluorescent diaphragm is not in contact with the white wall colloid. The LED packaging structure is stable in structure and long in service life.

Description

TECHNICAL FIELD

[0001] The utility model relates to LED packaging technical field, especially a kind of LED packaging structure. BACKGROUND

[0002] As solid semiconductor device, LED has the advantages of small size, light weight, high luminous efficiency, energy saving and environmental protection, and has been widely used in various industries, and the market demand for LED is also increasing. Single-sided light-emitting LED is widely used in lighting, backlight and automotive fields due to its small size, light thickness, high power load, small size and high flexibility.

[0003] At present, most of the LED packaging structures that achieve single-sided light emission on the market use white wall glue to surround the LED wafer. In the production of single-sided light-emitting LED, the LED wafer 2 is first welded on the substrate 1, then the fluorescent film 4 with the same size as the surface of the LED wafer 2 is bonded on the top of the LED wafer 2 using adhesive, and finally white wall glue 3 is injected around the fluorescent film 4 to form a frame (as shown in Figure 1 However, due to the difference in material between the fluorescent film and the white wall glue, when the LED device is subjected to high and low temperature cold and hot impact, the white wall glue and the fluorescent film on the surface of the material will be affected by the temperature difference based on the thermal physical properties of different materials, and then a large stress will be generated, which easily leads to cracking at the junction of the fluorescent film and the white wall glue, seriously affecting the waterproof performance of the LED device, and thus shortening the overall service life of the LED device. UTILITY MODEL CONTENTS

[0004] The utility model solves the technical problem of providing a long-service-life LED packaging structure.

[0005] To solve the above technical problems, the utility model adopts the technical scheme of: an LED packaging structure, comprising a substrate, the substrate is provided with an LED wafer, the top surface of the LED wafer is provided with a fluorescent film, the substrate is further provided with a white wall glue, the bottom of the white wall glue has a first hole, the top of the white wall glue has a second hole communicating with the first hole, the boundary between the first hole and the second hole forms a step surface, the first hole is matched with the LED wafer, the second hole is provided with a transparent protective layer covering the fluorescent film, the transparent protective layer is sealingly connected with the white wall glue, and the fluorescent film is not in contact with the white wall glue.

[0006] In an embodiment, the transparent protective layer is formed by solidification of a transparent fluid material, and the transparent protective layer fills the second hole.

[0007] In an embodiment, the transparent protective layer is made of silica gel, silicone or epoxy resin.

[0008] In an embodiment, the top surface of the transparent protective layer is flush with the top surface of the white wall glue.

[0009] In an embodiment, the stepped surface is in the form of a continuous ring frame, and the stepped surface surrounds the first hole.

[0010] In an embodiment, the stepped surface is flush with the top surface of the LED wafer.

[0011] In an embodiment, the phosphor film coincides with the top surface of the LED wafer when the LED packaging structure is viewed from a top perspective.

[0012] In an embodiment, the phosphor film is bonded to the LED wafer.

[0013] In an embodiment, the white wall glue is bonded to the substrate.

[0014] In an embodiment, the substrate is provided with a positive electrode pad and a negative electrode pad, and the LED wafer is electrically connected to the positive electrode pad and the negative electrode pad, respectively.

[0015] The LED packaging structure has the advantages that the white wall glue and the phosphor film are not in direct contact, the cracking of the white wall glue and the phosphor film caused by different materials and stress after being subjected to cold and hot impact is effectively avoided, the risk of damage to the LED packaging structure is reduced, the service life of the LED packaging structure is prolonged, the path of external moisture entering the interior of the LED packaging structure is significantly prolonged, the air tightness and waterproofness of the LED packaging structure are effectively enhanced, the stability and reliability of the LED device in different environments are improved, the transparent protective layer can also protect the phosphor film, direct damage of external force to the phosphor film is effectively prevented, the integrity and normal function of the phosphor film are ensured, and the overall performance and service life of the LED device are further guaranteed. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiment or prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can obtain other drawings according to the structures shown in these drawings without creative labor.

[0017] Figure 1 is a sectional view of the prior art LED packaging structure;

[0018] Figure 2 Figure 1 is a sectional view of the LED packaging structure according to the first embodiment of the present application.

[0019] Brief Description of the Drawings

[0020] 1, substrate;

[0021] 2, LED wafer;

[0022] 3, white wall glue; 31, first hole; 32, second hole; 33, step surface;

[0023] 4, fluorescent film;

[0024] 5, transparent protective layer. DETAILED DESCRIPTION

[0025] The purposes, functional features and advantages of the present application will be further described in conjunction with the embodiments and with reference to the accompanying drawings.

[0026] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0027] It should be noted that if the embodiments of the present application involve directional indications such as up, down, left, right, front, back, etc., the directional indications are only used to explain the relative positional relationship, movement condition, etc. between the components in a certain specific posture such as shown in the accompanying drawings, and if the specific posture changes, the directional indications also change accordingly.

[0028] In addition, if the embodiments of the present application involve descriptions such as "first", "second", etc., the descriptions of "first", "second", etc. are only for description purposes, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features with "first" and "second" can explicitly or implicitly include at least one of the features.

[0029] In addition, the meaning of "and / or" appearing throughout the text is that it includes three parallel solutions. Taking "and / or" as an example, it includes solution, solution, or solution that satisfies both. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of the ordinary skilled in the art, and when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, nor is it within the scope of protection required by the present application.

[0030] In this application, unless otherwise expressly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0031] Embodiment one

[0032] Please refer to Figure 2 The embodiment one of the utility model discloses a LED packaging structure, including substrate 1, be equipped with LED wafer 2 on substrate 1, be equipped with anode pad and cathode pad on substrate 1, LED wafer 2 respectively with anode pad and cathode pad electric connection, the top surface of LED wafer 2 is equipped with fluorescent film piece 4, substrate 1 still is equipped with white wall colloid 3, the bottom of white wall colloid 3 has first hole 31, the top of white wall colloid 3 has the second hole 32 that communicates first hole 31, the demarcation of first hole 31 and second hole 32 forms step surface 33, first hole 31 with LED wafer 2 adaptation, second hole 32 is equipped with transparent protective layer 5 covering fluorescent film piece 4, transparent protective layer 5 with white wall colloid 3 sealed connection, fluorescent film piece 4 with white wall colloid 3 does not contact setting.

[0033] In this embodiment, the step surface 33 is flush with the top surface of the LED wafer 2, specifically, the transparent protective layer 5 is formed by solidifying a transparent fluid material, preferably the transparent protective layer 5 fills the second hole 32, that is, the solid transparent protective layer 5 is in contact with the top surface of the fluorescent film piece 4, the peripheral wall of the fluorescent film piece 4, the step surface 33 and the inner peripheral wall of the second hole 32, and forms a sealed joint.

[0034] The material of the transparent protective layer 5 is silicone, silicone resin, epoxy resin or other silicon-based high refractive index material.

[0035] In a specific product, the top surface of the transparent protective layer 5 is flush with the top surface of the white wall colloid 3.

[0036] To ensure the airtightness of the LED packaging structure to a greater extent, in this embodiment, the step surface 33 is in the form of a continuous ring frame, and the step surface 33 surrounds the first hole 31.

[0037] In the LED packaging structure product of the embodiment, the phosphor film 4 coincides with the top surface of the LED wafer 2 when the LED packaging structure is viewed from the top, that is, the top surface size of the phosphor film 4 is the same as the top surface size of the LED wafer 2.

[0038] The phosphor film 4 is bonded to the LED wafer 2, and the white wall adhesive 3 is bonded to the substrate 1.

[0039] Next, a processing method of the LED packaging structure of the embodiment is briefly described.

[0040] The substrate 1 with the LED wafer 2 fixed thereon is obtained, wherein the top surface of the LED wafer 2 is provided with the phosphor film 4,

[0041] First, the white wall adhesive 3 processed into a grid shape is cut according to the position of the phosphor film 4 relative to the substrate 1, and then the white wall adhesive 3 is placed on the substrate 1 with the bonding medium (for bonding the white wall adhesive 3) attached, so that the phosphor film 4 can be completely exposed from the grid holes of the white wall adhesive 3, the step surface 33 of the white wall adhesive 3 is flush with the top surface of the LED wafer 2, and the top surface of the white wall adhesive 3 is higher than the top surface of the phosphor film 4, so that the phosphor film 4 and the white wall adhesive 3 form a groove structure in the second hole 32, and the white wall adhesive 3 is no longer in direct contact with the phosphor film 4. Finally, the transparent protective layer 5 in liquid form is sprayed in the groove structure (including the top surface of the phosphor film 4), and the transparent protective layer 5 is flush with the top surface of the white wall adhesive 3.

[0042] The above is only an optional embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structural transformation or direct / indirect application in other related technical fields within the inventive concept of the present application and the contents of the present application specification and drawings are included in the patent protection scope of the present application.

Claims

1. An LED packaging structure, characterized in that: The device includes a substrate on which an LED chip is disposed. A fluorescent film is disposed on the top surface of the LED chip. A white wall colloid is also disposed on the substrate. The bottom of the white wall colloid has a first hole, and the top of the white wall colloid has a second hole that connects to the first hole. A stepped surface is formed at the boundary between the first hole and the second hole. The first hole is adapted to the LED chip. A transparent protective layer covering the fluorescent film is disposed in the second hole. The transparent protective layer is sealed to the white wall colloid. The fluorescent film is disposed in a way that does not contact the white wall colloid.

2. The LED packaging structure according to claim 1, characterized in that: The transparent protective layer is formed by solidifying a transparent fluid material and fills the second hole.

3. The LED packaging structure according to claim 2, characterized in that: The transparent protective layer is made of silicone, silicone resin, or epoxy resin.

4. The LED packaging structure according to claim 2, characterized in that: The top surface of the transparent protective layer is flush with the top surface of the white wall adhesive.

5. The LED packaging structure according to claim 1, characterized in that: The stepped surface is in the shape of a continuous ring, and the stepped surface surrounds the first hole.

6. The LED packaging structure according to claim 1, characterized in that: The stepped surface is flush with the top surface of the LED chip.

7. The LED packaging structure according to claim 1, characterized in that: When viewed from above, the top surface of the LED package structure coincides with the top surface of the LED chip.

8. The LED packaging structure according to claim 1, characterized in that: The fluorescent film is bonded to the LED chip.

9. The LED packaging structure according to claim 1, characterized in that: The white wall adhesive is bonded to the substrate.

10. The LED packaging structure according to claim 1, characterized in that: The substrate is provided with a positive electrode pad and a negative electrode pad, and the LED chip is electrically connected to the positive electrode pad and the negative electrode pad respectively.

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