LED packaging structure
By constructing a sealed cavity around the LED chip and filling it with transparent encapsulant to excite phosphor, the problem of insufficient brightness in the prior art is solved, and the brightness and stability of the LED packaging structure are improved.
Patent Information
- Application Number
- CN202520046712.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-08
- Publication Date
- 2026-01-20
- Estimated Expiration
- 2035-01-08
AI Technical Summary
In existing LED packaging structures, the LED chip is covered with white adhesive around its perimeter, resulting in low brightness and an inability to effectively utilize the blue light from around the chip.
An independent sealed chamber is constructed around the LED chip. The fluorescent film is fixedly connected to the frame, and the transparent encapsulating adhesive inside the chamber is used to improve the utilization rate of blue light and excite the phosphor to enhance the brightness.
It significantly improves the brightness of LED packaging structures, enhances heat dissipation and stability, and extends service life.
Smart Images
Figure CN223816376U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to LED technical field, especially a kind of LED packaging structure. BACKGROUND
[0002] As solid semiconductor device, LED has the advantages of small size, light weight, high luminous efficiency, energy saving and environmental protection, and has been widely used in various industries, and the market demand for LED is also increasing. Single-sided light-emitting LED is widely used in lighting, backlight and automotive fields due to its small size, light thickness, high power load, small size and high flexibility.
[0003] At present, most of the LED packaging structures that achieve single-sided light emission on the market use white wall glue to surround the LED wafer. When producing single-sided light-emitting LED, the LED wafer 2 is first welded on the substrate 1, then the fluorescent film piece 5 with the same size as the surface of the LED wafer 2 is bonded on the top of the LED wafer 2 using adhesive, and finally white wall glue is injected around the fluorescent film piece 5 to form a frame 3 (as shown in Figure 1 This results in the entire periphery of the LED wafer being covered by white wall glue, leaving only the upper surface of the LED wafer available for blue light, resulting in low brightness of the finished LED packaging structure. SUMMARY
[0004] The technical problem solved by the utility model is to provide an LED packaging structure with high luminous brightness.
[0005] To solve the above technical problem, the utility model adopts the technical scheme of an LED packaging structure, which comprises a substrate, an LED wafer and a frame provided on the substrate, the frame is made of white wall glue, the frame surrounds the LED wafer, a cavity is formed between the inner circumferential wall of the frame and the peripheral wall of the LED wafer, a fluorescent film piece is fixed on the top surface of the LED wafer, and the edge of the fluorescent film piece is fixedly connected with the frame to seal the cavity.
[0006] In one embodiment, the cavity is in the shape of a continuous ring frame.
[0007] In one embodiment, the single-side width of the cavity is less than or equal to one-third of the width of the LED wafer.
[0008] In one embodiment, the single-side width of the cavity is less than or equal to one-fourth of the width of the LED wafer.
[0009] In one embodiment, the top surface of the fluorescent film piece is flush with the top surface of the frame.
[0010] In one embodiment, the fluorescent film piece is fixedly bonded with the LED wafer.
[0011] In an embodiment, the chamber is filled with transparent encapsulation glue.
[0012] In an embodiment, the transparent encapsulation glue fills the entire chamber.
[0013] In an embodiment, the transparent encapsulation glue is made of silicone, silicone resin or epoxy resin.
[0014] The LED packaging structure has the advantages that the structure is novel, an independent sealed chamber can be constructed between the LED wafer and the frame made of white glue, the heat dissipation performance of the LED wafer is effectively improved, the stability and service life of the LED packaging structure are improved, meanwhile, the blue light around the LED wafer can overflow and irradiate on the fluorescent film, the fluorescent powder in the fluorescent film is excited, the utilization rate of the blue light of the LED wafer is improved, and the brightness of the finished LED packaging structure is improved. BRIEF DESCRIPTION OF DRAWINGS
[0015] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative labor.
[0016] Figure 1 is a sectional view of the prior art LED packaging structure;
[0017] Figure 2 is a sectional view of the LED packaging structure of the first embodiment of the present application;
[0018] Figure 3 is a sectional view of the LED packaging structure of the second embodiment of the present application.
[0019] Explanation of the drawings:
[0020] 1, substrate;
[0021] 2, LED wafer;
[0022] 3, frame;
[0023] 4, chamber;
[0024] 5, fluorescent film;
[0025] 6, transparent encapsulation glue. DETAILED DESCRIPTION
[0026] The purposes, functional features and advantages will be further described in combination with embodiments and with reference to the drawings.
[0027] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present application.
[0028] It should be noted that if the embodiments of the present application involve directional indications such as up, down, left, right, front, back, etc., the directional indications are only used to explain the relative positional relationship, movement condition, etc. between components in a certain specific posture such as shown in the drawings, and if the specific posture changes, the directional indications also change accordingly.
[0029] In addition, if the embodiments of the present application involve descriptions such as "first", "second", etc., the descriptions of "first", "second", etc. are only for description purposes, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features with "first" and "second" can explicitly or implicitly include at least one of the features.
[0030] In addition, the meaning of "and / or" appearing throughout the text is that it includes three parallel schemes, for example, "and / or" includes scheme, or scheme, or and simultaneously satisfied scheme. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of the ordinary skill in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the scope of protection required by the present application.
[0031] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0032] Embodiment one
[0033] Please refer to Figure 2The utility model discloses an embodiment one for: a LED package structure, including substrate 1, substrate 1 has anode pad and cathode pad, be equipped with LED wafer 2 and surround frame 3 on substrate 1, LED wafer 2 respectively with anode pad and cathode pad electric connection, surround frame 3 is made of white wall glue, surround frame 3 surrounds LED wafer 2 and sets up, the inner periphery wall of surround frame 3 and the periphery wall of LED wafer 2 form chamber 4, the top surface of LED wafer 2 is fixed with fluorescent diaphragm 5, the edge of fluorescent diaphragm 5 is fixedly connected with surround frame 3 to make chamber 4 seal.
[0034] Chamber 4 is continuous annular frame, that is to say, in vertical section, fluorescent diaphragm 5, LED wafer 2 and substrate 1 form I shape.
[0035] The single side width of chamber 4 is less than or equal to one third of the width of LED wafer 2. Preferably, the single side width of chamber 4 is less than or equal to one fourth of the width of LED wafer 2. The single side width of chamber 4 is appropriately sized to ensure miniaturization of the LED package structure.
[0036] The top surface of fluorescent diaphragm 5 is flush with the top surface of surround frame 3. In this embodiment, fluorescent diaphragm 5 is adhesively fixed to LED wafer 2.
[0037] Next, a processing method for the LED package structure of the embodiment is briefly described as follows:
[0038] A substrate 1 having a LED wafer 2 fixed thereon is obtained, wherein a fluorescent diaphragm 5 is mounted on the top surface of LED wafer 2. According to the position of fluorescent diaphragm 5 on substrate 1, a white wall glue body is cut into a grid shape to form a surround frame 3, and then placed on substrate 1 with an adhesive medium (for bonding surround frame 3) so that fluorescent diaphragm 5 can be completely exposed from the grid holes of the white wall glue body. The top surface of the white wall glue body is flush with the top surface of fluorescent diaphragm 5, so that an independent sealed chamber 4 can be formed between LED wafer 2 and the white wall glue body.
[0039] Embodiment two
[0040] Please refer to Figure 3The utility model discloses an embodiment two: a kind of LED packaging structure, including substrate 1, the substrate 1 has anode pad and cathode pad, LED wafer 2 and surround frame 3 are equipped on the substrate 1, the LED wafer 2 is electrically connected with the anode pad and cathode pad respectively, the surround frame 3 is made of white wall glue, the surround frame 3 is arranged around the LED wafer 2, chamber 4 is formed between the inner peripheral wall of the surround frame 3 and the peripheral wall of the LED wafer 2, the top surface of the LED wafer 2 is fixed with fluorescent diaphragm 5, the edge of the fluorescent diaphragm 5 is fixedly connected with the surround frame 3 to make the chamber 4 seal, chamber 4 is filled with transparent encapsulation glue 6.
[0041] The chamber 4 is in continuous ring frame shape, that is to say, in vertical section, the fluorescent diaphragm 5, LED wafer 2 and substrate 1 form a H-shaped.
[0042] The single-side width of the chamber 4 is less than or equal to one third of the width of the LED wafer 2. Preferably, the single-side width of the chamber 4 is less than or equal to one fourth of the width of the LED wafer 2. The size of the single-side width of the chamber 4 is appropriate, which can ensure the miniaturization of the LED packaging structure.
[0043] The top surface of the fluorescent diaphragm 5 is flush with the top surface of the surround frame 3. In the embodiment, the fluorescent diaphragm 5 is fixedly bonded with the LED wafer 2.
[0044] Preferably, the transparent encapsulation glue 6 fills the entire chamber 4, that is to say, the transparent encapsulation glue 6 in the chamber 4 respectively contacts the bottom surface of the fluorescent diaphragm 5, the peripheral wall of the LED wafer 2, the region of the substrate 1 corresponding to the chamber 4 and the inner peripheral wall of the surround frame 3, which can effectively enhance the bonding force between the fluorescent diaphragm 5 and the LED wafer 2, make the LED packaging structure more stable, and facilitate the overflow of blue light around the LED wafer 2, thereby improving the utilization rate of blue light of the LED wafer 2 and improving the brightness of the finished product of the LED packaging structure.
[0045] The material of the transparent encapsulation glue 6 layer is silicone, silicone resin, epoxy resin or other silicon-based high-refractive-index material.
[0046] Next, a processing method of the LED packaging structure of the embodiment is briefly described as follows:
[0047] The substrate 1 fixedly provided with the LED wafer 2 is obtained, wherein the top surface of the LED wafer 2 is provided with the fluorescent diaphragm 5, the transparent encapsulation glue 6 with the same height as the fluorescent diaphragm 5 is coated at the gap surrounded by the fluorescent diaphragm 5, the LED wafer 2 and the substrate 1, the transparent encapsulation glue 6 layer which exceeds the peripheral edge and surface region of the fluorescent diaphragm 5 is cut after solidification, a semi-finished product is obtained, then the white wall glue body is arranged around the four peripheries of the fluorescent diaphragm 5, and the top surface of the white wall glue body is flush with the top surface of the fluorescent diaphragm 5.
[0048] The above are only optional embodiments of the present application, and do not limit the patent scope of the present application, and any equivalent structural transformation made by the present application specification and drawings, or directly / indirectly applied in other related technical fields under the inventive concept of the present application are included in the patent protection scope of the present application.
Claims
1. An LED packaging structure, characterized in that: The device includes a substrate on which an LED chip and a frame are disposed. The frame is made of white wall adhesive and is disposed around the LED chip. A cavity is formed between the inner peripheral wall of the frame and the peripheral wall of the LED chip. A fluorescent film is fixedly disposed on the top surface of the LED chip, and the edge of the fluorescent film is fixedly connected to the frame to seal the cavity.
2. The LED packaging structure according to claim 1, characterized in that: The chamber is in the shape of a continuous ring frame.
3. The LED packaging structure according to claim 2, characterized in that: The width of one side of the chamber is less than or equal to one-third of the width of the LED chip.
4. The LED packaging structure according to claim 3, characterized in that: The width of one side of the chamber is less than or equal to one-quarter of the width of the LED chip.
5. The LED packaging structure according to claim 1, characterized in that: The top surface of the fluorescent film is flush with the top surface of the frame.
6. The LED packaging structure according to claim 1, characterized in that: The fluorescent film is bonded and fixed to the LED chip.
7. The LED packaging structure according to claim 1, characterized in that: The cavity is filled with transparent encapsulating adhesive.
8. The LED packaging structure according to claim 7, characterized in that: The transparent encapsulating adhesive fills the entire cavity.
9. The LED packaging structure according to claim 7, characterized in that: The transparent encapsulating layer is made of silicone, silicone resin, or epoxy resin.