Laser grooving equipment and silicon wafer cutting equipment production line

Abstract

The utility model discloses laser grooving equipment and a silicon wafer cutting equipment production line, and belongs to the technical field of silicon wafer cutting equipment.The laser grooving equipment comprises a cutting assembly, a laser emitting device, a first driving assembly and a second driving assembly; the cutting assembly is configured to emit laser to the roll shaft; the laser emitting device is configured to emit laser to the cutting assembly; the first driving assembly is connected with the cutting assembly, and the first driving assembly is configured to drive the cutting assembly to move in the first direction; the second driving assembly is connected with the first driving assembly and the second driving assembly, the second driving assembly is configured to drive the cutting assembly to move close to or away from the roller shaft in the second direction, and the first direction intersects with the second direction. The second driving assembly enables the cutting assembly to move in the second direction so as to adjust the size of light spots irradiated on the surface of the roller shaft, and therefore grooves with different groove widths and groove depths can be machined more efficiently.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor manufacturing equipment, and particularly relates to a laser slotting device and a silicon wafer cutting equipment production line. BACKGROUND

[0002] When the silicon wafer cutting equipment is manufactured, a groove for positioning a cutting line needs to be formed on a roller shaft.

[0003] However, in the process of machining, the cutting tool will be worn, and the cutting force of the cutting tool is insufficient in the later stage of the life of the cutting tool, so that the groove precision of the roller shaft is poor, and the performance of the roller shaft is poor. CONTENT OF THE UTILITY MODEL

[0004] The utility model provides a kind of laser slotting device, to solve the technical problem that the performance of roller shaft is poor due to tool wear;Another purpose of the present application is to provide a silicon wafer cutting equipment production line.

[0005] Technical scheme, the present application provides a kind of laser slotting device, comprising:

[0006] Cutting assembly, the cutting assembly is configured to emit laser to the roller shaft;

[0007] Laser emission device, the laser emission device is configured to emit laser to the cutting assembly;

[0008] First drive assembly, the first drive assembly is connected with the cutting assembly, and the first drive assembly is configured to drive the cutting assembly to move along the first direction;

[0009] Wherein, the laser slotting device further includes a second drive assembly, the second drive assembly is connected with the first drive assembly and the cutting assembly respectively, and the second drive assembly is configured to drive the cutting assembly to move along the second direction to approach or away from roller shaft, and the first direction and the second direction intersect.

[0010] In some embodiments, the laser slotting device further includes:

[0011] Base;

[0012] Clamping assembly, the clamping assembly is arranged on the base, and the clamping assembly is configured to clamp the roller shaft and drive the roller shaft to rotate around the axis of the roller shaft, the axis of the roller shaft extends along the first direction, the cutting assembly is arranged on the side of the clamping assembly away from the base along the second direction, and the laser emission device is connected with the base.

[0013] The cutting assembly includes a cutting head and a first mounting member. The cutting head is disposed on the side of the clamping assembly away from the base along the second direction. The first mounting member is connected to the cutting head. The second driving assembly is connected to the first mounting member and the first driving assembly respectively.

[0014] In some embodiments, the cutting component further includes:

[0015] A connecting bracket, which is connected to the first mounting component;

[0016] A nozzle is disposed between the cutting head and the clamping assembly along the second direction.

[0017] In some embodiments, the cutting assembly further includes a first guide connected to the cutting head and the first drive assembly, the first guide being configured to guide the cutting assembly along the second direction.

[0018] In some embodiments, the laser grooving device further includes:

[0019] Base;

[0020] A clamping assembly is disposed on the base and configured to clamp the roller shaft and drive the roller shaft to rotate about the axis of the roller shaft, the axis of the roller shaft extending along a first direction; a cutting assembly is disposed on the side of the clamping assembly away from the base along a second direction; and a laser emitting device is connected to the base.

[0021] The cutting component has an initial position;

[0022] The laser grooving equipment further includes a housing connected to the base on the side of the base close to the cutting assembly along the second direction. The housing includes a bottom wall, which is located between the cutting assembly and the clamping assembly along the second direction when the cutting assembly is in the initial position.

[0023] In some embodiments, the laser grooving device further has a third direction, wherein the first direction, the second direction, and the third direction intersect each other;

[0024] The housing further includes a first sidewall, a second sidewall, and a third sidewall. The first sidewall and the second sidewall are respectively connected to the bottom wall and are spaced apart along the third direction. When the cutting assembly is in the initial position, the cutting assembly is located between the first sidewall and the second sidewall along the third direction. The third sidewall is connected to the bottom wall and is located between the first sidewall and the second sidewall along the third direction, and is connected to the first sidewall and the second sidewall respectively. The third sidewall is located on one side of the cutting assembly along the second direction.

[0025] In some embodiments, the bottom wall has a side peripheral surface with a receiving groove, and when the cutting assembly is in the initial position, a portion of the cutting assembly is located in the receiving groove.

[0026] In some embodiments, the laser grooving device further includes:

[0027] Base;

[0028] A clamping assembly is disposed on the base and configured to clamp the roller shaft and drive the roller shaft to rotate about the axis of the roller shaft, the axis of the roller shaft extending along a first direction; a cutting assembly is disposed on the side of the clamping assembly away from the base along a second direction; and a laser emitting device is connected to the base.

[0029] The first driving component includes a fixing part and a driving part. The fixing part is disposed on the base, the driving part is connected to the fixing part, and the driving part is connected to the second driving component.

[0030] The laser emitting device includes a laser emitter and a light guide assembly. The laser emitter is connected to the base, and the light guide assembly is connected to the driving unit. The laser emitter and the light guide assembly are spaced apart along the first direction. The laser emitter is configured to emit the laser toward the light guide assembly, and the light guide assembly is configured to reflect the laser toward the cutting assembly.

[0031] In some embodiments, the laser grooving device further has a third direction, wherein the first direction, the second direction, and the third direction intersect each other;

[0032] The light guide assembly includes a first reflector and a second reflector respectively connected to the driving unit. The first reflector and the laser emitter are spaced apart along the first direction, and the second reflector and the first reflector are spaced apart along the third direction. The second reflector is spaced apart from the cutting assembly along the second direction. The first reflector is configured to reflect the laser along the third direction to the second reflector, and the second reflector is configured to reflect the laser along the second direction to the cutting assembly.

[0033] In some embodiments, the laser emitting device further includes a light-shielding component, which includes a light-shielding tube disposed between the laser emitter and the light guide component along the first direction.

[0034] In some embodiments, the light-shielding tube is connected to the laser emitter and the driving unit at its two ends along the first direction, and the light-shielding tube is capable of deforming along the first direction when the driving unit moves along the first direction.

[0035] In some embodiments, the light-shielding assembly further includes a second guide member, the second guide member including a support portion and a guide portion, the support portion being connected to the base, the guide portion being connected to the support portion, the guide portion being disposed on the side of the light-shielding tube away from the base along the second direction, the guide portion being connected to the light-shielding tube to guide the light-shielding tube along the second direction.

[0036] In some embodiments, the drive unit has a receiving cavity, and an inlet and an outlet communicating with the receiving cavity. The light guide assembly is disposed in the receiving cavity, the inlet faces the laser emitter, and a portion of the light guide assembly is exposed outside the inlet; the outlet faces the cutting assembly, and a portion of the light guide assembly is exposed outside the outlet.

[0037] Accordingly, this application also provides a silicon wafer cutting equipment production line, including the laser grooving equipment as described in any of the above embodiments.

[0038] Beneficial Effects: Compared with the prior art, the laser grooving equipment provided in this application includes a cutting component, a laser emitting device, a first driving component, and a second driving component. The cutting component is configured to emit laser light onto the roller shaft; the laser emitting device is configured to emit laser light onto the cutting component; the first driving component is connected to the cutting component and is configured to drive the cutting component to move along a first direction; the second driving component is connected to both the first and second driving components and is configured to drive the cutting component to move closer to or further away from the roller shaft along a second direction, where the first and second directions intersect. This application avoids the problem of tool wear by setting up a laser emitting device and a cutting component to use laser to groove the roller shaft. Simultaneously, the second driving component allows the cutting component to move along the second direction, thereby adjusting the size of the laser spot irradiating the roller shaft surface, thus enabling more efficient processing of grooves with different widths and depths. Attached Figure Description

[0039] The technical solution and other beneficial effects of this application will become apparent from the following detailed description of specific embodiments in conjunction with the accompanying drawings.

[0040] Figure 1 This is a schematic diagram of the structure of the laser grooving equipment provided in the embodiments of this application;

[0041] Figure 2 This is a schematic diagram of the mechanism of the laser grooving equipment provided in the embodiments of this application;

[0042] Figure 3 This is a front view of the laser grooving equipment provided in an embodiment of this application;

[0043] Figure 4 for Figure 1 Detailed view of point A in the middle circle;

[0044] Figure 5 for Figure 2 Detailed view of point B in the middle circle;

[0045] Figure 6 for Figure 3 Detailed view of point C in the middle circle;

[0046] Figure 7 A cross-sectional view of the cutting component in the laser grooving equipment provided in an embodiment of this application;

[0047] Figure 8 A cross-sectional view of the cutting component in the laser grooving equipment provided in an embodiment of this application;

[0048] Figure 9 This is a schematic diagram of the drive unit in the laser grooving equipment provided in the embodiments of this application;

[0049] Figure 10This is a cross-sectional view of the drive unit in the laser grooving equipment provided in the embodiments of this application;

[0050] Figure 11 This is a schematic diagram of the hidden portion of the drive unit in the laser grooving equipment provided in the embodiments of this application;

[0051] Figure 12 for Figure 11 Detailed view of point D in the middle circle

[0052] Figure 13 for Figure 2 Detailed view of point E in the middle circle.

[0053] Reference numerals in the attached figures: 100-base, 200-clamping assembly, 300-cutting assembly, 310-cutting head, 320-first mounting component, 330-connecting bracket, 340-nozzle, 350-first guide component, 360-second mounting component, 370-adjusting component, 400-laser emitting device, 410-laser emitter, 420-light guide assembly, 421-first reflector, 422-second reflector, 430-shield Light assembly, 431-shielding tube, 432-second guide, 500-first drive assembly, 510-fixing part, 520-drive part, 521-accommodating cavity, 522-inlet, 523-outlet, 600-second drive assembly, 700-housing, 710-bottom wall, 711-side peripheral surface, 712-accommodating groove, 720-first side wall, 730-second side wall, 740-third side wall, 800-roller. Detailed Implementation

[0054] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0055] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows for mutual communication; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two elements or the interaction between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances. In the description of this application, "multiple" means two or more, unless otherwise expressly and specifically limited. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more features.

[0056] It should also be noted that in the accompanying drawings of the embodiments of this application, the arrows labeled X, Y, and Z respectively represent the first direction X, the second direction Y, and the third direction Z. The description of this application introduces the first direction X, the second direction Y, and the third direction Z to more clearly express the relative positional relationship involved in this application. The first direction X, the second direction Y, and the third direction Z are three intersecting relative directions, not absolute directions. In practical applications, the first direction X, the second direction Y, and the third direction Z can point to any direction in space, as long as the intersection relationship between them is maintained.

[0057] The following disclosure provides many different implementations or examples for carrying out different structures of this application. To simplify the disclosure of this application, the components and arrangements of specific examples are described below. Of course, these are merely examples and are not intended to limit this application.

[0058] When manufacturing silicon wafer cutting equipment, grooves need to be made on the roller 800 to position the cutting lines.

[0059] However, during the processing, the cutting tool will wear out. In the later stages of the tool's life, the cutting force of the tool will be insufficient, resulting in poor groove accuracy of the roller 800 and poor performance of the roller 800.

[0060] To address the aforementioned technical problem of poor performance of roller 800 due to tool wear, embodiments of this application provide a laser grooving device. Please refer to [link to relevant documentation]. Figure 1 , Figure 2 , Figure 3 and Figure 6The laser grooving equipment includes a cutting component 300, a laser emitting device 400, a first driving component 500, and a second driving component 600. The cutting component 300 is configured to emit a laser beam toward a roller 800. The laser emitting device 400 is configured to emit a laser beam toward the cutting component 300. The first driving component 500 is connected to the cutting component 300 and is configured to drive the cutting component 300 to move along a first direction X. The laser grooving equipment also includes a second driving component 600, which is connected to both the first driving component 500 and the cutting component 300. The second driving component 600 is configured to drive the cutting component 300 to move toward or away from the roller 800 along a second direction Y. The first direction X and the second direction Y intersect.

[0061] In some embodiments, please refer to Figure 1 The laser grooving equipment also includes a base 100 and a clamping assembly 200. The clamping assembly 200 is disposed on the base 100 and is configured to clamp a roller 800 and drive the roller 800 to rotate around its axis. The axis of the roller 800 extends along a first direction X. A cutting assembly 300 is disposed on the side of the clamping assembly 200 away from the base 100 along a second direction Y. A laser emitting device 400 is connected to the base.

[0062] In some embodiments, the clamping assembly 200 includes a clamp and a rotating member connected to one side of the clamp. The clamp is used to clamp the roller shaft 800 at both ends along the axial direction of the roller shaft 800. When the roller shaft 800 is clamped in the clamp, the rotating member connected to one side of the clamp rotates to drive the roller shaft 800 to rotate about the axial direction of the roller shaft 800.

[0063] It is understood that the connection between the cutting component 300 and the first driving component 500 is indirect. The cutting component 300 and the first driving component 500 are connected through the second driving component 600. The first driving component 500 can move both the second driving component 600 and the cutting component 300 simultaneously. The first driving component 500 is used to drive the cutting component 300 to move along the axial direction of the roller 800, that is, to drive the cutting component 300 to move along the first direction X in order to open grooves on the roller 800.

[0064] Understandably, the laser emitting device 400 is capable of generating laser light, and the cutting assembly 300 is capable of receiving laser light from the laser emitting device 400, transmitting, focusing, and irradiating the surface of the roller 800 to perform laser cutting on the roller 800.

[0065] In the above embodiments, the use of laser cutting avoids the problem of reduced cutting accuracy due to tool wear, which in turn degrades the performance of the roller 800. Furthermore, by providing the second drive component 600, the distance between the cutting component 300 and the roller 800 during the cutting process can be adjusted, thereby adjusting the size of the laser spot formed on the surface of the roller 800 to accommodate grooves of different widths and depths, thus improving grooving efficiency.

[0066] In some embodiments, please refer to Figure 6 , Figure 7 and Figure 8 The cutting assembly 300 includes a cutting head 310 and a first mounting member 320. The cutting head 310 is disposed on the side of the clamping assembly 200 away from the base 100 along the second direction Y. The first mounting member 320 is connected to the cutting head 310. The second driving assembly 600 is connected to the first mounting member 320 and the first driving assembly 500 respectively.

[0067] Specifically, a lens is provided inside the cutting head 310. The second drive assembly 600 can drive the cutting head 310 to move along the second direction Y, so as to change the distance between the lens and the roller 800 along the second direction Y, thereby changing the size of the light spot.

[0068] In some embodiments, the first mounting member 320 and the cutting head 310 are indirectly connected. Specifically, the cutting assembly 300 further includes a second mounting member 360, which is connected to the first mounting member 320. The first mounting member 320 has a first mounting hole, and the second mounting member 360 has a second mounting hole. The cutting head 310 passes through the first mounting hole and the second mounting hole along the second direction Y, and the cutting head 310 is connected to the second mounting member 360.

[0069] In some embodiments, one end of the second drive component 600 is connected to the first drive component 500, and the other end of the second drive component 600 is directly connected to the first mounting member 320; in other embodiments, one end of the second drive component 600 is connected to the first drive component 500, and the other end of the second drive component 600 is indirectly connected to the first mounting member 320, that is, the other end of the second drive component 600 is connected to the second mounting member 360.

[0070] In some embodiments, the distance between the first mounting member 320 and the second mounting member 360 along the second direction Y is adjustable to adjust the initial position of the cutting head 310 along the second direction Y. Specifically, the cutting assembly 300 further includes an adjusting member 370, which can be a screw or a bolt. The adjusting member 370 passes through both the first mounting member 320 and the second mounting member 360 along the second direction Y, and one of the first mounting member 320 and the second mounting member 360 is threadedly connected to the adjusting member 370. The distance between the first mounting member 320 and the second mounting member 360 along the second direction Y is adjusted by rotating the adjusting member 370.

[0071] In the above embodiment, by providing a first mounting component 320 to fix the cutting head 310, the cutting head 310 is prevented from shaking during the operation of the first drive assembly 500 and the second drive assembly 600, thereby improving the cutting accuracy of the cutting head 310 and thus enhancing the performance of the laser grooving equipment. The first mounting component 320 can also be used to mount accessories, thereby further improving the performance of the laser grooving equipment.

[0072] In some embodiments, please refer to Figure 13 The cutting assembly 300 also includes a connecting bracket 330 and a nozzle 340. The connecting bracket 330 is connected to the first mounting member 320. The nozzle 340 is disposed between the cutting head 310 and the clamping assembly 200 along the second direction Y.

[0073] Specifically, the nozzle 340 is connected to an air pipe to blow the waste generated during cutting away from the working area of ​​the cutting head 310, keeping the area to be cut clean.

[0074] In the above embodiments, by setting the nozzle 340 to clean the working area of ​​the cutting head 310, the impact of waste on the cutting operation is reduced, and the performance of the laser grooving equipment is improved. In addition, by setting the connecting bracket 330 to bring the nozzle 340 closer to the surface of the roller 800, the surface of the roller 800 is cleaned more efficiently, thereby improving the cleaning efficiency of the nozzle 340.

[0075] In some embodiments, please refer again Figure 6 , Figure 7 and Figure 8 The cutting assembly 300 also includes a first guide 350, which is connected to the cutting head 310 and the first drive assembly 500 respectively. The first guide 350 is configured to guide the cutting assembly 300 along the second direction Y.

[0076] In some embodiments, the first guide member 350 includes a first guide rod and a first linear bearing, the first linear bearing being disposed in one of the drive unit 520 and the cutting assembly 300, and the first guide member 350 being fixedly connected to the other and disposed in the first linear bearing.

[0077] In the above embodiment, by setting the first guide 350 to guide the movement of the cutting component 300 when it moves relative to the second direction Y, the angle between the cutting component 300 and the surface of the roller 800 is maintained, the tilt of the cutting component 300 after the second drive component 600 is activated is reduced, and the performance of the laser grooving equipment is improved.

[0078] In some embodiments, please refer to Figure 1 , Figure 2 , Figure 4 and Figure 5 ,in, Figure 1 and Figure 4 The cutting component 300 is located in the initial position, and the cutting component 300 has an initial position; the laser grooving equipment also includes a housing 700, which is connected to the side of the base 100 close to the cutting component 300 along the second direction Y. The housing 700 includes a bottom wall 710, which is located between the cutting component 300 and the clamping component 200 along the second direction Y when the cutting component 300 is in the initial position.

[0079] In the above embodiment, the housing 700 is provided to protect the cutting component 300 when it is not in operation, especially to block the part of the cutting component 300 facing the clamping component 200, so as to avoid the part of the cutting component 300 emitting laser from touching the roller 800 when it is installed, thereby preventing damage to the cutting component 300.

[0080] In some embodiments, please refer to Figure 4 and Figure 5 The laser grooving equipment also has a third direction Y, and the first direction X, the second direction Y and the third direction Y intersect each other; the housing 700 also includes a first side wall 720, a second side wall 730 and a third side wall 740, the first side wall 720 and the second side wall 730 are respectively connected to the bottom wall 710, and the first side wall 720 and the second side wall 730 are spaced apart along the third direction Y. When the cutting assembly 300 is in the initial position, the cutting assembly 300 is located between the first side wall 720 and the second side wall 730 along the third direction Y; the third side wall 740 is connected to the bottom wall 710, and is located between the first side wall 720 and the second side wall 730 along the third direction Y, and is respectively connected to the first side wall 720 and the second side wall 730, and the third side wall 740 is located on one side of the cutting assembly 300 along the second direction Y.

[0081] In the above embodiments, by providing a first sidewall 720, a second sidewall 730, and a third sidewall 740 in the housing 700 to protect the periphery of the cutting assembly 300 when it is not in operation, the lifespan of the cutting assembly 300 is extended. Meanwhile, the housing 700 does not completely surround the cutting assembly 300 along its circumference, but instead reserves a notch in the first direction X opposite to the third sidewall 740, allowing the cutting assembly 300 to move away from the space enclosed by the first sidewall 720, the second sidewall 730, and the third sidewall 740 along the first direction X when in operation.

[0082] In some embodiments, the housing 700 further includes a fourth sidewall, which is disposed between the first sidewall 720 and the second sidewall 730 along a third direction Y, and is detachably connected to the first sidewall 720 and the second sidewall 730, respectively. The fourth sidewall is spaced apart from the third sidewall 740 along a first direction X. When the cutting assembly 300 is in its initial position, the fourth sidewall ensures that the cutting assembly 300 is completely surrounded circumferentially by the first sidewall 720, the second sidewall 730, the third sidewall 740, and the fourth sidewall, achieving better protection. When the cutting assembly 300 needs to operate, the fourth sidewall can be detached from the first sidewall 720 and the second sidewall 730, allowing the cutting assembly 300 to be moved out of the space enclosed by the first sidewall 720, the second sidewall 730, and the third sidewall 740 along the first direction X.

[0083] In some embodiments, please refer again Figure 4 and Figure 5 The bottom wall 710 has a side peripheral surface 711, and the side peripheral surface 711 has a receiving groove 712. When the cutting assembly 300 is in the initial position, a portion of the cutting assembly 300 is located in the receiving groove 712.

[0084] Understandably, the closer the bottom wall 710 is to the cutting head 310 in the cutting assembly 300 when they are not in contact, the better the bottom wall 710 protects the cutting head 310.

[0085] In the above embodiment, in order to minimize the distance between the bottom wall 710 and the cutting head 310 along the second direction Y, a receiving groove 712 is provided to prevent interference between the connecting bracket 330 and the bottom wall 710 when the cutting assembly 300 is in the initial position.

[0086] In some embodiments, please refer to Figure 11 and Figure 12The first driving assembly 500 includes a fixing part 510 and a driving part 520. The fixing part 510 is disposed on the base 100, and the driving part 520 is connected to the fixing part 510 and the driving part 520 is connected to the second driving assembly 600. The laser emitting device 400 includes a laser emitter 410 and a light guide assembly 420. The laser emitter 410 is connected to the base 100, and the light guide assembly 420 is connected to the driving part 520. The laser emitter 410 and the light guide assembly 420 are spaced apart along a first direction X. The laser emitter 410 is configured to emit laser towards the light guide assembly 420, and the light guide assembly 420 is configured to reflect the laser to the cutting assembly 300.

[0087] In the above embodiment, the laser emitter 410 is fixedly connected to the base 100. The fixed connection of the laser emitter 410 to the base 100 makes it more stable, and the emitted laser is less prone to shaking, thus being less affected by vibrations during the operation of the first driving component 500. Simultaneously, the light guide component 420 can also guide the laser from the stationary laser emitter 410 to the moving cutting component 300, achieving a solution where the cutting component 300 moves while the laser emitter 410 remains stationary, thereby improving the performance of the laser grooving equipment.

[0088] In some embodiments, please refer to Figure 12 The laser grooving equipment also has a third direction Y, and the first direction X, the second direction Y and the third direction Y intersect each other; the light guide assembly 420 includes a first reflector 421 and a second reflector 422 respectively connected to the drive unit 520. The first reflector 421 and the laser emitter 410 are spaced apart along the first direction X, the second reflector 422 and the first reflector 421 are spaced apart along the third direction Y, and the second reflector 422 is spaced apart from the cutting assembly 300 along the second direction Y. The first reflector 421 is configured to reflect the laser along the third direction Y to the second reflector 422, and the second reflector 422 is configured to reflect the laser along the second direction Y to the cutting assembly 300.

[0089] Specifically, the first reflector 421 is used to bend the laser path by 90° so that the laser emitted by the laser emitter 410 along the first direction X is directed along the third direction Y to the second reflector 422.

[0090] Specifically, the second reflector 422 is used to bend the laser path by 90°, so that the laser emitted from the first reflector 421 along the third direction Y is directed along the second direction Y towards the cutting assembly 300.

[0091] In the above embodiment, by setting the first reflector 421 and the second reflector 422, a solution is achieved in which the laser emitter 410 is fixed and the cutting component 300, which can move along the first direction X and the second direction Y, can still receive the laser emitted from the laser emitter 410, thereby improving the performance of the laser grooving equipment.

[0092] In some embodiments, please refer to Figure 1 and Figure 2 The laser emitting device 400 also includes a light-shielding component 430, which includes a light-shielding tube 431. The light-shielding tube 431 is disposed between the laser emitter 410 and the light guide component 420 along the first direction X.

[0093] Specifically, after the laser is emitted from the laser emitter 410, it can pass through the interior of the light-shielding tube 431 and reach the light guide assembly 420.

[0094] In the above embodiment, by setting the light-shielding tube 431 to reduce the dispersion of the laser, the energy loss of the laser during transmission is reduced, and the possibility of the cutting component 300 experiencing a decrease in cutting force due to energy loss is reduced.

[0095] In some embodiments, the light-shielding tube 431 is connected to the laser emitter 410 and the driving unit 520 at its two ends along the first direction X, respectively, and the light-shielding tube 431 can deform along the first direction X when the driving unit 520 moves along the first direction X.

[0096] In some embodiments, the light-shielding tube 431 can be an organ tube, a corrugated telescopic tube, etc.

[0097] Specifically, when the driving unit 520 approaches the laser emitter 410 along the first direction X, the size of the light-shielding tube 431 along the first direction X decreases; when the driving unit 520 moves away from the laser emitter 410 along the first direction X, the size of the light-shielding tube 431 along the first direction X increases.

[0098] In the above embodiment, by setting a light-shielding tube 431 that can deform along the first direction X, the energy loss of the laser is further reduced, thereby reducing the possibility of a decrease in the cutting force of the cutting assembly 300.

[0099] In some embodiments, please refer again Figure 1 and Figure 2 The light-shielding assembly 430 also includes a second guide member 432, which includes a support portion and a guide portion. The support portion is connected to the base 100, and the guide portion is connected to the support portion. The guide portion is disposed on the side of the light-shielding tube 431 away from the base 100 along the second direction Y. The guide portion is connected to the light-shielding tube 431 to guide the light-shielding tube 431 along the second direction Y.

[0100] It is understandable that, since the light-shielding tube 431 can deform along the first direction X, in some embodiments, the light-shielding tube 431 can also deform along the second direction Y. Specifically, when the second direction Y is the direction of gravity, the light-shielding tube 431 may bend towards the base 100 along the second direction Y under the action of gravity.

[0101] In the above embodiment, by setting the second guide 432 and connecting the light-shielding tube 431 and the second guide 432 to limit the deformation of the light-shielding tube 431 along the second direction Y, the possibility of the light-shielding tube 431 blocking the laser due to deformation is reduced, thereby improving the reliability of the laser grooving equipment.

[0102] In some embodiments, please refer to Figure 9 and Figure 10 The drive unit 520 has a receiving cavity 521, and an inlet 522 and an outlet 523 communicating with the receiving cavity 521. The light guide assembly 420 is disposed in the receiving cavity 521. The inlet 522 faces the laser emitter 410, and a portion of the light guide assembly 420 is exposed in the inlet 522. The outlet 523 faces the cutting assembly 300, and a portion of the light guide assembly 420 is exposed in the outlet 523.

[0103] In the above embodiments, by placing the light guide component 420 inside the receiving cavity 521, the possibility of energy loss when the laser is transmitted through the light guide component 420 is reduced, thereby improving the performance of the laser grooving device.

[0104] Accordingly, this application also provides a silicon wafer cutting equipment production line, including laser grooving equipment as described in any of the above embodiments.

[0105] The above provides a detailed description of a laser grooving device and a silicon wafer cutting production line provided in the embodiments of this application. Specific examples have been used in this application to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A laser grooving device, characterized in that, For processing rollers (800), the laser grooving equipment includes: A cutting assembly (300) configured to emit a laser toward the roller (800); A laser emitting device (400) is configured to emit a laser beam toward the cutting assembly (300); A first drive assembly (500) is connected to the cutting assembly (300) and is configured to drive the cutting assembly (300) to move along a first direction (X). The laser grooving equipment further includes a second drive assembly (600), which is connected to the first drive assembly (500) and the cutting assembly (300) respectively. The second drive assembly (600) is configured to drive the cutting assembly (300) to move closer to or away from the roller (800) along a second direction (Y), where the first direction (X) and the second direction (Y) intersect.

2. The laser grooving equipment according to claim 1, characterized in that, The laser grooving equipment also includes: Base (100); A clamping assembly (200) is disposed on the base (100) and configured to clamp the roller (800) and drive the roller (800) to rotate about the axis of the roller (800), the axis of the roller (800) extending along a first direction (X); a cutting assembly (300) is disposed on the side of the clamping assembly (200) away from the base (100) along a second direction (Y); and a laser emitting device (400) is connected to the base (100). The cutting assembly (300) includes a cutting head (310) and a first mounting member (320). The cutting head (310) is disposed on the side of the clamping assembly (200) away from the base (100) along the second direction (Y). The first mounting member (320) is connected to the cutting head (310). The second driving assembly (600) is connected to the first mounting member (320) and the first driving assembly (500) respectively.

3. The laser grooving equipment according to claim 2, characterized in that, The cutting assembly (300) also includes: A connecting bracket (330) is connected to the first mounting member (320); A nozzle (340) is disposed between the cutting head (310) and the clamping assembly (200) along the second direction (Y).

4. The laser grooving equipment according to claim 2, characterized in that, The cutting assembly (300) further includes a first guide (350) that connects the cutting head (310) and the first drive assembly (500) respectively, and the first guide (350) is configured to guide the cutting assembly (300) along the second direction (Y).

5. The laser grooving equipment according to claim 1, characterized in that, The laser grooving equipment also includes: Base (100); A clamping assembly (200) is disposed on the base (100) and configured to clamp the roller (800) and drive the roller (800) to rotate about the axis of the roller (800), the axis of the roller (800) extending along a first direction (X); a cutting assembly (300) is disposed on the side of the clamping assembly (200) away from the base (100) along a second direction (Y); and a laser emitting device (400) is connected to the base (100). The cutting assembly (300) has an initial position; The laser grooving equipment further includes a housing (700) connected to the base (100) along the second direction (Y) near the cutting assembly (300). The housing (700) includes a bottom wall (710) located between the cutting assembly (300) and the clamping assembly (200) along the second direction (Y) when the cutting assembly (300) is in the initial position.

6. The laser grooving equipment according to claim 5, characterized in that, The laser grooving equipment also has a third direction (Z), and the first direction (X), the second direction (Y) and the third direction (Z) intersect each other; The housing (700) further includes a first sidewall (720), a second sidewall (730), and a third sidewall (740). The first sidewall (720) and the second sidewall (730) are respectively connected to the bottom wall (710), and the first sidewall (720) and the second sidewall (730) are spaced apart along the third direction (Z). When the cutting assembly (300) is in the initial position, the cutting assembly (300) is located between the first sidewall (720) and the second sidewall (730) along the third direction (Z). The third sidewall (740) is connected to the bottom wall (710), and is located between the first sidewall (720) and the second sidewall (730) along the third direction (Z), and connects the first sidewall (720) and the second sidewall (730) respectively. The third sidewall (740) is located on one side of the cutting assembly (300) along the second direction (Y).

7. The laser grooving equipment according to claim 5, characterized in that, The bottom wall (710) has a side peripheral surface (711) with a receiving groove (712), and when the cutting assembly (300) is in the initial position, a portion of the cutting assembly (300) is located in the receiving groove (712).

8. The laser grooving equipment according to claim 1, characterized in that, The laser grooving equipment also includes: Base (100); A clamping assembly (200) is disposed on the base (100) and configured to clamp the roller (800) and drive the roller (800) to rotate about the axis of the roller (800), the axis of the roller (800) extending along a first direction (X); a cutting assembly (300) is disposed on the side of the clamping assembly (200) away from the base (100) along a second direction (Y); and a laser emitting device (400) is connected to the base (100). The first drive assembly (500) includes a fixing part (510) and a drive part (520). The fixing part (510) is disposed on the base (100), the drive part (520) is connected to the fixing part (510), and the drive part (520) is connected to the second drive assembly (600). The laser emitting device (400) includes a laser emitter (410) and a light guide assembly (420). The laser emitter (410) is connected to the base (100), and the light guide assembly (420) is connected to the driving unit (520). The laser emitter (410) and the light guide assembly (420) are spaced apart along the first direction (X). The laser emitter (410) is configured to emit the laser toward the light guide assembly (420), and the light guide assembly (420) is configured to reflect the laser to the cutting assembly (300).

9. The laser grooving equipment according to claim 8, characterized in that, The laser grooving equipment also has a third direction (Z), and the first direction (X), the second direction (Y) and the third direction (Z) intersect each other; The light guide assembly (420) includes a first reflector (421) and a second reflector (422) respectively connected to the drive unit (520). The first reflector (421) is spaced apart from the laser emitter (410) along the first direction (X). The second reflector (422) is spaced apart from the first reflector (421) along the third direction (Z). The second reflector (422) is spaced apart from the cutting assembly (300) along the second direction (Y). The first reflector (421) is configured to reflect the laser along the third direction (Z) to the second reflector (422). The second reflector (422) is configured to reflect the laser along the second direction (Y) to the cutting assembly (300).

10. The laser grooving equipment according to claim 8, characterized in that, The laser emitting device (400) further includes a light-shielding component (430), which includes a light-shielding tube (431) disposed between the laser emitter (410) and the light guide component (420) along the first direction (X).

11. The laser grooving equipment according to claim 10, characterized in that, The light-shielding tube (431) is connected to the laser emitter (410) and the driving unit (520) at its two ends along the first direction (X), respectively. The light-shielding tube (431) is able to deform along the first direction (X) when the driving unit (520) moves along the first direction (X).

12. The laser grooving equipment according to claim 11, characterized in that, The light-shielding assembly (430) further includes a second guide (432), which includes a support portion and a guide portion. The support portion is connected to the base (100), and the guide portion is connected to the support portion. The guide portion is disposed on the side of the light-shielding tube (431) away from the base (100) along the second direction (Y). The guide portion is connected to the light-shielding tube (431) to guide the light-shielding tube (431) along the second direction (Y).

13. The laser grooving equipment according to claim 8, characterized in that, The drive unit (520) has a receiving cavity (521), and an inlet (522) and an outlet (523) communicating with the receiving cavity (521). The light guide assembly (420) is disposed in the receiving cavity (521). The inlet (522) faces the laser emitter (410), and a portion of the light guide assembly (420) is exposed in the inlet (522). The outlet (523) faces the cutting assembly (300), and a portion of the light guide assembly (420) is exposed in the outlet (523).

14. A silicon wafer cutting equipment production line, characterized in that, Includes the laser grooving equipment as described in any one of claims 1-13.

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