Glass substrate support structure for vacuum thermal evaporation

Abstract

The utility model relates to the technical field of display manufacturing, in particular to a glass substrate support structure for vacuum thermal evaporation, which comprises a glass substrate (1). The glass substrate (1) comprises an AA region (2) and a dummy region (3); a magnetic thermosensitive adhesive assembly is arranged at the bottom of the dummy region (3); a magnet assembly is arranged on one side of the magnetic thermosensitive adhesive assembly; a separation supporting rod (4) is arranged in the magnetic thermosensitive adhesive assembly; the separating support rod (4) is propped against the dummy area (3); according to the invention, only the bottom of the dummy region of the glass substrate is provided with the magnetic thermosensitive adhesive assembly and the separation support rod, and the bottom of the AA region cancels a pad (pad) and a separation pin in the prior art; therefore, pad mura and pin mura can be effectively prevented from being generated in the process production of the AA region; when the magnet assembly provides a magnetizing field, the viscosity of the magnetic thermosensitive adhesive assembly can be reduced or disappear, the glass substrate is jacked up through the separation supporting rod, and the glass substrate can be separated from the device in a lossless mode.

Description

Technical Field

[0001] This utility model relates to the field of display manufacturing technology, and more specifically, to a glass substrate support structure for vacuum thermal evaporation. Background Technology

[0002] In current technology, the organic functional layer in OLED (Organic Light Emitting Diode) displays is mainly prepared using vacuum thermal evaporation. The evaporation material is stored in a crucible within the evaporation source. A heater heats the crucible, causing the evaporation material to sublimate. Organic vapor is ejected from a jetting mechanism and deposited onto the evaporation surface of the substrate, forming a uniform organic film. Existing evaporation equipment often uses a substrate coating-down orientation, which improves material utilization and prevents dust particles generated during the evaporation process from falling onto the evaporation surface. However, existing equipment often uses ordinary adhesive pads to hold the substrate back, reducing bending. During substrate separation, separation pins are used to contact the substrate and apply force, which can easily lead to substrate breakage. Furthermore, when performing one-sided removal, if there are pads or separation pins in the AA area, pad mura (uniform brightness or color at the edge of the display panel) and pin mura (point defects on the display panel) will occur during the manufacturing process, resulting in yield loss.

[0003] The applicant discovered through a search that Chinese patent document with publication number 103014620A, published on April 3, 2013, discloses an OLED glass substrate evaporation machine. This OLED glass substrate evaporation machine includes a main baffle and a first point evaporation source and a second point evaporation source located below the main baffle. The glass substrate is disposed above the main baffle. The evaporation ranges of the first point evaporation source and the second point evaporation source on the glass substrate overlap. It also includes a sub-baffle, which is disposed below the glass substrate and can block the overlapping area. This device also fails to solve the above-mentioned technical problem.

[0004] Therefore, in order to improve or solve at least one of the above problems, it is necessary to provide a vacuum thermal evaporation glass substrate support structure that can prevent damage to the glass substrate when it is separated from the support structure and can prevent pad mura and pin mura in the AA region of the glass substrate. Utility Model Content

[0005] The purpose of this invention is to provide a vacuum thermal evaporation glass substrate support structure that can prevent damage to the glass substrate when it is separated from the support structure and can prevent pad mura and pin mura in the AA region of the glass substrate.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows: a glass substrate support structure for vacuum thermal evaporation, comprising a glass substrate; the glass substrate includes an AA region and a dummy region; a magnetic thermosensitive adhesive assembly is provided at the bottom of the dummy region; a magnet assembly is provided on one side of the magnetic thermosensitive adhesive assembly; a separation support rod is provided in the magnetic thermosensitive adhesive assembly; the separation support rod abuts against the dummy region.

[0007] The bottom of the glass substrate is provided with a base; the magnetic thermal adhesive assembly is disposed between the base and the dummy area; the base is provided with a first mounting hole; the magnetic thermal adhesive assembly is provided with a second mounting hole; the separation support rod passes through the first mounting hole and the second mounting hole in sequence, and the end of the separation support rod abuts against the bottom of the dummy area.

[0008] As one embodiment, the magnetic thermal adhesive assembly includes a first thermal adhesive; one side of the first thermal adhesive is connected to the base, and the other side of the first thermal adhesive is connected to the dummy region; a first magnetic block is provided in the first thermal adhesive.

[0009] As one embodiment, the magnetic thermosensitive adhesive assembly includes a second magnetic block; one side of the second magnetic block is connected to the base; the other side of the second magnetic block is provided with a second thermosensitive adhesive; the second thermosensitive adhesive is connected to the dummy region.

[0010] As one embodiment, the magnet assembly includes an electromagnet; the electromagnet is disposed on the side of the magnetic thermal adhesive assembly away from the separating support rod; the electromagnet is connected to a power source.

[0011] In one embodiment, the magnet assembly includes a superconducting magnet; the superconducting magnet is disposed on the side of the magnetic thermosensitive adhesive assembly away from the separation support rod; the superconducting magnet is connected to a refrigerator and a power source.

[0012] The base is provided with a third mounting hole; an auxiliary support rod is provided in the third mounting hole; the auxiliary support rod is located at the bottom of the AA area.

[0013] The AA area is located between adjacent dummy areas; the base is provided with multiple magnetic thermal adhesive components.

[0014] The beneficial effects of this application are as follows:

[0015] This application only sets a magnetic thermal adhesive assembly and a separation support rod at the bottom of the dummy area of ​​the glass substrate, and eliminates the pads and separation pins in the prior art at the bottom of the AA area; thereby effectively avoiding pad mura (uniform brightness or color in the edge area of ​​the display panel) and pin mura (point defects on the display panel) in the AA area during the manufacturing process.

[0016] The magnetic thermosensitive adhesive assembly includes a thermosensitive adhesive and a magnetic block. The magnetic block is ferromagnetic or paramagnetic. When magnetized by a magnetizing field, the magnetic order of the system increases (magnetic entropy decreases), releasing heat. When demagnetized, the magnetic order decreases (magnetic entropy increases), and heat is absorbed from the outside. The thermosensitive adhesive loses its viscosity or becomes almost non-viscous when it reaches a certain temperature. When the magnetic assembly provides a magnetizing field, the magnetic block releases heat, and the viscosity of the thermosensitive adhesive decreases or disappears. At this point, the glass substrate can be separated from the support structure by using a separation support rod, ensuring that the glass substrate is not damaged. Attached Figure Description

[0017] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings, wherein:

[0018] Figure 1 This is a schematic diagram of the connection structure between the first thermosensitive colloid and the first magnetic block in the glass substrate support structure for vacuum thermal evaporation.

[0019] Figure 2 This is a schematic diagram of the connection structure between the second thermosensitive colloid and the second magnetic block in the glass substrate support structure for vacuum thermal evaporation.

[0020] Figure 3 This is a schematic diagram of the auxiliary support rod of the glass substrate support structure for vacuum thermal evaporation.

[0021] The markings in the above figures are all:

[0022] The diagram is marked as follows:

[0023] 1. Glass substrate,

[0024] 2. Area AA

[0025] 3. Dummy area

[0026] 4. Separate the support rod.

[0027] 5. Base, 501, Auxiliary support rod,

[0028] 6. Second mounting hole,

[0029] 7. First thermosensitive colloid, 701. Second thermosensitive colloid.

[0030] 8. First magnetic block, 801. Second magnetic block. Detailed Implementation

[0031] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings, in order to help those skilled in the art to have a more complete, accurate and in-depth understanding of the inventive concept and technical solution of this utility model, and to facilitate its implementation.

[0032] A glass substrate support structure for vacuum thermal evaporation includes a glass substrate 1; the glass substrate 1 includes an AA region 2 and a dummy region 3; a magnetic thermosensitive adhesive assembly is provided at the bottom of the dummy region 3; a magnet assembly is provided on one side of the magnetic thermosensitive adhesive assembly; a separation support rod 4 is provided in the magnetic thermosensitive adhesive assembly; the separation support rod 4 abuts against the dummy region 3.

[0033] This application only provides a magnetic thermal adhesive assembly and a separation support rod 4 at the bottom of the dummy area 3 of the glass substrate 1, and eliminates the pads and separation pins in the prior art at the bottom of the AA area 2; thereby effectively avoiding pad mura (uniform brightness or color in the edge area of ​​the display panel) and pin mura (point defects on the display panel) in the AA area 2 during the manufacturing process; when the magnet assembly provides a magnetizing field, the adhesion of the magnetic thermal adhesive assembly will decrease or disappear. At this time, the glass substrate 1 is lifted by the separation support rod 4, which can separate the glass substrate 1 from the support structure and ensure that the glass substrate 1 is not damaged.

[0034] A base 5 is provided at the bottom of the glass substrate 1; a magnetic thermal adhesive assembly is provided between the base 5 and the dummy area 3; a first mounting hole is provided on the base 5; a second mounting hole 6 is provided on the magnetic thermal adhesive assembly; a separation support rod 4 passes through the first mounting hole and the second mounting hole 6 in sequence, and the end of the separation support rod 4 abuts against the bottom of the dummy area 3.

[0035] Area AA 2 (Active Area) is the effective area, which is the core area on the glass substrate 1 that is actually used to display images, and can also be called the display pixel area. Area 3 is the virtual pixel area, which is the part located at the edge of the glass substrate 1 and other parts outside Area AA 2. The glass substrate 1 is bonded to the base 5 by a magnetic thermal adhesive assembly. The first mounting hole and the second mounting hole 6 are both through holes, and the base 5 is provided with multiple first mounting holes. The magnetic thermal adhesive assembly has a ring structure. The second mounting hole 6 is located in the magnetic thermal adhesive assembly. The first mounting hole and the second mounting hole 6 are corresponding and connected. The separation support rod 4 passes through the first mounting hole and the second mounting hole 6 from the bottom of the base 5 and abuts against the bottom surface of the dummy area 3, thereby lifting the dummy area 3.

[0036] like Figure 1 As shown, the magnetic thermal adhesive assembly includes a first thermal adhesive 7; one side of the first thermal adhesive 7 is connected to the base 5, and the other side of the first thermal adhesive 7 is connected to the dummy area 3; a first magnetic block 8 is provided in the first thermal adhesive 7.

[0037] The first thermosensitive colloid 7 is a ring-shaped colloid; the first magnetic block 8 is a magnetic particle; multiple first magnetic blocks 8 are disposed in the first thermosensitive colloid 7 and are disposed at one end of the first thermosensitive colloid 7 near the glass substrate 1; the bottom of the first thermosensitive colloid 7 is bonded to the base 5; the top of the first thermosensitive colloid 7 is bonded to the glass substrate 1; when the first magnetic block 8 releases heat, the end of the first thermosensitive colloid 7 near the glass substrate 1 is heated, and the viscosity decreases, thereby enabling the glass substrate 1 to detach from the adsorption; at the same time, the bottom of the first thermosensitive colloid 7 is heated to a lower temperature and retains a certain degree of viscosity, thereby ensuring that the first thermosensitive colloid 7 is bonded to the base 5.

[0038] like Figure 2 As shown, the magnetic thermosensitive adhesive assembly includes a second magnetic block 801; one side of the second magnetic block 801 is connected to the base 5; the other side of the second magnetic block 801 is provided with a second thermosensitive adhesive 701; the second thermosensitive adhesive 701 is connected to the dummy area 3.

[0039] The second magnetic block 801 is a ring-shaped block; the second thermosensitive colloid 701 is a thermosensitive adhesive layer; the bottom of the second magnetic block 801 is fixedly connected to the base 5; the top of the second magnetic block 801 is fixedly connected to the second thermosensitive colloid 701; the second thermosensitive colloid 701 is bonded to the glass substrate 1; silicone-based adhesive or acrylic adhesive can be used to fix the second magnetic block 801 and the second thermosensitive colloid 701, which can not only bond well with the second magnetic block 801, but also be compatible with the second thermosensitive colloid 701 and will not affect the thermosensitive performance of the second thermosensitive colloid 701; when the second magnetic block 801 releases heat, the viscosity of the second thermosensitive colloid 701 decreases, thereby enabling the glass substrate 1 to detach from the adsorption.

[0040] The first magnetic block 8 and the second magnetic block 801 are both ferromagnetic or paramagnetic materials. When a solid magnetic material (a system composed of magnetic ions) is magnetized by a magnetic field, the magnetic order of the system increases (magnetic entropy decreases) and it releases heat to the outside. When it is demagnetized, the magnetic order decreases (magnetic entropy increases) and it absorbs heat from the outside again. The thermal phenomenon that occurs in this magnetic ion system during the application and removal of the magnetic field is called the magnetocaloric effect. The first magnetic block 8 and the second magnetic block 801 can be one of the following compounds: Gd / Si / Ge, Mn / Co / Ge, Fe / P, La-Si, Ni-Ga, MnAs. These magnetic materials have high magnetic entropy, first-order phase transition properties, and exhibit strong magnetocrystalline coupling characteristics. The magnetic phase transition is accompanied by a significant crystal structure phase transition.

[0041] When the first thermosensitive colloid 7 and the second thermosensitive colloid 701 reach a certain temperature T, their viscosity will decrease or become almost non-viscous. However, as long as the temperature is below T, the viscosity will return to normal. Preferably, T is >80°. The first thermosensitive colloid 7 and the second thermosensitive colloid 701 can be one of polyimide, polybenzimidazole, or polyurethane.

[0042] The magnet assembly includes an electromagnet; the electromagnet is located on the side of the magnetic thermal adhesive assembly away from the separation support rod 4; the electromagnet is connected to a power source.

[0043] The magnet assembly can be an electromagnet; when the electromagnet is energized, it generates a magnetic field, which magnetizes the first magnetic block 8 and the second magnetic block 801, causing the first magnetic block 8 and the second magnetic block 801 to release heat, and the viscosity of the first thermosensitive colloid 7 and the second thermosensitive colloid 701 to decrease; when the electromagnet is de-energized, it no longer generates a magnetic field, the first magnetic block 8 and the second magnetic block 801 are demagnetized, the first magnetic block 8 and the second magnetic block 801 stop releasing heat, and the viscosity of the first thermosensitive colloid 7 and the second thermosensitive colloid 701 is restored.

[0044] The magnet assembly includes a superconducting magnet; the superconducting magnet is located on the side of the magnetic thermosensitive adhesive assembly away from the separation support rod 4; the superconducting magnet is connected to a refrigerator and a power supply respectively.

[0045] The magnet assembly can be a superconducting magnet. A refrigerator cools the superconducting magnet below its critical temperature, placing it in a superconducting state with almost zero resistance. Current is supplied to the coil of the superconducting magnet via a power source. According to Ampere's law, the current generates a magnetic field around the superconducting coil, thus magnetizing the first magnetic block 8 and the second magnetic block 801. This causes the first and second magnetic blocks 801 to release heat, reducing the viscosity of the first and second thermistor colloids 7 and 701. The power supply is then cut off, stopping the current input. The refrigerator heats up, breaking the superconducting state of the superconducting magnet, restoring the resistance, rapidly decaying the current, and eliminating the magnetic field. The first and second magnetic blocks 801 are demagnetized, stopping the heat release, and the viscosity of the first and second thermistor colloids 7 and 701 recovers.

[0046] like Figure 3 As shown, the base 5 is provided with a third mounting hole; an auxiliary support rod 501 is provided in the third mounting hole; the auxiliary support rod 501 is located at the bottom of area AA 2.

[0047] The auxiliary support rod 501 passes through the third mounting hole and abuts against the bottom of the AA area 2. The glass substrate 1 with one side (single-sided light exposure) has a large AA area 2 in its middle. During the vacuum thermal evaporation process, the auxiliary support rod 501 is located at the bottom of the AA area 2 and does not contact the AA area 2. When the vacuum thermal evaporation process of the glass substrate 1 is completed and it needs to be separated, the separation support rod 4 and the auxiliary support rod 501 extend upward together. The separation support rod 4 can prevent the middle part of the glass substrate 1 from bending.

[0048] AA area 2 is located between adjacent dummy areas 3; multiple magnetic thermal adhesive components are provided on the base 5.

[0049] The specific workflow of this utility model is as follows:

[0050] At room temperature, the first thermosensitive colloid 7 and the second thermosensitive colloid 701 have normal viscosity and adhere to the glass substrate 1 after it comes from upstream. When the vacuum thermal evaporation process of the glass substrate 1 is completed and it needs to be separated, the first magnetic block 8 and the second magnetic block 801 release heat under the action of the magnetic field. The first thermosensitive colloid 7 and the second thermosensitive colloid 701 reach the separation temperature, the viscosity decreases, the separation support rod 4 rises, lifts the glass substrate 1, and then it is taken away by the robot arm. The device is then reset.

[0051] The present invention has been described above by way of example with reference to the accompanying drawings. Obviously, the specific implementation of the present invention is not limited to the above-described manner. Any non-substantial improvements made using the inventive concept and technical solution of the present invention; or the direct application of the inventive concept and technical solution to other situations without modification, are all within the protection scope of the present invention.

Claims

1. A glass substrate support structure for vacuum thermal evaporation, characterized in that: The device includes a glass substrate (1); the glass substrate (1) includes an AA region (2) and a dummy region (3); a magnetic thermosensitive adhesive assembly is provided at the bottom of the dummy region (3); a magnet assembly is provided on one side of the magnetic thermosensitive adhesive assembly; a separation support rod (4) is provided in the magnetic thermosensitive adhesive assembly; the separation support rod (4) abuts against the dummy region (3).

2. The glass substrate support structure for vacuum thermal evaporation according to claim 1, characterized in that: The bottom of the glass substrate (1) is provided with a base (5); the magnetic thermal adhesive assembly is disposed between the base (5) and the dummy area (3); the base (5) is provided with a first mounting hole; the magnetic thermal adhesive assembly is provided with a second mounting hole (6); the separation support rod (4) passes through the first mounting hole and the second mounting hole (6) in sequence, and the end of the separation support rod (4) abuts against the bottom of the dummy area (3).

3. The glass substrate support structure for vacuum thermal evaporation according to claim 2, characterized in that: The magnetic thermosensitive adhesive assembly includes a first thermosensitive adhesive (7); one side of the first thermosensitive adhesive (7) is connected to the base (5), and the other side of the first thermosensitive adhesive (7) is connected to the dummy area (3); a first magnetic block (8) is provided in the first thermosensitive adhesive (7).

4. A glass substrate support structure for vacuum thermal evaporation according to claim 2, characterized in that: The magnetic thermosensitive adhesive assembly includes a second magnetic block (801); one side of the second magnetic block (801) is connected to the base (5); the other side of the second magnetic block (801) is provided with a second thermosensitive adhesive (701); the second thermosensitive adhesive (701) is connected to the dummy area (3).

5. A glass substrate support structure for vacuum thermal evaporation according to any one of claims 2-4, characterized in that: The magnet assembly includes an electromagnet; the electromagnet is located on the side of the magnetic thermosensitive adhesive assembly away from the separation support rod (4); the electromagnet is connected to a power source.

6. A glass substrate support structure for vacuum thermal evaporation according to any one of claims 2-4, characterized in that: The magnet assembly includes a superconducting magnet; the superconducting magnet is located on the side of the magnetic thermosensitive adhesive assembly away from the separation support rod (4); the superconducting magnet is connected to a refrigerator and a power source respectively.

7. A glass substrate support structure for vacuum thermal evaporation according to claim 2, characterized in that: The base (5) is provided with a third mounting hole; an auxiliary support rod (501) is provided in the third mounting hole; the auxiliary support rod (501) is located at the bottom of the AA area (2).

8. A glass substrate support structure for vacuum thermal evaporation according to claim 7, characterized in that: The AA area (2) is located between adjacent dummy areas (3); the base (5) is provided with a plurality of magnetic thermal adhesive components.

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