5G communication anti-interference band elimination filter

By introducing a heat dissipation mechanism into the filter and using a thermal expansion block to drive airflow circulation for cooling, the problem of equipment damage caused by overheating is solved, effective heat dissipation protection is achieved, and service life is extended.

CN223829290UActive Publication Date: 2026-01-23SUZHOU LANCONT ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202423123964.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-18
Publication Date
2026-01-23
Estimated Expiration
2034-12-18

AI Technical Summary

Technical Problem

Existing 5G communication anti-interference bandstop filters cannot effectively dissipate heat when overheated, leading to equipment damage and affecting service life.

Method used

A filter incorporating a heat dissipation mechanism was designed. The thermal expansion block drives the lifting rod and the driving plate, and the airflow is regulated by the baffle to enter the housing. Combined with the fan, an airflow circulation is formed to achieve rapid heat dissipation.

Benefits of technology

Without affecting the normal operation of the filter, timely heat dissipation reduces the risk of overheating damage, extends the filter's lifespan, and improves its cost-effectiveness.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a 5G communication anti-interference band elimination filter, and relates to the field of filters. The 5G communication anti-interference band elimination filter comprises a shell and a main device, heat dissipation mechanisms are arranged on the left side and the right side of the shell, each heat dissipation mechanism comprises a baffle and an outer groove, the baffles are arranged on the left side and the right side of the shell, and the outer grooves are formed in the left side and the right side of the shell. According to the 5G communication anti-interference band elimination filter, a heat dissipation mechanism is arranged, a thermal expansion block in a fixed cylinder is affected by heat conducted by a heat conduction plate to expand downwards to drive a lifting rod to move downwards, the lifting rod moves downwards to drive a driving plate to rotate, and the driving plate rotates to push a baffle, connected with a rotating shaft, on one side of a hinge frame to incline; external air can conveniently enter the shell from the outer groove and the air inlet to drive air to flow so as to achieve the purpose of cooling and heat dissipation, heat can be dissipated in time on the premise that normal operation of the filter is not affected, damage caused by overheat in operation of the filter is reduced, the service life of the filter is prolonged, and the cost performance of the filter is improved.
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Description

Technical Field

[0001] This application relates to the field of filter technology, specifically a 5G communication anti-interference bandstop filter. Background Technology

[0002] A filter is a filtering circuit composed of capacitors, inductors, and resistors. Filters can effectively filter out specific frequencies or frequencies outside of a power supply line, resulting in a power signal of a specific frequency, or eliminating a power signal at a specific frequency. Filters are used in 5G communication deployment to reduce interference to 5G signals.

[0003] Patent document CN213094201U discloses a 5G communication anti-interference band-stop filter. This filter connects to a connector on the device body, allowing the device to filter and clear interference signals when powered on. When the device overheats, a heat-absorbing block on a conductive block inside the casing absorbs heat, causing the thermal expansion medium on the air-push groove to expand and push a rubber push rod vertically upwards. This push rod contacts a conductive plate on the conductive connector, separating the conductive plate from the conductive block and stopping the device. This structural improvement allows the device to disconnect its power supply when overheating, providing protection. However, this filter does not actually dissipate heat; it only stops the filter from operating when overheating. This not only affects the filter's effectiveness and allows 5G signals to interfere, but also prevents heat from dissipating quickly enough, potentially damaging the filter and reducing its lifespan. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this application provides a 5G communication anti-interference bandstop filter, which solves the problems mentioned in the background section.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, this application provides the following technical solution: a 5G communication anti-interference bandstop filter, comprising a housing and a main device, wherein the housing is provided with heat dissipation mechanisms on both the left and right sides for dissipating heat generated when the main device overheats during operation, the heat dissipation mechanism comprising a baffle and an outer groove, the baffle being provided on the left and right sides of the housing, the outer groove being provided on the left and right sides of the housing, and the top of the main device being fixedly connected to the top of the inner wall of the housing.

[0008] By adopting the above technical solution, the size of the leakage from the outer slot can be adjusted by using the baffle, which facilitates the adjustment of the airflow size, timely dissipates heat, and reduces the damage caused by overheating of the filter.

[0009] Preferably, the heat dissipation mechanism further includes a fixed cylinder and a thermal expansion block. The top of the fixed cylinder is fixedly connected to the top left and right sides of the inner wall of the outer shell, and the top of the thermal expansion block is fixedly connected to the bottom of the inner wall of the outer shell. The thermal expansion block is disposed inside the fixed cylinder.

[0010] By adopting the above technical solution, the thermal expansion block inside the fixed cylinder can be expanded downward under the constraint of the fixed cylinder due to the heat conducted by the heat-conducting plate, thus providing power support for the movement of the lifting rod.

[0011] Preferably, the heat dissipation mechanism further includes a lifting rod and a driving plate, wherein the top of the lifting rod is fixedly connected to the bottom of the thermal expansion block, and the driving plate is hinged to one side of the lifting rod.

[0012] By adopting the above technical solution, the thermal expansion block can be used to drive the plate to move downwards, thus converting the thermal expansion block's thermal expansion into the power for downward movement.

[0013] Preferably, the heat dissipation mechanism further includes a hinge frame and a rotating shaft. The hinge frame is hinged to one side of the drive plate, one side of the hinge frame is fixedly connected to one side of the baffle, the rotating shaft is fixedly connected to the front and rear sides of the baffle, and the rotating shaft is rotatably connected to the front and rear sides of the outer groove.

[0014] By adopting the above technical solution, the downward movement of the drive plate can push the baffle on one side of the hinge frame to tilt, providing an inlet and outlet for external airflow.

[0015] Preferably, the heat dissipation mechanism further includes an air inlet, which is located on one side of the outer slot.

[0016] By adopting the above technical solution, the air inlet can be used to provide a channel for airflow to enter the interior of the casing.

[0017] Preferably, the outer casing includes a housing and a fixing plate. The housing has outer grooves on its left and right sides, the fixing plate is fixedly connected to the bottom of the housing, and the fixing plate has a fixing hole on one side of its top.

[0018] By adopting the above technical solution, the filter can be easily fixed by using the fixing plate with fixing holes connected to the housing, thereby enhancing the stability of the filter in a static state.

[0019] Preferably, the housing further includes a heat dissipation vent and a heat-conducting plate. The heat dissipation vent is located at the bottom of the housing. The bottom of the heat-conducting plate is fixedly connected to the top of the housing. The center of the bottom of the heat-conducting plate is fixedly connected to the top of the main equipment. The left and right sides of the bottom of the heat-conducting plate are fixedly connected to the top of the fixed cylinder.

[0020] By adopting the above technical solution, the heat dissipation port can provide space for airflow at the bottom of the filter when it is fixed, and the heat-conducting plate can facilitate the heating of the thermal expansion block and the dissipation of the heat generated by the main equipment fixedly connected to the heat-conducting plate from the top, further accelerating the cooling speed.

[0021] Preferably, the housing further includes an air outlet and a fan, the air outlet being located at the center of the bottom of the housing, and the fan being fixedly connected to the inner wall of the air outlet.

[0022] By adopting the above technical solution, the fan in the air outlet can drive the external air into the housing from the air inlet and discharge it through the heat dissipation outlet, forming an airflow circulation channel.

[0023] (III) Beneficial Effects

[0024] This application provides a 5G communication anti-interference band-stop filter. It has the following beneficial effects:

[0025] 1. This 5G communication anti-interference bandstop filter, through the setting of a heat dissipation mechanism, causes the thermal expansion block inside the fixed cylinder to expand downward under the influence of heat conducted by the heat-conducting plate, which in turn causes the lifting rod to move downward. The downward movement of the lifting rod causes the driving plate to rotate, which in turn pushes the baffle connected to the rotating shaft on one side of the hinge frame to tilt. This facilitates the entry of external gas into the housing through the outer groove and air inlet, driving airflow to achieve the purpose of cooling and heat dissipation. Without affecting the normal operation of the filter, the heat is dissipated in a timely manner, reducing the damage caused by overheating of the filter, extending the service life of the filter, and improving the cost performance of the filter.

[0026] 2. This 5G communication anti-interference band-stop filter, by setting up an outer shell, the heat-conducting plate on the top of the shell dissipates the heat generated by the main device during operation. The filter is fixed by fixing holes on the surface of the fixing plate. The fan in the air outlet starts and drives the gas in the shell to be discharged from the heat dissipation port through the air outlet. The air flow reduces the internal temperature of the shell, prevents the heat from accumulating due to the closed interior of the shell when the main device is running, and assists the heat dissipation mechanism to circulate airflow to accelerate the heat dissipation. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0028] Figure 1 This is a top-view schematic diagram of the external structure of this application from the right side;

[0029] Figure 2 This is a schematic diagram of the external structure of this application from a left-side, upward-looking perspective;

[0030] Figure 3 This is an enlarged schematic diagram of Part A of the structure of this application;

[0031] Figure 4 This is a schematic cross-sectional view of the front and bottom sections of the structure in this application;

[0032] Figure 5 This is a schematic diagram of the heat dissipation mechanism from the left-hand top view of this application;

[0033] Figure 6 This is a schematic diagram of the heat dissipation mechanism from the right-hand top view of this application.

[0034] In the diagram: 1. Outer shell; 101. Housing; 102. Fixing plate; 103. Fixing hole; 104. Heat dissipation vent; 105. Heat conduction plate; 106. Air outlet; 107. Fan; 2. Filter body; 3. Heat dissipation mechanism; 301. Fixing cylinder; 302. Thermal expansion block; 303. Lifting rod; 304. Drive plate; 305. Hinge frame; 306. Baffle; 307. Rotating shaft; 308. Outer groove; 309. Air inlet. Detailed Implementation

[0035] It should be noted that in the description of the embodiments of this application, the terms "front," "rear," "left," "right," "up," "down," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0036] The present application will be further described in detail below with reference to the accompanying drawings and embodiments.

[0037] Reference Figure 1 , Figure 4 , Figure 5 and Figure 6 This application provides a 5G communication anti-interference bandstop filter, including a housing 1 and a main device 2. The housing 1 has heat dissipation mechanisms 3 on both its left and right sides to dissipate heat generated when the main device 2 overheats. Each heat dissipation mechanism 3 includes a baffle 306 and an outer groove 308. The baffle 306 is located on the left and right sides of the housing 1, and the outer groove 308 is located on the left and right sides of the housing 1. Fixed cylinders 301 are fixedly connected to the top left and right sides of the inner wall of the housing 1, and thermal expansion blocks 302 are fixedly connected to the bottom of the inner wall of the housing 1. The thermal expansion blocks 302 are located inside the fixed cylinders 301, and a lifting rod 303 is fixedly connected to the bottom of the thermal expansion blocks 302. A driving plate 304 is hinged to one side of the lifting rod 303, and a hinge frame 305 is hinged to one side of the driving plate 304. One side of the hinge frame 305 is fixedly connected to one side of the baffle 306. The front and rear sides of the baffle 306 are fixedly connected to the rotating shafts 307. The rotating shafts 307 are rotatably connected to the front and rear sides of the outer groove 308. An air inlet 309 is opened on one side of the outer groove 308. The top of the main equipment 2 is fixedly connected to the top of the inner wall of the outer shell 1. The thermal expansion block 302 in the fixed cylinder 301 expands downward due to the heat conducted by the heat conduction plate 105, which causes the lifting rod 303 to move down. The downward movement of the lifting rod 303 causes the driving plate 304 to rotate. The rotation of the driving plate 304 pushes the baffle 306 connected to the rotating shaft 307 on one side of the hinge frame 305 to tilt, so that external gas can enter the interior of the shell 101 through the outer groove 308 and the air inlet 309, which drives the air flow to achieve the purpose of cooling and heat dissipation.

[0038] Reference Figure 1 , Figure 2 and Figure 3 In one aspect of this embodiment, the outer casing 1 includes a casing 101 and a fixing plate 102. Outer grooves 308 are formed on the left and right sides of the casing 101. The fixing plate 102 is fixedly connected to the bottom of the casing 101. A fixing hole 103 is formed on one side of the top of the fixing plate 102. A heat dissipation vent 104 is formed at the bottom of the casing 101. A heat-conducting plate 105 is fixedly connected to the top of the main device 2 at the bottom center of the heat-conducting plate 105. The left and right sides of the bottom of the heat-conducting plate 105 are fixedly connected to the top of the fixing cylinder 301. An air outlet 106 is formed at the bottom center of the casing 101. A fan 107 is fixedly connected to the inner wall of the air outlet 106. The heat-conducting plate 105 at the top of the casing 101 conducts heat generated by the main device 2 during operation. The filter is fixed by the fixing hole 103 formed on the surface of the fixing plate 102. The fan 107 in the air outlet 106 is started and drives the gas in the casing 101 to be discharged from the heat dissipation vent 104 through the air outlet 106.

[0039] All electrical devices in this plan are powered by an external power source.

[0040] Working principle: During use, the filter is fixed by the fixing holes 103 on the surface of the fixing plate 102. The heat conduction plate 105 on the top of the housing 101 conducts the heat generated by the main equipment 2 during operation. The thermal expansion block 302 in the fixing cylinder 301 expands downward due to the heat conducted by the heat conduction plate 105, which causes the lifting rod 303 to move down. The downward movement of the lifting rod 303 causes the driving plate 304 to rotate. The rotation of the driving plate 304 pushes the baffle 306 connected to the rotating shaft 307 on one side of the hinge frame 305 to tilt, so that the outside air can enter the housing 101. The fan 107 in the air outlet 106 starts and drives the gas in the housing 101 to be discharged from the heat dissipation port 104 through the air outlet 106.

[0041] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0042] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A 5G communication anti-interference band-stop filter, comprising a housing (1) and a main device (2), characterized in that: The outer shell (1) is provided with heat dissipation mechanisms (3) on both the left and right sides for dissipating the heat generated when the main equipment (2) overheats during operation. The heat dissipation mechanism (3) includes a baffle (306) and an outer groove (308). The baffle (306) is provided on the left and right sides of the outer shell (1), and the outer groove (308) is opened on the left and right sides of the outer shell (1). The top of the main equipment (2) is fixedly connected to the top of the inner wall of the outer shell (1).

2. The 5G communication anti-interference band-stop filter according to claim 1, characterized in that: The heat dissipation mechanism (3) further includes a fixed cylinder (301) and a thermal expansion block (302). The top of the fixed cylinder (301) is fixedly connected to the top left and right sides of the inner wall of the outer shell (1), and the top of the thermal expansion block (302) is fixedly connected to the bottom of the inner wall of the outer shell (1). The thermal expansion block (302) is disposed inside the fixed cylinder (301).

3. The 5G communication anti-interference band-stop filter according to claim 2, characterized in that: The heat dissipation mechanism (3) also includes a lifting rod (303) and a driving plate (304). The top of the lifting rod (303) is fixedly connected to the bottom of the thermal expansion block (302), and the driving plate (304) is hinged to one side of the lifting rod (303).

4. A 5G communication anti-interference band-stop filter according to claim 3, characterized in that: The heat dissipation mechanism (3) further includes a hinge frame (305) and a rotating shaft (307). The hinge frame (305) is hinged to one side of the drive plate (304). One side of the hinge frame (305) is fixedly connected to one side of the baffle (306). The rotating shaft (307) is fixedly connected to the front and rear sides of the baffle (306). The rotating shaft (307) is rotatably connected to the front and rear sides of the outer groove (308).

5. A 5G communication anti-interference band-stop filter according to claim 4, characterized in that: The heat dissipation mechanism (3) also includes an air inlet (309), which is located on one side of the outer slot (308).

6. A 5G communication anti-interference band-stop filter according to claim 1, characterized in that: The outer shell (1) includes a shell (101) and a fixing plate (102). The shell (101) has outer grooves (308) on its left and right sides. The fixing plate (102) is fixedly connected to the bottom of the shell (101). The fixing plate (102) has a fixing hole (103) on one side of its top.

7. A 5G communication anti-interference band-stop filter according to claim 6, characterized in that: The outer casing (1) also includes a heat dissipation vent (104) and a heat conduction plate (105). The heat dissipation vent (104) is located at the center of the bottom of the casing (101). The bottom of the heat conduction plate (105) is fixedly connected to the top of the casing (101). The center of the bottom of the heat conduction plate (105) is fixedly connected to the top of the main device (2). The left and right sides of the bottom of the heat conduction plate (105) are fixedly connected to the top of the fixed cylinder (301).

8. A 5G communication anti-interference band-stop filter according to claim 7, characterized in that: The outer casing (1) also includes an air outlet (106) and a fan (107). The air outlet (106) is located at the center of the bottom of the casing (101), and the fan (107) is fixedly connected to the inner wall of the air outlet (106).

Citation Information

Patent Citations

  • 5G communication anti-interference band-stop filter

    CN213094201U